CN113709998B - Circuit board pad correction equipment - Google Patents
Circuit board pad correction equipment Download PDFInfo
- Publication number
- CN113709998B CN113709998B CN202110999955.2A CN202110999955A CN113709998B CN 113709998 B CN113709998 B CN 113709998B CN 202110999955 A CN202110999955 A CN 202110999955A CN 113709998 B CN113709998 B CN 113709998B
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- plate
- circuit board
- gear
- vertical plate
- frame body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a circuit board pad correction apparatus, comprising: the circuit board welding frame comprises a frame body structure, wherein a lifting elastic plate is movably arranged on the frame body structure and used for correcting a bent circuit board welding plate; the fixing component is arranged on the frame body structure and used for bearing a circuit board bonding pad; the trend mechanism is arranged on the frame body structure and used for driving the elastic plate to do lifting motion in the spatial vertical direction so as to correct a circuit board bonding pad arranged on the fixed component, and the trend mechanism drives the elastic plate to do lifting motion with smaller amplitude in the continuous action process; the guide assembly is arranged on the frame body structure and connected with the trend mechanism and the elastic plate, and the guide assembly drives the elastic plate to move up and down when the trend mechanism acts, so that a bonding pad of the correction circuit board is realized.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board pad correction device.
Background
Circuit boards are classified into three major categories, i.e., single-sided boards, double-sided boards, and multilayer circuit boards, according to the number of layers.
First, a single panel, on the most basic PCB, the components are concentrated on one side and the wires are concentrated on the other side. Such a PCB is called a single-sided circuit board because the conductors are present on only one side. The single panel is generally simple to manufacture and low in cost, but has the disadvantage that the single panel cannot be applied to a complex product.
The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection. The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology towards high speed, multiple functions, large capacity, small volume, thinning and light weight.
The land, the basic component unit of surface mount assembly, is used to form the land pattern of the circuit board, i.e. various land combinations designed for specific component types.
In the use process of the circuit board bonding pad, the bonding pad is easy to bend due to temperature or external physical extrusion, the bent circuit board bonding pad cannot be used any more, and waste is caused greatly.
Disclosure of Invention
The present invention is directed to a circuit board pad modification apparatus to solve the above-mentioned problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
a circuit board pad dressing apparatus, said circuit board pad dressing apparatus comprising:
the circuit board welding frame comprises a frame body structure, wherein a lifting elastic plate is movably arranged on the frame body structure and used for correcting a bent circuit board welding plate;
the fixing component is arranged on the frame body structure and used for bearing a circuit board bonding pad;
the trend mechanism is arranged on the frame body structure and used for driving the elastic plate to do lifting motion in the spatial vertical direction so as to correct a circuit board bonding pad arranged on the fixed component, and the trend mechanism drives the elastic plate to do lifting motion with smaller amplitude in the continuous action process;
the guide assembly is arranged on the frame body structure and connected with the trend mechanism and the elastic plate, and the guide assembly drives the elastic plate to do lifting motion when the trend mechanism acts.
As a further scheme of the invention: the support body structure comprises a horizontally arranged mounting seat, a vertical plate fixedly connected with the mounting seat in a vertical manner, and a mounting plate fixedly mounted on the vertical plate.
As a still further scheme of the invention: the fixing component comprises two fixing pieces which are symmetrically and rotatably arranged on the vertical plate, an elastic piece which is connected with the two fixing pieces, and a limiting block which is fixedly arranged on the vertical plate and matched with the fixing pieces.
As a still further scheme of the invention: the tending mechanism comprises a power component arranged on the vertical plate and a gradual component connected with the power component and rotatably installed on the vertical plate;
wherein the progressive assembly is connected to the guide assembly by a connecting rod.
As a still further scheme of the invention: the power component comprises a driving device fixedly installed on the vertical plate, a gear installed on the vertical plate in a rotating mode through an output shaft of the driving device, a gear meshed with the gear and installed in a rotating mode on the vertical plate, and a second gear connected with the progressive component.
As a still further scheme of the invention: the progressive assembly comprises an adjusting structure arranged on the vertical plate, a first bevel gear fixedly connected with the vertical plate, and a second bevel gear which is meshed with the first bevel gear and is rotatably installed on the adjusting structure;
the rotating shaft of the first bevel gear penetrates through the rotating shaft of the second gear and is fixedly connected with the vertical plate, and the rotating shaft of the first bevel gear and the rotating shaft of the second gear are coaxially arranged.
As a still further scheme of the invention: the adjusting structure comprises a rotary table fixedly connected with the second gear through a bolt, a screw rod rotatably mounted on the rotary table, and a threaded sleeve matched with the screw rod;
the screw rod is fixedly connected with the second bevel gear, and the threaded sleeve is rotatably connected with one end of the connecting rod.
As a still further scheme of the invention: the guide assembly comprises guide rods symmetrically and fixedly arranged on the mounting plate and sliding plates arranged on the guide rods in a sliding manner;
the sliding plate is rotatably connected with the other end of the connecting rod, and the sliding plate is connected with the elastic plate through a supporting plate.
As a still further scheme of the invention: a buffer assembly is further arranged between the abutting plate and the elastic plate, and comprises a transverse plate fixedly mounted at one end of the abutting plate far away from the sliding plate and a buffer rod, one end of the buffer rod is connected with the transverse plate in a sliding manner, and the other end of the buffer rod is fixedly connected with the elastic plate;
and the buffer rod is sleeved with a pressure spring.
Compared with the prior art, the invention has the beneficial effects that:
1. the circuit board bonding pad is fixed through the fixing component, and when the elastic plate acts on the circuit board bonding pad, the fixing component moves along with the circuit board bonding pad, so that damage to a circuit board bonding pad body in the process of correcting the circuit board bonding pad is effectively reduced;
2. under the action of the tending mechanism, the acting force of the elastic plate on the circuit board bonding pad is gradually reduced, and the secondary damage to the circuit board bonding pad caused by frequent pressing is avoided while the correction purpose is achieved.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a circuit board pad modification apparatus.
Fig. 2 is an enlarged schematic view of the structure at a in fig. 1.
Fig. 3 is a schematic structural view of fig. 1 with the connecting rod, the turntable, the screw rod, the threaded sleeve and the second bevel gear removed.
Fig. 4 is a schematic plan view of an embodiment of a circuit board pad modification apparatus.
In the figure: the device comprises a mounting base 1, a vertical plate 2, a vertical plate 3, a driving device 4, a first gear, a second gear 5, a rotary table 6, a first bevel gear 7, a second bevel gear 8, a screw rod 9, a threaded sleeve 10, a connecting rod 11, a guide rod 12, a sliding plate 13, a resisting plate 14, a transverse plate 15, an elastic plate 16, a pressure spring 17, a rubber pad 18, a fixing piece 19, an elastic piece 20 and a heater 21.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In addition, an element of the present invention may be said to be "fixed" or "disposed" to another element, either directly on the other element or with intervening elements present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1~4, in an embodiment of the present invention, an apparatus for correcting a pad of a circuit board, includes:
the device comprises a horizontally arranged mounting seat 1 and a vertical plate 2 fixedly connected with a hammer stone of the mounting seat 1, wherein a mounting plate is fixedly mounted on the vertical plate 2, a liftable elastic plate 16 is movably arranged on the vertical plate 2, and the elastic plate 16 is used for correcting a bent circuit board bonding pad;
the fixing component is arranged on the frame body structure and used for bearing a circuit board bonding pad;
the tending mechanism is arranged on the frame body structure and is used for driving the elastic plate 16 to do lifting motion in the spatial vertical direction so as to correct a circuit board bonding pad arranged on the fixed component, and the amplitude of the lifting motion of the elastic plate 16 is driven to be smaller and smaller in the continuous action process of the tending mechanism;
the guide assembly is arranged on the frame body structure and connected with the trend mechanism and the elastic plate 16, and the guide assembly drives the elastic plate 16 to do lifting motion when the trend mechanism acts.
