CN202667929U - Device of double-faced copper film on pulse-laser-etched organic glass - Google Patents
Device of double-faced copper film on pulse-laser-etched organic glass Download PDFInfo
- Publication number
- CN202667929U CN202667929U CN 201220266399 CN201220266399U CN202667929U CN 202667929 U CN202667929 U CN 202667929U CN 201220266399 CN201220266399 CN 201220266399 CN 201220266399 U CN201220266399 U CN 201220266399U CN 202667929 U CN202667929 U CN 202667929U
- Authority
- CN
- China
- Prior art keywords
- laser
- copper film
- glass
- organic
- pulse laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Abstract
The utility model relates to a device of a double-faced copper film on a pulse-laser-etched organic glass. The device comprises a pulse laser etching device. The pulse laser etching device comprises a laser device (1), a light gate (2), a 1/2 wave plate (3), a Glan prism (4), a beam expander (5), a full reflex lens (6), a galvanometer system (7) and a tele-centric field lens (8). Lasers emitted by the laser device (1) enter the beam expander (5) to be coaxially expanded after passing through the electric light gate (2), the 1/2 wave plate (3) and the Glan prism (4) sequentially. The lasers expanded and collimated by the beam expander (5) reach the full reflex lens (6). The lasers reflected by the full reflex lens (6) enter the galvanometer system (7). The lasers emitted from the galvanometer system (7) are focused by the tele-centric field lens (8) onto an organic glass which is a piece to be processed (12). The device of the double-faced copper film on the pulse-laser-etched organic glass has the advantages of being simple to process and high in efficiency, and having no need to consume materials.
Description
Technical field
The utility model relates to the device of the organic two-sided copper film on glass of a kind of pulse laser etching, belongs near field optic, electronic touch designing technique and laser micro-machining technology field.
Background technology
Traditional touch-screen conductive material base material mostly is PET and GLASS, and this type of base material majority is external imported material, and delivery cycle is long and cost is higher, and more limitation is arranged; Moreover existing touch-screen field all is that the single face etch process carries out, and can't reduce so the final thickness of touch-screen product, has restricted the process of touch-screen to thinner future development; If use with lucite and can be easy to find at home suitable material as the manufacture craft of substrate, and relative low price, manufacturing process is comparatively simple, and cost and the material cost of equipment had greatly improved; Adding the two-sided technique of making, the touch-screen product thickness can be reduced about 1mm again, is a new breakthrough in the touch-screen field;
But the copper film layer circuit is realized that width is the thinnest and can only be reached 80um on traditional wet etching touch-screen, and yields is lower, and linear inhomogeneous, it is comparatively loaded down with trivial details to change the different batches product, need to clean with chemical medicinal liquid contaminated environment; The net tension value that stretches tight is less, and finished-product material wearability, chemical proofing are relatively poor, easily aging embrittlement.Need more consumptive material in this mode of printing complex procedures, the production, producing line needs more manpower to safeguard that limitation is larger.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides that processing is simple, efficient is high and need not the device of the organic two-sided copper film on glass of a kind of pulse laser etching of consumptive material.
The purpose of this utility model is achieved in that the device of the organic two-sided copper film on glass of a kind of pulse laser etching, described device includes laser ablation equipment, described laser ablation equipment includes laser instrument, optical gate, 1/2 wave plate, Glan prism, beam expanding lens, eyeglass is all-trans, galvanometer system and psychological field mirror far away, the laser that described laser instrument sends is successively through optical gate, inject beam expanding lens behind 1/2 wave plate and the Glan prism light beam is carried out coaxial expanding, laser behind the beam expanding lens beam-expanding collimation arrives the eyeglass that is all-trans, laser behind the lens reflecting that is all-trans is injected galvanometer system, penetrates the laser of galvanometer system on focusing on as to be processed lucite behind the psychological field mirror far away.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the utility model, described laser instrument is the high-frequency short-pulse laser.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the utility model, described device includes height-gauge, and height-gauge is arranged on the galvanometer system.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the utility model, described height-gauge is contactless height-gauge.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the utility model, described laser instrument, galvanometer system and height-gauge all link to each other with industrial computer by communication system.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the utility model, described lucite as to be processed is fixed by clamping cylinder, and the top of the copper film layer of described lucite as to be processed is provided with a CCD contraposition observing system.
