CN202825476U - Grinding and polishing device for accelerating corrosion in radiation temperature field - Google Patents
Grinding and polishing device for accelerating corrosion in radiation temperature field Download PDFInfo
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- CN202825476U CN202825476U CN 201220407154 CN201220407154U CN202825476U CN 202825476 U CN202825476 U CN 202825476U CN 201220407154 CN201220407154 CN 201220407154 CN 201220407154 U CN201220407154 U CN 201220407154U CN 202825476 U CN202825476 U CN 202825476U
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- temperature field
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- corrosive liquid
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Abstract
The utility model provides a grinding and polishing device for accelerating corrosion in a radiation temperature field. The grinding and polishing device mainly solves the problems that the conventional optical elements, especially aspheric optical elements have higher machining cost and lower machining efficiency. The grinding and polishing device for accelerating corrosion in the radiation temperature field comprises a carrying mechanism used for carrying elements to be machined and a corrosive liquid storage tank; the carrying mechanism makes the elements to be machined completely soaked in the corrosive liquid storage tank; a transparent grinding tool is arranged and is mechanically contacted with workpieces to be machined; temperature field generation equipment is connected with a control mechanism; and the carrying mechanism and the corrosive liquid storage tank are fixedly arranged on a rotating shaft. The grinding and polishing device can quickly polish the aspheric optical elements, is suitable for grinding and polishing large-aperture optical elements and is low in cost.
Description
Technical field
The present invention relates to a kind of optical element processing unit (plant), be specifically related to the grinding and polishing device of the radiation temperature field accelerated corrosion of a kind of applicable heavy caliber, the quick grinding and polishing of aspherical optical element.
Background technology
Aspherical optical element has corrects multiple aberration, improves image quality, simplifies optical system and enlarges the plurality of advantages such as visual field, is used widely in the numerous photovoltaic in dual-use field.Apparatus expensive, precision are low, the problem of inefficiency but aspheric processing still exists, and have seriously restricted the development of related industry and scientific research project.
At present optics processing comprises the advanced technologies such as CCOS, magnetorheological, ion beam, and the small abrasive nose technology has become the main manufacturing process of aperture aspherical optical elements at present.The advantage of small abrasive nose is based on the removal function of Gaussian, easily realizes quantitatively control, and little edge effect is arranged.But its major defect is the generation high frequency error, working (machining) efficiency is low and relevant device is expensive.Based on the polishing technology of large bistrique, it is the effective means that significantly improves aspherical mirror machining efficient.Main large bistrique technology comprises strain disc technology and stress mirror technology at present, and wherein stress mirror technology adopts the whole mirror polish method of sphere, has more excellent working (machining) efficiency, but because its principle of elasticity changes the processing that technology can only be used for ultra-thin mirror.
Summary of the invention
The invention provides the grinding and polishing device of a kind of radiation temperature field accelerated corrosion, mainly solved existing optical element, especially to add the man-hour cost higher for aspherical optical element, the problem that working (machining) efficiency is lower.
Technical solution of the present invention is:
The grinding and polishing device of this radiation temperature field accelerated corrosion comprises that be used to the load carrier that carries processed element and corrosive liquid reservoir load carrier all is immersed in the corrosive liquid reservoir processed element; Dispose transparent grinding tool, with the workpiece to be machined Mechanical Contact; The temperature field generates equipment and control mechanism and connects; Described load carrier and corrosive liquid reservoir all are fixedly installed on the rotating shaft.
Above-mentioned load carrier, corrosive liquid reservoir, grinding tool and temperature field generate equipment and all are arranged in the confined space.
Above-mentioned controlling organization comprises the controller that generates equipment connection with the temperature field, and controller one end and temperature field generate equipment connection, and the other end is connected with Industrial PC.
The said temperature field generates equipment and can select microwave formula temperature field to generate equipment, projection temperature field generation equipment or other temperature field generation equipment.
Advantage of the present invention is:
1, can realize the fast polishing of aspherical optical element.The present invention has realized aspheric whole polishing, rather than endless belt commonly used is repaiied throwing; In addition chemical attack mechanism is introduced optics processing, and realized the quickening of corrosion rate by heating, significantly improved the material removal level of optical element.
2, be fit to and the grinding and polishing of optical elements of large caliber.This technological invention is based on radiation and realizes Temperature Distribution, is not subjected to the restriction of workpiece to be machined size.
3, with low cost.At present the equipment prices such as CCOS commonly used, magnetorheological, ion beam are expensive.And key of the present invention mainly is enforcement and the maintenance in temperature field, and the temperature field can be realized with microwave or projecting apparatus, also can realize the balance of workpiece surface temperature field by temperature control measures commonly used.
4, the suitable transparent mould of employing and workpiece size, corrosion surface is carried out level and smooth in, can not produce astigmatism and high frequency error.
Description of drawings
Fig. 1 is the fundamental diagram of present technique invention;
Wherein: 1 temperature field generates equipment, 2 controllers, 3 computers, 4 transparent grinding tools, 5 workpieces to be machined, 6 corrosive liquid reservoirs, 7 closed environments.
