CN202678308U - 一种cob集成光源模块 - Google Patents

一种cob集成光源模块 Download PDF

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Publication number
CN202678308U
CN202678308U CN201220256095XU CN201220256095U CN202678308U CN 202678308 U CN202678308 U CN 202678308U CN 201220256095X U CN201220256095X U CN 201220256095XU CN 201220256095 U CN201220256095 U CN 201220256095U CN 202678308 U CN202678308 U CN 202678308U
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Prior art keywords
silica gel
source module
cob integrated
fluorescent powder
optical source
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CN201220256095XU
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张日光
林胜
叶兵
张耀华
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Ningbo Sunpu Opto Co Ltd
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NINGBO SUNPU-OPTO SEMICONDUCTOR Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

本实用新型涉及一种COB集成光源模块，包括铺设有引线电路的框架，框架内部设置有与引线电路电连接的LED晶片，其特征在于：所述框架上均匀的涂抹有透明硅胶层，透明硅胶层外覆盖有硅胶片，该硅胶片上分别印刷有黄色荧光粉，红色荧光粉和绿色荧光粉。与现有技术相比，本实用新型的优点在于：红色荧光粉跟绿色荧光粉发出的光不会出现互相吸收的现象，显指提高到90的同时不会降低光通量，产品整体光效能达到100lm/W。

Description

一种COB集成光源模块
技术领域
本实用新型涉及一种COB集成光源模块。
背景技术
LED(Light Emitting Diode，简称LED，中文名为发光二极管)灯被称为第四代照明光源或绿色光源，具有节能、环保、体积小、可靠性高等特点，广泛应用于各种指示、显示、装饰、背光源、普通照明和城市夜景等领域。随着LED晶片的整体水平的不断提高，LED灯整体光效不断提升，使得其照明领域的应用不断得以扩大。
目前，LED照明市场仍以COB集成光源为主，COB集成光源的制作趋向是功率做高体积做小，同时光效跟显指也需要相对提高。但是现有的COB集成光源，为了提高显指，通常会采用混合有绿色荧光粉3’与红色荧光粉2’的硅胶4’进行封装，参见图4所示，蓝色LED1’发出的蓝光分别激发红色荧光粉2’和绿色荧光粉3’，分别发出红光与绿光，蓝光与红光及绿光混合成白光，但是绿色荧光粉和红色荧光粉彼此会发生光吸收现象，会损失部分光，这会导致显指提高光效下降。
实用新型内容
本实用新型所要解决的技术问题是针对上述现有技术提供一种高光效高显指的COB集成光源模块。
本实用新型解决上述技术问题所采用的技术方案为：该COB集成光源模块，包括铺设有引线电路的框架，框架内部设置有与引线电路电连接的LED晶片，其特征在于：所述框架上均匀的涂抹有透明基材层，透明基材层外覆盖有硅胶片，该硅胶片上分别印刷有黄色荧光粉，红色荧光粉和绿色荧光粉。
作为改进，所述硅胶片上均匀设置有相互独立的、用于印刷黄色荧光粉、红色荧光粉和绿色荧光粉的印刷区域。
较好的，所述硅胶片厚度为0.25mm～0.35mm，以0.3mm为佳。
与现有技术相比，本实用新型的优点在于：红色荧光粉跟绿色荧光粉发出的光不会出现互相吸收的现象，显指提高到90的同时不会降低光通量，产品整体光效能达到100lm/W。
附图说明
图1为本实用新型实施例中COB集成光源模块的结构示意图；
图2为本实用新型实施例中硅胶片的俯视图；
图3为本实用新型实施例中硅胶片印刷有黄色荧光粉、红色荧光粉和绿色荧光粉后的俯视图；
图4为现有技术中COB集成光源模块的结构示意图。
具体实施方式
以下结合附图实施例对本实用新型作进一步详细描述。
如图1～3所示的COB集成光源模块，其包括铺设有引线电路的框架1，框架1内部设置有与引线电路电连接的LED晶片2，框架1上均匀的涂抹有透明硅胶层3，透明硅胶层3外覆盖有硅胶片4，该硅胶片4上分别印刷有黄色荧光粉c，红色荧光粉a和绿色荧光粉b；本实施例中，硅胶片4上均匀设置有相互独立的、用于印刷黄色荧光粉、红色荧光粉和绿色荧光粉的印刷区域41，这些印刷用于印刷黄色荧光粉c，红色荧光粉a和绿色荧光粉b；硅胶片厚度为0.3mm；产品的色温可以根据三种不同颜色荧光粉的总印刷量进行调整，而三种不同颜色荧光粉的总印刷量是根据印刷次数剩以印刷面积得到，其调整方式有多种：例如需要做色温3000K的产品，其中一种较好的调整方式为：先调整印刷治具，将三种不同颜色荧光粉所占用的印刷区域的比例确定为1:1:1，三种不同颜色荧光粉在硅胶片4上的分布位置可以不受限制，可随意调整印刷治具，用来调整三种荧光粉印刷面积所占的比例，只要最终三种不同颜色荧光粉所占用的印刷区域的比例为1:1:1即可，然后进行第一次印刷，第一次印刷完毕以后，如发现色温有所偏高，第二次印刷时只增加红色荧光粉印刷次数，直到色温符合要求为止；LED晶片2采用蓝光LED晶片后，蓝光激发该硅胶片，显指能达到90，且光效较红绿粉混合在一起的能提高20%左右，即能达到100lm/W。

Claims (3)

1.一种COB集成光源模块，包括铺设有引线电路的框架，框架内部设置有与引线电路电连接的LED晶片，其特征在于：所述框架上均匀的涂抹有透明基材层，透明基材层外覆盖有硅胶片，该硅胶片上分别印刷有黄色荧光粉，红色荧光粉和绿色荧光粉。
2.根据权利要求1所述的COB集成光源模块，其特征在于：所述硅胶片上均匀设置有相互独立的、用于印刷黄色荧光粉、红色荧光粉和绿色荧光粉的印刷区域。
3.根据权利要求1或2所述的COB集成光源模块，其特征在于：所述硅胶片厚度为0.25mm～0.35mm。
CN201220256095XU 2012-05-29 2012-05-29 一种cob集成光源模块 Expired - Lifetime CN202678308U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102709280A (zh) * 2012-05-29 2012-10-03 宁波升谱光电半导体有限公司 一种cob集成光源模块
CN103972222A (zh) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 Led光源封装方法、led光源封装结构及光源模块

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102709280A (zh) * 2012-05-29 2012-10-03 宁波升谱光电半导体有限公司 一种cob集成光源模块
CN103972222A (zh) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 Led光源封装方法、led光源封装结构及光源模块
US9379292B2 (en) 2014-06-03 2016-06-28 Ningbo Sunpu Led Co., Ltd. LED light source packaging method, LED light source package structure and light source module

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Address after: 315040, Xinhui Road, national hi tech Zone, Zhejiang, Ningbo, 150

Patentee after: NINGBO SUNPU OPTO CO., LTD.

Address before: 315040, Xinhui Road, national hi tech Zone, Zhejiang, Ningbo, 150

Patentee before: Ningbo Sunpu-opto Semiconductor Co., Ltd.

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