The device of the organic two-sided copper film on glass of a kind of pulse laser etching of the utility model, the both sides, top of the copper film layer of described lucite as to be processed are respectively arranged with dust-precipitating system and scavenger system.
Compared with prior art, the beneficial effects of the utility model are:
The utility model is by using high-frequency short-pulse laser as lasing light emitter, the two-sided copper film of lucite in the different touch-screen products is carried out laser-induced thermal etching, the lucite copper film is gasified under the effect of high-frequency short pulse solid state laser and reach the purpose of ablation, the etching of finishing these conductive film materials by mobile splicing and the etching of small breadth galvanometer of high accuracy platform, wherein contactless height-gauge is calibrated the stability that has guaranteed the laser-induced thermal etching working distance constantly, the dust that produces processes pollution-free through special scavenger system and large flow laying dust system control of dust, linear stable, the touch-screen electronic product that function is intact.
Description of drawings
Fig. 1 is the structural representation of the device of the organic two-sided copper film on glass of a kind of pulse laser etching of the utility model.
Wherein:
Laser instrument 1, optical gate 2,1/2 wave plate 3, Glan prism 4, beam expanding lens 5, the eyeglass 6 that is all-trans, galvanometer system 7, psychological field mirror 8 far away, CCD contraposition observing system 9, dust-precipitating system 10, scavenger system 11, to be processed 12, clamping cylinder 13, industrial computer 14, communication system 15, height-gauge 16.
The specific embodiment
Referring to Fig. 1, the utility model relates to the device of the organic two-sided copper film on glass of a kind of pulse laser etching, and the object of described device processing is take the conductive material of lucite as the two-sided copper plating film of substrate; Two bundle laser focus on respectively on the copper film of the upper and lower surface that the two-sided copper film of lucite leads, and carry out simultaneously laser-induced thermal etching; Described device includes two cover laser ablation equipment, described laser ablation equipment all includes laser instrument 1, optical gate 2,1/2 wave plate 3, Glan prism 4, beam expanding lens 5, eyeglass 6 is all-trans, galvanometer system 7 and psychological field mirror 8 far away, the laser that described laser instrument 1 sends is through optical gate 2 gauge tap light, specifically can be controlled by the software control induced signal opening and closing of optical gate 2, thereby realize the external control laser switch of laser instrument 1, behind the optical gate 2 control laser beams through 1/2 wave plate 3, regulate 1/2 wave plate and cooperate Glan prism 4 can realize that 0%～100% scope internal power is adjustable, provide very large facility to the selection of laser power; Then carry out coaxial expanding by 5 pairs of light beams of beam expanding lens, improve the angle of divergence of beam propagation on the one hand, thereby reach the purpose of beam path alignment; On the one hand, laser beams coaxial is expanded in addition, so that the rear hot spot of focusing and depth of focus are less, thereby realize the purpose of laser stabilization etching; Light beam arrives the eyeglass 6 that is all-trans behind beam expanding lens 5 beam-expanding collimations, makes laser all reflex to galvanometer system 7 and is cooperating psychological field mirror 8 far away can control accurately on the copper film of Laser Focusing to the lucite, makes its etch effect better stable; And the laser that two cover laser ablation equipment penetrate focus on respectively on up and down two copper films as to be processed 12 lucite;
Laser instrument 1 and galvanometer system 7 carries out data communication through communication systems 15 and industrial computer 14, specifically can realize scanning patter is converted into data signal, and then drive motors is needing graphics on to be processed 12 of etching; To be processed 12 simultaneously clamped cylinder 13 fixed, measure by contactless height-gauge 16, measurement data is fed back to control system, thereby control system can be processed adjusting focal length to data, guarantee that effectively focus is all the time on the copper film of lucite upper surface; Take and crawl target, then controlled working through the location mark that CCD observing system 9 will import.At this moment, scavenger system 11 and dust-precipitating system 10 are started working simultaneously, so that process is stable, after a unit is finished in high-frequency short-pulse laser etching, the next unit of platform movement, high-frequency short-pulse laser begins processing again, so repeatedly, finally realize the etching of whole processing breadth.
