CN202780259U - Solder wire - Google Patents
Solder wire Download PDFInfo
- Publication number
- CN202780259U CN202780259U CN 201220448164 CN201220448164U CN202780259U CN 202780259 U CN202780259 U CN 202780259U CN 201220448164 CN201220448164 CN 201220448164 CN 201220448164 U CN201220448164 U CN 201220448164U CN 202780259 U CN202780259 U CN 202780259U
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- China
- Prior art keywords
- layer
- tin layer
- tin
- solder
- helps
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Abstract
The utility model provides a solder wire which comprises a first tin layer, a soldering aid layer and a second tin layer, wherein the first tin layer is coated with the soldering aid layer; the soldering aid layer is coated with the second tin layer; at least two openings are formed in the second tin layer; and intervals between the openings are equal. Through the improvement of a solder wire structure, a soldering flux is uniformly distributed in the solder wire, so that the soldering flux can be released uniformly in the soldering process, and the fastness of soldering spots is ensured.
Description
Technical field
The utility model relates to a kind of soldering structure, particularly about a kind of the solder reduction.
Background technology
Scolding tin is the essential industry raw material of connecting electronic components and parts in the welding circuit, is widely used in electronics industry, household appliances manufacturing, auto manufacturing, maintenance industry and the daily life.
The solder reduction is manual welding circuit board, the most easily scolder.The solder reduction can be divided into Pb-free solder and lead welding tin is arranged by its metal ingredient.The different solder of composition has different fusing points, and purposes is also had nothing in common with each other.
In welding process, the scaling powder additive that is absolutely necessary, but because the bad control of its consumption, usually can affect the fastness of solder joint.
The utility model content
In order to overcome defects, the utility model provides a kind of the solder reduction, and by the improvement to the solder reduction structure, scaling powder is uniformly distributed in the solder reduction, so that in welding process, scaling powder can evenly discharge, thereby has guaranteed the fastness of solder joint.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of the solder reduction, comprise the first tin layer, help layer, the second tin layer, wherein, this helps layer to coat this first tin layer, and this second tin layer coats this and helps layer, and this second tin layer offers at least two openings, and the spacing between each opening equates.
As further improvement of the utility model, the rounded structure in the cross section of this solder reduction.
As further improvement of the utility model, this helps the cross section of layer to be cirque structure.
As further improvement of the utility model, the rounded structure in cross section of this first tin layer.
As further improvement of the utility model, the cross section of this second tin layer is cirque structure.
As further improvement of the utility model, this helps tight between layer and the first tin layer.
As further improvement of the utility model, this helps tight between layer and this second tin layer.
The beneficial effects of the utility model are: by the improvement to the solder reduction structure, scaling powder is uniformly distributed in the solder reduction, so that in welding process, scaling powder can evenly discharge, thereby has guaranteed the fastness of solder joint.
Description of drawings
Fig. 1 is the schematic diagram of the solder reduction of the present utility model;
Fig. 2 is that Fig. 1 is along the schematic cross-section of A-A ' direction.
The specific embodiment
Each embodiment of this case below will be described in detail in detail, and cooperate diagram as illustration.Except these were described in detail, the utility model can also be implemented among other the embodiment widely, the substituting easily of any described embodiment, revise, equivalence changes and is included in the scope of this case, and with after claim be as the criterion.In the description of specification, in order to make the reader the utility model there is more complete understanding, many specific detail are provided; Yet the utility model may at clipped or all under the prerequisite of these specific detail, still can be implemented.In addition, well-known step or element are not described in the details, with the restriction of avoiding causing the utility model unnecessary.Assembly identical or similar in the diagram will represent with identical or simileys.What pay special attention to is that diagram only is the usefulness of signal, is not size or the quantity of representation element reality, unless otherwise specified.
