CN202695409U - Non-destructive feeding device for semiconductor lead frame - Google Patents
Non-destructive feeding device for semiconductor lead frame Download PDFInfo
- Publication number
- CN202695409U CN202695409U CN 201220381961 CN201220381961U CN202695409U CN 202695409 U CN202695409 U CN 202695409U CN 201220381961 CN201220381961 CN 201220381961 CN 201220381961 U CN201220381961 U CN 201220381961U CN 202695409 U CN202695409 U CN 202695409U
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- CN
- China
- Prior art keywords
- lead frame
- semiconductor lead
- push rod
- semiconductor
- end stop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a non-destructive feeding device for a semiconductor lead frame. The non-destructive feeding device for the semiconductor lead frame comprises two pairs of upper and lower rollers (3 and 4) which respectively conflict with two sides of the semiconductor lead frame in a rolling manner to enable the semiconductor lead frame to move in a straight line; split lead rails (17 and 18) of which the interval is matched with the width of the semiconductor lead frame are arranged at one side of each of the upper and lower rollers (3 and 4) along the movement direction of the semiconductor lead frame, and the split lead rails (17 and 18) comprise detection sections for detecting whether the semiconductor lead frame is correctly placed, and an extraction section for detecting the qualified semiconductor lead frame. According to the non-destructive feeding device for the semiconductor lead frame, a base island welded with a gold pin and a chip in the lead frame is in a non-contact state all the time. A pushing distance of the lead frame pushed by a push rod and the length of the lead frame are matched and adjustable, so that the problem that the lead frame protrudes and deforms to damage the chip and the gold pin due to the fact that the rollers cannot timely stop or a feeding cylinder pushes overload is avoided.
Description
Technical field
The utility model relates to pay-off, relates in particular to the harmless pay-off for semiconductor lead frame.
Background technology
At present, the quality of domestic integrated circuit (IC) manufacturing industry bound pair goods and the serviceability rate of goods require more and more higher, so, the lead frame that welds spun gold pin and chip is relatively more fragile, does not slightly note damaging spun gold pin and the chip of lead frame, causes doing over again even scrapping of goods, and at present lead frame is adopted manual screening mostly, so very easily cause the damage of chip or spun gold pin because of human factor, reduced the serviceability rate of goods, improved production cost.
The utility model content
Problem to be solved in the utility model is the damage that the manual screening of people very easily causes chip or spun gold pin, and a kind of automatically screening and the harmless pay-off of defective chip or spun gold pin not are provided for this reason.
The technical solution of the utility model is: a kind of harmless pay-off for semiconductor lead frame, it comprises that two pairs make semiconductor lead frame make the upper bottom roller of traveling priority with the dual-side rolling friction of semiconductor lead frame respectively, described upper bottom roller has an adaptive split type guide rail of spacing and semiconductor lead frame width along semiconductor lead frame moving direction one side is adaptive, and described split type guide rail comprises and detects the detection segment whether semiconductor lead frame correctly place and extract the after testing extraction section of qualified semiconductor lead frame.
To be described detection segment be connected with first guide vane end stop that can move up and down at split type guide rail away from an end of upper bottom roller in the further improvement of such scheme, described the first guide vane end stop and the first guide vane end stop cylinder-driven of stepping down is connected, and the centre distance of the first guide vane end stop and upper bottom roller and the length of semiconductor lead frame are suitable.
Further improving of such scheme is described section is connected with the promotion semiconductor lead frame near an end of detection segment the push rod that extracts, described push rod is connected with the push rod that the drives push rod cylinder of stepping down, and extracts section and is connected with the second guide vane end stop away from the other end of detection segment.
Further improving again of such scheme is that described push rod and the push rod cylinder of stepping down is connected with the movable block that is driven by the feeding cylinder that is fixed on the feeding cylinder mounting panel, be mounted with the front limit plate between described movable block and the feeding cylinder, be mounted with rear position margining plate between movable block and the detection segment, on the movable block adaptive have can regulate the caging bolt that feeding cylinder pushes stroke, above-mentioned feeding cylinder mounting panel, front limit plate, rear position margining plate are fixed on the mounting base under the split type guide rail.
The beneficial effects of the utility model are that the lead frame that welds spun gold pin and chip slides at two split type guide rails all the time.Lead frame makes the Ji Dao that is welded with spun gold pin and chip in the lead frame be in all the time contactless state in pushed process, has protected well chip and spun gold pin.The length that pushes the propelling movement distance of lead frame and lead frame by push rod is complementary and is adjustable, can not in time not stop or feeding cylinder pushes overload and makes lead frame bulging deformation defective chip and spun gold pin because of roller.
Description of drawings
Fig. 1 is for welding the lead frame schematic diagram of spun gold pin and chip;
Fig. 2 is the detection segment schematic diagram of split type guide rail;
Fig. 3 is the extraction section schematic diagram of split type guide rail;
Fig. 4 is the extraction section vertical view of split type guide rail;
Fig. 5 is the extraction section end view of split type guide rail;
Fig. 6 is split type guide rail schematic diagram.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
As shown in Figure 1, the basic island 2 of each in the lead frame 1 is welded with chip and spun gold pin, will avoid touching chip and the spun gold pin on basic island 2 in feeding process.
The utility model provides following scheme for this reason: such as Fig. 2, shown in Figure 6, it comprises that two pairs make semiconductor lead frame make the upper bottom roller 3 of traveling priority with the dual-side rolling friction of semiconductor lead frame respectively, 4, described upper bottom roller 3,4 have an adaptive split type guide rail 17 of spacing and semiconductor lead frame width along semiconductor lead frame moving direction one side is adaptive, 18, described split type guide rail 17,18 comprises the detection segment whether the detection semiconductor lead frame is correctly placed and extracts the after testing extraction section of qualified semiconductor lead frame.The dual-side of lead frame 1 slides on split type guide rail 17,18 all the time, guarantees that the basic island 2 of framework 1 is in contactless state all the time.
Such as Fig. 2, Fig. 3, shown in Figure 6, preference of the present utility model is that described detection segment is away from upper bottom roller 3, an end of 4 is connected with can be at split type guide rail 17, the first guide vane end stop 5 that moves up and down on 18, described the first guide vane end stop 5 and the first guide vane end stop cylinder 6 of stepping down is in transmission connection, the centre distance of the first guide vane end stop 5 and upper bottom roller 3,4 and the length of semiconductor lead frame are suitable.The described section of extracting is connected with the push rod 7 that promotes semiconductor lead frame near an end of detection segment, and described push rod 7 is connected with the push rod that drives push rod 7 cylinder 8 of stepping down, and extracts section and is connected with the second guide vane end stop 9 away from the other end of detection segment.Such as Fig. 4, shown in Figure 5, push rod 7 and the push rod cylinder 8 of stepping down is connected with the movable block 10 that is driven by the feeding cylinder 15 that is fixed on the feeding cylinder mounting panel 12, be mounted with front limit plate 16 between described movable block 10 and the feeding cylinder 15, be mounted with rear position margining plate 11 between movable block 10 and the detection segment, on the movable block 10 adaptive have can regulate the caging bolt 13 that feeding cylinder 15 pushes strokes, above-mentioned feeding cylinder mounting panel 12, front limit plate 16, rear position margining plate 11 are fixed on the mounting base 14 under the split type guide rail 17,18.
When using the utility model, the first step, the lead frame 1 that welds spun gold pin and chip is released from special-purpose magazine.3,4 pairs of pair rollers roll up and down, by friction lead frame 1 are delivered to the motion of stepping down up and down of the first guide vane end stop 5(air cylinder driven guide vane end stop).The length of the distance of center to the first guide vane end stop 5 of a pair roller 3,4 and lead frame 1 is complementary up and down.Split type guide rail 17,18 between roller 3,4 and the first guide vane end stop 5 can adaptively have the checkout gear that checks whether lead frame 1 puts back, and places mistake and can in time send alarm in case find lead frame 1.Second step pushes the motion of stepping down up and down of lead frames 1 to second guide vane end stop 9(air cylinder driven push rod by push rod 7).Cylinder, push rod are connected in movable block 10, drive movable block 10 by feeding cylinder 15 and push lead frame 1.Adjust the caging bolt 13 on the movable block, make the propelling movement stroke of feeding cylinder 15 and the distance coupling that push rod 7 pushes lead frame 1 to second guide vane end stop 9.Manipulator grasps the lead frame that is sent to the second guide vane end stop and finishes a circulation on the extraction section.The lead frame that welds spun gold pin and chip slides at two split type guide rails all the time.
Claims (4)
1. harmless pay-off that is used for semiconductor lead frame, it is characterized in that it comprises that two pairs make semiconductor lead frame make the upper bottom roller (3 of traveling priority with the dual-side rolling friction of semiconductor lead frame respectively, 4), described upper bottom roller (3,4) along semiconductor lead frame moving direction one side is adaptive the adaptive split type guide rail (17 of spacing and semiconductor lead frame width arranged, 18), described split type guide rail (17,18) comprises the detection segment whether the detection semiconductor lead frame is correctly placed and extracts the after testing extraction section of qualified semiconductor lead frame.
2. a kind of harmless pay-off for semiconductor lead frame as claimed in claim 1, it is characterized in that described detection segment is away from upper bottom roller (3,4) a end is connected with can be at split type guide rail (17,18) the first guide vane end stop (5) that moves up and down on, described the first guide vane end stop (5) and the first guide vane end stop cylinder (6) of stepping down is in transmission connection, the centre distance of the first guide vane end stop (5) and upper bottom roller (3,4) and the length of semiconductor lead frame are suitable.
3. a kind of harmless pay-off for semiconductor lead frame as claimed in claim 1, it is characterized in that described section is connected with the promotion semiconductor lead frame near an end of detection segment the push rod (7) that extracts, described push rod (7) is connected with the push rod that drives push rod (7) cylinder (8) of stepping down, and extracts section and is connected with the second guide vane end stop (9) away from the other end of detection segment.
4. a kind of harmless pay-off for semiconductor lead frame as claimed in claim 3, it is characterized in that described push rod (7) and the push rod cylinder (8) of stepping down is connected with the movable block (10) that is driven by the feeding cylinder (15) that is fixed on the feeding cylinder mounting panel (12), be mounted with front limit plate (16) between described movable block (10) and the feeding cylinder (15), be mounted with rear position margining plate (11) between movable block (10) and the detection segment, the upper adaptive caging bolt (13) that to regulate feeding cylinder (15) propelling movement stroke that has of movable block (10), above-mentioned feeding cylinder mounting panel (12), front limit plate (16), rear position margining plate (11) is fixed on the mounting base (14) under the split type guide rail (17,18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220381961 CN202695409U (en) | 2012-08-03 | 2012-08-03 | Non-destructive feeding device for semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220381961 CN202695409U (en) | 2012-08-03 | 2012-08-03 | Non-destructive feeding device for semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202695409U true CN202695409U (en) | 2013-01-23 |
Family
ID=47550986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220381961 Expired - Fee Related CN202695409U (en) | 2012-08-03 | 2012-08-03 | Non-destructive feeding device for semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202695409U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783707A (en) * | 2016-12-19 | 2017-05-31 | 江阴新基电子设备有限公司 | Box device is received in lead frame blanking |
-
2012
- 2012-08-03 CN CN 201220381961 patent/CN202695409U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783707A (en) * | 2016-12-19 | 2017-05-31 | 江阴新基电子设备有限公司 | Box device is received in lead frame blanking |
| CN106783707B (en) * | 2016-12-19 | 2023-09-15 | 江阴新基电子设备有限公司 | Lead frame blanking and box receiving device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20190803 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |