CN202905685U - Telescopic vacuum suction pen - Google Patents
Telescopic vacuum suction pen Download PDFInfo
- Publication number
- CN202905685U CN202905685U CN 201220607550 CN201220607550U CN202905685U CN 202905685 U CN202905685 U CN 202905685U CN 201220607550 CN201220607550 CN 201220607550 CN 201220607550 U CN201220607550 U CN 201220607550U CN 202905685 U CN202905685 U CN 202905685U
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- Prior art keywords
- suction
- suction pipe
- telescopic vacuum
- telescopic
- cone
- Prior art date
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- Expired - Fee Related
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Abstract
The utility model relates to a tool used during the solar cell manufacturing process, and particularly relates to a telescopic vacuum suction pen for sucking raw material silicon slices. The telescopic vacuum suction pen comprises multiple sections of suction tubes which can be nested with each other and can be telescopic relatively; the lower end of the suction tube in the outer layer and the outer wall of the inner layer suction tube are sealed and contacted; the upper end of the suction tube in the outmost layer is connected with an elastic air bag; and the lower end of the suction tube in the innermost layer is connected with a suction mouth. The telescopic vacuum suction pen is simple in structure, convenient in operation, and can be applied to different operation spaces with the telescopic structure and the suction mouth whose direction can be adjusted; and with the two-section-type elastic air bag, stability of suction can be improved, and sucking silicon slices can be ensured to be reliable.
Description
Technical field
The utility model relates to the instrument that uses in the solar cell manufacture process, specifically a kind of telescopic vacuum WAND that is used for picking up the raw material silicon chip.
Background technology
In the crystal silicon cell manufacture process, modal situation is still utilized and is manually got sheet or inserted sheet, considers the requirement of the antistatic of silicon chip, and operating personnel must the static electrification gloves in when operation, otherwise the q﹠r of silicon chip can be affected.But when manually getting sheet, dynamics, posture is improper then can be to the silicon chip injury, and perhaps silicon chip is in some position of equipment in manufacture process, cannot get with hand.
Afterwards, some vacuum WANDs occurred, vacuum WAND global shape and size are similar with general pen, one end connects an air bag, and the other end arranges suction nozzle, and one or several aperture that usually only distributes on the suction nozzle, if silicon chip surface has small out-of-flatness like this, then be easy to sheet.In addition, because a suction limited length of this type is difficult to the silicon chip absorption of ad-hoc location, bring very large inconvenience to producers.
The air bag that some other vacuum WAND does not carry needs to connect outside compressed air source, inhales pen and can only use in fixed range when getting sheet, perhaps because peripheral pressure instability, air pressure is fluctuated, is easy to inhale broken silicon wafers, and its equipment cost is also higher in addition.
Summary of the invention
The invention provides a kind of easy to usely, with low cost, can reliably pick up the telescopic vacuum WAND of silicon chip.
Telescopic vacuum WAND of the present utility model includes the suction pipe that multistage is mutually nested and can relatively stretch, and outer field suction pipe lower end contacts with the sealing of internal layer suction pipe outer wall, outermost suction pipe upper end connects an elastic bag, and the suction pipe lower end of innermost layer connects a suction nozzle.
Described elastic bag is by the larger utricule of two diameters and be connected to two less ducts of the diameter between the utricule and form.
Described suction nozzle includes a cone-shaped cavity, and the cone-shaped cavity top communicates with suction pipe, and air-breathing aperture gathers in the cone-shaped cavity bottom.
Be connected by one section flexible hose between described suction pipe and the suction nozzle, with the convenient direction of adjusting suction nozzle.
The utility model is simple in structure, easy to operate; The suction nozzle of each capable of regulating direction of structure that it is flexible can be adapted to different operating spaces; The elastic bag of its two-part can improve air-breathing stability, guarantees reliably to pick up silicon chip.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the suction nozzle structure for amplifying schematic diagram of the utility model embodiment.
Embodiment
As shown in the figure, this telescopic vacuum WAND includes the suction pipe 1 that multistage is mutually nested and can relatively stretch, and outer field suction pipe lower end contacts with the sealing of internal layer suction pipe outer wall, and outermost suction pipe upper end connects an elastic bag 2, and the suction pipe lower end of innermost layer connects a suction nozzle 3.Elastic bag 2 is by the larger utricule 21 of two diameters and be connected to two less ducts 22 of the diameter between the utricule and form.Suction nozzle 3 includes a cone-shaped cavity, and the cone-shaped cavity top communicates with suction pipe, and air-breathing aperture 31 gathers in the cone-shaped cavity bottom.Be connected by one section flexible hose 4 between suction pipe 1 and the suction nozzle 3, with the convenient direction of adjusting suction nozzle.
Claims (4)
1. telescopic vacuum WAND, it is characterized in that: it includes the suction pipe (1) that multistage is mutually nested and can relatively stretch, and outer field suction pipe lower end contacts with the sealing of internal layer suction pipe outer wall, outermost suction pipe upper end connects an elastic bag (2), and the suction pipe lower end of innermost layer connects a suction nozzle (3).
2. telescopic vacuum WAND according to claim 1 is characterized in that: elastic bag (2) is by the larger utricule (21) of two diameters and be connected to two less ducts (22) of the diameter between the utricule and form.
3. telescopic vacuum WAND according to claim 1 is characterized in that: be connected by one section flexible hose (4) between suction pipe (1) and the suction nozzle 3.
4. described telescopic vacuum WAND one of according to claim 1-3, it is characterized in that: suction nozzle (3) includes a cone-shaped cavity, and the cone-shaped cavity top communicates with suction pipe, and air-breathing aperture (31) gathers in the cone-shaped cavity bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220607550 CN202905685U (en) | 2012-11-17 | 2012-11-17 | Telescopic vacuum suction pen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220607550 CN202905685U (en) | 2012-11-17 | 2012-11-17 | Telescopic vacuum suction pen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202905685U true CN202905685U (en) | 2013-04-24 |
Family
ID=48126319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220607550 Expired - Fee Related CN202905685U (en) | 2012-11-17 | 2012-11-17 | Telescopic vacuum suction pen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202905685U (en) |
-
2012
- 2012-11-17 CN CN 201220607550 patent/CN202905685U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20201117 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |