CN202977414U - 片式开关复合管 - Google Patents

片式开关复合管 Download PDF

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Publication number
CN202977414U
CN202977414U CN 201220658647 CN201220658647U CN202977414U CN 202977414 U CN202977414 U CN 202977414U CN 201220658647 CN201220658647 CN 201220658647 CN 201220658647 U CN201220658647 U CN 201220658647U CN 202977414 U CN202977414 U CN 202977414U
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China
Prior art keywords
pin
wiring board
diode
triode wafer
triode
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Expired - Fee Related
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CN 201220658647
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English (en)
Inventor
张长华
钱宝龙
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Xinhua Huayu Electronic Co Ltd
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Xinhua Huayu Electronic Co Ltd
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Priority to CN 201220658647 priority Critical patent/CN202977414U/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型为片式开关复合管,包括一个三极管晶片、一个共阳双管芯开关二极管和五个金属引出脚封装而成,五个金属引出脚分别为脚一为三级管晶片的集电极,脚二为三极管晶片的发射极与二级管的阳极C1的共同极,脚三为二极管的阳极C2,脚四为二极管的阴极,脚五为三极管晶片的基极;本实用新型的有益效果是,缩小线路板的使用面积、原材料大幅减少、简化操作、降低成本、提高生产率。

Description

片式开关复合管
技术领域
本实用新型涉及一种复合管,具体地说,是片式开关复合管。
背景技术
目前作为片式开关其结构往往比较复杂,且其线路板占用的空间比价大,不仅浪费了资源而且不适合做为小电器内部的开关的使用。特别是不适合蜂鸣器使用。
实用新型内容
为了解决现有技术的不足,本实用新型开发了片式开关复合管,包括一个三极管晶片、一个共阳双管芯开关二极管和五个金属引出脚封装而成,所述五个金属引出脚分别为脚一为三级管晶片的集电极,所述脚二为三极管晶片的发射极与二级管的阳极C1的共同极,所述脚三为二极管的阳极C2,所述脚四为二极管的阴极,所述脚五为三极管晶片的基极。
作为本实用新型的进一步改进,所述三极管晶片与脚一设置在同一块线路板A上,所述线路板A上部为脚五所在的线路板B,所述线路板A和线路板B的旁边为脚二所在的线路板C,所述线路板C的另一侧为脚三和和脚四所在的线路板D和线路板E,所述线路板D在下部,所述线路板E在上部。
作为本实用新型的进一步改进,所述线路板A、线路板B、线路板C、线路板D和线路板E串联在一起。
本实用新型的有益效果是,缩小线路板的使用面积、原材料大幅减少、简化操作、降低成本、提高生产率的优点。
附图说明
图1是本实用新型的结构示意图。
其中:1-三极管晶片,2-二极管,3-脚一,4-脚二,5-脚三,6-脚四,7-脚五,8-线路板A,9-线路板B,10-线路板C,11-线路板D,12-线路板E。
具体实施方式
如图1所示,本实用新型涉及片式开关复合管,包括一个三极管晶片1、一个共阳双管芯开关二极管2和五个金属引出脚封装而成,五个金属引出脚分别为脚一3为三级管晶片1的集电极,脚二4为三极管晶片1的发射极与二级管2的阳极C1的共同极,脚三5为二极管2的阳极C2,脚四6为二极管2的阴极,脚五7为三极管晶片1的基极。三极管晶片1与脚一3设置在同一块线路板A8上,线路板A8上部为脚五7所在的线路板B9,线路板A8和线路板B9的旁边为脚二4所在的线路板C,10所述线路板C10的另一侧为脚三5和和脚四6所在的线路板D11和线路板E12,所述线路板D11在下部,所述线路板E12在上部。
    线路板A8、线路板B9、线路板C10、线路板D11和线路板E12串联在一起。
    本实施例的有益效果在于;缩小线路板的使用面积、原材料大幅减少、简化操作、降低成本、提高生产率的优点。

Claims (3)

1.片式开关复合管,其特征在于:包括一个三极管晶片(1)、一个共阳双管芯开关的二极管(2)和五个金属引出脚封装而成,所述五个金属引出脚分别是脚一(3)为三级管晶片(1)的集电极,所述脚二(4)为三极管晶片(1)的发射极与二级管(2)的阳极C1的共同极,所述脚三(5)为二极管(2)的阳极C2,所述脚四(6)为二极管(2)的阴极,所述脚五(7)为三极管晶片(1)的基极。
2.如权利要求1所述的片式开关复合管,其特征在于:所述三极管晶片(1)与脚一(3)设置在同一块线路板A(8)上,所述线路板A(8)上部为脚五(7)所在的线路板B(9),所述线路板A(8)和线路板B(9)的旁边为脚二(4)所在的线路板C(10),所述线路板C(10)的另一侧为脚三(5)和脚四(6)所在的线路板D(11)和线路板E(12),所述线路板D(11)在下部,所述线路板E(12)在上部。
3.如权利要求1或2所述的片式开关复合管,其特征在于:所述线路板A(8)、线路板B(9)、线路板C(10)、线路板D(11)和线路板E(12)串联在一起。
CN 201220658647 2012-12-04 2012-12-04 片式开关复合管 Expired - Fee Related CN202977414U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220658647 CN202977414U (zh) 2012-12-04 2012-12-04 片式开关复合管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220658647 CN202977414U (zh) 2012-12-04 2012-12-04 片式开关复合管

Publications (1)

Publication Number Publication Date
CN202977414U true CN202977414U (zh) 2013-06-05

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CN 201220658647 Expired - Fee Related CN202977414U (zh) 2012-12-04 2012-12-04 片式开关复合管

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CN (1) CN202977414U (zh)

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Granted publication date: 20130605

Termination date: 20131204