CN202733485U - Light emitting diode (LED) lamp radiating white light - Google Patents

Light emitting diode (LED) lamp radiating white light Download PDF

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Publication number
CN202733485U
CN202733485U CN2012201015797U CN201220101579U CN202733485U CN 202733485 U CN202733485 U CN 202733485U CN 2012201015797 U CN2012201015797 U CN 2012201015797U CN 201220101579 U CN201220101579 U CN 201220101579U CN 202733485 U CN202733485 U CN 202733485U
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CN
China
Prior art keywords
light
conducting substrate
led
heat
led chip
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2012201015797U
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Chinese (zh)
Inventor
陈亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHONGSHAN GONGXUANLED OPTOELECTRONICS CO Ltd
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ZHONGSHAN GONGXUANLED OPTOELECTRONICS CO Ltd
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Priority to CN2012201015797U priority Critical patent/CN202733485U/en
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Abstract

The utility model discloses a light emitting diode (LED) lamp radiating white light. The LED lamp radiating white light is characterized by comprising a heat conduction substrate. An LED chip is fixedly connected to the heat conduction substrate, and the heat conduction substrate is provided with a light-changing lamp cover made from mixed materials composed of fluorescent powder and light-pervious resin. The LED lamp radiating the white light aims to overcome defects in the prior art, and is simple in structure, convenient to produce and process, soft in color temperature and good in color rendering.

Description

A kind of white LED lamp
Technical field
The utility model relates to a kind of white LED lamp, and the utility model also relates to a kind of method for preparing this white LED lamp.
Background technology
Light emitting diode (LED, Light Emitting Diode) is a kind of semiconductor solid luminescence device, and it utilizes semiconductor PN as luminescent material, can directly electricity be converted to light.After the two ends of semiconductor PN add forward voltage, inject the minority carrier of PN junction and majority carrier and occur compoundly, emit superfluous energy and cause photo emissions, directly send the light that color is red, orange, yellow, green, blue, blue, purple.
Compare with the traditional lighting light source, white light LEDs has lot of advantages, such as: volume is little, less energy consumption, response is fast, the life-span is long, pollution-free etc., thereby make its focus that becomes present research, be widely used in the lighting, and be considered to light source of future generation.
At present, the method for realization white light LEDs mainly contains following several:
(1) adopts red, green, blue three-primary color LED illuminated in combination, i.e. multi-chip white light LEDs;
(2) adopt blue-light LED chip and yellow fluorescent powder, complementary by the gold-tinted dichromatism that blue light and yellow fluorescent powder send, obtain white light;
(3) the near ultraviolet excitation three primary colors fluorescent powder that utilizes the ultraviolet LED chip to send obtains white light.
The white light LEDs of above-mentioned first method preparation has that efficient height, colour temperature are controlled, colour rendering advantage preferably, yet the method needs complicated control circuit, cost high, and exists because three primary colours light decay difference causes the unsettled problem of colour temperature.
The white light LEDs that above-mentioned rear two kinds of methods obtain all needs to use fluorescent material, so be referred to as fluorescent material conversion LED (PC-LED, Phosphor Converted Light Emitting Diode).PC-LED compares with the multi-chip white light LEDs, has outstanding advantage at aspects such as control circuit, production cost, heat radiations, thereby occupies leading position at present LED produce market.In PC-LED, fluorescent material is to make led chip realize the critical material of white-light illuminating.
Yet efficient height, preparation are simple although the white light LEDs of above-mentioned second method preparation has, temperature stability better, colour rendering advantage preferably, the problem that have still that uniformity is poor, colour temperature and angle changes.Although the white light LEDs of above-mentioned the third method preparation have colour rendering good, prepare simple advantage, yet also exist led chip efficient low, have ultraviolet light to reveal and the not high problem of fluorescent material temperature stability.And, at present, use at most, what technology was the most ripe is blue-ray LED; And the luminous intensity of ultraviolet leds is extremely low, does not almost have use value.
In the process of utilizing fluorescent material conversion preparation white light LEDs, fluorescent material generally is to adopt modes such as putting glue directly to be encapsulated on the led chip surface, yet encapsulating structure and method for packing directly affect serviceability and the life-span of white light LEDs, existing encapsulation technology generally is difficult to the applied thickness of fluorescent material and shape are accurately controlled, and the white light LEDs that causes said method to obtain has partially indigo plant or the generation of aberration situation.
The utility model content
The purpose of this utility model is in order to overcome weak point of the prior art, to provide a kind of simple in structure, produces and easy to process, and colour temperature is soft, colour rendering white LED lamp preferably.
Another purpose of the utility model provides a kind of method for preparing above-mentioned LED lamp.
In order to achieve the above object, the utility model adopts following scheme:
A kind of white LED lamp is characterized in that: comprise heat-conducting substrate, be fixedly connected with led chip at described heat-conducting substrate, be provided with the alternating light cover that the compound that is comprised of fluorescent material and light-transmissive resin is made at described heat-conducting substrate.
Aforesaid a kind of white LED lamp, it is characterized in that being provided with the lamp base support that left and right two intervals arrange at described heat-conducting substrate, described led chip is fixedly installed on one of them lamp base support, and described led chip is electrically connected with another lamp base support by a wire.
Aforesaid a kind of white LED lamp is characterized in that being provided with the PCB circuit board at described heat-conducting substrate, and described led chip is mounted on the described PCB circuit board.
Aforesaid a kind of white LED lamp is characterized in that described alternating light cover made by the transparent resin of 85-99% and the fluorescent material of 1-15%.
Aforesaid a kind of white LED lamp is characterized in that described led chip is blue-light LED chip, and described fluorescent material is by blue-light excited white phosphor powder for LED.
A kind of as mentioned above method of white LED lamp for preparing of the utility model is characterized in that may further comprise the steps:
A, the transparent resin of 85-99% and the fluorescent material of 1-15% are mixed, then make film or thin slice;
B, led chip is fixedly connected on the heat-conducting substrate;
Film or thin slice in C, the employing steps A are produced the lampshade that can be fixedly connected on the heat-conducting substrate, and described lampshade is fixedly connected on the heat-conducting substrate.
In sum, the utility model with respect to its beneficial effect of prior art is:
The utility model LED lamp, simple in structure, production and processing is convenient, and colour temperature is soft, colour rendering is better, and the thickness of fluorescent glue and shape can accurately be controlled, and effectively reduce the generation of aberration.Thereby improved the quality of product.
Description of drawings
Fig. 1 is schematic diagram of the present utility model.
The specific embodiment
Below in conjunction with description of drawings and the specific embodiment the utility model is further described:
A kind of white LED lamp as shown in Figure 1 comprises heat-conducting substrate 1, is fixedly connected with led chip 2 at described heat-conducting substrate 1, is provided with the alternating light cover 3 that the compound that is comprised of fluorescent material and light-transmissive resin is made at described heat-conducting substrate 1.
The first embodiment of the present utility model, if shown in Figure 1, be provided with the lamp base support 4 that left and right two intervals arrange at described heat-conducting substrate 1, described led chip 2 is fixedly installed on one of them lamp base support 4, and described led chip 2 is electrically connected with another lamp base support 4 by a wire 5.
The second embodiment of the present utility model is provided with the PCB circuit board at described heat-conducting substrate 1, and described led chip 2 is mounted on the described PCB circuit board.
Alternating light cover 3 described in the utility model is made by the transparent resin of 85-99% and the fluorescent material of 1-15%.
Led chip 2 described in the utility model is blue-light LED chip, and described fluorescent material is by blue-light excited white phosphor powder for LED.
The utility model prepares the method for above-mentioned white LED lamp, may further comprise the steps:
A, the transparent resin of 85-99% and the fluorescent material of 1-15% are mixed, then make film or thin slice;
B, led chip is fixedly connected on the heat-conducting substrate;
Film or thin slice in C, the employing steps A are produced the lampshade that can be fixedly connected on the heat-conducting substrate, and described lampshade is fixedly connected on the heat-conducting substrate.
Embodiment 1
The utility model white LED lamp comprises heat-conducting substrate 1, is fixedly connected with blue-light LED chip 2 at described heat-conducting substrate 1, is provided with the alternating light cover 3 that the compound that is comprised of fluorescent material and light-transmissive resin is made at described heat-conducting substrate 1.
The utility model preparation method may further comprise the steps:
A, adopt the LED mixer that 85% transparent resin and 15% fluorescent material are mixed, then make film or thin slice;
B, led chip is fixedly connected on the heat-conducting substrate;
Film or thin slice in C, the employing steps A are produced the lampshade that can be fixedly connected on the heat-conducting substrate, and described lampshade is fixedly connected on the heat-conducting substrate.
Embodiment 2
The utility model white LED lamp comprises heat-conducting substrate 1, is fixedly connected with blue-light LED chip 2 at described heat-conducting substrate 1, is provided with the alternating light cover 3 that the compound that is comprised of fluorescent material and light-transmissive resin is made at described heat-conducting substrate 1.
The utility model preparation method may further comprise the steps:
A, adopt the LED mixer that 99% transparent resin and 1% fluorescent material are mixed, then make film or thin slice;
B, led chip is fixedly connected on the heat-conducting substrate;
Film or thin slice in C, the employing steps A are produced the lampshade that can be fixedly connected on the heat-conducting substrate, and described lampshade is fixedly connected on the heat-conducting substrate.
Embodiment 3
The utility model white LED lamp comprises heat-conducting substrate 1, is fixedly connected with blue-light LED chip 2 at described heat-conducting substrate 1, is provided with the alternating light cover 3 that the compound that is comprised of fluorescent material and light-transmissive resin is made at described heat-conducting substrate 1.
The utility model preparation method may further comprise the steps:
A, adopt the LED mixer that 90% transparent resin and 10% fluorescent material are mixed, then make film or thin slice;
B, led chip is fixedly connected on the heat-conducting substrate;
Film or thin slice in C, the employing steps A are produced the lampshade that can be fixedly connected on the heat-conducting substrate, and described lampshade is fixedly connected on the heat-conducting substrate.
Embodiment 4
The utility model white LED lamp comprises heat-conducting substrate 1, is fixedly connected with blue-light LED chip 2 at described heat-conducting substrate 1, is provided with the alternating light cover 3 that the compound that is comprised of fluorescent material and light-transmissive resin is made at described heat-conducting substrate 1.
The utility model preparation method may further comprise the steps:
A, adopt the LED mixer that 95% transparent resin and 5% fluorescent material are mixed, then make film or thin slice;
B, led chip is fixedly connected on the heat-conducting substrate;
Film or thin slice in C, the employing steps A are produced the lampshade that can be fixedly connected on the heat-conducting substrate, and described lampshade is fixedly connected on the heat-conducting substrate.