In the embodiment of the invention, the circuit board bonding pad is fixed through the fixing component, and the fixing component moves along with the circuit board bonding pad when the elastic plate 16 acts on the circuit board bonding pad, so that the damage to the circuit board bonding pad body in the process of correcting the circuit board bonding pad is effectively reduced.
Under the action of the tending mechanism, the acting force of the elastic plate 16 on the circuit board pad is gradually reduced, and the circuit board pad is prevented from being secondarily damaged in the process of frequent pressing while the correcting purpose is achieved.
The lower part of the elastic plate 16 is fixedly provided with a rubber pad 18, the rubber pad 18 is in a semi-cylindrical shape, and when the elastic plate 16 drives the rubber pad 18 to act on the circuit board pad downwards, the structure of the circuit board pad is prevented from being damaged.
Further, a heater 21 is fixedly mounted on the mounting base 1 to keep the circuit board from being heated and corrected better.
As an embodiment of the present invention, the fixing component includes two fixing pieces 19 symmetrically and rotatably mounted on the vertical plate 2, an elastic piece 20 connecting the two fixing pieces 19, and a limiting block fixedly mounted on the vertical plate 2 and adapted to the fixing pieces 19.
In the embodiment of the invention, in the initial state, the circuit board pad is placed in the groove on the fixing member 19, and meanwhile, under the action of the limiting block, the fixing member 19 is prevented from rotating due to the action of the elastic member 20, and when the rubber pad 18 acts on the circuit board pad, the fixing member 19 rotates relatively, so that the damage to the corner of the circuit board pad in the correction process is reduced.
It should be noted that, the distance between the two fixing members 19 is fixed, so the device is only suitable for a circuit board pad of a certain model, if the device is suitable for circuit board pads of different sizes, the rotating shaft of the fixing member 19 can be installed on a moving block, the moving block can be fixed or slidably arranged in a through groove formed in the vertical plate 2 through a bolt, at the moment, the limiting block needs to move synchronously along with the fixing member 19, namely, the limiting block is fixedly installed on the moving block, and meanwhile, when the fixing member 19 is movable, the relative or opposite movement amount of the two needs to be consistent.
The elastic member 20 is made of a temperature-resistant material capable of withstanding a predetermined temperature.
As an embodiment of the invention, the tending mechanism comprises a power component arranged on the vertical plate 2, a gradual component connected with the power component and rotatably mounted on the vertical plate 2;
wherein the progressive assembly is connected with the guide assembly through a connecting rod 11;
the power assembly comprises a driving device 3 fixedly mounted on the vertical plate 2, a first gear 4 connected with an output shaft of the driving device 3 and rotatably mounted on the vertical plate 2, and a second gear 5 meshed with the first gear 4 and rotatably mounted on the vertical plate 2, wherein the second gear 5 is connected with the progressive assembly;
the progressive assembly comprises an adjusting structure arranged on the vertical plate 2, a first bevel gear 7 fixedly connected with the vertical plate 2, and a second bevel gear 8 which is meshed with the first bevel gear 7 and rotatably mounted on the adjusting structure;
the rotating shaft of the first bevel gear 7 penetrates through the rotating shaft of the second gear 5 to be fixedly connected with the vertical plate 2, and the rotating shaft of the first bevel gear 7 and the rotating shaft of the second gear 5 are coaxially arranged;
the adjusting structure comprises a rotary table 6 fixedly connected with the second gear 5 through a bolt, a screw rod 9 rotatably installed on the rotary table 6, and a threaded sleeve 10 matched with the screw rod 9;
the screw rod 9 is fixedly connected with the second bevel gear 8, and the threaded sleeve 10 is rotatably connected with one end of the connecting rod 11.
