JP2004186498A - Working simulation system of grinding device, working simulation method of the grinding device, and working simulation program of the grinding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a working simulation system of a grinding device and its simulation method for grinding a work such as a glass of optical components or a semiconductor silicon wafer with the super-precision, wherein an optimum working condition of the work does not depend on a skilled level of an operator and the number of works to be ground is reduced to easily obtain in a short time. <P>SOLUTION: Parameters α, n for obtaining the quantity of grinding a work 42 are acquired by an arithmetic process in accordance with two actual working data of a temporal change of a grinding resistance and a relationship between a cutting speed and the grinding resistance. The work 42 is divided into cells 95, so that the quantity of grinding of only the cell 95 coming into contact with grinding operation planes 34a, 34b is acquired by an arithmetic means, and a condition of the grinding working plane of the work 42 is simulated from the quantity of grinding. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a processing simulation system for a grinding device, a processing simulation method for a grinding device, and a processing simulation program for a grinding device, and particularly to the processing of a grinding device for ultra-precise grinding of a workpiece such as glass of an optical component or a semiconductor silicon wafer. The present invention relates to a simulation system, a processing simulation method for a grinding device, and a processing simulation program for a grinding device.
[0002]
[Prior art]
Generally, in a double-headed grinding machine of a grinding machine, when a grindstone is replaced with a new grindstone of the same type or a grindstone of a different shape, the grindstone diameter, the width of the grinding operation surface (grinding the work of the grindstone) The part to be processed), the physical properties such as the Young's modulus of the grindstone, the size of the abrasive grains, the inclination of the grinding spindle with respect to the grinding surface of the workpiece, the inclination of the grinding stone with respect to the grinding spindle, the rotation speed of the grinding stone, and the cutting speed of the grinding stone. The state of the grinding surface of the work changes. Therefore, in order to precisely machine the workpiece after changing the grinding wheel, the double-head grinding machine optimizes the grinding conditions such as the inclination of the grinding spindle with respect to the grinding surface of the workpiece, the inclination of the grinding wheel with respect to the grinding spindle, the rotation speed of the grinding wheel, the cutting speed of the grinding wheel, etc. Need to be
[0003]
In a conventional double-headed grinding machine, a skilled worker determines grinding conditions based on his own intuition and experience, uses several tens of workpieces, grinds the workpiece, and evaluates the ground surface after grinding. Was repeated.
[0004]
In a CMP (Chemical Mechanical Polishing) apparatus for flattening a step by polishing, there is a technique for predicting a shape after polishing by simulation. (For example, refer to Patent Document 1).
[0005]
[Patent Document 1]
JP-A-11-126765
[0006]
[Problems to be solved by the invention]
However, as described above, in the conventional double-headed grinding device, the grinding conditions after the replacement of the grinding wheel are optimized based on the intuition and experience of the operator. However, there is a problem that the state of the ground surface of the ground work deteriorates, and the processing accuracy of the work depends on the skill of the operator.
[0007]
Furthermore, in the method based on the intuition and experience of the operator, it is necessary to grind and evaluate a large number of works, and there is a problem that much time is required until the grinding conditions are optimized.
[0008]
In addition, a double-headed grinding device that simultaneously polishes both surfaces of a work has a different basic configuration from a CMP device, so that the simulation technology of the CMP device cannot be simply diverted to simulation of the double-headed grinding device.
[0009]
Therefore, the present invention has been made in view of the above circumstances, and without depending on the skill of the operator, the optimal grinding conditions of the work, using a small number of works, can be easily obtained in a short time, An object of the present invention is to provide a processing simulation system for a grinding device, a processing simulation method for a grinding device, and a processing simulation program for a grinding device.
[0010]
[Means for Solving the Problems]
In order to solve the above problems, the present invention is characterized by taking the following means.
[0011]
According to the first aspect of the present invention, there is provided a machining apparatus for a grinding apparatus, comprising: a computing unit for computing a state of a grinding surface of a workpiece based on a time change of a grinding resistance and a relationship between a cutting speed and a grinding resistance. It can be solved by a simulation system.
[0012]
Here, a description will be given of an equation for calculating the amount of grinding of the work necessary for obtaining the state of the ground surface of the work by calculation.
[0013]
du = ασⁿdh ... (1)
The above equation is an equation for obtaining the grinding amount of the work. Du shown in the above formula is the grinding amount of the workpiece, σ is the grinding resistance generated by the contact between the workpiece and the grinding wheel, dh is the distance the grinding wheel has moved on the grinding surface of the workpiece, and α and n are the grinding wheels. Are shown, respectively, indicating the grinding ability.
[0014]
In the above-mentioned invention, α and n shown in the above equation necessary for obtaining the grinding amount are obtained from the time change of the grinding resistance, and n is obtained from the relationship between the cutting speed and the grinding resistance. By calculating the amount of grinding by the calculating means based on the two processing data of α and n in this manner, the state of the ground surface of the workpiece can be easily obtained without actually grinding the workpiece. Therefore, the work can be evaluated and the grinding conditions can be optimized in a short time without depending on the skill of the operator.
[0015]
According to the second aspect of the present invention, the time change of the grinding resistance is obtained based on actual machining data obtained by grinding the work, and it can be solved by the machining simulation system for a grinding device according to the first aspect.
[0016]
According to the above invention, the time change of the grinding resistance is obtained based on actual machining data obtained by grinding the work. Therefore, the time change of the grinding resistance obtained from the actual processing data is used for calculating the state of the grinding surface of the work. As a result, it is possible to improve the accuracy of the state of the ground surface of the workpiece obtained by the calculation.
