CN202846036U - Soldering wire - Google Patents
Soldering wire Download PDFInfo
- Publication number
- CN202846036U CN202846036U CN 201220448413 CN201220448413U CN202846036U CN 202846036 U CN202846036 U CN 202846036U CN 201220448413 CN201220448413 CN 201220448413 CN 201220448413 U CN201220448413 U CN 201220448413U CN 202846036 U CN202846036 U CN 202846036U
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- China
- Prior art keywords
- layer
- tin
- anti oxidation
- tin layer
- soldering
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A soldering wire comprises a soldering-aid layer, a first tin layer, a second tin layer, a first anti-oxidation layer and a second anti-oxidation layer, wherein the first tin layer is coated on the soldering-aid layer and the first anti-oxidation layer. The second tin layer is arranged between the soldering-aid layer and the first anti-oxidation layer, the soldering-aid layer and the first anti-oxidation layer are completely separated from each other by the second tin layer, and the second anti-oxidation layer is coated on the first tin layer. According to the soldering wire, through improvement of a soldering wire structure, scaling powder is not needed to be additionally added when the soldering wire is soldered, and the soldering wire can be prevented from being oxidized when the soldering wire is stored and soldered, and therefore fastness of a soldered dot is guaranteed.
Description
Technical field
The utility model relates to a kind of soldering structure, particularly about a kind of the solder reduction.
Background technology
Scolding tin is the essential industry raw material of connecting electronic components and parts in the welding circuit, is widely used in electronics industry, household appliances manufacturing, auto manufacturing, maintenance industry and the daily life.
The solder reduction is manual welding circuit board, the most easily scolder.The solder reduction can be divided into Pb-free solder and lead welding tin is arranged by its metal ingredient.The different solder of composition has different fusing points, and purposes is also had nothing in common with each other.
In welding process, the scaling powder additive that is absolutely necessary, but because the bad control of its consumption; usually can affect the fastness of solder joint, and the solder reduction the surface directly contact with air, deposit in the process easily oxidized; and under the hot environment of welding, the oxidation situation is even more serious.
The utility model content
In order to overcome defects, the utility model provides a kind of the solder reduction, by the improvement to the solder reduction structure, so that need not extra interpolation scaling powder when welding, and can prevent that solder stick is oxidized when depositing and weld, thus guaranteed the fastness of solder joint.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of the solder reduction, comprise and help layer, the first tin layer, the second tin layer, the first anti oxidation layer and the second anti oxidation layer, wherein, this the first tin layer coats this and helps layer and this first anti oxidation layer, this the second tin layer is located at this and is helped between layer and this first anti oxidation layer, and helps layer and this first anti oxidation layer to separate fully this, and this second anti oxidation layer coats this first tin layer.
As further improvement of the utility model, this first tin layer is connected with this second tin layer.
As further improvement of the utility model, the rounded structure in the cross section of this solder reduction.
As further improvement of the utility model, the cross section of this first tin layer is cirque structure.
As further improvement of the utility model, the rectangular structure in cross section of this second tin layer.
As further improvement of the utility model, the cross section of this ORC is cirque structure.
The beneficial effects of the utility model are: the utility model passes through the improvement to the solder reduction structure, so that need not extra interpolation scaling powder when welding, and can prevent that solder stick is oxidized when depositing and weld, thus guaranteed the fastness of solder joint.
Description of drawings
Fig. 1 is the schematic diagram of the solder reduction of the present utility model;
Fig. 2 is that Fig. 1 is along the schematic cross-section of A-A ' direction.
The specific embodiment
Each embodiment of this case below will be described in detail in detail, and cooperate diagram as illustration.Except these were described in detail, the utility model can also be implemented among other the embodiment widely, the substituting easily of any described embodiment, revise, equivalence changes and is included in the scope of this case, and with after claim be as the criterion.In the description of specification, in order to make the reader the utility model there is more complete understanding, many specific detail are provided; Yet the utility model may at clipped or all under the prerequisite of these specific detail, still can be implemented.In addition, well-known step or element are not described in the details, with the restriction of avoiding causing the utility model unnecessary.Assembly identical or similar in the diagram will represent with identical or simileys.What pay special attention to is that diagram only is the usefulness of signal, is not size or the quantity of representation element reality, unless otherwise specified.
As shown in Figures 1 and 2, wherein, Fig. 2 be Fig. 1 along the schematic cross-section of A-A ' direction, a kind of the solder reduction 10 comprises and helps layer 11, the first tin layer 121, the second tin layer 122, the first anti oxidation layer 131 and the second anti oxidation layer 132, wherein, the first tin layer 121 coats and helps layer 11 and the first anti oxidation layer 131, the second tin layers 122 to be located to help between layer 11 and the first anti oxidation layer 131, and will help layer 11 and the first anti oxidation layer 131 to separate fully, the second anti oxidation layer 132 coats the first tin layer 121.The rounded structure in the cross section of the solder reduction 10.
Wherein, the material that helps layer 11 is the mixture take rosin as main component, and its composition comprises organic solvent, abietic resin and derivative thereof, synthetic resin surfactant, organic acid for activating agent, anticorrosive, cosolvent, film forming agent.Help between layer 11 and the first anti oxidation layer 131 by the second tin layer 122 and separate, can not react because of being in contact with one another to guarantee to help between layer 11 and the first anti oxidation layer 131, thereby affect both performance.In welding process, help layer 11 can remove the oxide on scolder and welded mother metal surface, make the metal surface reach necessary cleannes, the again oxidation on surface when preventing from welding reduces solder surface tension force, improves welding performance.
The first tin layer 121 is identical with the material of the second tin layer 122, be mainly metallic tin, 121 coating of the first tin layer help layer 11 and the first anti oxidation layer 131, the second tin layers 122 to be located at and help between layer 11 and the first anti oxidation layer 131, and will help layer 11 and the first anti oxidation layer 131 to separate fully.The first tin layer 121 is connected with the second tin layer 122.The cross section of the first tin layer 121 is cirque structure, the rectangular structure in the cross section of the second tin layer 122.
The first anti oxidation layer 131 is identical with the material of the second anti oxidation layer 132, mainly is made of anti-oxidant powder, and its composition is the nonmetallic mineral combination of materials.When welding, the first anti oxidation layer 131 contacts at scolding tin surface formation crystalline solid with melting scolding tin, and the isolation tin liquor contacts with airborne oxygen, prevents the tin liquor oxidation, will carry out decomposition-reduction to scruff simultaneously and reach the generation of minimizing scruff.The second anti oxidation layer 132 coats the first tin layer 121, can prevent first tin layer 121 oxidation by air in depositing process.The cross section of the second anti oxidation layer 132 is cirque structure.
In sum, the utility model passes through the improvement to the solder reduction structure, so that need not extra interpolation scaling powder when welding, and can prevent that solder stick is oxidized when depositing and weld, thus guaranteed the fastness of solder joint.
Claims (6)
1. the solder reduction, comprise and help layer, the first tin layer, the second tin layer, the first anti oxidation layer and the second anti oxidation layer, wherein, this the first tin layer coats this and helps layer and this first anti oxidation layer, this the second tin layer is located at this and is helped between layer and this first anti oxidation layer, and helps layer and this first anti oxidation layer to separate fully this, and this second anti oxidation layer coats this first tin layer.
2. the solder reduction as claimed in claim 1 is characterized in that, this first tin layer is connected with this second tin layer.
3. the solder reduction as claimed in claim 1 is characterized in that, the rounded structure in the cross section of this solder reduction.
4. the solder reduction as claimed in claim 1 is characterized in that, the cross section of this first tin layer is cirque structure.
5. the solder reduction as claimed in claim 1 is characterized in that, the rectangular structure in cross section of this second tin layer.
6. the solder reduction as claimed in claim 1 is characterized in that, the cross section of this second anti oxidation layer is cirque structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220448413 CN202846036U (en) | 2012-09-05 | 2012-09-05 | Soldering wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220448413 CN202846036U (en) | 2012-09-05 | 2012-09-05 | Soldering wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202846036U true CN202846036U (en) | 2013-04-03 |
Family
ID=47977272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220448413 Expired - Fee Related CN202846036U (en) | 2012-09-05 | 2012-09-05 | Soldering wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202846036U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103418927A (en) * | 2013-08-27 | 2013-12-04 | 昆山市宏嘉焊锡制造有限公司 | Improved solder wire |
| CN103433640A (en) * | 2013-08-24 | 2013-12-11 | 昆山市宏嘉焊锡制造有限公司 | Anti-spattering soldering tin wire structure |
-
2012
- 2012-09-05 CN CN 201220448413 patent/CN202846036U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433640A (en) * | 2013-08-24 | 2013-12-11 | 昆山市宏嘉焊锡制造有限公司 | Anti-spattering soldering tin wire structure |
| CN103418927A (en) * | 2013-08-27 | 2013-12-04 | 昆山市宏嘉焊锡制造有限公司 | Improved solder wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20130905 |