In the embodiment of the present invention, the transmission ratio of the first gear 4 to the second gear 5 is smaller than 1, when the rotary table 6 rotates along with the second gear 5, the output torque of the driving device 3 is effectively reduced, and the first bevel gear 7 is fixedly mounted on the vertical plate 2, and when the rotary table 6 rotates along with the second gear 5, the second bevel gear 8 makes a circular motion with respect to the first bevel gear 7, so as to drive the screw rod 9 to rotate, so that the threaded sleeve 10 moves towards the second bevel gear 8 on the screw rod 9, such that the radius of the circular motion of the threaded sleeve 10 is gradually reduced, and the elastic plate 16 is driven to move, such that the amplitude of the lifting motion is gradually reduced.
It is worth noting that the 3-position output shaft of the driving device can be a servo motor which can rotate forward and backward.
As an embodiment of the present invention, the guiding assembly includes a guiding rod 12 symmetrically and fixedly installed on the mounting plate, a sliding plate 13 slidably disposed on the guiding rod 12;
the sliding plate 13 is rotatably connected with the other end of the connecting rod 11, and the sliding plate 13 is connected with the elastic plate 16 through a resisting plate 14;
a buffer assembly is further arranged between the abutting plate 14 and the elastic plate 16, and comprises a transverse plate 15 fixedly mounted at one end of the abutting plate 14 far away from the sliding plate 13, and a buffer rod with one end connected with the transverse plate 15 in a sliding manner and the other end fixedly connected with the elastic plate 16;
wherein, the buffer rod is sleeved with a pressure spring 17.
In the embodiment of the present invention, the buffer rod 17 extends to the abutting plate 14 and is connected to a fixing block to prevent the buffer rod from being separated from the abutting plate 14 by the compression spring 17.
Through setting up two sets of guide bars 12, increase the stability of device to under the effect of pressure spring 17, when making rubber pad 18 act on the circuit board pad, the structure of circuit board pad obtains maximum protection.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. A circuit board pad modification apparatus, characterized by comprising:
the circuit board welding frame comprises a frame body structure, wherein a lifting elastic plate (16) is movably arranged on the frame body structure, and the elastic plate (16) is used for correcting a bent circuit board welding disc;
the fixing component is arranged on the frame body structure and used for bearing a circuit board welding disc;
the tending mechanism is arranged on the frame body structure and is used for driving the elastic plate (16) to do lifting motion in the vertical direction of the space so as to correct a circuit board bonding pad arranged on the fixed component, and the amplitude of the lifting motion of the elastic plate (16) is driven to be smaller and smaller in the continuous action process of the tending mechanism;
the guide assembly is arranged on the frame body structure and connected with the tending mechanism and the elastic plate (16), and drives the elastic plate (16) to do lifting motion when the tending mechanism acts;
the frame body structure comprises a horizontally arranged mounting seat (1), a vertical plate (2) vertically and fixedly connected with the mounting seat (1), and a mounting plate fixedly mounted on the vertical plate (2);
the fixing component comprises two fixing pieces (19) symmetrically and rotatably mounted on the vertical plate (2), an elastic piece (20) connected with the two fixing pieces (19), and a limiting block fixedly mounted on the vertical plate (2) and matched with the fixing pieces (19);
the tending mechanism comprises a power component arranged on the vertical plate (2), and a progressive component connected with the power component and rotatably mounted on the vertical plate (2);
wherein the progressive assembly is connected to the guide assembly by a connecting rod (11);
the power assembly comprises a driving device (3) fixedly mounted on the vertical plate (2), a first gear (4) which is connected with an output shaft of the driving device (3) and rotatably mounted on the vertical plate (2), and a second gear (5) which is meshed with the first gear (4) and rotatably mounted on the vertical plate (2), wherein the second gear (5) is connected with the progressive assembly;
the progressive assembly comprises an adjusting structure arranged on the vertical plate (2), a first bevel gear (7) fixedly connected with the vertical plate (2), and a second bevel gear (8) which is meshed with the first bevel gear (7) and is rotatably installed on the adjusting structure;
the rotating shaft of the first bevel gear (7) penetrates through the rotating shaft of the second gear (5) and is fixedly connected with the vertical plate (2), and the rotating shaft of the first bevel gear (7) and the rotating shaft of the second gear (5) are coaxially arranged.
