CN202956190U - Multi-lens profound hypothermia infrared detector shell packaged in Dewar - Google Patents
Multi-lens profound hypothermia infrared detector shell packaged in Dewar Download PDFInfo
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- CN202956190U CN202956190U CN 201220571670 CN201220571670U CN202956190U CN 202956190 U CN202956190 U CN 202956190U CN 201220571670 CN201220571670 CN 201220571670 CN 201220571670 U CN201220571670 U CN 201220571670U CN 202956190 U CN202956190 U CN 202956190U
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Abstract
The utility model discloses a multi-lens profound hypothermia infrared detector shell packaged in Dewar, which is assembled in high precision, and is suitable for profound hypothermia shell packaging technology in which an infrared focal plane detector Dewar is equipped with multiple cold optical elements. A multi-lens profound hypothermia infrared detector shell structure comprises a detector chip, an electrode lead circuit substrate, multiple lenses, an optical filter, a supporting shell, a compression-ring type cold shield, a chip and lead silicon-aluminum wires, etc. According to the utility model, high-precision package of the multi-lens shell in profound hypothermia is realized by special means and structures including laser positioning boring, compression-ring type cold shield embedding, the integral supporting shell of special alloy and fine tuning of side surfaces; the multi-lens profound hypothermia infrared detector shell packaged in Dewar can effectively ensure low-temperature infrared optical precision requirements, reduces background and stray lights in a view field of the chip as well as heat radiation of the whole Dewar, and effectively eliminates low-temperature deformation stress of a ceramic sintered shell to the detector chip; and the multi-lens profound hypothermia infrared detector shell packaged in Dewar can be also used as shell packaging structure for other coldness-radiation, thermoelectricity, and refrigeration infrared detectors.
Description
Technical field
This patent relates to the shell encapsulation technology in a kind of infrared acquisition Dewar, specifically refers to a kind of poly-lens profound hypothermia infrared detector package structure be encapsulated in Dewar.Belong to infrared eye encapsulation technology field.
Background technology
Infrared eye is by the rear infrared assembly that forms of encapsulation, and its purpose can work for guaranteeing infrared eye.Infrared detector module has a wide range of applications in the infrared field of space flight.Along with the raising of wavelength to long wave expansion and detection sensitivity, cadmium-telluride-mercury infrared detector must could be worked at low temperatures.Due to advantages such as mechanical refrigeration have compact conformation, volume is little, lightweight, refrigerating capacity is large, cooling time is short, the cryogenic temperature controlled range is large, such detector mostly adopts the mechanical refrigeration mode in the application of space at present.For guaranteeing the requirement of HgCdTe infrared focal plane detector chip low-temperature working, mostly adopt the metal Dewar packing forms, form infrared detector dewar assembly.
Due to the vertical distribution outline line that needs the atmospheric sounding temperature and humidity and cloud parameter, after therefore requiring for some very long wave interfere type detection instrument, optical lens must operate under the profound hypothermia environment.Detectivity due to current very long wave infrared eye can't arrive the demand of the highly sensitive detection of interferometer fully simultaneously, thereby, in order to obtain larger interference signal energy, often needs the optical system that adopts the F# number very little.And in order to eliminate the negative consequence that becomes huge and complicated by the too little optical system caused of F# number, the lens combination of follow-up optics need to be placed in the position of as far as possible close infrared detector chip, make like this Dewar interior except infrared eye, also need the shell assembly of packaging belt lens.Be packaged with a plurality of lens in the infrared detector package assembly, and whole shell assembly also is operated under the profound hypothermia environment, this at home and abroad reports seldom.The frame mode of encapsulation profound hypothermia lens that only had at present U.S. GEOS Advanced Baseline Sounder (ABS) interferometer to adopt, but which kind of mode fixed lens ABS adopts actually and guarantees that the spacing between lens do not mention.
Interfere type very long wave detection instrument carries out the profound hypothermia refrigeration to two lens of the close infrared eye of follow-up optics, and its purpose is mainly in order to reduce background radiation, thereby improves effective detectivity of infrared eye.The lens of the in fact general follow-up optics of infrared camera are from infrared eye at a distance of larger, and follow-up like this optical lens and detector Dewar can separate packages.But there are several problems in the profound hypothermia of the follow-up optics of interfere type very long wave detection instrument refrigeration lens and detector Dewar separate packages: 1) if will meet aforesaid way, the angle of each photosensitive first image optics can not be too large.If the image optics angle is excessive, primary optical system can become very large, and whole like this detection instrument can become very huge and heavy, and the processing of bigbore optical lens also can become very difficult; 2) because follow-up optical lens also needs refrigeration, if separate packages refrigeration machine also needs to separate cold chain to its refrigeration or configures in addition a refrigeration machine again it is freezed, can make so whole infrared system become more complicated, thereby system reliability is reduced, be unfavorable for very much the environmental mechanics examination of machine system.