[0017]
In the invention according to claim 3, the relationship between the cutting speed and the grinding resistance is obtained based on actual machining data obtained by grinding the work, and the processing simulation system for a grinding device according to claim 1, Solvable.
[0018]
According to the present invention, the relationship between the cutting speed and the grinding resistance is obtained based on actual machining data obtained by grinding the work. Therefore, the relationship between the cutting speed and the grinding resistance obtained from the actual machining data is used for calculating the state of the grinding surface of the work. As a result, it is possible to improve the accuracy of the state of the ground surface of the workpiece obtained by the calculation.
[0019]
According to a fourth aspect of the present invention, there is provided the machining simulation system for a grinding apparatus according to any one of the first to third aspects, wherein a communication unit is provided for receiving data on a time change of the grinding resistance generated by the grinding apparatus. The problem can be solved by a processing simulation system for a grinding device characterized by the following.
[0020]
According to the above invention, since the communication unit can receive the data on the time change of the grinding resistance transmitted from the grinding device, the data on the time change of the grinding resistance can be updated. As a result, the state of the grinding device, which changes with time, is reflected in the data on the time change of the grinding resistance, and the accuracy of the state of the grinding surface of the work, which is obtained by calculation, can be improved.
[0021]
In the invention according to claim 5, the grinding surface of the workpiece is divided into a plurality of cells, and a contact determination is made as to whether or not each of the cells has contacted a grindstone. The problem can be solved by a processing simulation system for a grinding device, which calculates the state of the ground surface of the cell with respect to the completed cell.
[0022]
According to the above invention, the state of the ground surface of the cell is calculated only for the cell determined to be in contact with the grindstone, that is, only for the cell to be ground, among the plurality of divided cells. Therefore, since it is not necessary to perform the operation for all cells, the time required for the operation can be reduced.
[0023]
In the invention according to claim 6, the contact determination is made based on the position of the grindstone and the position of the cell, and can be solved by the processing simulation system for a grinding device according to claim 5.
[0024]
According to the above invention, it is determined whether or not each cell is in contact with the grindstone by determining whether the position of the grindstone and the position of the cell match. Therefore, the contact between the cell and the grindstone can be determined.
[0025]
In the invention according to claim 7, a step of acquiring first data which is a time change of the grinding resistance, a step of acquiring second data which is a relationship between the cutting speed and the grinding resistance, and a step of acquiring the first data And a step of calculating the state of the ground surface of the workpiece by calculation based on the second data and the second data.
[0026]
According to the invention described above, α and n shown in the equation (1) required for obtaining the above-mentioned grinding amount are obtained from the first data which is the time change of the grinding resistance, and the cutting speed, the grinding resistance and Is obtained from the second data having the relationship By calculating the amount of grinding by the calculating means based on the two data of α and n in this manner, the state of the ground surface of the work can be easily obtained without actually grinding the work. Therefore, the work can be evaluated and the grinding conditions can be optimized in a short time without depending on the skill of the operator.
[0027]
In the invention according to claim 8, the first data is obtained based on actual machining data obtained by grinding the work, and the first data can be solved by the machining simulation method for a grinding device according to claim 7. .
[0028]
According to the above invention, the first data is obtained based on actual machining data obtained by grinding the work. Therefore, the first data obtained from the actual processing data is used for the calculation of the state of the ground surface of the work. As a result, it is possible to improve the accuracy of the state of the ground surface of the workpiece obtained by the calculation.
[0029]
According to a ninth aspect of the present invention, the second data is obtained based on actual machining data obtained by grinding the workpiece, and the second data can be solved by the machining simulation method for a grinding apparatus according to the seventh aspect. .
[0030]
According to the above invention, the second data is obtained based on actual machining data obtained by grinding the work. Therefore, the second data obtained from the actual processing data is used for the calculation of the state of the grinding surface of the work. As a result, it is possible to improve the accuracy of the state of the ground surface of the workpiece obtained by the calculation.
[0031]
In the invention according to claim 10, a step of dividing the ground surface of the workpiece into a plurality of cells, a step of determining whether or not each cell has contacted a grindstone, Calculating the state of the ground surface of the cell with respect to the cell determined to be in contact with the cell.
[0032]
According to the above-described invention, the grinding surface of the work is divided into a plurality of cells, and only the cells determined to be in contact with the grindstone perform the calculation of the state of the grinding surface of the cell. Therefore, since it is not necessary to perform the operation for all cells, the time required for the operation can be reduced.
[0033]
According to the eleventh aspect of the present invention, the computer determines the state of the grinding surface of the workpiece on the basis of the first data which is a time change of the grinding resistance and the second data which is a relationship between the cutting speed and the grinding resistance. The problem can be solved by a processing simulation program of the grinding device for performing the calculation.
[0034]
According to the invention described above, α and n shown in the equation (1) required for obtaining the above-mentioned grinding amount are obtained from the first data which is the time change of the grinding resistance, and the cutting speed, the grinding resistance and Is obtained from the second data having the relationship By calculating the amount of grinding by the calculating means based on the two data of α and n in this manner, the state of the ground surface of the work can be easily obtained without actually grinding the work. Therefore, the work can be evaluated and the grinding conditions can be optimized in a short time without depending on the skill of the operator.
[0035]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of the present invention will be described with reference to the drawings.
[0036]
(First embodiment)
In the present embodiment, a double-headed grinding device will be described as an example of a grinding device.
[0037]
FIG. 1 is a system configuration diagram of a machining simulation system according to a first embodiment of the present invention. In this embodiment, as will be described in detail later, a processing simulation is performed based on actual processing data obtained from the double-disc grinding apparatus 20.
[0038]
The processing simulation system of the double-headed grinding device 20 is implemented using a computer 10 (see FIG. 1). The processing simulation system of the double-ended grinding device 20 is performed based on data generated by the double-ended grinding device 20 in advance.
[0039]
In the following description, first, the configuration of the double-head grinding device 20 will be described, and then the configuration of the simulation system will be described.
[0040]
FIG. 2 is a diagram showing a general double-headed grinding device. As shown in the figure, the double-headed grinding device 20 is roughly composed of grinding devices 40a and 40b and a work holding device 41.
[0041]
Two grinding devices 40a and 40b are provided so that the same configurations are opposed to each other with the grinding position of the workpiece 42 interposed therebetween. Since the grinding devices 40a and 40b provided with the grinding position of the workpiece 42 interposed therebetween have the same configuration, the grinding device located at the upper part in FIG. The grinding device located at the lower part in the figure will be described with reference numeral b. In the following, the side with the reference a is referred to as the master side, and the side with the reference b is referred to as the slave.
[0042]
The grinding devices 40a and 40b include grindstones 35a and 35b, grinding spindles 36a and 36b, driving devices 38a and 38b, and moving devices 37a and 37b. The grindstones 35a and 35b are annular grindstones, and have a configuration in which the grindstones are fixed in a cup shape (a portion facing the work 42). The grindstones 35a and 35b are formed with flat grinding operation surfaces 34a and 34b on the cup-shaped open side end surfaces (surfaces on which abrasive grains are fixed).
[0043]
The grindstones 35a and 35b configured as described above are integrally provided at one end of the grinding spindles 36a and 36b. Drive devices 38a and 38b are provided at the other ends of the grinding spindles 36a and 36b. The driving devices 38a and 38b are for rotating the grinding spindles 36a and 36b. Therefore, the grindstones 35a and 35b are rotated by the driving devices 38a and 38b via the grinding spindles 36a and 36b.
[0044]
The driving devices 38a and 38b are configured to be moved by the moving devices 37a and 37b. The moving devices 37a and 37b move the driving devices 38a and 38b in directions indicated by arrows Y1 and Y2 in FIG. Therefore, the moving devices 37a and 37b move the driving devices 38a and 38b away from the grinding position, so that the grindstones 35a and 35b are separated as shown in FIG. Conversely, the moving devices 37a, 37b move the driving devices 38a, 38b from the position shown in FIG. 2 to approach the grinding position, so that the double-head grinding device 20 shown on the right side in FIG. 1 is obtained. The grindstones 35a and 35b are in a state of holding the work 42 therebetween.
[0045]
Next, the work holding device 41 will be described. The work holding device 41 includes a work holder frame 31, a clamp arm 43, an arm opening / closing rotary shaft 44, rollers with V-grooves 33A, 33B, 33C, the drive motor 30, and the like.
[0046]
The work holder frame 31 is provided with a clamp arm 43, an arm opening / closing rotary shaft 44, rollers with V-grooves 33A, 33B, 33C, and a drive motor 30. At one upper end of the workpiece holder frame 31 in the figure, a clamp arm 43 is arranged so as to be swingable in the directions of arrows X1 and X2 in the figure around the arm closing / opening rotation shaft 44. Is established. The clamp arm 43 is integrally provided with a V-grooved roller 33C for holding the work 42 in rotation. When the work 42 is mounted and demounted, the clamp arm 43 shown in FIG. 2 moves from the closed state to the open state (not shown) by moving in the directions of arrows X1 and X2 in FIG. The work 42 can be attached and detached. The clamp arm 43 moves in the directions indicated by arrows X1 and X2 in FIG. 2 after the work 42 is attached and detached, and is closed as shown in FIG. Reference numeral 42 is rotatably held by a V-grooved roller 33C and V-grooved rollers 33A and 33B.
[0047]
A drive motor 30 is provided at the upper left position of the work holder frame 31 in the figure, and a V-grooved roller 33A is provided below the drive motor 30. A V-grooved roller 33B is disposed on the work holder frame 31 between the V-grooved roller 33A and the V-grooved roller 33C shown in FIG.
[0048]
In the double-ended grinding apparatus 20 described above, the following grinding conditions must be input when actual machining is performed.
[0049]
Next, with reference to FIG. 3, the grinding conditions used for the processing simulation of the double-head grinding device 20 will be described. FIG. 3 is a diagram showing grinding conditions used for processing simulation of the double-headed grinding device.
[0050]
The grinding conditions used for the processing simulation of the shape and thickness distribution of the grinding surface of the work include the cutting speed of the grindstone, the inclination of the grinding spindle with respect to the work, the inclination of the grindstone with respect to the grinding spindle, the number of rotations of the work, Diameter, number of rotations of the grindstone, grindstone diameter, width of the grinding operation surface of the grindstone, Young's modulus of the grindstone, rotation direction of the grindstone, rotation direction of the work, grinding time, spark-out time, and external force (In the following description, the above-described grinding conditions are collectively referred to as a grinding condition 50).
[0051]
As shown in FIG. 3, the cutting speed of the grindstone is a moving speed of the grindstones 35 a and 35 b moving in the Y1 and Y2 directions toward the work 42. The inclination of the grinding spindle with respect to the work 42 is an inclination θ1 formed by the center line 48 of the workpiece 42 in the Y1 and Y2 directions and the center line 49 of the grinding spindle 36a in the Y1 and Y2 directions.
[0052]
The inclination of the grindstone with respect to the grinding spindle is the inclination θ2 formed by the center line 53 of the grinding spindle 36b in the Y1 and Y2 directions and the center line 52 of the grinding stone 35b in the Y1 and Y2 directions. When the grinding is performed in a state where the inclination θ2 is large, the grinding spindle 36b and the grindstone 35b rotate while swinging together, thereby affecting the grinding surface of the work 42. The inclination of the grindstone with respect to the grinding spindle has been described as an example representing the whirling of the grindstone 35b.
