CN202652724U - Replacement carrying platform for PCB with BGA - Google Patents
Replacement carrying platform for PCB with BGA Download PDFInfo
- Publication number
- CN202652724U CN202652724U CN 201220147545 CN201220147545U CN202652724U CN 202652724 U CN202652724 U CN 202652724U CN 201220147545 CN201220147545 CN 201220147545 CN 201220147545 U CN201220147545 U CN 201220147545U CN 202652724 U CN202652724 U CN 202652724U
- Authority
- CN
- China
- Prior art keywords
- pcb
- bga
- fixing
- support portion
- fixed block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a replacement carrying platform for a PCB with a BGA. The replacement carrying platform comprises a platform body for fixing the PCB and a fixing block for fixing the BGA which is mounted on the PCB. The platform body comprises a frame and a supporting part which is arranged inside the frame to support the PCB. An upper plane of the supporting part is lower than an upper plane of the frame. The supporting part is provided with four first fixing holes for fixing the fixing block. The fixing block is a square-loop-shaped sheet body. The fixing block is provided with second fixing holes at such positions as to correspond to the first fixing holes. The second fixing holes are provided at four corners of the fixing block. The first fixing holes and the second fixing holes are connected via fasteners. The BGA is fixed between the supporting part and the fixing block. In the utility model, the pressure of four edges of the BGA which is already heated is made to be uniform by the lower supporting part and the upper fixing block, providing convenience for detaching and replacing the BGA from the PCB, effectively enhancing the replacement success rate, improving the product yield rate and saving materials.
Description
Technical field
The utility model relates to a kind of PCB be used to BGA is installed and changes microscope carrier.
Background technology
Be the PCB(Ball Grid Array of ball grid array structure), in the course of processing, need it is heated.Method to its heating in the prior art is as follows: adopt tool as shown in Figure 4, this tool has a frame 4, the inside of frame 4 is furnished with many brace rods 5 anyhow, establish on the brace rod 5 to the fixed strip 6 that PCB is fixing is arranged, when needing heating, BGA is fixed on the PCB, PCB is placed on the brace rod 5, and by fixed strip 6 each limit of PCB is fixed, tool is put into the heating board BGA is heated; Heat complete after, BGA is pulled down from PCB, whether it is checked qualified, and another BGA is installed.But during owing to heating, PCB and BGA all are heated, and PCB tends to because being heated deformation occur, and when BGA is changed, can cause the bad of BGA, causes and scraps, thereby affect the yield of product, have also wasted material, have increased cost.
Summary of the invention
The purpose of this utility model provides a kind of PCB be used to BGA is installed and changes microscope carrier.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of PCB be used to BGA is installed changes microscope carrier, it comprise one fixedly PCB body, can be fixedly mounted on the fixed block of the upper BGA of PCB, described body comprises frame, is arranged on the support portion that described PCB can be supported in described frame inside, the upper plane of described support portion is lower than the upper plane of described frame, offers 4 the first fixing holes that are used for fixing described fixed block on the described support portion; Described fixed block is side's ring-type lamellar body, the position of corresponding described the first fixing hole offers 4 the second fixing holes on the described fixed block, 4 described the second fixing holes are opened on 4 angles on the described fixed block, described the first fixing hole, the second fixing hole are connected by securing member, and described BGA is fixed between described support portion and the fixed block.
Preferably, position that described support portion is not set, described frame inside is dug and is worn.
Preferably, be provided with on the described support portion for the reference column of locating PCB.
Because technique scheme is used, the utility model compared with prior art has following advantages:
The fixed block on the support portion of replacing microscope carrier of the present utility model by the bottom, top makes the BGA four limit pressure after the heating even, makes things convenient for BGA to pull down from PCB and changes, and the success rate of the replacing that effectively improves has improved the yield of product, and saved material.
Description of drawings
Accompanying drawing 1 is the structural representation of body in the utility model;
Accompanying drawing 2 is the structural representation of fixed block in the utility model;
Accompanying drawing 3 is fixed on schematic diagram on the body for fixed block in the utility model;
Accompanying drawing 4 is the fixture schematic diagram of prior art.
