CN202735643U

CN202735643U - Lead connection device and display device

Info

Publication number: CN202735643U
Application number: CN 201220330409
Authority: CN
Inventors: 许睿
Original assignee: Beijing BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2012-07-06
Filing date: 2012-07-06
Publication date: 2013-02-13
Anticipated expiration: 2022-07-06

Abstract

The utility model discloses a lead connection device which comprises a grid line and/or a data line, an insulation layer and an anisotropic conductive film; more than two through holes are formed on the insulation layer and in a welding area in the direction of the grid line and/or the data line; a conductive padding object is arranged in each through hole and is connected with a lead of the grid line and/or the data line and the anisotropic conductive film. The utility model further discloses a display device. After the lead connection device and the display device, provided by the utility model, are adopted, a grid lead and/or a data lead can be effectively prevented from being corroded, so that undesirable phenomena of a Y lead can be prevented effectively.

Description

A kind of lead-in wire coupling arrangement and display device

Technical field

The utility model relates to lcd technology, relates in particular to a kind of lead-in wire coupling arrangement and display device.

Background technology

At present, in the production run of liquid crystal display, in order to weld the integrated (COF of (bonding) thin film chip, Chip On Film), realization is to the drives of liquid crystal panel, as shown in Figure 1, need to beat via hole (via hole) at SiNx insulation course corresponding to the gate lead-in wire position in grid (gate) the line direction bonding district of liquid crystal panel, and at via hole by composition process deposits indium oxide layer tin (ITO), connect gate lead-in wire and anisotropic conductive film (ACF, Anisotropic Conductive Film) by ITO; Same, in order to realize the drives to liquid crystal panel, also need to beat via hole at SiNx insulation course corresponding to the data lead-in wire position in data (data) line direction bonding district, and pass through composition process deposits one deck ITO at via hole, connect data lead-in wire and ACF by ITO.

But, there is certain defect in this design proposal: as shown in Figure 1, if it is higher that liquid crystal display is used in temperature, in the larger environment of humidity ratio, as color film (CF, when Color Film) distance between substrate and the via hole is too small, that is: during via hole oversize, electrochemical reaction can occur with exposed aerial ITO in steam, thereby cause the ITO corrosion, and after the ITO of the via area that is not covered by COF is corroded, electrochemical reaction can further occur with gate lead-in wire and/or data lead-in wire in steam, and corrosion gate lead-in wire and/or data lead-in wire finally cause the corrosion of array (array) substrate, thereby at liquid crystal display appearance Y line (line) as shown in Figure 2, so, so that the user experiences variation, and then give manufacturer's economic loss of production liquid crystal display.

The utility model content

In view of this, fundamental purpose of the present utility model is to provide a kind of lead-in wire coupling arrangement and display device, can prevent effectively that gate lead-in wire and/or data lead-in wire are corroded.

For achieving the above object, the technical solution of the utility model is achieved in that

A kind of lead-in wire coupling arrangement, comprise: grid line and/or data line, insulation course and anisotropic conductive film, be provided with two above via holes on the described insulation course of described grid line and/or data line direction weld zone, be mounted with conductive spacer in each described via hole, conductive spacer connects lead-in wire and the described anisotropic conductive film of described grid line and/or data line.

Further, the diameter of described via hole is 6 μ m～10 μ m.

Further, the height of described conductive spacer equals the degree of depth of described via hole.

Further, the diameter of described conductive spacer is less than the diameter of described via hole.

Further, described conductive spacer be shaped as cylindrical or for conical.

A kind of display device comprises: array base palte, color membrane substrates, thin film chip is integrated and the lead-in wire coupling arrangement; Described lead-in wire coupling arrangement comprises: grid line and/or data line, insulation course and anisotropic conductive film, be provided with two above via holes on the described insulation course of described grid line and/or data line direction weld zone, be mounted with conductive spacer in each described via hole, conductive spacer connects lead-in wire and the described anisotropic conductive film of described grid line and/or data line.

Lead-in wire coupling arrangement and display device that the utility model provides, be provided with two above via holes on the insulation course in grid line and/or data line direction bonding district, be mounted with conductive spacer (PS in each described via hole, Post Spacer), conduction PS connects lead-in wire and the ACF of grid line and/or data line; In the time of in the middle of conduction PS is exposed on moist environment, can form passivation layer on the surface of conduction PS, thereby stop gate lead-in wire and/or data lead-in wire to be corroded, and then stop array base palte by vapour corrosion, so, can effectively prevent the generation of Y Line bad phenomenon.

In addition, PS connects lead-in wire and the ACF of grid line and/or data line by conduction, because a plurality of conduction PS are arranged, so, when COF carries out bonding, the dislocation that occurs in the time of can also effectively avoiding bonding and loose contact phenomenon.

Description of drawings

Fig. 1 is the lead-in wire connected mode schematic diagram in gate direction bonding district in the prior art;

Fig. 2 is the Y line bad phenomenon schematic diagram that liquid crystal display produces in the prior art;

Fig. 3 is the utility model lead-in wire coupling arrangement structural representation;

Fig. 4 is the via structure schematic diagram that the insulation course in a plurality of grid lines of liquid crystal panel and/or data line direction bonding district arranges;

Fig. 5 is the utility model display device structural representation.