[0053]
The rotation speed of the work refers to the speed at which the work 42 rotates. The number of rotations of the grindstone is a speed at which the grindstones 35a and 35b rotate. The grindstone diameter is 55 shown in the figure, and the width of the grinding operation surface of the grindstone is L shown in the figure.
[0054]
The spark-out time is a time period at the end of the grinding of the work 42 in which the cutting speed of the grindstone is stopped while the grindstone and the work are rotated, and the work is ground in this state. The external force is a force that affects the grinding of the work 42 under conditions other than the above-described grinding conditions.
[0055]
By performing a simulation using the grinding conditions 50 having information on grinding as described above, the shape of the ground surface of the workpiece 42 obtained by actually grinding the workpiece 42 and the workpiece 42 obtained from the simulation are obtained. The difference from the shape of the ground surface is reduced, and a highly accurate simulation can be performed. By performing the above simulation, the thickness of the work 42 can be obtained in addition to the shape of the ground surface of the work 42.
[0056]
Next, a configuration of the computer 10 that performs a processing simulation of the double-headed grinding device will be described with reference to FIG. FIG. 4 is a diagram showing an internal configuration of the computer shown in FIG.
[0057]
The computer 10 includes a CPU 60, an input device 61, a ROM 62, a RAM 63, a CLK 64, a first database 65, a second database 66, and an output device 67.
[0058]
The CPU 60 reads out the processing simulation software stored in the RAM 63 and executes the processing simulation processing described later. The input device 61 is specifically a keyboard or the like, and in this embodiment, a floppy (registered trademark) disk device (FDD) is also used as the input device. The input device 61 is for inputting external data to the computer 10.
[0059]
The ROM 62 stores a predetermined OS, and the RAM 63 stores processing simulation software for obtaining the shape and thickness distribution of the ground surface of the work 42. The CLK 64 controls the operation timing of the CPU 60, the ROM 62, and the RAM 63.
[0060]
The first database 65 is for storing the time change data of the grinding resistance input from the input device 61 and the data of the grinding resistance with respect to the cutting speed of the grinding wheel. The second database 66 is for storing data on the surface shape and thickness distribution of the work 42 calculated by the CPU 60.
[0061]
The output device 67 is a CRT, a printer, or the like, and displays a result calculated by the CPU 60.
[0062]
Next, with reference to FIG. 5, a description will be given of a processing simulation process for obtaining the shape of the ground surface of the work 42 in the present embodiment. FIG. 5 is a flowchart showing a processing simulation process for obtaining a shape of a ground surface of a workpiece.
[0063]
In addition, a main component force, a back component stress, and the like can be used for the grinding force required to obtain the grinding amount. In the present embodiment, the following processing simulation of an example in which the back stress is used as the grinding force is described below. Give an explanation.
[0064]
First, prior to the description of the specific processing of the processing simulation, a calculation processing of a grinding amount of the cell 95, which will be described later, which is necessary for performing the processing simulation of the state of the ground processing surface of the work will be described using the following equation. The cell 95 is a cell of one area obtained by dividing the ground surface of the workpiece 42 into a plurality of cells as described later.
[0065]
du_M= Α_Mσ_M ^nMdhβ (t) (2)
The above equation (2) is an equation for calculating the grinding amount du of the cell 95._MIndicates the master side grinding apparatus 40a, and in the case of the slave side grinding apparatus 40b,_MPart is_SChanges to The arithmetic processing for obtaining the grinding amount du of the cell 95 is performed for each of the master side grinding apparatus 40a and the slave side grinding apparatus 40b using the above equation.
[0066]
In the above equation (2), σ is a back stress generated when a cell 95 described later contacts the grinding operation surfaces 34a and 34b, and dh is a grinding surface of the cell 95 described later when the grinding operation surfaces 34a and 34b are used. Β (t) indicates the presence or absence of contact between the grinding operation surfaces 34a and 34b and the cell 95, and α and n indicate parameters indicating the grinding ability of the grindstone. The parameters α and n indicating the grinding ability of the grindstone are obtained based on the actual machining for both the master side grinding apparatus 40a and the slave side grinding apparatus 40b. When the grinding operation surfaces 34a and 34b are in contact with the cell 95, β (t) = 1, and when not, β (t) = 0. Note that σ includes the external force f.
[0067]
The grinding amount du is calculated based on the parameters α, n, β (t) = 1, the distance dh in which the grinding operation surfaces 34a, 34b have moved the grinding surface of the cell 95 described later, and the back stress σ. It can be obtained by performing processing.
[0068]
Next, the processing simulation processing will be described with reference to FIG.
[0069]
When the process shown in FIG. 5 is started, first, the above-described grinding condition 50 is input to the computer 10 by the process of ST70. This input processing is performed by the operator of the computer 10. Subsequently, in ST71, based on the grinding conditions 50, the parameters α and n indicating the grinding ability of the grindstone are obtained by arithmetic processing. In the present embodiment, the grinding amount of the work 42 necessary for performing the processing simulation of the shape of the ground surface of the work 42 is obtained using the parameters α and n. If the parameters α and n are obtained at least once after the replacement of the grindstones 35a and 35b, a processing simulation of the state of the ground surface of the work 42 can be performed.
[0070]
Here, how to determine the parameters α and n will be described. The parameter α is determined from the slope of a curve indicating the change in the grinding resistance within the spark-out time, by performing the grinding of the workpiece 42, acquiring the actual processing data of the change in the grinding resistance with time. The parameter n is obtained by acquiring data on the relationship between the cutting speed of the grindstones 35a and 35b and the grinding resistance, and creating a fitting curve.
[0071]
Next, a method of obtaining the parameter α indicating the grinding ability of the grinding wheel will be described with reference to FIG. In the processing shown in FIG. 6, actual machining data is acquired in advance before machining simulation is performed, and actual machining data is not acquired every time the machining simulation is executed. FIG. 6 is a flowchart showing a method of acquiring actual processing data of the temporal change of the back stress.
[0072]
When the process shown in the figure is started, first, in the process of ST84, a grinding condition 50 for actually machining the work 42 is input to the computer of the double-head grinding device 20 side. In subsequent ST85, a plurality of (in this embodiment, three pieces for one grindstone) workpieces 42 are ground.
[0073]
In ST86, actual processing data of the time change of the back stress is obtained. In ST87, the actual processing data of the time change of the back stress is input to the first database 65 of the computer 10, and all the processing ends. The actual processing data of the time change of the back stress described with reference to FIG. 6 is obtained for each of the master-side grinding apparatus 30a and the slave-side grinding apparatus 30b of the double-headed grinding apparatus 20.
[0074]
FIG. 7 is a diagram showing a change in the back stress over time. In the same figure, A to C show actual processing data of the temporal change of the back stress of the three workpieces 42 that have been ground, and D is the result of calculation using the obtained α.
[0075]
A range E shown in the figure indicates a time period in which the grindstones 35a and 35b are moved toward the work 42 at a constant cutting speed, and the grinding is performed while the grindstones 35a and 35b and the work 42 are rotated. A range F indicates a spark-out time. The spark-out time is a time period in which the movement of the grindstones 35a and 35b is stopped while the grindstones 35a and 35b and the work 42 are rotated, and the grinding process is performed. The parameter α is obtained by fitting D in the range F of FIG.
[0076]
Next, a method for obtaining the parameter n indicating the grinding ability of the grindstone will be described with reference to the flowchart shown in FIG. In the processing shown in FIG. 8, actual machining data is acquired in advance before machining simulation is performed, and actual machining data is not acquired every time the machining simulation is executed. FIG. 8 is a flowchart showing a method for acquiring actual processing data on the relationship between the cutting speed of the grinding wheel and the back stress.
[0077]
When the process shown in the figure is started, first, in the process of ST88, a grinding condition 50 for actually processing the work 42 is input to the computer 13 of the double-headed grinding device 20 side. In the subsequent ST89, a plurality of (in this embodiment, three times for one grindstone) workpieces 42 are ground under the condition that the cutting speed of the grindstones 35a and 35b is changed.
[0078]
In ST90, actual processing data of the back stress with respect to the cutting speed of each of the grindstones 35a and 35b is obtained. In ST91, the actual processing data of the back stress with respect to the cutting speed of the grindstones 35a and 35b is input to the first database 65 of the computer 10, and all the processing ends.
[0079]
It should be noted that the actual processing data of the relationship between the cutting speed of the grindstone and the back stress described with reference to FIG. 8 is obtained for each of the master-side grindstone 35a and the slave-side grindstone 35b of the double-headed grinding device 20.
[0080]
FIG. 9 is a diagram showing the relationship between the cutting speed of the grindstone and the back stress. G shown in the figure is actual processing data indicating the relationship between the cutting speed of the grindstone of the workpiece 42 and the back stress on the workpiece 42 that has been ground three times. H shown in the figure is a fitting curve created based on the actual machining data of G, and the parameter n is obtained from the slope of H.
[0081]
As described above, since the arithmetic processing is performed based on the parameters α and n obtained from the actual processing data, the difference between the shape of the ground surface of the workpiece 42 and the shape of the ground surface of the ground work obtained by the arithmetic processing is obtained. Is small, and a highly accurate simulation can be performed.
[0082]
As described above, the parameters α and n are obtained by the method described with reference to FIGS. 6 to 9, and the step 71 shown in FIG. 6 ends and proceeds to the next ST72.
[0083]
In ST72, the cell division of the grinding surface of the work 42 is performed.
[0084]
Here, with reference to FIG. 10, a description will be given of cell division of the ground surface of the work 42. FIG. 10 is a diagram showing a ground surface of a work divided into cells.
[0085]
As shown in the figure, the workpiece 42 is divided into cells 95 each having a width in the X direction of I and a width in the Y direction of J. The numbers in parentheses shown in the figure are the addresses of the respective cells 95. For example, (1, 2) indicates that the address in the X direction is 1 and the address in the Y direction is 2. It should be noted that the magnitudes of I and J can be appropriately determined according to the use and purpose of the simulation.
[0086]
When the cell division of the ground surface of the work 42 is completed, the process proceeds from ST72 to ST73.
[0087]
In ST73, it is determined whether or not the cell 95 has contacted the grinding operation surfaces 34a and 34b by a processing simulation. The cell that has been determined to be in contact with the grinding operation surface 34a is the cell 95 that has been determined to have undergone grinding by the processing simulation.
[0088]
Here, only the master-side grinding operation surface 34a will be disclosed, and contact determination between the master-side grinding operation surface 34a and the cell 95 will be described. FIG. 11 is a diagram illustrating a state where the grinding operation surface on the master side is in contact with the cell-divided work.
[0089]
The contact determination is performed based on the coordinate data of each cell 95 and the coordinate data of the grinding operation surface 34a. When the coordinate data of each cell 95 and the coordinate data of the grinding operation surface 34a match, the cell 95 is determined. And the grinding operation surface 34a are determined to be in contact with each other. In the figure, K is a cell 95 determined not to be in contact with the grinding operation surface 34a, and L is a cell 95 determined to be in contact with the grinding operation surface 34a.
[0090]
Further, β (t) indicating the result of the contact determination described above is β (t) = 1 when it is determined that a contact is made, and β (t) = 0 when no contact is made. If it is determined in ST73 that the contact has been made, the process proceeds to ST74, and if it is determined that there is no contact, the process returns to ST73. In ST74, arithmetic processing of the back stress generated by the contact between the cell 95 and the grinding operation surface 34a is performed.
[0091]
Here, with reference to FIGS. 12 and 13, a description will be given of a method of obtaining the back stress generated by the contact between the cell 95 and the grinding operation surface 34a. FIG. 12 is a diagram showing a contact portion between a cell and a grinding operation surface in a grinding state, and FIG. 13 is a diagram modeling the grinding state.
[0092]
As shown in FIG. 12, abrasive grains 96 are integrally provided on the grinding operation surface 34 a by a binder 97. The arrows shown in the figure indicate the direction in which the abrasive grains 96 move. A back stress is generated at a contact portion 98 between the cell 95 and the abrasive grains 96, and the cell 95 is ground by moving in a direction indicated by an arrow in the drawing while the abrasive grains 96 are pressed by the back stress.
[0093]
As shown in FIG. 13, in the present embodiment, the bonding agent 97 shown in FIG. The back stress of the cell 95 can be obtained from the contraction amount of the spring 99. The contraction amount of the spring 99 is obtained by performing an arithmetic process based on the grinding condition 50.
[0094]
In ST74, when the back stress of the cell 95 is obtained by the arithmetic processing, the process proceeds to ST75 and ST77. In ST75, the back stress obtained in ST74 is stored in the first database 65 of the computer 10, and the process proceeds to ST76. In ST76, the CPU 60 of the computer 10 performs an arithmetic process based on the actual processing data of the back stress stored in the first database 65, and the output device 67 calculates the time change of the back stress as shown in FIG. Data is output.
[0095]
In ST77, the grinding amount of the cell 95 is determined by the above-described equation (2) for determining the grinding amount, and the arithmetic processing is performed based on the grinding amount of the cell 95. Requires shape and thickness distribution
The grinding amount du is calculated by the parameters α and n obtained in ST71 in the above equation, β (t) = 1 obtained in ST73, the distance dh in which the grinding operation surface 34a has moved the grinding surface of the cell 95, and ST74. Calculated back stress σ_MIs obtained by performing arithmetic processing based on The arithmetic processing for obtaining the grinding amount du is performed for all the cells 95 determined to have come into contact in ST73. By performing arithmetic processing based on the grinding amount du of the cell 95 obtained in this manner, the shape and thickness distribution of the ground surface of the cell 95 can be obtained.
[0096]
As described above, in the present embodiment, the ground surface of the workpiece 42 is divided into a plurality of cells 95, and only the cells 95 determined to have been ground are subjected to arithmetic processing of the state of the ground surface. There is no need to perform arithmetic processing on cells, and the time required for arithmetic processing can be reduced. Further, by displaying and displaying the back stress, it is possible to determine whether or not the work 42 is normally ground, and it is possible to prevent the work 42 and the double-ended grinding device 20 from being damaged.
[0097]
In ST77, when the processing of calculating the shape and thickness distribution of the ground surface of the cell 95 is completed, the process proceeds to ST78 and ST80. In ST78, the data on the shape and thickness distribution of the ground surface of the cell 95 obtained in ST77 is stored in the second database 66 of the computer 10, and the process proceeds to ST79.
[0098]
In ST79, the CPU 60 of the computer 10 performs an arithmetic process based on the data stored in the second database 66, and the output device 67 outputs a three-dimensional bird's-eye view as shown in FIG. . FIG. 14 is a diagram showing a three-dimensional bird's-eye view of a grinding surface of a work.
[0099]
By outputting the three-dimensional bird's-eye view in this way, the shape of the ground surface of the workpiece 42 can be easily recognized. Further, by performing the processing simulation while repeatedly changing the grinding conditions, it is possible to know which parameter of the grinding conditions should be changed, and it is possible to easily optimize the grinding conditions. In addition, by outputting a three-dimensional bird's-eye view at the time of grinding, the state of the ground surface of the workpiece 42 can be three-dimensionally and directly understood.
[0100]
In ST80, it is determined whether or not the arithmetic processing of all the cells 95 in contact with the grinding operation surface 34a has been completed. If the determination is No, the process returns to ST73. When the determination is Yes, the process proceeds to ST81. In ST81, the grinding time is advanced by Δt. Thus, the coordinates of the grinding position of the grindstone 34a are changed.
[0101]
In the following ST82, it is determined whether or not the grinding processing time input in ST70 has elapsed. If the determination is No, the process returns to ST73. If the determination is Yes, the process proceeds to ST83. In ST83, the output and display of the shape and thickness distribution of the ground surface of the workpiece 42 on which the grinding process has been completed are performed, and the processing simulation process of the state of the ground surface of the workpiece 42 ends.
[0102]
By applying the processing simulation method of the double-headed grinding apparatus 20 as described above, the calculation is performed based on the time change of the grinding resistance obtained by grinding the work 42 and the two data of the relationship between the cutting speed and the grinding resistance. Thus, the state of the ground surface can be obtained by the processing simulation. Therefore, the operator can know the state of the ground surface of the work 42 after the grinding only by inputting desired grinding conditions to the double-headed grinding device 20 and starting the processing simulation processing without grinding the work. it can. Therefore, the grinding conditions can be optimized in a short time without depending on the skill of the operator.