The specific embodiment
The present invention is based on effectively control is implemented in chemical attack, realize the Temperature Distribution of the different endless belt of optical work by radiation, optical element is carried out quantitative material remove, in view of the impact of chemical attack on the optical surface quality, be aided with the final polishing moulding that mechanical means is finished optical surface.
The present invention adopts microwave or projection to realize the Temperature Distribution of determining, combines chemical etch polishing and machine glazed finish, and the former mainly realizes the workpiece material removal, and the latter mainly is in order to obtain smooth surface; Be fit to quick grinding and polishing with aperture aspherical optical elements.
The polishing dress of this radiation temperature field accelerated corrosion comprises that the temperature field generates equipment 1, controller 2, and computer 3, transparent grinding tool 4, workpiece to be machined 5, corrosive liquid reservoir 6 and closed environment 7, closed environment can adopt closed shell.
Load carrier all is immersed in the corrosive liquid reservoir 6 processed element, also is provided with transparent grinding tool 4 on the load carrier, and polished die is transparent material, and is suitable with the workpiece to be machined size; The temperature field generates equipment 1 and is connected with controlling organization; Load carrier and corrosive liquid reservoir 6 all are fixedly installed on the rotating shaft.Generate equipment 1 by the temperature field and implement definite Temperature Distribution radiation; By the equilibrium temperature field that 7 realizations of control closed environment need, workpiece will be realized the material removal of different endless belt in corrosive liquid; Transparent grinding tool and workpiece spindle relatively rotate and slightly swing realizes surface smoothing, thereby obtains high-quality type surface.
With reference to Fig. 1, workpiece to be machined 5 places corrosive liquid reservoir 6, and installation fixes, workpiece to be machined 5 and corrosive liquid reservoir 6 rotate with single shaft owner axle, transparent grinding tool 4 tools place on the workpiece to be machined, owing to requiring grinding tool can see through radius, requiring grinding tool is transparent material.In corrosive liquid reservoir 6, pour the corrosive liquid that is complementary with workpiece to be machined 5 into.
Should note pouring the corrosive liquid capacity into, because in the single shaft owner axle rotation process, corrosive liquid can be assembled to periphery under centrifugal action, should guarantee that the corrosive liquid in the middle of the groove 6 can cover workpiece to be machined.According to the face type error of workpiece, calculate temperature field required in the set time and distribute, apply by temperature field generation equipment, guarantee to generate the equilibrium temperature field that needs.So after a period of time, pour out corrosive liquid (but filtration cycle use), clean and take off workpiece, can carry out the face type and detect.
Claims (4)
1. the grinding and polishing device of a radiation temperature field accelerated corrosion comprises be used to the load carrier that carries processed element, it is characterized in that: also comprise the corrosive liquid reservoir, load carrier all is immersed in the corrosive liquid reservoir processed element; Dispose transparent grinding tool, with the workpiece to be machined Mechanical Contact; The temperature field generates equipment and control mechanism and connects; Described load carrier and corrosive liquid reservoir all are fixedly installed on the rotating shaft.
2. the grinding and polishing device of penetrating temperature field accelerated corrosion according to claim 1 is characterized in that: described load carrier, corrosive liquid reservoir, grinding tool and temperature field generate equipment and all are arranged in the confined space.
3. the grinding and polishing device of penetrating temperature field accelerated corrosion according to claim 2 is characterized in that: described controlling organization comprises and the temperature field generates the controller of equipment connection, and controller also is connected with Industrial PC.
4. the grinding and polishing device of penetrating temperature field accelerated corrosion according to claim 3 is characterized in that: described temperature field generation equipment is that microwave formula temperature field generates equipment or the projection temperature field generates equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220407154 CN202825476U (en) | 2012-08-16 | 2012-08-16 | Grinding and polishing device for accelerating corrosion in radiation temperature field |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220407154 CN202825476U (en) | 2012-08-16 | 2012-08-16 | Grinding and polishing device for accelerating corrosion in radiation temperature field |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202825476U true CN202825476U (en) | 2013-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220407154 Withdrawn - After Issue CN202825476U (en) | 2012-08-16 | 2012-08-16 | Grinding and polishing device for accelerating corrosion in radiation temperature field |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202825476U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102794698A (en) * | 2012-08-16 | 2012-11-28 | 中国科学院西安光学精密机械研究所 | Grinding and polishing device for accelerated corrosion of radiation temperature field |
-
2012
- 2012-08-16 CN CN 201220407154 patent/CN202825476U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102794698A (en) * | 2012-08-16 | 2012-11-28 | 中国科学院西安光学精密机械研究所 | Grinding and polishing device for accelerated corrosion of radiation temperature field |
| CN102794698B (en) * | 2012-08-16 | 2015-10-21 | 中国科学院西安光学精密机械研究所 | The grinding and polishing device of radiant temperature field accelerated corrosion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130327 Effective date of abandoning: 20151021 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20130327 Effective date of abandoning: 20151021 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |