CN202868626U

CN202868626U - Radiating structure for high-power LED

Info

Publication number: CN202868626U
Application number: CN2012202559596U
Authority: CN
Inventors: 李勇; 揭志伟; 陈举聪; 曾志新
Original assignee: South China University of Technology SCUT
Current assignee: South China University of Technology SCUT
Priority date: 2012-05-31
Filing date: 2012-05-31
Publication date: 2013-04-10
Anticipated expiration: 2022-05-31

Abstract

The utility model discloses a radiating structure for high-power LED. The radiating structure for high-power LED comprises an LED, an LED array packaging base plate, flat micro heat pipes, a supporting structure and a radiating fin which are fixed from the top down in sequence; and the flat micro heat pipes are embedded in a cavity of the supporting structure at intervals and are corresponding to LED arrays in position. The flat micro heat pipes with heat conducting layers are thin in thickness, small in size, high in thermal conductivity, good in homeothermy performance, lower in cost, and mature in manufacture process; when the flat micro heat pipes are used with aluminum profile, complicated manufacturing techniques such as welding can be avoided; and the flat micro heat pipes and the aluminum profile are used for radiating of high-power LED integrated packaging chips after being assembled directly, so that the radiating effect can be improved, the manufacturing cost can be lowered, and the radiating structure for high-power LED is favorable for high-power LEDs in application of illuminating lamps and has broad market prospects.

Description

A kind of high-power LED radiating structure

Technical field

The utility model relates to electronic component heat radiating structure, specifically a kind of high-power LED radiating structure.

Background technology

In today of global energy crisis, the advantages such as LED is low with its energy consumption, long service life have boundless application prospect.At present, great power LED adopts aluminium base as the integrated heat dissipation structure, and its manufacture craft is simple, cost is low, but radiating effect is unsatisfactory, affects the service life of LED, and especially heat dissipation problem is particularly severe concerning great power LED.

Summary of the invention

The purpose of this utility model is to overcome the shortcoming and defect of above-mentioned prior art, and a kind of a kind of high-power LED radiating structure of simple in structure, good heat dissipation is provided.

The utility model is achieved through the following technical solutions:

A kind of high-power LED radiating structure, comprise the LED, led array base plate for packaging, flat micro heat pipe, supporting construction, the radiating fin that are fixedly installed successively from top to bottom, described flat micro heat pipe interval is embedded in the cavity of supporting construction, and the position of described flat micro heat pipe is corresponding with the led array position.

Offer installing hole on the described led array base plate for packaging, installing hole is fixedly connected with supporting construction by connector.

Described flat micro heat pipe outer surface scribbles heat-conducting layer; Also be filled with heat-conducting layer in the gap between the outer surface of described flat micro heat pipe and the cavity of supporting construction.

This end cover that only is mated of the two ends of described supporting construction.

Described radiating fin and supporting construction are the integral type molding structure.

The cross sectional shape of described radiating fin is a kind of in fan-shaped or the rectangle.

Compared with prior art the beneficial effects of the utility model are: the led array base plate for packaging directly adopts connector (such as bolt) to be connected with radiating fin, removes complicated welding procedure from, and can change easily dismounting; The hole position corresponding with installing hole on the led array base plate for packaging all can be offered in the edge of supporting construction and center, satisfies installation requirements; Radiating fin can design polytype, satisfies the demand of outward appearance variation and heat radiation.

Have heat-conducting layer flat micro heat pipe thin thickness, volume is little, thermal conductivity is high, average temperature performance is good, cost is low, manufacture craft is ripe and cost is lower, collocation is used with aluminium section bar, can avoid the complex fabrication process such as welding, the two can improve radiating effect by the directly rear heat radiation that is used for the high power LED integration packaging chip of assembling, reduces manufacturing cost, be conducive to great power LED and use as lighting, have wide market prospects.

The utility model technological means is simple and easy to do, has positive technique effect and application value.

Description of drawings

Fig. 1 is the utility model assembly structure schematic diagram;

Fig. 2 is the utility model partial structurtes schematic diagrames;

Fig. 3 is the structural representation after the utility model assembling;

Fig. 4 is the another kind of structural representation of the utility model assembling.

The specific embodiment

Below in conjunction with specific embodiment the utility model is done further concrete detailed description the in detail, but embodiment of the present utility model is not limited to this, the technological parameter for not indicating especially can carry out with reference to routine techniques.

Embodiment

As shown in Figure 1 and Figure 2.The utility model high-power LED radiating structure, comprise the LED7, led array base plate for packaging 1, flat micro heat pipe 2, supporting construction 5, the radiating fin 4 that are fixedly installed successively from top to bottom, described flat micro heat pipe 2 intervals are embedded in the cavity of supporting construction 5, and the position of described flat micro heat pipe 2 is corresponding with the led array position.The metal material that led array base plate for packaging 1 adopts aluminium or copper etc. to have the good heat conductive performance is made.

As shown in Figure 1.Offering installing hole 6(quantity on the described led array base plate for packaging 1 does not limit), installing hole 6 is fixedly connected with supporting construction 5 by connector, combines closely by connector and led array base plate for packaging 1, guarantees that overall structure is reliable.Connect by connector (such as bolt), do not have the welding procedure of any complexity, simple to operate, be easy to change.

As shown in Figure 1 and Figure 2.The one side of flat micro heat pipe 2 contacts with radiating fin 4, another side contacts with led array base plate for packaging 1 bottom surface, fills heat-conducting layer (Heat Conduction Material) between the slit, so just forms heat transfer path, take the heat of LED to the radiating fin zone, again by the convection current heat loss through radiation.

As shown in Figure 2.Described flat micro heat pipe 2 outer surfaces scribble heat-conducting layer; Also be filled with heat-conducting layer in the gap between the cavity of the outer surface of described flat micro heat pipe 2 and supporting construction 5.Such as heat-conducting glue 9, get rid of ambient air, improve its heat conductivility.

This end cover that only is mated 3 of the two ends of described supporting construction 5.

Described radiating fin 4 is the integral type molding structure with supporting construction 5.

As shown in Figure 3, Figure 4.The cross sectional shape of described radiating fin 4 is a kind of in fan-shaped or the rectangle.Design according to the actual requirements its geomery, can be for vertical types such as array type, circumference radial pattern etc.

Just can realize preferably the utility model as mentioned above.

Above-described embodiment is the better embodiment of the present invention; but embodiment of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.

Claims

1. high-power LED radiating structure, it is characterized in that, comprise the LED, led array base plate for packaging, flat micro heat pipe, supporting construction, the radiating fin that are fixedly installed successively from top to bottom, described flat micro heat pipe interval is embedded in the cavity of supporting construction, and the position of described flat micro heat pipe is corresponding with the led array position.

2. high-power LED radiating structure according to claim 1 is characterized in that, offers installing hole on the described led array base plate for packaging, and installing hole is fixedly connected with supporting construction by connector.

3. high-power LED radiating structure according to claim 1 and 2 is characterized in that, described flat micro heat pipe outer surface scribbles heat-conducting layer; Also be filled with heat-conducting layer in the gap between the outer surface of described flat micro heat pipe and the cavity of supporting construction.

4. high-power LED radiating structure according to claim 3 is characterized in that, the two ends of described supporting construction are provided with the end cover that is mated.

5. high-power LED radiating structure according to claim 3 is characterized in that, described radiating fin and supporting construction are the integral type molding structure.

6. high-power LED radiating structure according to claim 3 is characterized in that, the cross sectional shape of described radiating fin is a kind of in fan-shaped or the rectangle.