[0103]
In addition, since the grinding surface of the workpiece 42 is divided into a plurality of cells 95, and only the cells 95 determined to be in contact with the grinding operation surfaces 34a and 34b are subjected to the arithmetic processing of the state of the grinding surface, all processing is performed. There is no need to perform arithmetic processing on the cell 95, and the time required for arithmetic processing can be reduced. Further, by displaying and displaying the back stress, it is possible to determine whether or not the work 42 is properly ground, and it is possible to prevent the work 42 and the double-ended grinding device 20 from being damaged.
[0104]
(Second embodiment)
In the second embodiment, the computer 10 shown in the first embodiment is connected to a computer 13 for a double-head grinding machine. Therefore, the same components as those of the first embodiment are denoted by the same reference numerals, and only the differences from the processing simulation processing of the double-headed grinding device shown in the first embodiment will be described.
[0105]
FIG. 15 is a system configuration diagram of the machining simulation system of the second embodiment. In the present embodiment, similarly to the first embodiment, a machining simulation is performed based on actual machining data obtained from the double-ended grinding device 20. As shown in FIG. 1, the computer 10 is connected online with a computer 13 for a double-head grinding machine provided in a double-head grinding machine 20, and is configured to be able to receive data from the computer 13 for a double-head grinding machine. I have.
[0106]
Next, with reference to FIG. 16, a description will be given of a process of acquiring actual processing data of a temporal change in grinding resistance, which is performed by the computer 13 for a double-headed grinding machine. FIG. 16 is a diagram showing a flowchart of a process of acquiring actual processing data of a change in grinding resistance with time.
[0107]
When the processing shown in FIG. 16 is started, in ST101, actual processing data of the temporal change of the back stress is obtained for each grinding processing of the work 42. In the following ST102, the actual processing data of the time change of the back stress acquired in ST101 is stored in the computer 13 for the double-headed grinding machine, and the process proceeds to ST103. In ST103, it is determined whether or not the actual processing data of the time change of the back stress has been stored m times. If it is determined that the actual processing data has not been stored m times, the process returns to ST101.
[0108]
If it is determined that the actual processing data has been stored m times, the process proceeds to ST104. Note that m, which is the number of times the actual processing data is stored, can be appropriately determined according to the purpose of the work 42 to be ground. In ST104, the data of the time change of the back stress is transferred to the computer 10 for processing simulation, and all the processing shown in FIG. 16 ends.
[0109]
Thus, by acquiring the actual processing data of the temporal change of the back stress of the ground work 42, a large amount of actual processing data including the apparatus state of the double-headed grinding apparatus 20 that changes with time is accumulated. be able to.
[0110]
Next, with reference to FIG. 17, the processing in the computer 10 after the actual machining data of the time change of the grinding resistance acquired in FIG. FIG. 17 is a flowchart showing the processing of the computer 10 after the actual processing data has been transferred to the computer 10.
[0111]
The computer for simulation 10 constantly determines whether or not the computer 13 for the double-headed grinding machine 20 has transferred the actual processing data of the back stress and the time change to the computer 10. Then, when the actual processing data is transferred from the computer 13 for the double-headed grinding device 20, that is, when it is determined as Yes, the process proceeds to Step 106.
[0112]
In step 106, the actual machining data of the time change of the back stress stored in the first database 65 is updated. The calculation processing for obtaining the parameter α is performed by a method similar to the method described in the first embodiment.
[0113]
As described above, by updating the actual machining data of the back stress and the time change, the parameter α including the device state of the double-headed grinding device 20 that changes with time is obtained, and the grinding surface of the work with higher accuracy is obtained. The processing simulation of the state can be performed.
[0114]
As described above, the preferred embodiments of the present invention have been described in detail, but the present invention is not limited to such specific embodiments, and various modifications may be made within the scope of the present invention described in the appended claims. Deformation and modification are possible.
[0115]
【The invention's effect】
According to the first aspect of the present invention, the calculation is performed by the calculating means based on the time change of the grinding resistance and the two data of the relationship between the cutting speed and the grinding resistance, so that the work can be easily processed without grinding the work. Of the ground surface can be obtained. Therefore, the work can be evaluated and the grinding conditions can be optimized in a short time without depending on the skill of the operator.
[0116]
According to the second aspect of the invention, the time change of the grinding resistance is obtained based on actual machining data obtained by grinding the work. Therefore, the time change of the grinding resistance obtained from the actual processing data is used for calculating the state of the grinding surface of the work. As a result, it is possible to improve the accuracy of the state of the ground surface of the workpiece obtained by the calculation.
[0117]
According to the third aspect of the invention, the relationship between the cutting speed and the grinding resistance is obtained based on actual machining data obtained by grinding the work. Therefore, the relationship between the cutting speed and the grinding resistance obtained from the actual machining data is used for calculating the state of the grinding surface of the work. As a result, it is possible to improve the accuracy of the state of the ground surface of the workpiece obtained by the calculation.
[0118]
According to the fourth aspect of the present invention, since the communication unit can receive the data relating to the time change of the grinding resistance transmitted from the grinding device, it is possible to update the data relating to the time change of the grinding resistance. As a result, the state of the grinding device, which changes with time, is reflected in the data on the time change of the grinding resistance, and the accuracy of the state of the grinding surface of the work, which is obtained by calculation, can be improved.
[0119]
According to the fifth aspect of the present invention, the state of the ground surface of the cell is calculated only for the cell determined to be in contact with the grindstone, that is, only for the cell to be ground, among the plurality of divided cells. I do. Therefore, since it is not necessary to perform the operation for all cells, the time required for the operation can be reduced.
[0120]
According to the sixth aspect of the present invention, it is determined whether or not each cell is in contact with the grindstone by determining whether the position of the grindstone matches the position of the cell. Therefore, the contact between the cell and the grindstone can be determined.