Summary of the invention
The purpose of this patent is to provide a kind of poly-lens profound hypothermia infrared detector package structure be encapsulated in Dewar, to solve the problem that interfere type profound hypothermia infrared eye detection instrument is too huge and follow-up optical texture is too complicated, realize the highly integrated encapsulation of infrared detector dewar simultaneously.
The a kind of of this patent is encapsulated in the interior poly-lens profound hypothermia infrared detector package structure of Dewar as shown in Figure 1, and it comprises: shell base 1, jewel sheet chip module 2, location polyimide 3, lens supports shell 4, lower lens 5, the cold screen 6 of lower lens chuck ring formula, upper lens 7, the cold screen 8 of upper lens chuck ring formula, pipe cap 9.
Upper strata jewel battery lead plate 202 and lower floor's jewel battery lead plate 201 of described jewel sheet chip module 2 first carry out the laser high-precision location drilling, each pitch of holes error precision is less than 0.03mm, then lower floor's jewel battery lead plate 201 first glueds joint with upper strata jewel battery lead plate 202 centerings, infrared detector chip 203 is glued on lower floor's jewel battery lead plate 201, and infrared detector chip connects by gold ball bonding with levels jewel plate electrode simultaneously.
The cold screen 6 of described lower lens chuck ring formula, the cold screen 8 of upper lens chuck ring formula all adopts thin-wall construction, and these two parts are carried out to the wire drawing joint-cutting.
Described window (902) is glued on the light hole step of pipe cap 9 with low temperature glue.
Described shell base 1, lens supports shell 4 and pipe cap 9 all adopt the CE7 alloy be complementary with the Ge expansion coefficient under extraordinary high thermal conductance, low temperature, and shell base 1, lens supports shell 4 and pipe cap 9 surface finish are gold-plated.
The cold screen 6 of described lower lens chuck ring formula and the cold screen 8 of upper lens chuck ring formula all adopt the kovar alloy material, the cold screen 6 of lower lens chuck ring formula, the cold screen 8 surface electrical black coating nickel blackening process of upper lens chuck ring formula.
The implementation method of this patent is as follows:
1) after part machines, (reference field) the height D1 of lens 5 installed surfaces to step 404 from bottom surface to measure the lens supports shell by Z axis measuring microscope and three-coordinates measuring machine, and then measures bottom surface (reference field) and go up the height D2 of lens 7 installed surfaces to step 405.
2), under the high precision image instrument, complete jewel battery lead plate 201 and 202 centerings and glued joint, and then glued joint with infrared detector chip 203 centerings.After glue is dry, the jewel battery lead plate is connected with chip 203 gold ball bondings, form jewel sheet chip module 2.Measure the height D3 of the photosensitive first face of chip to the chip jewelry battery lead plate simultaneously.
3) according to height D1, D2 and D3 value, calculate step 404 to chip photosurface height H 1, step 405 is to chip photosurface height H 2.H1 while considering design, the value of H2 than the little 0.01mm of theoretical required value to 0.02mm, therefore according to the actual computation value, determine in step 404, step 405 and position, three of lens supports shell 4 bottoms type and the quantity of the polyimide ring washer of cushioning 0.005mm or 0.01mm respectively, can guarantee that like this actual value of H1, H2 is less than 0.01mm than theoretical value deviation.
4) by special centering clamp, shell base 102 and fixture are fixed, under the high precision image instrument, simultaneously lens supports shell 4 and jewel sheet chip module 2 centered assemblings; Then scioptics support the threaded hole 401 of shell, adopt four M2 screws that shell base 102, jewel sheet chip module 2, chip place polyimide pad 301 and lens supports shell 4 are fixed.
5) according to the H1 calculated, get out of a predicament or an embarrassing situation polyimide pad 302 and lower lens 5 are fixed on step 404, the cold screen 6 of lower COMPRESSIONTYPE vertically are pressed in lens supports shell 4 simultaneously.Screw by four M1.6, lens 5 central shafts from lens support tube shell-side face screw 406 centerings are regulated, and maintain static, make itself and chip module center superposition, then the screw by M1.4 is nested in the cold screen 6 of lower lens chuck ring formula on lens 5, unclamps four M1.6 screws at side screw 406 places, and last M1.4 head of screw point glue is fixed, on the fixing lower lens 5 of the cold screen inclined edge surfaces 601 of lower COMPRESSIONTYPE, guarantee that lens center is spacing fixing like this.
