CN202712662U - Antenna welding device of intelligent dual-interface card - Google Patents
Antenna welding device of intelligent dual-interface card Download PDFInfo
- Publication number
- CN202712662U CN202712662U CN 201220341670 CN201220341670U CN202712662U CN 202712662 U CN202712662 U CN 202712662U CN 201220341670 CN201220341670 CN 201220341670 CN 201220341670 U CN201220341670 U CN 201220341670U CN 202712662 U CN202712662 U CN 202712662U
- Authority
- CN
- China
- Prior art keywords
- conductive solder
- solder material
- axis driving
- driving mechanism
- individual layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Images
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The utility model discloses an antenna welding device of an intelligent dual-interface card, which employs two single-layer card base-material carrying tables to realize material replacement without shut down to thereby improve the work efficiency. The two single-layer card base material carrying tables match the X-axis movements of a conductive welding material absorption part, an antenna winding part and a welding gun, thereby realizing the filling and arrangements of multi-row of conductive welding materials, the antenna winding and the welding of both on a layout.
Description
Technical field
The utility model relates to Intelligent dual-interface card manufacturing technology field, particularly Intelligent dual-interface card antenna welding equipment.
Background technology
Double-interface card is the card that the function with Contact Type Ic Card and non-contact IC card is combined.Contact Type Ic Card is the sort of just like phonecard, needs to insert in the telephone set to use.Non-contact IC card is just like bus IC card, and its chip and antenna because antenna is arranged, so when getting a lift, swiped the card as long as respond to just can finish, do not need contact all in the card the inside.And double-interface card be with two kinds of functions with a chip, but must be furnished with antenna, and antenna is connected with chip, like this, just formed a kind of double-interface card, on contact and contactless facility, can both use.
The technique of making at present double-interface card is: produce antenna, and---laminated------------manual scolding tin---rushes the manual encapsulation of PUR---manual welding---to manual take-up to die-cut lesser calorie by hand in groove milling, owing to its take-up, scolding tin, rush PUR, welding and encapsulation all is to adopt manual carrying out, speed is slow, the difficult control of quality is difficult to meeting the market requirement.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of Intelligent dual-interface card antenna welding equipment for the existing problem of existing double-interface card antenna welding process.
Technical problem to be solved in the utility model can be achieved through the following technical solutions:
Intelligent dual-interface card antenna welding equipment is characterized in that, comprising:
One workbench;
Be configured in the conductive solder material conveyance X-axis driving mechanism on the described workbench;
Be configured on the described conductive solder material conveyance X-axis driving mechanism and by its driving and carry out the reciprocating conductive solder material absorption of X-direction parts;
Be configured in the antenna coiling X-axis driving mechanism on the described workbench;
Be configured on the described antenna coiling X-axis driving mechanism and by its driving and carry out the reciprocating antenna coiling of X-direction parts;
Be configured at least one individual layer card base-material microscope carrier Y-axis driving mechanism on the described workbench;
Be configured on the described individual layer card base-material microscope carrier Y-axis driving mechanism and by its driving and carry out the reciprocating individual layer card of Y direction base-material microscope carrier;
Be configured in the butt-joint rifle X-axis driving mechanism on the described workbench;
Be configured on the described butt-joint rifle X-axis driving mechanism and by its driving and carry out the reciprocating butt-joint rifle of X-direction;
The conductive solder material that is configured on the described workbench bears platform, described conductive solder material is drawn parts and is urged to described conductive solder material by conductive solder material conveyance X-axis driving mechanism and bears and draw the conductive solder material on the platform, is urged on the individual layer card base-material on the individual layer card base-material microscope carrier by conductive solder material conveyance X-axis driving mechanism and the conductive solder material is put into fabrication hole on the individual layer card base-material.
In device described in the utility model, described individual layer card base-material microscope carrier Y-axis driving mechanism is two, two individual layer card base-material microscope carrier Y-axis driving mechanisms be arranged in parallel, all dispose an individual layer card base-material microscope carrier on each individual layer card base-material microscope carrier Y-axis driving mechanism, two individual layer card base-material microscope carrier directions of motion are opposite.
In device described in the utility model, described conductive solder material bears platform configuration between two individual layer card base-material microscope carrier Y-axis driving mechanisms.
In device described in the utility model, it is a die cutting die that described conductive solder material bears platform, in drawing parts, described conductive solder material is provided with one or more cutting heads and one or more vacuum suction head, and be provided with to lay conductive solder material bands reel releasing parts and a traction cylinder of conductive solder material bands reel at described workbench, the conductive solder material bands that described traction cylinder traction conductive solder material bands reel discharges enters in the described die cutting die, the conductive solder material die that described cutting head will enter on the conductive solder material bands in the die cutting die is got off, and described vacuum suction head is with punched conductive solder material absorption of getting off in the die cutting die.
In device described in the utility model, conductive solder material conveyance X-axis driving mechanism and antenna coiling X-axis driving mechanism are arranged on the same supporting mechanism and are positioned on the front and back sides of this X-axis supporting mechanism.
Owing to adopted technical scheme as above, device of the present utility model adopts two individual layer card base-material microscope carriers, accomplishes to change material and does not shut down, and has improved operating efficiency.Two individual layer card base-material microscope carriers carry out the Y direction motion by individual layer card base-material microscope carrier Y-axis driving mechanism driving separately, cooperate the conductive solder material to draw parts, antenna coiling parts and the motion of butt-joint rifle X-direction, realized that many row's conductive solder materials are loaded placement on the space of a whole page, antenna coiling, and both welding.The conductive solder material adopts the mould automatic cutting, and the vacuum pick conveyance once can be drawn a plurality of conductive solder materials, increases work efficiency.
Description of drawings
Fig. 1 is the structural representation of the utility model Intelligent dual-interface card antenna welding equipment.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the right view of Fig. 1.
Fig. 4 is the individual layer card base-material structural representation that is useful on the hole of filled conductive welding material in the utility model.
Fig. 5 is the A-A cutaway view of Fig. 4.
Fig. 6 is the structural representation after the utility model conductive solder material and the antenna welding.
Embodiment
Further describe the utility model below in conjunction with the drawings and specific embodiments.
Referring to Fig. 1 to Fig. 3, the Intelligent dual-interface card antenna welding equipment that provides among the figure comprises a workbench 400, X-direction at workbench 400 disposes two X-axis supporting mechanisms 510,520 that be arranged in parallel, configuration is equipped with conductive solder material conveyance X-axis driving mechanism 610 on the leading flank of an X-axis supporting mechanism 510 therein, configuration is equipped with antenna coiling X-axis driving mechanism 710 on the trailing flank of X-axis supporting mechanism 510, disposes butt-joint rifle X-axis driving mechanism 810 at another X-axis supporting mechanism 520.
Conductive solder material absorption parts 620 are installed on the conductive solder material conveyance X-axis driving mechanism 610 and by its driving and move back and forth along X-axis.
Butt-joint rifle 820 is installed in butt-joint rifle X-axis driving mechanism 810 and is moved back and forth along X-axis by its driving.
Y direction at workbench 400 disposes two individual layer card base-material microscope carrier Y-axis driving mechanisms 910,920 that be arranged in parallel; on individual layer card base-material microscope carrier Y-axis driving mechanism 910,920, respectively dispose an individual layer card base-material microscope carrier 930,940; individual layer card base-material microscope carrier Y-axis driving mechanism 910,920 drives respectively individual layer card base-material microscope carrier 930,940 and moves towards two rightabouts; accomplish that like this changing material does not shut down, and has improved operating efficiency.
In a specific embodiment, at individual layer card base-material microscope carrier Y-axis driving mechanism 910, a conductive solder material is installed on the workbench 100 between 920 bears platform 1000, die-cut good conductive solder material is placed on the conductive solder material and bears on the platform 1000, and on the conductive solder material absorption parts 620 one or more vacuum suction heads can be set, when conductive solder material conveyance X-axis driving mechanism 610 drives the conductive solder materials and draws parts 620 and run to the conductive solder material and bear above the platform 1000, one or more vacuum suction heads that the conductive solder material is drawn on the parts 620 are descending under cylinder promotes, one or more vacuum suction heads adsorb the conductive solder material and bear conductive solder material on the platform 1000, then it is up that cylinder promotes conductive solder material absorption parts 620, then conductive solder material conveyance X-axis driving mechanism 610 drives the conductive solder materials and draws parts 620 and run to individual layer card base-material microscope carrier Y- axis driving mechanism 910 or 920 tops, and then the vacuum suction head is discharged into the conductive solder material that adsorbs in two holes that are used for the filled conductive welding material in each intelligent double-sided card zone on the individual layer card base-material.
In another specific embodiment, it is a die cutting die that the conductive solder material bears platform 1000, in drawing parts 620, the conductive solder material is provided with one or more cutting heads and one or more vacuum suction head, and be provided with to lay conductive solder material bands reel releasing parts 1200 and a traction cylinder 1300 of conductive solder material bands reel 1100 at workbench 100, the conductive solder material bands that traction cylinder 1300 traction conductive solder material bands reels 1100 discharge enters in the die cutting die, the conductive solder material is drawn the conductive solder material die that cutting head on the parts 620 will enter on the conductive solder material bands in the die cutting die and is got off, and then the vacuum suction head is with punched conductive solder material absorption of getting off in the die cutting die.It is up that then cylinder promotes conductive solder material absorption parts 620, then conductive solder material conveyance X-axis driving mechanism 610 drives the conductive solder materials and draws parts 620 and run to individual layer card base-material microscope carrier Y- axis driving mechanism 910 or 920 tops, and then the vacuum suction head is discharged into the conductive solder material that adsorbs in two holes that are used for the filled conductive welding material in each intelligent double-sided card zone on the individual layer card base-material.
The operation principle of upper Intelligent dual-interface card antenna welding equipment is: individual layer card base-material microscope carrier Y-axis driving mechanism 910,920 drives respectively individual layer card base-material microscope carrier 930,940 and moves towards two rightabouts, referring to Fig. 5, individual layer card base-material microscope carrier 930 runs to the conductive solder material and discharges station, and individual layer card base-material microscope carrier 940 runs to antenna coiling station and welding post.At this moment be filled with the conductive solder material owing to be used for two Kong Jun of filled conductive welding material in the regional 110a of each intelligent double-sided card on the individual layer card base-material 100a on the individual layer card base-material microscope carrier 940, at this moment antenna coiling parts 720 move in the X-axis direction under antenna coiling X-axis driving mechanism 710 drives, and individual layer card base-material microscope carrier 940 moves along Y direction under individual layer card base-material microscope carrier Y-axis driving mechanism 920 drives, both cooperate, coiled antenna in the regional 110a of each intelligent double-sided card of antenna coiling parts 720 on individual layer card base-material 100a, in the antenna winding process in the regional 110a of each intelligent double-sided card on individual layer card base-material 100a, butt-joint rifle 820 is driven by butt-joint rifle X-axis driving mechanism 810 and moves back and forth along X-axis, cooperate the Y direction motion of individual layer card base-material microscope carrier 940, butt-joint rifle 820 welds two terminations of antenna and the conductive solder material in the regional 110a of each intelligent double-sided card.Can certainly be after the antenna coiling in the regional 110a of each intelligent double-sided card on individual layer card base-material 100a be complete, butt-joint rifle 820 is driven by butt-joint rifle X-axis driving mechanism 810 and moves back and forth along X-axis, cooperate the Y direction motion of individual layer card base-material microscope carrier 940, butt-joint rifle 820 welds two terminations of antenna and the conductive solder material in the regional 110a of each intelligent double-sided card.
In antenna coiling parts 720 and/or 820 work of butt-joint rifle, the conductive solder material is drawn parts 620 and is also moved in the X-axis direction by 610 drivings of conductive solder material conveyance X-axis driving mechanism synchronously, and driving individual layer card base-material microscope carrier 930 simultaneously, individual layer card base-material microscope carrier Y-axis driving mechanism 910 moves along Y direction, both cooperate lower, and the conductive solder material is drawn parts 620 and will be born conductive solder material that platform 1000 picks up from the conductive solder material and put into one by one in the regional 110b of each intelligent double-sided card on the individual layer card base-material 100b on the individual layer card base-material microscope carrier 940 and be used in two holes of filled conductive welding material.
The Intelligent dual-interface card antenna welding process that utilizes above-mentioned Intelligent dual-interface card antenna welding equipment to realize specifically comprises the steps:
1. referring to Fig. 1 and Fig. 2, each the Intelligent dual-interface card zone 110 interior punching on individual layer card base-material 100 are used for two holes 111,112 of filled conductive welding material;
2. be used for filled conductive welding material in the hole of filled conductive welding material to each of step 1 punching;
3. antenna of coiling on each intelligent double-sided card on the individual layer card base-material, and two terminations of each antenna are connected across on two conductive solder materials on each intelligent double-sided card;
4, referring to Fig. 3, with two terminations 210 of antenna, 220 and conductive solder material 310,320 weld together.
Above-mentioned steps 2 can be exchanged with step 3 order.
Claims (5)
1. Intelligent dual-interface card antenna welding equipment is characterized in that, comprising:
One workbench;
Be configured in the conductive solder material conveyance X-axis driving mechanism on the described workbench;
Be configured on the described conductive solder material conveyance X-axis driving mechanism and by its driving and carry out the reciprocating conductive solder material absorption of X-direction parts;
Be configured in the antenna coiling X-axis driving mechanism on the described workbench;
Be configured on the described antenna coiling X-axis driving mechanism and by its driving and carry out the reciprocating antenna coiling of X-direction parts;
Be configured at least one individual layer card base-material microscope carrier Y-axis driving mechanism on the described workbench;
Be configured on the described individual layer card base-material microscope carrier Y-axis driving mechanism and by its driving and carry out the reciprocating individual layer card of Y direction base-material microscope carrier;
Be configured in the butt-joint rifle X-axis driving mechanism on the described workbench;
Be configured on the described butt-joint rifle X-axis driving mechanism and by its driving and carry out the reciprocating butt-joint rifle of X-direction;
The conductive solder material that is configured on the described workbench bears platform, described conductive solder material is drawn parts and is urged to described conductive solder material by conductive solder material conveyance X-axis driving mechanism and bears and draw the conductive solder material on the platform, is urged on the individual layer card base-material on the individual layer card base-material microscope carrier by conductive solder material conveyance X-axis driving mechanism and the conductive solder material is put into fabrication hole on the individual layer card base-material.
2. Intelligent dual-interface card antenna welding equipment as claimed in claim 1, it is characterized in that, described individual layer card base-material microscope carrier Y-axis driving mechanism is two, two individual layer card base-material microscope carrier Y-axis driving mechanisms be arranged in parallel, all dispose an individual layer card base-material microscope carrier on each individual layer card base-material microscope carrier Y-axis driving mechanism, two individual layer card base-material microscope carrier directions of motion are opposite.
3. Intelligent dual-interface card antenna welding equipment as claimed in claim 1 is characterized in that, described conductive solder material bears platform configuration between two individual layer card base-material microscope carrier Y-axis driving mechanisms.
4. Intelligent dual-interface card antenna welding equipment as claimed in claim 1, it is characterized in that, it is a die cutting die that described conductive solder material bears platform, in drawing parts, described conductive solder material is provided with one or more cutting heads and one or more vacuum suction head, and be provided with to lay conductive solder material bands reel releasing parts and a traction cylinder of conductive solder material bands reel at described workbench, the conductive solder material bands that described traction cylinder traction conductive solder material bands reel discharges enters in the described die cutting die, the conductive solder material die that described cutting head will enter on the conductive solder material bands in the die cutting die is got off, and described vacuum suction head is with punched conductive solder material absorption of getting off in the die cutting die.
5. Intelligent dual-interface card antenna welding equipment as claimed in claim 1, it is characterized in that described conductive solder material conveyance X-axis driving mechanism and antenna coiling X-axis driving mechanism are arranged on the same supporting mechanism and are positioned on the front and back sides of this X-axis supporting mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220341670 CN202712662U (en) | 2012-07-13 | 2012-07-13 | Antenna welding device of intelligent dual-interface card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220341670 CN202712662U (en) | 2012-07-13 | 2012-07-13 | Antenna welding device of intelligent dual-interface card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202712662U true CN202712662U (en) | 2013-01-30 |
Family
ID=47592927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220341670 Withdrawn - After Issue CN202712662U (en) | 2012-07-13 | 2012-07-13 | Antenna welding device of intelligent dual-interface card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202712662U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820602A (en) * | 2012-07-13 | 2012-12-12 | 上海一芯智能科技有限公司 | Intelligent double-interface-card antenna welding process and equipment |
-
2012
- 2012-07-13 CN CN 201220341670 patent/CN202712662U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820602A (en) * | 2012-07-13 | 2012-12-12 | 上海一芯智能科技有限公司 | Intelligent double-interface-card antenna welding process and equipment |
| CN102820602B (en) * | 2012-07-13 | 2014-11-19 | 上海一芯智能科技有限公司 | Intelligent double-interface-card antenna welding process and equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104269373B (en) | Smart card chip packaging equipment | |
| CN103010648B (en) | Three-dimensional warehousing method for automatic virtual storage bin and warehousing system | |
| CN108638669A (en) | Standalone character code spraying machine | |
| CN107310939B (en) | Full-automatic battery piece sorting machine | |
| CN205972963U (en) | Automatic laminating device of feed mechanism and fingerprint identification module | |
| CN205952416U (en) | Automatic multilayer case packer of canned food | |
| CN201352508Y (en) | Riveting device for capacitor manufacture | |
| CN101239676A (en) | Disc collecting machine | |
| CN107971664A (en) | A kind of electric appliance sheet metal component assembly welding machine | |
| CN104202917A (en) | High-efficiency surface mounting method and device | |
| CN202712662U (en) | Antenna welding device of intelligent dual-interface card | |
| CN108857398A (en) | A kind of electromagnetic valve component assembly equipment | |
| CN102820602B (en) | Intelligent double-interface-card antenna welding process and equipment | |
| CN204166560U (en) | It is a kind of that smart card is tower writes chip apparatus | |
| CN203237765U (en) | Double-linkage clamp moving mechanism | |
| CN209143028U (en) | A kind of sorting device of mixed cargo | |
| CN201952003U (en) | Magazine circulation device and system thereof | |
| CN203144283U (en) | Automatic feed mechanism of mobile phone glass | |
| CN204489975U (en) | A kind of automatic material changing mechanism | |
| CN204836820U (en) | Irregularly -shaped hole punching device and reinforcement machine | |
| CN110524890A (en) | A kind of locating platform for contactless smart card production equipment | |
| CN217806966U (en) | Battery cell stepping carrying device | |
| CN203794205U (en) | Intensive shuttling order picker for small batch cigarettes | |
| CN108555606A (en) | A kind of lithium battery nickel strap, which is cut, puts equipment | |
| CN204157218U (en) | A kind of SMT paster flies to reach car of getting the raw materials ready |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130130 Effective date of abandoning: 20141119 |
|
| RGAV | Abandon patent right to avoid regrant |