As shown in Figures 1 and 2, wherein, Fig. 2 be Fig. 1 along the schematic cross-section of A-A ' direction, a kind of the solder reduction 10, comprise the first tin layer 11, help layer 12, the second tin layers 13, wherein, help layer 12 to coat the first tin layer 11,13 layers of coating of the second tin help layer 12, and the second tin layer 13 offers at least two openings 131, and the spacing between each opening equates.The rounded structure in the cross section of the solder reduction 10.
Wherein, the material of the first tin layer 11 is mainly metallic tin, helps layer 12 to coat the rounded structure in cross section of the first tin layer 11, the first tin layer 11.
The material that helps layer 12 is the mixture take rosin as main component, and its composition comprises organic solvent, abietic resin and derivative thereof, synthetic resin surfactant, organic acid for activating agent, anticorrosive, cosolvent, film forming agent.Help the cross section of layer 12 to be cirque structure.Suitable in order to guarantee to help the consumption of layer 12, help gapless between layer 12 and the first tin layer 11, gapless perhaps and between the second tin layer 13.To help layer 12 to be located between the first tin layer 11 and the second tin layer 13, can reach when welding, help more direct effect what tin layer of layer 12.In welding process, help layer 12 can remove the oxide on scolder and welded mother metal surface, make the metal surface reach necessary cleannes, the again oxidation on surface when preventing from welding reduces solder surface tension force, improves welding performance.
The material of the second tin layer 13 is mainly metallic tin, the second tin layer 13 coats and helps layer 12, and offer two openings 131, spacing between each opening equates, being provided with of opening 131 is beneficial to the internal pressure that produces that discharges the solder reduction 10 when being subject to high temperature, thereby avoid the generation of the situations such as sputter, the quantity of opening 131 is not limited to two, can be a plurality of.The cross section of the second tin layer 13 is cirque structure.
In sum, by the improvement to the solder reduction structure, scaling powder is uniformly distributed in the solder reduction, so that in welding process, scaling powder can evenly discharge, thereby has guaranteed the fastness of solder joint.
Claims (7)
1. a solder reduction comprises the first tin layer, helps layer, the second tin layer, and wherein, this helps layer to coat this first tin layer, and this second tin layer coats this and helps layer, and this second tin layer offers at least two openings, and the spacing between each opening equates.
2. the solder reduction as claimed in claim 1 is characterized in that, the rounded structure in the cross section of this solder reduction.
3. the solder reduction as claimed in claim 1 is characterized in that, this helps the cross section of layer to be cirque structure.
4. the solder reduction as claimed in claim 1 is characterized in that, the rounded structure in cross section of this first tin layer.
5. the solder reduction as claimed in claim 1 is characterized in that, the cross section of this second tin layer is cirque structure.
6. the solder reduction as claimed in claim 1 is characterized in that, this helps tight between layer and the first tin layer.
7. the solder reduction as claimed in claim 1 is characterized in that, this helps tight between layer and this second tin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220448164 CN202780259U (en) | 2012-09-05 | 2012-09-05 | Solder wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220448164 CN202780259U (en) | 2012-09-05 | 2012-09-05 | Solder wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202780259U true CN202780259U (en) | 2013-03-13 |
Family
ID=47807598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220448164 Expired - Fee Related CN202780259U (en) | 2012-09-05 | 2012-09-05 | Solder wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202780259U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433640A (en) * | 2013-08-24 | 2013-12-11 | 昆山市宏嘉焊锡制造有限公司 | Anti-spattering soldering tin wire structure |
| CN103978318A (en) * | 2014-04-25 | 2014-08-13 | 浙江新锐焊接材料有限公司 | Round sandwich self-fluxing brazing filler metal and preparation method thereof |
-
2012
- 2012-09-05 CN CN 201220448164 patent/CN202780259U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433640A (en) * | 2013-08-24 | 2013-12-11 | 昆山市宏嘉焊锡制造有限公司 | Anti-spattering soldering tin wire structure |
| CN103978318A (en) * | 2014-04-25 | 2014-08-13 | 浙江新锐焊接材料有限公司 | Round sandwich self-fluxing brazing filler metal and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20130905 |