6) according to the H2 calculated, top bar polyimide pad 303 and upper lens 7 are fixed on step 405, the cold screen 8 of upper press ring formula vertically are pressed in lens supports shell 4, by the fixing upper lens 7 of the cold screen inclined edge surfaces 801 of upper press ring formula simultaneously.Screw by four M1.6 is regulated lens 7 central shafts from lens support tube shell-side face screw 407, and maintains static, and makes itself and chip module center superposition.
7) by low temperature glue, bandpass filter 902 is glued in pipe cap 9, after waiting solidification by cement, pipe cap threaded portion 901 is spun on lens supports shell 4.Consider that cold screen 8 aspect ratio pipe cap window 902 bottom surfaces of upper press ring formula will exceed 0.1mm to the height of step 405, therefore when the spacing base 904 of pipe cap touches the support of lens shell, support the cold screen 8 of step bottom surface 903 compressing upper press ring formula of pipe cap window 902, thus fixing upper lens 7.After upper lens 7 are fixing, 4 centerings are unclamped at screw 407 places from the side with the M1.6 screw, finally surface of contact 904 is carried out to a glue and fix.Guarantee that like this lens center is spacing fixing.
8) after forming the shell assembly, the shell assembly is fixed on shell on Dewar cold platform 101 by the Titanium Alloy Screw of threaded hole 103 and four M2, covers the window cap 10 that is welded with window 1002, and laser bonding, complete whole Dewar encapsulation, form the Dewar component with shell.
Be more than a kind of assembling and implementation procedure that is encapsulated in the poly-lens profound hypothermia infrared detector package structure in Dewar of this patent.
This patent has the following advantages:
1) version more complicated, but simple possible assembled.
2) whole shell structure adopts brand-new CE7 special alloy, and this alloy has high heat conductance under low temperature (for cutting down 7 times of material), lightweight (density for can cut down material 1/3), the characteristics that linear expansion coefficient and lens Ge are approaching.Select the advantage of CE7 to be:
A. can make the temperature of whole shell structure and the profound hypothermia temperature difference of Dewar cold platform 65K be less than 2K, the internal temperature field is even simultaneously, can guarantee that like this Ge lens have fixing transmitance under profound hypothermia, can also guarantee that shell has enough low background;
B. case temperature is enough low and even, like this under profound hypothermia in shell each lenticular spacing controlled, thereby guarantee that low temperature imaging focal plane position is controlled;
C. the mechanics that adopts light-weighted shell structure greatly to alleviate the Dewar cold platform bears a heavy burden, thereby makes whole Dewar component reliability improve.
3) lens installation structure adopts the form of monoblock type processing, and step dimension can be measured under high-resolution Z axis microscope and three-dimensional simultaneously, can pass through very thin pad machine shop distance, guarantees that the lenticular spacing error is less than the 0.01mm that optical system requires.
4) infrared detector chip is arranged separately on the jewel battery lead plate, scioptics stay pipe shell-and-tube shell base and lens combination high precision centered assembling again, then adopt the screw of 4 M2 to fix and use DW-3 low temperature glue rubber seal gib screw head, compare most of and ceramic co-fired shell structure, the benefit of doing like this is effectively discharge profound hypothermia lowerside stone sheet and can cut down (or CE7) shell due to the stress that different deformation causes by the screw gap, guarantees that chip does not stress.
5) installation of jewel battery lead plate in shell is that scioptics stay pipe shell-and-tube shell base pinch fastens, therefore must carry out precision drilling to stacked jewel sheet, general equipment can't carry out Drilling operation to the jewel sheet, even general infrared laser is due to thermo-effect of infrared radiation, the hole shape of machine-shaping also can't meet request for utilization, and adopt the hi-Fix boring of Ultra-Violet Laser drilling machine not only can greatly improve the machining precision in single hole, can also meet the accuracy requirement of relative position between each hole.Finally can guarantee the centering status requirement that chip is required.
6) adopt the multilayer jewel sheet alternating expression multilayer electrode pin configuration of laser accurate location processing, make jewel battery lead plate lead-in wire rationally, dutycycle is little, is very beneficial for the integrated form encapsulation of shell in Dewar, makes whole Dewar structure little and compact.Finally make the Dewar structure reliability significantly improve.