Wherein: 1, body; 10, frame; 11, support portion; 110, reference column; 12, the first fixing hole; 2, fixed block; 20, the second fixing hole; 3, securing member.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
A kind of PCB be used to BGA is installed as shown in Figure 3 changes microscope carrier, it comprise one fixedly PCB body 1, can be fixedly mounted on the fixed block 2 of the upper BGA of PCB, specifically:
As shown in Figure 1: body 1 comprises frame 10, is arranged on the support portion 11 that PCB can be supported in frame 10 inside, and the upper plane of support portion 11 is lower than the upper plane of frame 10, that is to say, after PCB is placed on the support portion 11, the upper surface of PCB can not be higher than the upper surface of frame 10 or flush with it, and frame 10 inside do not arrange the position of support portion 11 and dig and wear, and avoid the part of PCB bottom impaired because pushing.The body 1 of present embodiment is applicable to PCB has 4 holes around BGA model, namely offers 4 the first fixing holes 12 that are used for fixing this fixed block 2 on the support portion 11;
As shown in Figure 2: fixed block 2 is side's ring-type lamellar body, offers 20,4 the second fixing holes 20 of 4 the second fixing holes in the position of corresponding the first fixing hole 12 on the fixed block 2 and is opened on 4 angles on the fixed block 2.
In addition, 11 reference columns 110 that are provided with for location PCB in the support portion.
In use, PCB is placed on the support portion 11, reference column 110 passes the location hole on the PCB, PCB is fixed on the support portion 1 stably, BGA is placed on the PCB, and 4 the first fixing holes 12 on the corresponding support portion 11, the second fixing hole 20 corresponding the first fixing holes 12 with fixed block 2, by securing member 3(such as screw) with the first fixing hole 12, the second fixing hole 20 connects, four limits of BGA then are fixed between support portion 11 and the fixed block 2, after BGA is heated, support portion 11 by the bottom, the fixed block 2 on top makes the pressure on BGA four limits after the heating even, is replaced with power because PCB is subjected to high temperature deformation to affect it when preventing from changing BGA.
[0013] above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with technique can understand content of the present utility model and according to this enforcement, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model Spirit Essence change or modify, and all should be encompassed within the protection range of the present utility model.
Claims (3)
1. a PCB who is used for being equipped with BGA changes microscope carrier, it is characterized in that: it comprise one fixedly PCB body, can be fixedly mounted on the fixed block of the upper BGA of PCB, described body comprises frame, is arranged on the support portion that described PCB can be supported in described frame inside, the upper plane of described support portion is lower than the upper plane of described frame, offers 4 the first fixing holes that are used for fixing described fixed block on the described support portion; Described fixed block is side's ring-type lamellar body, the position of corresponding described the first fixing hole offers 4 the second fixing holes on the described fixed block, 4 described the second fixing holes are opened on 4 angles on the described fixed block, described the first fixing hole, the second fixing hole are connected by securing member, and described BGA is fixed between described support portion and the fixed block.
2. the PCB be used to BGA is installed according to claim 1 changes microscope carrier, it is characterized in that: the position that described frame inside does not arrange described support portion is dug and is worn.
3. the PCB be used to BGA is installed according to claim 1 changes microscope carrier, it is characterized in that: be provided with the reference column for location PCB on the described support portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220147545 CN202652724U (en) | 2012-04-10 | 2012-04-10 | Replacement carrying platform for PCB with BGA |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220147545 CN202652724U (en) | 2012-04-10 | 2012-04-10 | Replacement carrying platform for PCB with BGA |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202652724U true CN202652724U (en) | 2013-01-02 |
Family
ID=47421739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220147545 Expired - Fee Related CN202652724U (en) | 2012-04-10 | 2012-04-10 | Replacement carrying platform for PCB with BGA |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202652724U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107860500A (en) * | 2017-11-13 | 2018-03-30 | 肇庆市高新区晓靖科技有限公司 | A kind of placement pressure test device of BGA repair workstations |
-
2012
- 2012-04-10 CN CN 201220147545 patent/CN202652724U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107860500A (en) * | 2017-11-13 | 2018-03-30 | 肇庆市高新区晓靖科技有限公司 | A kind of placement pressure test device of BGA repair workstations |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20130410 |