The lithographic method of the organic double-side copper rete on glass of a kind of pulse laser etching of the utility model, the method includes following steps:
The laser that step 1, laser instrument 1 send behind beam expanding lens 5 collimator and extenders, focuses on by galvanometer system 7 and the psychological field mirror far away 8 with less focal length behind 1/2 wave plate 3 and Glan prism 4 more again, makes focal beam spot at 5um～20um;
Step 2, the wall that lucite is led are fixed on the clamping cylinder 13, cooperating height-gauge 16 to measure in real time, measurement data is fed back to industrial computer 14, thereby industrial computer 14 can be processed adjusting focal length to data, guarantees that effectively focus focuses on the copper film of lucite upper and lower surface all the time;
Step 3, carry out CCD location; Utilization has the CCD contraposition observing system 9 that CCD grabs the target function automatically, only need in software, to set up for the first time template, the figure that imports sample target position in bitmap layer target position and the platform coordinate is arranged one by one is corresponding, and follow-up same batch products is directly grabbed target automatically can finish the location;
Step 4: when laser carries out etching according to design configuration, open simultaneously the dust-precipitating system 10 and the scavenger system 11 that are arranged at as the both sides, top of the copper film of to be processed 12 lucite, guarantee that the dust that etching produces all sucks in the dust-precipitating system 10;
The removal of lucite copper film need to be carried out under less depth of focus when carrying out etching, so we adopt M
2＜1.5(M
2The beam quality factor of expression laser instrument) high-frequency pulse laser cooperates 2X-20X(2X-20X to represent that the multiplication factor of beam expanding lens is 2 ~ 20) expand, add the psychological field mirror far away of F30 ~ F250 and process the etch copper rete.
Claims (7)
1. the device of the organic two-sided copper film on glass of pulse laser etching, it is characterized in that: described device includes laser ablation equipment, described laser ablation equipment includes laser instrument (1), optical gate (2), 1/2 wave plate (3), Glan prism (4), beam expanding lens (5), eyeglass (6) is all-trans, galvanometer system (7) and psychological field mirror (8) far away, the laser that described laser instrument (1) sends is successively through optical gate (2), inject beam expanding lens (5) behind 1/2 wave plate (3) and the Glan prism (4) light beam is carried out coaxial expanding, laser behind beam expanding lens (5) beam-expanding collimation arrives the eyeglass (6) that is all-trans, laser after the eyeglass that is all-trans (6) reflection is injected galvanometer system (7), penetrates the laser of galvanometer system (7) through focusing on behind the psychological field mirror (8) far away on the lucite as to be processed (12).
2. the device of the organic two-sided copper film on glass of a kind of pulse laser etching as claimed in claim 1, it is characterized in that: described laser instrument (1) is the high-frequency short-pulse laser.
3. the device of the organic two-sided copper film on glass of a kind of pulse laser etching as claimed in claim 1, it is characterized in that: described device includes height-gauge (16), and height-gauge (16) is arranged on the galvanometer system (7).
4. the device of the organic two-sided copper film on glass of a kind of pulse laser etching as claimed in claim 3, it is characterized in that: described height-gauge (16) is contactless height-gauge.
5. such as the device of the organic two-sided copper film on glass of a kind of pulse laser etching as described in claim 1 or 2 or 3, it is characterized in that: described laser instrument (1), galvanometer system (7) and height-gauge (16) all link to each other with industrial computer (14) by communication system (15).
6. the device of the organic two-sided copper film on glass of a kind of pulse laser etching as claimed in claim 5, it is characterized in that: described lucite as to be processed (12) is fixed by clamping cylinder (13), and the top of the copper film layer of described lucite as to be processed (12) is provided with a CCD contraposition observing system (9).
7. the device of the organic two-sided copper film on glass of a kind of pulse laser etching as claimed in claim 6 is characterized in that: the both sides, top of the copper film layer of described lucite as to be processed (12) are respectively arranged with dust-precipitating system (10) and scavenger system (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220266399 CN202667929U (en) | 2012-06-07 | 2012-06-07 | Device of double-faced copper film on pulse-laser-etched organic glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220266399 CN202667929U (en) | 2012-06-07 | 2012-06-07 | Device of double-faced copper film on pulse-laser-etched organic glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202667929U true CN202667929U (en) | 2013-01-16 |
Family
ID=47488862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220266399 Expired - Lifetime CN202667929U (en) | 2012-06-07 | 2012-06-07 | Device of double-faced copper film on pulse-laser-etched organic glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202667929U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102773609A (en) * | 2012-06-07 | 2012-11-14 | 江阴德力激光设备有限公司 | Device and method for pulse laser etching of two-side copper film on organic glass |
-
2012
- 2012-06-07 CN CN 201220266399 patent/CN202667929U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102773609A (en) * | 2012-06-07 | 2012-11-14 | 江阴德力激光设备有限公司 | Device and method for pulse laser etching of two-side copper film on organic glass |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102717190A (en) | Device and method for pulse laser etching of conducting film on organic glass | |
| CN102357736A (en) | Device and method for pulse laser etching of conducting film layer on double-sided indium tin oxide (ITO) glass | |
| CN104625415B (en) | Femtosecond laser prepares method and the device of bionic super-hydrophobic micro nano surface | |
| CN200998940Y (en) | Solar battery laser marking device | |
| CN102896421B (en) | Adopt laser micro-machining system and the processing method thereof of LCOS | |
| CN103143839A (en) | Device and method for etching conductive layer on global positioning system (GPS) touch panel by infrared nanosecond pulse laser | |
| CN102744521A (en) | Device and method for pulse laser etching for double-faced conductive film layer on organic glass | |
| CN202667927U (en) | Device for etching conductive film layer on organic glass by pulsed laser | |
| CN208195936U (en) | A kind of laser removes coating procedure coaxial monitoring device | |
| CN102416528A (en) | Device and method for etching copper conducting film on glass substrate ink by using pulse laser | |
| CN101222001A (en) | Solar battery laser marking device | |
| CN108098146A (en) | A kind of non-burnishing surface high-precision laser increases material manufacturing process | |
| CN107498183B (en) | A method of preparation large area periodic structure is induced with linear light spot | |
| CN105081564A (en) | Processing method and device for inner hole of tempered glass | |
| CN102773609A (en) | Device and method for pulse laser etching of two-side copper film on organic glass | |
| CN102205468A (en) | Device and method for etching silver syrup on electronic product | |
| CN103364090B (en) | Measure the device and method that ultra-short pulse laser propagates phase velocity in media as well | |
| CN103056527A (en) | Device and method for laser etching of conducting film layers on touch on lens (TOL) and one glass solution (OGS) touch components | |
| CN104475979A (en) | Laser etching method of transparent conductive thin film | |
| CN102284789A (en) | Device and method for performing laser etching on organic light emitting diode (OLED) display cathode film material | |
| CN102284794A (en) | Device and method for performing laser etching on organic light emitting diode (OLED) display anode film material | |
| CN101434005B (en) | Multichannel amorphous silicon solar energy plate laser film-engraving machine | |
| CN105149773A (en) | Transparent glass machining method and device | |
| CN202667928U (en) | Device of double-faced conductive film layer on pulse-laser-etched organic glass | |
| CN202344127U (en) | Device for etching conductive film layer on double-faced indium tin oxide (ITO) glass by pulse laser |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |
|
| CX01 | Expiry of patent term |