Description of reference numerals:

31-grid line and/or data line; The 32--insulation course; 33--ACF; The 34-via hole; 35--conducts electricity PS; The 51--array base palte; The 52--CF substrate; 53--COF.

Embodiment

Below in conjunction with drawings and Examples the utility model is further described in more detail.

The lead-in wire coupling arrangement that the utility model provides, as shown in Figure 3, this lead-in wire coupling arrangement comprises: grid line and/or data line 31, insulation course 32 and ACF 33; Wherein, be provided with two above via holes 34 on the insulation course 32 in grid line and/or data line 31 direction bonding districts, be mounted with conduction PS 35 in each described via hole 34, conduction PS 35 connects lead-in wire and the ACF 33 of grid line and/or data line 31.

Wherein, the material of described insulation course 32 can be SiNx.

When practical application, in order to drive each pixel cell, as shown in Figure 4, need to two above via holes 34 be set at every grid line of liquid crystal panel and/or the insulation course 32 in data line 31 direction bonding districts, and be mounted with conduction PS 35 in each described via hole 34.And, can determine as required the concrete number of via hole 34.In addition, for fear of because the diameter of via hole 34 is too small, the phenomenon generation of loose contact occurs, therefore, the diameter of described via hole 34 can be 6 μ m～10 μ m usually.

The material of described conduction PS 35 can be any one in the existing conductive material.For the formedness that guarantees to contact and the planarization of whole liquid crystal panel, the diameter of described conduction PS 35 is less than the diameter of described via hole 34; Preferably, the diameter of described conduction PS 35 is slightly less than the diameter of described via hole 34.The height of described conduction PS 35 equals the degree of depth of described via hole 34; The shape of described conduction PS 35 can be: cylindrical or conical etc.

Based on above-mentioned lead-in wire coupling arrangement, the utility model also provides a kind of display device, and as shown in Figure 5, this display device comprises: array base palte 51, CF substrate 52, COF 53 and lead-in wire coupling arrangement; Described lead-in wire coupling arrangement further comprises: grid line and/or data line 31, insulation course 32 and ACF 33; Wherein, be provided with two above via holes 34 on the insulation course 32 in grid line and/or data line 31 direction bonding districts, be mounted with conduction PS 35 in each described via hole 34, conduction PS 35 connects lead-in wire and the ACF 33 of grid line and/or data line 31.

Wherein, the material of described insulation course 32 can be SiNx.

When practical application, in order to drive each pixel cell, need to two above via holes 34 be set at every grid line of liquid crystal panel and/or the insulation course 32 in data line 31 direction bonding districts.And, can determine as required the concrete number of via hole 34.In addition, for fear of because the diameter of via hole 34 is too small, the phenomenon generation of loose contact occurs, therefore, the diameter of described via hole 34 can be 6 μ m～10 μ m usually.

From top description, can find out, lead-in wire coupling arrangement and display device that the utility model provides, compared with prior art, owing to being provided with a plurality of via holes, and the lead-in wire and the ACF that connect grid line and/or data line by conduction PS, and in the middle of conduction PS is exposed on moist environment the time, can form passivation layer on the surface of conduction PS, thereby stop gate lead-in wire and/or data lead-in wire to be corroded, in other words, gate lead-in wire and/or data lead-in wire can not be exposed in the environment indirectly, and then can stop array base palte by vapour corrosion, thereby effectively prevented the generation of the bad phenomenon such as Y Line, and then guaranteed the interests of production firm.

In addition, PS connects lead-in wire and the ACF of grid line and/or data line by conduction, because a plurality of conduction PS are arranged, therefore, when COF carries out bonding, the dislocation that occurs in the time of can also avoiding bonding and loose contact phenomenon.

The above is preferred embodiment of the present utility model only, is not be used to limiting protection domain of the present utility model.

Claims

1. lead-in wire coupling arrangement comprises: grid line and/or data line, insulation course and anisotropic conductive film, it is characterized in that,

Be provided with two above via holes on the described insulation course of described grid line and/or data line direction weld zone, be mounted with conductive spacer in each described via hole, conductive spacer connects lead-in wire and the described anisotropic conductive film of described grid line and/or data line.

2. device according to claim 1 is characterized in that, the diameter of described via hole is 6 μ m～10 μ m.

3. device according to claim 1 is characterized in that, the height of described conductive spacer equals the degree of depth of described via hole.

4. according to claim 1,2 or 3 described devices, it is characterized in that, the diameter of described conductive spacer is less than the diameter of described via hole.

5. according to claim 1,2 or 3 described devices, it is characterized in that, described conductive spacer be shaped as cylindrical or for conical.

6. display device comprises: array base palte, color membrane substrates, thin film chip is integrated and the lead-in wire coupling arrangement; Described lead-in wire coupling arrangement comprises: grid line and/or data line, insulation course and anisotropic conductive film, it is characterized in that,

7. display device according to claim 6 is characterized in that, the diameter of described via hole is 6 μ m～10 μ m.

8. display device according to claim 6 is characterized in that, the height of described conductive spacer equals the degree of depth of described via hole.

9. according to claim 6,7 or 8 described display devices, it is characterized in that, the diameter of described conductive spacer is less than the diameter of described via hole.

10. according to claim 6,7 or 8 described display devices, it is characterized in that, described conductive spacer be shaped as cylindrical or for conical.