Claims (3)

1. a white LED lamp is characterized in that: comprise heat-conducting substrate (1), be fixedly connected with led chip (2) at described heat-conducting substrate (1), be provided with alternating light cover (3) at described heat-conducting substrate (1).
2. a kind of white LED lamp according to claim 1, it is characterized in that being provided with the lamp base support (4) that left and right two intervals arrange at described heat-conducting substrate (1), described led chip (2) is fixedly installed on one of them lamp base support (4), and described led chip (2) is electrically connected with another lamp base support (4) by a wire (5).
3. a kind of white LED lamp according to claim 1 is characterized in that being provided with the PCB circuit board at described heat-conducting substrate (1), and described led chip (2) is mounted on the described PCB circuit board.
CN2012201015797U 2012-03-16 2012-03-16 Light emitting diode (LED) lamp radiating white light Expired - Fee Related CN202733485U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012201015797U CN202733485U (en) 2012-03-16 2012-03-16 Light emitting diode (LED) lamp radiating white light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012201015797U CN202733485U (en) 2012-03-16 2012-03-16 Light emitting diode (LED) lamp radiating white light

Publications (1)

Publication Number Publication Date
CN202733485U true CN202733485U (en) 2013-02-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012201015797U Expired - Fee Related CN202733485U (en) 2012-03-16 2012-03-16 Light emitting diode (LED) lamp radiating white light

Country Status (1)

Country Link
CN (1) CN202733485U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130213

Termination date: 20140316