CN202957978U - 一种微机电传声器芯片 - Google Patents
一种微机电传声器芯片 Download PDFInfo
- Publication number
- CN202957978U CN202957978U CN 201220605844 CN201220605844U CN202957978U CN 202957978 U CN202957978 U CN 202957978U CN 201220605844 CN201220605844 CN 201220605844 CN 201220605844 U CN201220605844 U CN 201220605844U CN 202957978 U CN202957978 U CN 202957978U
- Authority
- CN
- China
- Prior art keywords
- microphone chip
- vibrating diaphragm
- pole plate
- layer
- electromechanical microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims abstract description 28
- 230000004888 barrier function Effects 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 15
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 9
- 229920005591 polysilicon Polymers 0.000 claims description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
- 235000003140 Panax quinquefolius Nutrition 0.000 claims description 3
- 240000005373 Panax quinquefolius Species 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000003071 parasitic effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220605844 CN202957978U (zh) | 2012-11-15 | 2012-11-15 | 一种微机电传声器芯片 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220605844 CN202957978U (zh) | 2012-11-15 | 2012-11-15 | 一种微机电传声器芯片 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202957978U true CN202957978U (zh) | 2013-05-29 |
Family
ID=48463528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220605844 Expired - Lifetime CN202957978U (zh) | 2012-11-15 | 2012-11-15 | 一种微机电传声器芯片 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202957978U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105338458A (zh) * | 2014-08-01 | 2016-02-17 | 无锡华润上华半导体有限公司 | Mems麦克风 |
WO2018223987A1 (zh) * | 2017-06-07 | 2018-12-13 | 深圳市艾辰电子有限公司 | 一种硅基mems微扬声器 |
-
2012
- 2012-11-15 CN CN 201220605844 patent/CN202957978U/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105338458A (zh) * | 2014-08-01 | 2016-02-17 | 无锡华润上华半导体有限公司 | Mems麦克风 |
CN105338458B (zh) * | 2014-08-01 | 2019-06-07 | 无锡华润上华科技有限公司 | Mems麦克风 |
WO2018223987A1 (zh) * | 2017-06-07 | 2018-12-13 | 深圳市艾辰电子有限公司 | 一种硅基mems微扬声器 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102932724B (zh) | 一种微机电传声器芯片及其制作方法 | |
US10273150B2 (en) | Integrated structure of MEMS microphone and pressure sensor and manufacturing method for the integrated structure | |
CN103281659B (zh) | Mems麦克风及其制作方法 | |
CN101835079B (zh) | 一种电容式微型硅麦克风及其制备方法 | |
CN105792084B (zh) | Mems麦克风及其制造方法 | |
CN105721997A (zh) | 一种mems硅麦克风及其制备方法 | |
CN206341427U (zh) | Mems麦克风 | |
US20110154905A1 (en) | Capacitive sensor and manufacturing method thereof | |
CN103686570A (zh) | Mems麦克风 | |
US9221675B2 (en) | Chip with integrated circuit and micro-silicon condenser microphone integrated on single substrate and method for making the same | |
US11516595B2 (en) | Integrated structure of mems microphone and air pressure sensor and fabrication method thereof | |
CN203279171U (zh) | Mems麦克风 | |
CN103067838B (zh) | 一种高灵敏度压电式硅麦克风的制备方法 | |
CN203279172U (zh) | Mems麦克风 | |
CN106535072A (zh) | 一种mems麦克风芯片以及mems麦克风 | |
CN203027480U (zh) | 一种高灵敏度压电式硅麦克风 | |
CN202957978U (zh) | 一种微机电传声器芯片 | |
CN202957975U (zh) | 微机电传声器芯片 | |
CN202957977U (zh) | 一种微机电传声器芯片 | |
CN103347241B (zh) | 电容式硅麦克风芯片及其制备方法 | |
CN103338427A (zh) | Mems芯片以及mems麦克风 | |
CN201854425U (zh) | 硅麦克风 | |
CN104754480B (zh) | 微型机电系统麦克风及其制造方法 | |
US11609091B2 (en) | Microelectromechanical systems device including a proof mass and movable plate | |
CN104080032A (zh) | 一种可防水汽的电容式微型麦克风及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20130529 |