CN109922649A - A kind of semiconductor flush mounting of integrated circuit - Google Patents
A kind of semiconductor flush mounting of integrated circuit Download PDFInfo
- Publication number
- CN109922649A CN109922649A CN201910198493.7A CN201910198493A CN109922649A CN 109922649 A CN109922649 A CN 109922649A CN 201910198493 A CN201910198493 A CN 201910198493A CN 109922649 A CN109922649 A CN 109922649A
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- Prior art keywords
- fixedly connected
- semiconductor
- integrated circuit
- outline border
- flush mounting
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 61
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000005476 soldering Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000005028 tinplate Substances 0.000 claims description 11
- 230000003139 buffering effect Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 4
- 238000003780 insertion Methods 0.000 abstract description 9
- 230000037431 insertion Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a kind of semiconductor flush mountings of integrated circuit, including support baseboard, motion thread bar is rotatably connected at the top of auxiliary pole, motion thread bar outer surface is arranged and is threaded with transmission external screw thread block, the outside of transmission external screw thread block is fixedly connected with operation transverse slat, the middle position of operation transverse slat bottom is fixedly connected with restricted outline border, the inner rotation of limitation outline border is connected with adjustment threaded rod, the outer surface of adjustment threaded rod is arranged and is threaded with adjustment outer block, the bottom of support hanging pole and the bottom of adjustment outer block are fixedly connected to semiconductor limiting mechanism, the present invention relates to technical field of integrated circuits.The semiconductor flush mounting of the integrated circuit has reached realization by mechanical generation transmission for the dynamic clamping of manpower, has liberated the both hands of worker, it reduces labor intensity, intelligent scolding tin is fixed, and the contact between personnel and workpiece is avoided, and improves the purpose of the safety of semiconductor insertion.
Description
Technical field
The present invention relates to technical field of integrated circuits, the semiconductor flush mounting of specially a kind of integrated circuit.
Background technique
Integrated circuit is a kind of microelectronic device or component.Using certain technique, crystalline substance needed for a circuit
The elements such as body pipe, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or medium
On substrate, it is then encapsulated in a shell, becomes the microstructure with required circuit function；Wherein all elements are in structure
On formed a whole, so that electronic component has been strided forward one in terms of microminaturization, low-power consumption, intelligence and high reliability big
Step.It uses alphabetical " IC " to indicate in circuit.Integrated circuit inventor is integrated circuit and the Robert of Jack Kiel ratio
Noy is thought.The application of most of current semi-conductor industry is the integrated circuit based on silicon.
Integrated circuit has small in size, and light-weight, lead-out wire and pad are few, and the service life is long, high reliablity, and it is excellent that performance is good etc.
Point, at the same it is at low cost, convenient for large-scale production.It is not only in work, consumer electronic device such as radio cassette player, television set, computer etc.
Aspect is widely used, at the same military, communication, in terms of be also widely used.It is filled with integrated circuit
With electronic equipment, packaging density can be improved tens times to thousands of times than transistor, and the stable work time of equipment can also be significantly
It improves.
Direct insertion semiconductor is mounted on integrated circuit board by man-hour manually hand-held scolding tin at present, is needed in this way using double
Hand or two people, which cooperate, to complete, and the insertion installation effectiveness of semiconductor is low, and due to the small volume of semiconductor material, solid in scolding tin
It is easy to make to go smoothly during fixed with the contact of scolding tin tool, the safety that semiconductor material insertion is installed is low.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of semiconductor flush mounting of integrated circuit, mesh is solved
It is preceding that direct insertion semiconductor is mounted on integrated circuit board by man-hour manually hand-held scolding tin, it needs to match using both hands or two people in this way
It closes and completes, the insertion installation effectiveness of semiconductor is low, and due to the small volume of semiconductor material, holds in scolding tin fixation procedure
It is easier that the contact of hand and scolding tin tool, the low problem of the safety of semiconductor material insertion installation.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs: a kind of semiconductor of integrated circuit is embedding
Enter device, including support baseboard, the right side at the top of the support baseboard is fixedly connected with auxiliary pole, the top of the auxiliary pole
Portion is rotatably connected to motion thread bar, and the motion thread bar outer surface is arranged and is threaded with transmission external screw thread block, institute
The outside for stating transmission external screw thread block is fixedly connected with operation transverse slat, and the middle position of the operation transverse slat bottom is fixedly connected limited
The inner rotation of outline border processed, the limitation outline border is connected with adjustment threaded rod, the outer surface of the adjustment threaded rod be arranged and
It is threaded with adjustment outer block, is fixedly connected with support hanging pole on the left of the operation transverse slat bottom, the support hanging pole
Bottom and the bottom of adjustment outer block are fixedly connected to semiconductor limiting mechanism；
The semiconductor limiting mechanism includes fixed outline border, the top of the fixed outline border respectively with support hanging pole and adjustment
Outer block is fixedly connected, and inner spring top plate, inner spring top plate position are run through and slidably connected in the right side of the fixed outline border
It is fixedly connected with extruding spring in the side of fixed outline border, the inner spring top plate is located at the fixed company in one end outside fixed outline border
It is connected to buffering clamping plate, the side at shock-absorbing clip board bottom end is fixedly connected with auxiliary scolding tin plate, the top of the auxiliary scolding tin plate
It is fixedly connected with tin soldering machine, the middle position in auxiliary scolding tin board bottom portion is provided with scolding tin guiding groove, auxiliary scolding tin board bottom portion
And the two sides for being located at scolding tin guiding groove are fixedly connected to tactile sensor, the interior side of the scolding tin guiding groove is fixedly connected
There is heating sheet, the heating sheet is connect by conducting wire with tin soldering machine.
Preferably, interior moving track, the interior moving track are fixedly connected on the left of the support baseboard inner bottom
Internal slide be connected with interior mobile sliding block, objective table, the objective table top are fixedly connected at the top of the interior mobile sliding block
Portion is fixedly connected to circuit board clamp close to the two sides at the back side.
Preferably, the motion thread bar is fixedly connected with driven gear at the axle center of auxiliary pole.
Preferably, the auxiliary pole is fixedly connected with right support cross bar, the right support cross bar on the right side of top
Motor is fixedly connected on the left of top.
Preferably, driving gear, the driving gear and driven gear are fixedly connected on the output shaft of the motor
Engagement connection.
Preferably, the right side at the top of the right support cross bar is fixedly connected with restricted inserted link, the right side of the operation transverse slat
It is fixedly connected with restricted slot, the limitation slot is arranged and is slidably connected with the outer surface for limiting inserted link.
Preferably, the right side that the adjustment threaded rod is located at outside limitation outline border is fixedly connected with follow bevel gear.
Preferably, the operation transverse slat runs through close to the position of follow bevel gear and is rotatably connected to fixed connecting shaft, described
The bottom end of fixed connecting shaft is fixedly connected with drive bevel gear, and the drive bevel gear engages connection with follow bevel gear, described solid
Determine to be fixedly connected with joystick at the top of connecting shaft.
Preferably, the right side at the top of the support baseboard is fixedly connected with master controller.
Preferably, the output end of the tactile sensor is connect with master controller, the output end of the master controller and weldering
Tin machine, the tin soldering machine and heating sheet are electrically connected.
(3) beneficial effect
The present invention provides a kind of semiconductor flush mountings of integrated circuit.Have it is following the utility model has the advantages that
(1), the semiconductor flush mounting of the integrated circuit by the way that circuit board to be placed on to the top of objective table, and passes through
Circuit board clamp is fixed, and can be manually rotated adjusting joystick at this time, and joystick drives adjustment threaded rod to rotate by helical gear, thus
Adjusting outer block drives the semiconductor limiting mechanism transverse shifting on right side to adjust, so that the two sides of semiconductor limit machine by semiconductor
Structure mutually clamps, and two connecting pin conducting wires of semiconductor are placed on inside scolding tin guiding groove, due to leading for semiconductor both ends
Line is flexible, so that connecting wire is fixed inside scolding tin guiding groove without adding outside, the elastic force that buffering clamping plate passes through extruding spring
Effect, mutually clamping semiconductor have reached realization by mechanical generation transmission for the dynamic clamping of manpower, have liberated the both hands of worker, mitigate
The purpose of labor intensity.
(2), the semiconductor flush mounting of the integrated circuit adjusts the lateral position of objective table after fixing by semiconductor,
Motor rotation is controlled simultaneously, and motor drives motion thread bar to rotate by gear, so that being driven external screw thread block drives operation
Transverse slat integrally moves down, so that semiconductor and positional symmetry corresponding on integrated circuit board, when tactile sensor and integrated electricity
When road plate contacts, tactile sensor will press information and be transferred to master controller, and master controller controls tin soldering machine work, to heat
Piece heating and melting block tin has reached intelligent scolding tin and has fixed, avoided so that the both ends conducting wire of semiconductor is fixed with integrated circuit board
Contact between personnel and workpiece improves the purpose of the safety of semiconductor insertion.
Detailed description of the invention
Fig. 1 is the whole structural schematic diagram of the present invention；
Fig. 2 is the structural schematic diagram of semiconductor limiting mechanism of the present invention；
Fig. 3 is the top view of present invention auxiliary scolding tin plate；
Fig. 4 is the structural schematic diagram at A of the present invention；
Fig. 5 is the structural schematic diagram at B of the present invention；
Fig. 6 is the structural block diagram of sensing element of the present invention.
In figure: 1 support baseboard, 2 auxiliary poles, 3 motion thread bars, 4 transmission external screw thread blocks, 5 operation transverse slats, 6 limitations are outer
Frame, 7 adjustment threaded rods, 8 adjustment outer blocks, 9 support hanging poles, 10 semiconductor limiting mechanisms, 101 fixed outline borders, 102 inner spring tops
Plate, 103 buffering clamping plates, 104 auxiliary scolding tin plates, 105 tin soldering machines, 106 scolding tin guiding grooves, 107 tactile sensors, 108 heating sheets,
109 squeeze springs, moving track in 11, mobile sliding block in 12,13 objective tables, 14 circuit board clamps, 15 driven gears, 16 electronic
Machine, 17 driving gears, 18 right support cross bars, 19 limitation inserted links, 20 limitation slots, 21 follow bevel gears, 22 fixed connecting shafts, 23 masters
Dynamic helical gear, 24 joysticks, 25 master controllers.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-6 is please referred to, the present invention provides a kind of technical solution: a kind of semiconductor flush mounting of integrated circuit, including
The right side of support baseboard 1,1 top of support baseboard is fixedly connected with auxiliary pole 2, and the top of auxiliary pole 2 is rotatably connected to biography
Dynamic threaded rod 3,3 outer surface of motion thread bar are arranged and are threaded with transmission external screw thread block 4, be driven the outer of external screw thread block 4
Portion is fixedly connected with operation transverse slat 5, and the middle position of operation 5 bottom of transverse slat is fixedly connected with restricted outline border 6, limitation outline border 6
Inner rotation is connected with adjustment threaded rod 7, and the outer surface of adjustment threaded rod 7 is arranged and is threaded with adjustment outer block 8, behaviour
Make to be fixedly connected with support hanging pole 9 on the left of 5 bottom of transverse slat, the bottom of support hanging pole 9 and the bottom of adjustment outer block 8 are fixed
It is connected with semiconductor limiting mechanism 10；
Semiconductor limiting mechanism 10 includes fixed outline border 101, the top of fixed outline border 101 respectively with support hanging pole 9 and adjust
Whole outer block 8 is fixedly connected, and inner spring top plate 102, inner spring top plate are run through and slidably connected in the right side of fixed outline border 101
102 sides for being located at fixed outline border 101, which are fixedly connected with, squeezes spring 109, and inner spring top plate 102 is located at outside fixed outline border 101
The one end in portion is fixedly connected with buffering clamping plate 103, and the side of buffering 103 bottom end of clamping plate is fixedly connected with auxiliary scolding tin plate 104, auxiliary
The top of scolding tin plate 104 is helped to be fixedly connected with tin soldering machine 105, the middle position of auxiliary 104 bottom of scolding tin plate is provided with scolding tin and draws
Guide groove 106 assists 104 bottom of scolding tin plate and is fixedly connected to tactile sensor 107 positioned at the two sides of scolding tin guiding groove 106,
The interior side of scolding tin guiding groove 106 is fixedly connected with heating sheet 108, and heating sheet 108 is connect by conducting wire with tin soldering machine 105.
Interior moving track 11 is fixedly connected on the left of 1 inner bottom of support baseboard, the internal slide of interior moving track 11 is connected with interior
Mobile sliding block 12, the top of interior mobile sliding block 12 are fixedly connected with objective table 13, and 13 top of objective table is equal close to the two sides at the back side
It is fixedly connected with circuit board clamp 14.Motion thread bar 3 is fixedly connected with driven gear 15 at the axle center of auxiliary pole 2.
Auxiliary pole 2 is fixedly connected with right support cross bar 18 on the right side of top, and the left side at 18 top of right support cross bar is fixedly connected
There is motor 16.Driving gear 17 is fixedly connected on the output shaft of motor 16, driving gear 17 is engaged with driven gear 15
Connection.The right side at 18 top of right support cross bar is fixedly connected with restricted inserted link 19, and the right side of operation transverse slat 5 is fixedly connected restricted
Slot 20, limitation slot 20 are arranged and are slidably connected with the outer surface for limiting inserted link 19.It adjusts threaded rod 7 and is located at limitation outline border 6
External right side is fixedly connected with follow bevel gear 21.Operation transverse slat 5 runs through and rotates close to the position of follow bevel gear 21
Be connected with fixed connecting shaft 22, the bottom end of fixed connecting shaft 22 is fixedly connected with drive bevel gear 23, drive bevel gear 23 and it is driven tiltedly
The engagement connection of gear 21, the top of fixed connecting shaft 22 are fixedly connected with joystick 24.The right side at 1 top of support baseboard is fixedly connected
There is master controller 25.The output end of tactile sensor 107 is connect with master controller 25, the output end and tin soldering machine of master controller 25
105, tin soldering machine 105 and heating sheet 108 are electrically connected.
In use, by the top that circuit board is placed on to objective table 13, and fixed by circuit board clamp 14, hand at this time
Dynamic rotation adjusts joystick 24, and joystick 24 drives adjustment threaded rod 7 to rotate by helical gear, so as to adjust the drive of outer block 8
10 transverse shifting of semiconductor limiting mechanism on right side is adjusted, so that the two sides of semiconductor are mutually pressed from both sides by semiconductor limiting mechanism 10
It holds, and two connecting pin conducting wires of semiconductor is placed on inside scolding tin guiding groove 106, due to the conducting wire bendable at semiconductor both ends
Song, so that connecting wire is fixed inside scolding tin guiding groove 106 without adding outside, the bullet that buffering clamping plate 103 passes through extruding spring 109
Power effect, mutually clamping semiconductor have reached realization by mechanical generation transmission for the dynamic clamping of manpower, have liberated the both hands of worker, subtract
The purpose of light work intensity after fixing by semiconductor, adjusts the lateral position of objective table 13, while controlling 16 turns of motor
Dynamic, motor 16 drives motion thread bar 3 to rotate by gear, drives operation transverse slat 5 whole downwards to be driven external screw thread block 4
It is mobile, so that semiconductor and positional symmetry corresponding on integrated circuit board, when tactile sensor 107 is contacted with integrated circuit board
When, tactile sensor 107 will press information and be transferred to master controller 25, and master controller 25 controls tin soldering machine 105 and works, thus plus
It is solid to have reached intelligent scolding tin so that the both ends conducting wire of semiconductor is fixed with integrated circuit board for 108 heating and melting block tin of backing
It is fixed, the contact between personnel and workpiece is avoided, the purpose of the safety of semiconductor insertion is improved.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of semiconductor flush mounting of integrated circuit, including support baseboard (1), it is characterised in that: the support baseboard (1)
It is fixedly connected on the right side of top auxiliary pole (2), is rotatably connected to motion thread bar (3) at the top of the auxiliary pole (2),
Motion thread bar (3) outer surface is arranged and is threaded with transmission external screw thread block (4), the transmission external screw thread block (4)
Outside be fixedly connected with operation transverse slat (5), it is described operation transverse slat (5) bottom middle position be fixedly connected with restricted outline border
(6), the inner rotation of limitation outline border (6) is connected with adjustment threaded rod (7), the outer surface of adjustment threaded rod (7)
It is arranged and is threaded with adjustment outer block (8), is fixedly connected with support hanging pole (9) on the left of operation transverse slat (5) bottom,
The bottom of the support hanging pole (9) and the bottom of adjustment outer block (8) are fixedly connected to semiconductor limiting mechanism (10)；
The semiconductor limiting mechanism (10) includes fixed outline border (101), the top of the fixed outline border (101) respectively with support
Hanging rod (9) is fixedly connected with adjustment outer block (8), and the right side of the fixed outline border (101) is run through and slidably connects inner spring
Top plate (102), the side that the inner spring top plate (102) is located at fixed outline border (101), which is fixedly connected with, squeezes spring (109),
The inner spring top plate (102) is located at fixed outline border (101) external one end and is fixedly connected with buffering clamping plate (103), described slow
The side for rushing clamping plate (103) bottom end is fixedly connected with auxiliary scolding tin plate (104), and the top of auxiliary scolding tin plate (104) is fixed
It is connected with tin soldering machine (105), the middle position of described auxiliary scolding tin plate (104) bottom is provided with scolding tin guiding groove (106), described
It assists scolding tin plate (104) bottom and is fixedly connected to tactile sensor (107), institute positioned at the two sides of scolding tin guiding groove (106)
The interior side for stating scolding tin guiding groove (106) is fixedly connected with heating sheet (108), and the heating sheet (108) passes through conducting wire and weldering
Tin machine (105) connection.
2. a kind of semiconductor flush mounting of integrated circuit according to claim 1, it is characterised in that: the support baseboard
(1) it is fixedly connected on the left of inner bottom interior moving track (11), the internal slide of the interior moving track (11) is connected with
Interior mobile sliding block (12) is fixedly connected with objective table (13) at the top of the interior mobile sliding block (12), objective table (13) top
Portion is fixedly connected to circuit board clamp (14) close to the two sides at the back side.
3. a kind of semiconductor flush mounting of integrated circuit according to claim 1, it is characterised in that: the motion thread
Bar (3) is fixedly connected with driven gear (15) at the axle center of auxiliary pole (2).
4. a kind of semiconductor flush mounting of integrated circuit according to claim 3, it is characterised in that: the auxiliary pole
(2) it is fixedly connected with right support cross bar (18) on the right side of top, the left side at the top of the right support cross bar (18) is fixed to be connected
It is connected to motor (16).
5. a kind of semiconductor flush mounting of integrated circuit according to claim 4, it is characterised in that: the motor
(16) it is fixedly connected on output shaft driving gear (17), the driving gear (17) engages connection with driven gear (15).
6. a kind of semiconductor flush mounting of integrated circuit according to claim 4, it is characterised in that: the right support is horizontal
Right side at the top of bar (18) is fixedly connected restricted inserted link (19), and restricted insert is fixedly connected on the right side of the operation transverse slat (5)
Slot (20), limitation slot (20) are arranged and are slidably connected with the outer surface for limiting inserted link (19).
7. a kind of semiconductor flush mounting of integrated circuit according to claim 1, it is characterised in that: the adjustment screw thread
Bar (7) is located at the external right side of limitation outline border (6) and is fixedly connected with follow bevel gear (21).
8. a kind of semiconductor flush mounting of integrated circuit according to claim 7, it is characterised in that: the operation transverse slat
(5) position close to follow bevel gear (21) is run through and is rotatably connected to fixed connecting shaft (22), the bottom of the fixed connecting shaft (22)
End is fixedly connected with drive bevel gear (23), and the drive bevel gear (23) engages connection with follow bevel gear (21), described solid
Determine to be fixedly connected with joystick (24) at the top of connecting shaft (22).
9. a kind of semiconductor flush mounting of integrated circuit according to claim 1, it is characterised in that: the support baseboard
(1) right side at the top of is fixedly connected with master controller (25).
10. a kind of semiconductor flush mounting of integrated circuit according to claim 9, it is characterised in that: described to press biography
The output end of sensor (107) is connect with master controller (25), the output end of the master controller (25) and tin soldering machine (105), institute
Tin soldering machine (105) and heating sheet (108) are stated to be electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910198493.7A CN109922649B (en) | 2019-03-15 | 2019-03-15 | Semiconductor embedding device of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910198493.7A CN109922649B (en) | 2019-03-15 | 2019-03-15 | Semiconductor embedding device of integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109922649A true CN109922649A (en) | 2019-06-21 |
| CN109922649B CN109922649B (en) | 2020-09-29 |
Family
ID=66965200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910198493.7A Active CN109922649B (en) | 2019-03-15 | 2019-03-15 | Semiconductor embedding device of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109922649B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113851288A (en) * | 2021-09-27 | 2021-12-28 | 蚌埠市爱瑞特电子有限责任公司 | Semi-precision plastic package resistor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6466068A (en) * | 1987-04-17 | 1989-03-13 | Matsumoto Giken Kk | Circuit board holding device in hot blast type solder melting device |
| CN106695058A (en) * | 2017-01-05 | 2017-05-24 | 南阳市日昌光电科技有限公司 | Automatic welding equipment for LED lamp circuit board |
| CN107584241A (en) * | 2017-09-01 | 2018-01-16 | 湖州德耀金属制品有限公司 | A kind of metal furniture full auto-bonding system |
| CN208127144U (en) * | 2018-03-16 | 2018-11-20 | 黄嘉烨 | A kind of link tin ball device of integrated antenna package |
| CN108942795A (en) * | 2018-08-23 | 2018-12-07 | 湖州银轴智能装备有限公司 | Rapid mounting pump dedicated |
-
2019
- 2019-03-15 CN CN201910198493.7A patent/CN109922649B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6466068A (en) * | 1987-04-17 | 1989-03-13 | Matsumoto Giken Kk | Circuit board holding device in hot blast type solder melting device |
| CN106695058A (en) * | 2017-01-05 | 2017-05-24 | 南阳市日昌光电科技有限公司 | Automatic welding equipment for LED lamp circuit board |
| CN107584241A (en) * | 2017-09-01 | 2018-01-16 | 湖州德耀金属制品有限公司 | A kind of metal furniture full auto-bonding system |
| CN208127144U (en) * | 2018-03-16 | 2018-11-20 | 黄嘉烨 | A kind of link tin ball device of integrated antenna package |
| CN108942795A (en) * | 2018-08-23 | 2018-12-07 | 湖州银轴智能装备有限公司 | Rapid mounting pump dedicated |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113851288A (en) * | 2021-09-27 | 2021-12-28 | 蚌埠市爱瑞特电子有限责任公司 | Semi-precision plastic package resistor |
| CN113851288B (en) * | 2021-09-27 | 2022-06-07 | 蚌埠市爱瑞特电子有限责任公司 | Semi-precision plastic package resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109922649B (en) | 2020-09-29 |
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Denomination of invention: A Semiconductor Embedding Device for Integrated Circuits Granted publication date: 20200929 Pledgee: Jingjiang Branch of Bank of China Ltd. Pledgor: Jingjiang Jiasheng Vacuum Technology Co.,Ltd. Registration number: Y2024980011506 |