7) adopt the structure of the cold screen structure of COMPRESSIONTYPE fixed lens group, because four finedraws of its cylinder wire drawing cutting make cold screen have enough elasticity, compare most of structure of directly glueing joint fixed lens, have the advantages that can fixedly secure under easy for installation and low temperature, can easily realize lens replacing maintenance, simultaneously by the operation of side screw centering, make between lens optical axis alignment easier.Because the cold screen of COMPRESSIONTYPE can black coating nickel, and whole shell is gold-plated, can eliminate the gold-plated parasitic light caused of shell after the cold screen of black coating nickel is installed like this, thereby effectively reduce background radiation, finally realizes the desired outer bright interior black designing requirement of optical system.
The accompanying drawing explanation
Fig. 1 is a kind of poly-lens profound hypothermia infrared detector package structure be encapsulated in Dewar;
In figure: 1-shell base;
101-Dewar and shell thermal coupling cold platform;
102-shell chip mounting seat;
The 103-shell is fixed on the installation screw in Dewar;
104-jewel sheet chip module is installed fixedly via hole;
2-infrared acquisition jewel sheet chip module;
201-lowerside stone sheet;
The upper jewel sheet of 202-;
The 203-infrared eye;
3-polyimide pad;
301-chip place polyimide pad;
The 302-polyimide pad of getting out of a predicament or an embarrassing situation;
The 303-polyimide pad of topping bar;
4-lens supports shell;
401-jewel sheet chip module is installed fixing threaded hole;
402-lens supports shell bleeder vent;
Lens and the cold screen fixing threaded hole of lower COMPRESSIONTYPE under 403-;
Lens installation step under 404-;
The upper lens installation step of 405-;
The adjusting threaded hole that under 406-, the lens contraposition is installed;
The adjusting threaded hole that the upper lens contraposition of 407-is installed;
Lens under 5-;
The cold screen of COMPRESSIONTYPE under 6-;
Pressure ring lens stationary plane under 601-;
The upper lens of 7-;
The cold screen of 8-upper press ring formula;
The cold screen lens stationary plane of 801-upper press ring formula;
The 9-pipe cap;
901-pipe cap shell;
The 902-bandpass filter;
903-is the pipe cap bottom surface of the cold screen of upper press ring formula fixedly;
The spacing base of 904-pipe cap;
The 10-window cap;
101-window cap shell;
The 1002-window.
Fig. 2 levels jewel battery lead plate schematic diagram.
Fig. 3 jewel sheet chip module diagram.
Embodiment
Below in conjunction with accompanying drawing, in embodiment, the embodiment of this patent is described in further detail:
The present embodiment is shell structure in 15 μ m very long wave poly-lens profound hypothermia infrared detector dewars, and as shown in Figure 1, its main implementation method is as follows:
1), after part machines, according to the drawing dimensional requirement, whether the check part meets designing requirement.By Z axis measuring microscope and three-coordinates measuring machine measure the lens supports shell from bottom surface (reference field) to step 404, descend the height D1 of lens 5 installed surfaces, and then measure bottom surface (reference field) to step 405, go up the height D2 of lens 7 installed surfaces.
2) the jewel battery lead plate all adopts two-layer staggered being formed by stacking that 0.4mm is thick, and jewel sheet 201 diameters are 42mm, and jewel sheet 202 diameters are 38mm.Two-layer jewel sheet cleans up rear line ion sputtering one deck
The Cr layer of thickness, and then the Au layer of the above thickness of sputter 1 μ m.According to the telegraph circuit layout patterns of design, by photoetching and etching, form telegraph circuit.
3) by the 355nm ultraviolet laser machining system, lowerside stone battery lead plate 201 and upper jewel battery lead plate 202 are carried out to precision positioning boring, the intermediate chip that processes 3mm * 7mm is laid through hole, Φ 2.6mm installs via hole and the wide U-shaped groove of 4mm.
4), under the high precision image instrument, complete jewel battery lead plate 201 and 202 centerings and glued joint, and then glued joint with infrared detector chip 203 centerings.After glue is dry, the jewel battery lead plate is connected with chip 203 gold ball bondings, form jewel sheet chip module 2.Measure the height D3 of the photosensitive first face of chip to upper jewel battery lead plate 202 simultaneously.
