CN202762911U - Bending device for leading-out electrode of high-power semiconductor module - Google Patents
Bending device for leading-out electrode of high-power semiconductor module Download PDFInfo
- Publication number
- CN202762911U CN202762911U CN 201220273284 CN201220273284U CN202762911U CN 202762911 U CN202762911 U CN 202762911U CN 201220273284 CN201220273284 CN 201220273284 CN 201220273284 U CN201220273284 U CN 201220273284U CN 202762911 U CN202762911 U CN 202762911U
- Authority
- CN
- China
- Prior art keywords
- bending
- power semiconductor
- semiconductor module
- chute
- extraction electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The utility model provides a bending device for a leading-out electrode of a high-power semiconductor module, belongs to the technical field of power electronics, and solves the problems that in the prior art, as tools such as pliers are used, the electrode bending efficiency is low, and the bending quality is poor. The bending device comprises an engine base and a bending pressing block, wherein a working table and a three-dimensional moving bracket are arranged on the engine base; the three-dimension moving bracket can drive the bending pressing block to move in the three-dimensional direction; and the bending pressing block is hinged on the moving bracket. The bending device can bend various models of leading-out electrodes of high-power semiconductors, and improves the bending efficiency and the product quality.
Description
Technical field
The utility model belongs to electric and electronic technical field, relates to a kind of apparatus for bending of high-power semiconductor module extraction electrode.
Background technology
Power semiconductor modular or claim that electric power electronic module is for the circuit design that is operated in relatively high voltage or relatively high electric current.Power semiconductor modular comprises power semiconductor chip at least, is used for carrying out switching, adjusting or the rectification of electric current.Now, power semiconductor modular particularly has the high-power single-phase half-bridge fast recovery diode semiconductor module of double pipe structure, is used in many power electronic circuits, especially in the circuit such as inversion welding machine, electroplating power supply and frequency converter.
At present, domestic manufacturer is when producing high-power semiconductor module, and the bending of its extraction electrode all adopts manual mode to carry out bending, and operation is many in operating process, labour intensity is large, the working time that not only spends is long, and inefficiency is of poor quality, and, in Forging Process, easily damage high-power semiconductor module, cause unnecessary product rejection, cause the artificial wasting of resources.
Summary of the invention
There are the problems referred to above in the utility model for existing technology, has proposed a kind of apparatus for bending of high-power semiconductor module extraction electrode, and this bending device can bend the high power semi-conductor extraction electrode of Multiple Type, improves bending efficient and product quality.
The utility model is realized by following technical proposal: a kind of apparatus for bending of high-power semiconductor module extraction electrode, comprise support and bending briquetting, it is characterized in that, be provided with workbench and can drive the bending briquetting at the mobile three-dimensional traversing carriage of three-dimensional at described support, described bending briquetting is articulated on the traversing carriage.
This bending device makes extraction electrode vertically upward by high-power semiconductor module is placed on first on the workbench, will bend briquetting by traversing carriage and move to workbench and go out, and rotates the bending briquetting extraction electrode is vertically upward bent.The high-power semiconductor module of model of the same race can bend operation continuously, does not need to adjust.
In the apparatus for bending of above-mentioned high-power semiconductor module extraction electrode, described three-dimensional traversing carriage comprises the horizontal cross support, horizontal longitudinal carrier and vertical support frame, described horizontal longitudinal carrier is L-shaped, described vertical support frame is fixed on the support, at the vertical support frame cover lifting cover is arranged, the vertical panel face of above-mentioned horizontal longitudinal carrier is connected to lifting by the governor motion one that can make horizontal longitudinal carrier and vertically move and puts, and above-mentioned horizontal cross support is connected on the level board face of horizontal longitudinal carrier by the governor motion two that can make horizontal cross support transverse shifting.Thisly make three-dimensional traversing carriage can regulate according to the actual needs position between horizontal cross support, horizontal longitudinal carrier and the vertical support frame three, make the bending briquetting be adjusted to suitable position.
In the apparatus for bending of above-mentioned high-power semiconductor module extraction electrode, described governor motion one comprises the chute one that is arranged on the bar shaped on the vertical panel face, chute one arranges along the longitudinal, be provided with set bolt one in chute one, this set bolt one passes chute one and is connected with above-mentioned lifting external threading.When need regulating set bolt one is loosened, again set bolt one is tightened after being adjusted to correct position.