[0121]
According to the seventh aspect of the present invention, the work is calculated by the calculating means based on the first data which is a time change of the grinding resistance and the second data which is a relationship between the cutting speed and the grinding resistance. It is possible to easily obtain the state of the ground surface of the workpiece without grinding the surface. Therefore, the work can be evaluated and the grinding conditions can be optimized in a short time without depending on the skill of the operator.
[0122]
According to the invention described in claim 8, the first data is obtained based on actual machining data obtained by grinding the work. Therefore, the first data obtained from the actual processing data is used for the calculation of the state of the ground surface of the work. As a result, it is possible to improve the accuracy of the state of the ground surface of the workpiece obtained by the calculation.
[0123]
According to the ninth aspect, the second data is obtained based on actual machining data obtained by grinding the work. Therefore, the second data obtained from the actual processing data is used for the calculation of the state of the grinding surface of the work. As a result, it is possible to improve the accuracy of the state of the ground surface of the workpiece obtained by the calculation.
[0124]
According to the tenth aspect, the ground surface of the work is divided into a plurality of cells, and the state of the ground surface of the cell is calculated only for the cells determined to be in contact with the grindstone. Therefore, since it is not necessary to perform the operation for all cells, the time required for the operation can be reduced.
[0125]
According to the eleventh aspect of the present invention, the work is easily performed without grinding the work by performing the calculation by the calculating means based on two data of the time change of the grinding resistance and the relationship between the cutting speed and the grinding resistance. The state of the ground surface can be determined.
[Brief description of the drawings]
FIG. 1 is a system configuration diagram of a machining simulation system according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a general double-headed grinding device.
FIG. 3 is a diagram showing grinding conditions used for processing simulation of a double-ended grinding device.
FIG. 4 is a diagram showing an internal configuration of the computer shown in FIG.
FIG. 5 is a flowchart showing a processing simulation process for obtaining a shape of a ground processing surface of a work.
FIG. 6 is a flowchart showing a method for acquiring actual processing data of a temporal change of a back stress.
FIG. 7 is a diagram showing a transition of a temporal change of a back stress.
FIG. 8 is a flowchart showing a method for acquiring data on the relationship between the cutting speed of the grinding wheel and the back stress.
FIG. 9 is a diagram showing a relationship between a cutting speed of a grindstone and a back stress.
FIG. 10 is a view showing a ground surface of a work divided into cells.
FIG. 11 is a diagram showing a state in which a grinding operation surface on a master side is in contact with a cell-divided work.
FIG. 12 is a diagram showing a contact portion between a cell and a grinding operation surface in a grinding state.
FIG. 13 is a diagram modeling a state of grinding processing.
FIG. 14 is a diagram showing a three-dimensional bird's-eye view of a grinding surface of a work.
FIG. 15 is a system configuration diagram of a machining simulation system according to a second embodiment.
FIG. 16 is a diagram showing a flowchart of a process of acquiring actual processing data of a change in grinding resistance with time.
FIG. 17 is a flowchart illustrating a process of the computer after the actual processing data is transferred to the computer.
[Explanation of symbols]
10 Computer
13 Double-headed grinding machine computer
20 Double head grinding machine
30 Drive source
31 Work holder frame
32 static pressure pad
33A, 33B, 33C V-grooved roller
34a, 34b Grinding operation surface
35a, 35b Whetstone
36a, 36b Grinding spindle
37a, 37b moving device
38a, 38b drive unit
40a, 40b grinding machine
41 Work holding device
42 Work
48, 49, 52, 53 center line
55 diameter
60 CPU
61 Input device
62 ROM
63 RAM
64 CLK
65 First Database
66 Second database
67 Output device
95 cells
96 abrasives
97 Binder
98 Contact
99 spring

Claims (11)

A processing simulation system for a grinding apparatus, comprising: a calculation unit configured to calculate a state of a ground surface of a workpiece based on a time change of a grinding resistance and a relationship between a cutting speed and a grinding resistance. The processing simulation system for a grinding apparatus according to claim 1, wherein the time change of the grinding resistance is obtained based on actual processing data obtained by grinding the work. The processing simulation system according to claim 1, wherein the relationship between the cutting speed and the grinding resistance is obtained based on actual processing data obtained by grinding the work. A processing simulation system for a grinding device according to claim 1, wherein:
A processing system for a grinding machine, comprising a communication unit for receiving data on a time change of the grinding resistance generated by the grinding machine. Divide the grinding surface of the work into a plurality of cells, and make a contact determination as to whether or not each cell has contacted a grindstone,
A machining simulation system for a grinding apparatus, wherein a state of a grinding surface of a cell determined to be in contact is calculated in the contact determination. The processing simulation system for a grinding device according to claim 5, wherein the contact determination is performed based on a position of the grinding wheel and a position of the cell. Obtaining a first data which is a time change of the grinding resistance;
Obtaining second data that is a relationship between the cutting speed and the grinding resistance;
Calculating the state of the ground surface of the workpiece by calculation based on the first data and the second data. The method according to claim 7, wherein the first data is obtained based on actual machining data obtained by grinding the work. The method according to claim 7, wherein the second data is obtained based on actual machining data obtained by grinding the work. Dividing the ground surface of the work into a plurality of cells,
Performing a contact determination of whether or not each cell has contacted a grinding wheel,
Calculating a state of a ground surface of the cell determined to be in contact with the contact determination in the contact determination. On the computer,
First data which is a time change of the grinding resistance;
A processing simulation program for a grinding apparatus for calculating a state of a ground surface of a workpiece based on second data that is a relationship between a cutting speed and a grinding resistance.

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