5) according to height D1, D2 and D3 value, calculate step 404 to chip photosurface height H 1, step 405 is to chip photosurface height H 2.H1 while considering design, the value of H2 than the little 0.01mm of theoretical required value to 0.02mm, therefore according to the actual computation value, determine in step 404, step 405 and position, three of lens supports shell 4 bottoms type and the quantity of the polyimide ring washer of cushioning 0.005mm or 0.01mm respectively, can guarantee that like this actual value of H1, H2 is less than 0.01mm than theoretical value deviation.
6) under the high precision image instrument, by special centering clamp, shell base 102 and fixture are fixed, like this lens supports shell 4 can with jewel sheet chip module 2 centered assemblings; Then scioptics support the threaded hole 401 of shell, adopt four screws that shell base 102, jewel sheet chip module 2, polyimide pad 301 and lens supports shell 4 are fixed.
7) according to the H1 calculated, get out of a predicament or an embarrassing situation polyimide pad 302 and lower lens 5 are fixed on step 404, the cold screen 6 of lower COMPRESSIONTYPE vertically are pressed in lens supports shell 4 simultaneously.Screw by four M1.6, lens 5 central shafts from lens support tube shell-side face screw 406 centerings are regulated, and maintain static, make itself and chip module center superposition, then the screw by M1.4 is nested in the cold screen 6 of lower lens chuck ring formula on lens 5, unclamp four screws at side screw 406 places, last M1.4 head of screw point glue is fixed.The final lower cold screen inclined edge surfaces 601 of COMPRESSIONTYPE is fixed on lower lens 5, guarantees that lens center is spacing fixing.
8) according to the H2 calculated, top bar polyimide pad 303 and upper lens 7 are fixed on step 405, the cold screen 8 of upper press ring formula vertically are pressed in lens supports shell 4, by the fixing upper lens 7 of the cold screen inclined edge surfaces 801 of upper press ring formula simultaneously.Screw by four M1.6 is regulated lens 7 central shafts from lens support tube shell-side face screw 407, and maintains static, and makes itself and chip module center superposition.
9) by DW-3 low temperature glue, bandpass filter 902 is glued in pipe cap 9, after waiting solidification by cement, pipe cap threaded portion 901 is spun on lens supports shell 4.Consider that cold screen 8 aspect ratio pipe cap window 902 bottom surfaces of upper press ring formula will exceed 0.1mm to the height of step 405, therefore when the spacing base 904 of pipe cap touches the support of lens shell, support the cold screen 8 of step bottom surface 903 compressing upper press ring formula of pipe cap window 902, thus fixing upper lens 7.After upper lens 7 are fixing, 4 centerings are unclamped at screw 407 places from the side with the M1.6 screw, finally surface of contact 904 is carried out to a glue and fix.Guarantee that like this lens center is spacing fixing.
10) after forming the shell assembly, Titanium Alloy Screw by threaded hole 103 and four M2 is fixed on whole shell on Dewar cold platform 101, covers the window cap 10 that is welded with window 1002, and laser bonding, complete whole Dewar encapsulation, form the Dewar component with shell.
More than having completed poly-lens profound hypothermia infrared detector package structure in infrared Dewar realizes and assembling process.
Claims (6)
1. one kind is encapsulated in the interior poly-lens profound hypothermia infrared detector package of Dewar, it comprises: shell base (1), jewel sheet chip module (2), location polyimide (3), lens supports shell (4), lower lens (5), the cold screen of lower lens chuck ring formula (6), upper lens (7), the cold screen of upper lens chuck ring formula (8), pipe cap (9) and dewar window cap (10) is characterized in that:
1) shell base (1) is connected by screw (401) with lens supports shell (4), in the middle of jewel sheet chip module (2) is fixed on;
2) lower lens (5) are placed on lower floor's step (404) of lens supports shell (4), and the above is pressed with the cold screen of lower lens chuck ring formula (6);
3) upper lens (7) are placed on the upper strata step (405) of lens supports shell (4), and the above is pressed with the cold screen of lens chuck ring formula (8);
4) bandpass filter of pipe cap (902) splicing is fixed on pipe cap (9) above, then fixing with lens supports shell (4) location pipe cap (9);
5) whole band lens shell is fixed on Dewar cold platform (101) above after fixedly assembling, and last laser bonding dewar window cap (10), form and comprise the Dewar component with lens combination shell and detector.
2. a kind of poly-lens profound hypothermia infrared detector package be encapsulated in Dewar according to claim 1, it is characterized in that: upper strata jewel battery lead plate (202) and lower floor's jewel battery lead plate (201) of described jewel sheet chip module (2) first carry out the laser high-precision location drilling, each pitch of holes error precision is less than 0.03mm, then lower floor's jewel battery lead plate (201) first glueds joint with upper strata jewel battery lead plate (202) centering, infrared detector chip (203) is glued on lower floor's jewel battery lead plate (201), infrared detector chip connects by gold ball bonding with levels jewel plate electrode simultaneously.
3. a kind of poly-lens profound hypothermia infrared detector package be encapsulated in Dewar according to claim 1, it is characterized in that: the cold screen of described lower lens chuck ring formula (6), the cold screen of upper lens chuck ring formula (8) all adopts thin-wall construction, and these two parts are carried out to the wire drawing joint-cutting.
4. a kind of poly-lens profound hypothermia infrared detector package be encapsulated in Dewar according to claim 1, it is characterized in that: described window (902) is glued on the light hole step of pipe cap (9) with low temperature glue.
5. a kind of poly-lens profound hypothermia infrared detector package be encapsulated in Dewar according to claim 1, it is characterized in that: described shell base (1), lens supports shell (4) and pipe cap (9) all adopt the CE7 alloy be complementary with the Ge expansion coefficient under extraordinary high thermal conductance, low temperature, and shell base (1), lens supports shell (4) and pipe cap (9) surface finish are gold-plated.
6. a kind of poly-lens profound hypothermia infrared detector package be encapsulated in Dewar according to claim 1, it is characterized in that: the cold screen of described lower lens chuck ring formula (6) and the cold screen of upper lens chuck ring formula (8) all adopt the kovar alloy material, and the cold screen of lower lens chuck ring formula (6), the cold screen of upper lens chuck ring formula (8) surface electrical black coating nickel are processed.
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| CN 201220571670 CN202956190U (en) | 2012-11-01 | 2012-11-01 | Multi-lens profound hypothermia infrared detector shell packaged in Dewar |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220571670 CN202956190U (en) | 2012-11-01 | 2012-11-01 | Multi-lens profound hypothermia infrared detector shell packaged in Dewar |
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| CN202956190U true CN202956190U (en) | 2013-05-29 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105185804A (en) * | 2015-09-23 | 2015-12-23 | 中航（重庆）微电子有限公司 | Focal plane array device packaging structure and packaging method |
| CN105318973A (en) * | 2015-11-13 | 2016-02-10 | 深圳通感微电子有限公司 | A self-focusing lens thermopile sensor and an assembly process therefor |
| CN106404188A (en) * | 2016-08-26 | 2017-02-15 | 淄博博山新颖传感器厂 | Anti-compression impact-resistant pyroelectric infrared detector |
| CN107340061A (en) * | 2017-05-31 | 2017-11-10 | 中国电子科技集团公司第十研究所 | A kind of infrared detector ice chest |
| CN109186780A (en) * | 2018-07-24 | 2019-01-11 | 北京空间机电研究所 | Spaceborne infrared remote sensor device profound hypothermia classification refrigeration and insulation system |
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2012
- 2012-11-01 CN CN 201220571670 patent/CN202956190U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105185804A (en) * | 2015-09-23 | 2015-12-23 | 中航（重庆）微电子有限公司 | Focal plane array device packaging structure and packaging method |
| CN105185804B (en) * | 2015-09-23 | 2019-05-03 | 华润微电子（重庆）有限公司 | The encapsulating structure and packaging method of focal plane array device |
| CN105318973A (en) * | 2015-11-13 | 2016-02-10 | 深圳通感微电子有限公司 | A self-focusing lens thermopile sensor and an assembly process therefor |
| CN106404188A (en) * | 2016-08-26 | 2017-02-15 | 淄博博山新颖传感器厂 | Anti-compression impact-resistant pyroelectric infrared detector |
| CN106404188B (en) * | 2016-08-26 | 2017-09-19 | 淄博博山新颖传感器厂 | A kind of resistance to compression shock resistance pyroelectric infrared detector |
| CN107340061A (en) * | 2017-05-31 | 2017-11-10 | 中国电子科技集团公司第十研究所 | A kind of infrared detector ice chest |
| CN107340061B (en) * | 2017-05-31 | 2020-01-24 | 中国电子科技集团公司第十一研究所 | Infrared detector cold box |
| CN109186780A (en) * | 2018-07-24 | 2019-01-11 | 北京空间机电研究所 | Spaceborne infrared remote sensor device profound hypothermia classification refrigeration and insulation system |
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Granted publication date: 20130529 Termination date: 20151101 |
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