In the apparatus for bending of above-mentioned high-power semiconductor module extraction electrode, described governor motion two comprises the chute two that is arranged on the bar shaped on the level board face, chute two transversely arranges, be provided with set bolt two in chute two, this set bolt two passes chute two and is connected with the horizontal cross support.When need regulating set bolt two is loosened, again set bolt two is tightened after being adjusted to correct position.
In the apparatus for bending of above-mentioned high-power semiconductor module extraction electrode, be provided with holding screw between described lifting cover and the vertical support frame.When need regulating holding screw is loosened, again holding screw is tightened after being adjusted to correct position.
In the apparatus for bending of above-mentioned high-power semiconductor module extraction electrode, described horizontal cross bracket end is provided with a U-shaped breach, and above-mentioned bending briquetting is arranged in this U-shaped breach and will bends briquetting by the axle of having strong market potential and is hinged on the horizontal cross support.
In the apparatus for bending of above-mentioned high-power semiconductor module extraction electrode, have some the grooves that arrange along the longitudinal on the described workbench.
In the apparatus for bending of above-mentioned high-power semiconductor module extraction electrode, described bending briquetting is the pentagon shaped with radian bottom surface and fillet surface, and fillet surface is for connecting a plane of side and end face, and its lap is the plane.
In the apparatus for bending of above-mentioned high-power semiconductor module extraction electrode, at described end face operating grip is housed.
Compared with prior art, the apparatus for bending of this high-power semiconductor module extraction electrode is owing to being provided with three-dimensional traversing carriage, can adjust to the optional position by three-dimensional traversing carriage so that bend briquetting, like this so that this device can be suitable for the high-power semiconductor module of different models, and for the high-power semiconductor module that screw is arranged, can be by groove so that high-power semiconductor module can be set level, therefore, bending device is applied widely.Can make extraction electrode be easy to be driven plain by the bending briquetting, the flatness of bending electrode and high conformity reduce manufacturing procedure, shorten the process-cycle, and production efficiency is high, without waste, reduce workman's the advantages such as labour intensity.
Description of drawings
Fig. 1 is perspective view of the present utility model.
Fig. 2 is the structural representation of bending briquetting in this bending device.
Fig. 3 is the side schematic view of the bending briquetting in this bending device.
Among the figure, 1, support; 2, bending briquetting; 3, workbench; 31, groove; 4, horizontal cross support; 5, horizontal longitudinal carrier; 51, vertical panel face; 52, chute one; 53, set bolt one; 54, level board face; 55, chute two; 56, set bolt two; 6, vertical support frame; 61, lifting cover; 62, holding screw; 7, the axle of having strong market potential; 8, fillet surface; 9, radian bottom surface; 10, operating grip.
The specific embodiment
Below be specific embodiment of the utility model, and by reference to the accompanying drawings the technical solution of the utility model be further described, but the utility model is not limited to these embodiment.
As shown in Figure 1, the apparatus for bending of this high-power semiconductor module extraction electrode, comprise support 1 and bending briquetting 2, be provided with workbench 3 and can drive bending briquetting 2 at the mobile three-dimensional traversing carriage of three-dimensional at support 1, bending briquetting 2 is articulated on the traversing carriage.Have some the grooves 31 that arrange along the longitudinal on the workbench 3.Groove 31 numbers depend on the needs, and number is not limit, and shape and the degree of depth of groove 31 depend on the needs
Specifically, three-dimensional traversing carriage comprises horizontal cross support 4, horizontal longitudinal carrier 5 and vertical support frame 6, and horizontal longitudinal carrier 5 is L-shaped, and vertical support frame 6 is fixed on the support 1, at vertical support frame 6 covers lifting cover 61 is arranged, be provided with holding screw 62 between lifting cover 61 and the vertical support frame 6.The vertical panel face 51 of horizontal longitudinal carrier 5 is connected on the lifting cover 61 by the governor motion one that horizontal longitudinal carrier 5 is vertically moved, governor motion one comprises the chute 1 that is arranged on the bar shaped on the vertical panel face 51, chute 1 arranges along the longitudinal, be provided with set bolt 1 in chute 1, this set bolt 1 passes chute 1 and is threaded with lifting cover 61.Horizontal cross support 4 is connected on the level board face 54 of horizontal longitudinal carrier 5 by the governor motion two that can make horizontal cross support 4 transverse shiftings.Governor motion two comprises the chute 2 55 that is arranged on the bar shaped on the level board face 54, and chute 2 55 transversely arranges, and is provided with set bolt 2 56 in chute 2 55, and this set bolt 2 56 passes chute 2 55 and is connected with horizontal cross support 4.As shown in Figures 2 and 3, horizontal cross support 4 ends are provided with a U-shaped breach, and bending briquetting 2 is arranged in this U-shaped breach and will bends briquetting 2 by the axle 7 of having strong market potential and is hinged on the horizontal cross support 4.Bending briquetting 2 is the pentagon shaped with radian bottom surface 9 and fillet surface 8, and fillet surface 8 is for connecting a plane of side and end face, and its lap is the plane.At end face operating grip 10 is housed.The thickness of bending briquetting 2 is decided on high-power semiconductor module extraction electrode width, fillet surface 8 is the bendings that affect extraction electrode in order to prevent from bending briquetting 2 operations to carry out running into high-power semiconductor module when 90 degree rotate from A to B, the radian bottom surface be prevent the operation briquetting from A to B or B when A rotates, run into workbench 3 and affect the bending of high-power semiconductor module extraction electrode.
The use procedure of this device is as follows: this bending device makes extraction electrode vertically upward by high-power semiconductor module is placed on the workbench 3 first, when needing adjusting vertical set bolt 1 is loosened, again set bolt 1 is tightened after being adjusted to correct position, when needing adjusting horizontal set bolt 2 56 is loosened, again set bolt 2 56 is tightened after being adjusted to correct position, when need regulating upper-lower position holding screw 62 is loosened, again holding screw 62 is tightened after being adjusted to correct position.To bend briquetting 2 by traversing carriage and move to workbench 3 and go out, and rotate bending briquetting 2 extraction electrode is vertically upward bent.The high-power semiconductor module of model of the same race can bend operation continuously, does not need to adjust.
Specific embodiment described herein only is to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Although this paper has more used the terms such as support 1, bending briquetting 2, workbench 3, groove 31, horizontal cross support 4, horizontal longitudinal carrier 5, vertical panel face 51, chute 1, set bolt 1, level board face 54, chute 2 55, set bolt 2 56, vertical support frame 6, lifting cover 61, holding screw 62, the axle 7 of having strong market potential, fillet surface 8, radian bottom surface 9, operating grip 10, do not get rid of the possibility of using other term.Using these terms only is in order to describe more easily and explain essence of the present utility model; They are construed to any additional restriction all is contrary with the utility model spirit.
Claims (9)
1. the apparatus for bending of a high-power semiconductor module extraction electrode, comprise support (1) and bending briquetting (2), it is characterized in that, be provided with workbench (3) and can drive bending briquetting (2) at the mobile three-dimensional traversing carriage of three-dimensional at described support (1), described bending briquetting (2) is articulated on the traversing carriage.
2. the apparatus for bending of high-power semiconductor module extraction electrode according to claim 1, it is characterized in that, described three-dimensional traversing carriage comprises horizontal cross support (4), horizontal longitudinal carrier (5) and vertical support frame (6), described horizontal longitudinal carrier (5) is L-shaped, described vertical support frame (6) is fixed on the support (1), at vertical support frame (6) cover lifting cover (61) is arranged, the vertical panel face (51) of above-mentioned horizontal longitudinal carrier (5) is connected on the lifting cover (61) by the governor motion one that horizontal longitudinal carrier (5) is vertically moved, and above-mentioned horizontal cross support (4) is connected on the level board face (54) of horizontal longitudinal carrier (5) by the governor motion two that can make horizontal cross support (4) transverse shifting.
3. the apparatus for bending of high-power semiconductor module extraction electrode according to claim 2, it is characterized in that, described governor motion one comprises the chute one (52) that is arranged on the bar shaped on the vertical panel face (51), chute one (52) arranges along the longitudinal, be provided with set bolt one (53) in chute one (52), this set bolt one (53) passes chute one (52) and is threaded with above-mentioned lifting cover (61).
4. according to claim 2 or the apparatus for bending of 3 described high-power semiconductor module extraction electrodes, it is characterized in that, described governor motion two comprises the chute two (55) that is arranged on the bar shaped on the level board face (54), chute two (55) transversely arranges, be provided with set bolt two (56) in chute two (55), this set bolt two (56) passes chute two (55) and is connected with horizontal cross support (4).