2. A circuit board pad modification apparatus according to claim 1, wherein the adjustment structure comprises a rotary plate (6) fixedly connected to the second gear (5) by a bolt, a screw rod (9) rotatably mounted on the rotary plate (6), and a threaded sleeve (10) adapted to the screw rod (9);
the screw rod (9) is fixedly connected with the second bevel gear (8), and the threaded sleeve (10) is rotatably connected with one end of the connecting rod (11).
3. A circuit board pad dressing apparatus according to claim 1, wherein said guide assembly comprises guide rods (12) symmetrically fixedly mounted on said mounting plate, sliding plates (13) slidably disposed on said guide rods (12);
the sliding plate (13) is rotatably connected with the other end of the connecting rod (11), and the sliding plate (13) is connected with the elastic plate (16) through a resisting plate (14).
4. The circuit board pad correction device according to claim 3, wherein a buffer assembly is further arranged between the abutting plate (14) and the elastic plate (16), and comprises a transverse plate (15) fixedly mounted at one end of the abutting plate (14) far away from the sliding plate (13), and a buffer rod, one end of which is in sliding connection with the transverse plate (15), and the other end of which is fixedly connected with the elastic plate (16);
wherein, the buffer rod is sleeved with a pressure spring (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110999955.2A CN113709998B (en) | 2021-08-27 | 2021-08-27 | Circuit board pad correction equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110999955.2A CN113709998B (en) | 2021-08-27 | 2021-08-27 | Circuit board pad correction equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113709998A CN113709998A (en) | 2021-11-26 |
| CN113709998B true CN113709998B (en) | 2022-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110999955.2A Active CN113709998B (en) | 2021-08-27 | 2021-08-27 | Circuit board pad correction equipment |
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| Country | Link |
|---|---|
| CN (1) | CN113709998B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206435594U (en) * | 2017-01-22 | 2017-08-25 | 东莞市佑亿精密自动化设备有限公司 | A kind of removable formula arbor press of high-accuracy thin plate |
| CN110064682A (en) * | 2019-05-14 | 2019-07-30 | 珠海格力智能装备有限公司 | Crooked correction equipment |
| WO2020259521A1 (en) * | 2019-06-25 | 2020-12-30 | 安吉八塔机器人有限公司 | Carrying and deflection correction system for elastic material, and method thereof |
| CN113207238A (en) * | 2021-03-30 | 2021-08-03 | 广东兴达鸿业电子有限公司 | PCB correction equipment and correction method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008041633A1 (en) * | 2006-10-02 | 2008-04-10 | Nec Corporation | Correcting tool for use with printed-circuit board, and printed-circuit board unit |
-
2021
- 2021-08-27 CN CN202110999955.2A patent/CN113709998B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206435594U (en) * | 2017-01-22 | 2017-08-25 | 东莞市佑亿精密自动化设备有限公司 | A kind of removable formula arbor press of high-accuracy thin plate |
| CN110064682A (en) * | 2019-05-14 | 2019-07-30 | 珠海格力智能装备有限公司 | Crooked correction equipment |
| WO2020259521A1 (en) * | 2019-06-25 | 2020-12-30 | 安吉八塔机器人有限公司 | Carrying and deflection correction system for elastic material, and method thereof |
| CN113207238A (en) * | 2021-03-30 | 2021-08-03 | 广东兴达鸿业电子有限公司 | PCB correction equipment and correction method thereof |
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| CN113709998A (en) | 2021-11-26 |
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