5. the apparatus for bending of high-power semiconductor module extraction electrode according to claim 4 is characterized in that, is provided with holding screw (62) between described lifting cover (61) and the vertical support frame (6).
6. according to claim 5 or the apparatus for bending of described high-power semiconductor module extraction electrode, it is characterized in that, described horizontal cross support (4) end is provided with a U-shaped breach, and above-mentioned bending briquetting (2) is arranged in this U-shaped breach and will bends briquetting (2) by the axle of having strong market potential (7) and is hinged on the horizontal cross support (4).
7. according to claim 1 and 2 or the apparatus for bending of 3 described high-power semiconductor module extraction electrodes, it is characterized in that, have some the grooves (31) that arrange along the longitudinal on the described workbench (3).
8. according to claim 1 and 2 or the apparatus for bending of 3 described high-power semiconductor module extraction electrodes, it is characterized in that, described bending briquetting (2) is the pentagon shaped with radian bottom surface (9) and fillet surface (8), fillet surface (8) is for connecting a plane of side and end face, and its lap is the plane.
9. the apparatus for bending of high-power semiconductor module extraction electrode according to claim 8 is characterized in that, at described end face operating grip (10) is housed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220273284 CN202762911U (en) | 2012-06-11 | 2012-06-11 | Bending device for leading-out electrode of high-power semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220273284 CN202762911U (en) | 2012-06-11 | 2012-06-11 | Bending device for leading-out electrode of high-power semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202762911U true CN202762911U (en) | 2013-03-06 |
Family
ID=47769514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220273284 Expired - Fee Related CN202762911U (en) | 2012-06-11 | 2012-06-11 | Bending device for leading-out electrode of high-power semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202762911U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103586803A (en) * | 2013-11-25 | 2014-02-19 | 西安永电电气有限责任公司 | IGBT module electrode bending locating tool, equipment and using method |
-
2012
- 2012-06-11 CN CN 201220273284 patent/CN202762911U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103586803A (en) * | 2013-11-25 | 2014-02-19 | 西安永电电气有限责任公司 | IGBT module electrode bending locating tool, equipment and using method |
| CN103586803B (en) * | 2013-11-25 | 2016-04-13 | 西安永电电气有限责任公司 | A kind of IGBT module electrode bending positioning tool and equipment and using method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108247352A (en) | A kind of shared bicycle Ultra-High Efficiency casing machining device | |
| CN210709247U (en) | Material conveying device for electric automation | |
| CN202762911U (en) | Bending device for leading-out electrode of high-power semiconductor module | |
| CN202964226U (en) | Effective linear cutting and positioning device | |
| CN206882954U (en) | A kind of fixed welder of surface-mounted integrated circuit positioning | |
| CN211135604U (en) | Positioning and perforating device for flange machining | |
| CN217570637U (en) | Manual pin bending jig | |
| CN216632940U (en) | PIN welding and clamping fixture for IGBT module | |
| CN201966472U (en) | Formwork structure for lead welding machine | |
| CN204332917U (en) | A kind of apparatus for shaping of stamp-mounting-paper diode | |
| CN210208010U (en) | Clamping device for cleaning optical lens | |
| CN203265479U (en) | Bend-shifting device of electronic device pin | |
| CN109922649A (en) | A kind of semiconductor flush mounting of integrated circuit | |
| CN206452486U (en) | A kind of camera module double track OTP burning jigs | |
| CN206050901U (en) | A kind of frame self adaptation feeding machanism | |
| CN216241712U (en) | Automatic radiating fin pasting equipment | |
| CN218941454U (en) | Circuit board lamination jig | |
| CN213916473U (en) | Shaping device for motor shaft machining | |
| CN213496594U (en) | Linear guide rail multistation all-in-one that punches | |
| CN214351024U (en) | Positioning tool for machining mainboard bin | |
| CN202498286U (en) | Power line hand welding clamp | |
| CN210907469U (en) | Curved surface repairing device for copper substrate | |
| CN213615449U (en) | Fixing device for chip processing | |
| CN216420767U (en) | Automatic oil tank drum raising machine | |
| CN219901488U (en) | Product polishing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20180611 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |