CN201878492U - Jig of subminia-ture tube (SMT) product repairing device - Google Patents

Jig of subminia-ture tube (SMT) product repairing device Download PDF

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Publication number
CN201878492U
CN201878492U CN2010205799361U CN201020579936U CN201878492U CN 201878492 U CN201878492 U CN 201878492U CN 2010205799361 U CN2010205799361 U CN 2010205799361U CN 201020579936 U CN201020579936 U CN 201020579936U CN 201878492 U CN201878492 U CN 201878492U
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CN
China
Prior art keywords
support
pcba
studdle
business
smt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010205799361U
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Chinese (zh)
Inventor
阮真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Pangu information Polytron Technologies Inc
Original Assignee
DONGGUAN SITECH ELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN SITECH ELECTRONICS TECHNOLOGY Co Ltd filed Critical DONGGUAN SITECH ELECTRONICS TECHNOLOGY Co Ltd
Priority to CN2010205799361U priority Critical patent/CN201878492U/en
Application granted granted Critical
Publication of CN201878492U publication Critical patent/CN201878492U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a jig of a subminia-ture tube (SMT) product repairing device, which comprises a bottom support mechanism, wherein the bottom support mechanism comprises a bottom tuyere bayonet and a support top tray fixed on the tuyere, the bottom tuyere is provided with a wind baffle clamping piece, a support screw rod is connected between the wind baffle clamping piece and the support top tray, and a nut is arranged on the support screw rod. When a B ball grid array (BGA) component is repaired, the deformation quantity of a printed circuit board assembly (PCBA) is greatly reduced, the primary repairing success rate of the BGA component is more than 95%, and the jig is suitable for all BGA component repairing devices on the PCBA, so that the production cost is reduced, and the resource is saved.

Description

A kind of SMT product is reprocessed the tool of device
Technical field
The utility model relates to the SMT product and reprocesses device, specifically be meant a kind of to (the Ball Grid Array ball grid array structure of the BGA in the SMT product, be a kind of packaged type that integrated circuit adopts organic support plate) when carrying out reclamation work, cooperate the tool of reprocessing device.
Background technology
At present, during to the BGA reclamation work in all SMT products, all be to adopt the mode of localized heating that the BGA element is heated, will cause the temperature difference between BGA element and the PCBA like this, owing to the reason of expanding with heat and contract with cold, make the difference of expanding with heat and contract with cold of the generation at the different position of PCBA, simultaneously PCB is in that be heated also can softening transform, therefore when reprocessing the BGA element, PCBA is bound to produce distortion, different PCBA is varying in size of deflection only, and the phenomenon of empty weldering or short circuit can appear in the change when reprocessing welding of BGA element like this.The yield that makes the BGA element reprocess reduces greatly.
Reprocess low this problem of yield if solve the BGA element at present, must make special-purpose smelting tool at each PCBA.Existing technology is utilized BGA to reprocess the BGA element that platform reprocesses needs and is reprocessed, if once unsuccessfully carry out reprocessing second time, till the PCBA subscription rate again.Its shortcoming is: a) scrappage of PCBA is bigger, directly for factory causes production loss, strengthens production cost; B) too much making smelting tool (a PCB makes a smelting tool) improves production cost;
The utility model content
The problem that the utility model need solve provides a kind of PCBA of avoiding distortion and causes that the BGA element reprocesses the tool that yield is low, SMT product that save cost is reprocessed device.
To achieve these goals, the utility model is designed the tool that a kind of SMT product is reprocessed device, comprise bottom support mechanism, described bottom support mechanism comprises that bottom tuyeres air port bayonet socket and the support that is fixed on the air port take over a business, described bottom tuyeres is provided with the card that keeps out the wind, between keep out the wind card and support are taken over a business, be connected with studdle, nut is installed on studdle.And screw flight just with bottom tuyeres keep out the wind card hold-down nut match, can directly install.And realize supporting the function of free adjustment height by rotary screw.
Continuous screw rod and the bottom tuyeres type that is in line is taken over a business in described support, and vertical mutually.
Continuous studdle is taken over a business in described support and bottom tuyeres is provided with screw thread, and studdle realizes that with bottom tuyeres turn is connected.
The screw rod that described support takes over a business to be connected is fixedly connected, and vertical mutually.
The utility model SMT product is reprocessed the tool of device by but the bracing or strutting arrangement of a free adjustment height is installed on bottom tuyeres, can require to regulate according to reality simultaneously and highly support, make BGA reprocess platform and carrying out the BGA element when reprocessing, the PCBA deflection reduces greatly, simultaneously BGA element repair for 1st time success rate is reached more than 95%, and be applicable to the device that the BGA element on all PCBA is reprocessed, therefore reduced production cost, saved resource.The tool that the utility model SMT product is reprocessed device reduces the deflection of PCBA, stops factory because of a in the past PCBA of cancellation that scraps that the PCBA distortion produces makes a smelting tool, saves a large sum of smelting tool manufacturing cost.
Description of drawings:
Fig. 1 is the jig structure schematic diagram that the utility model SMT product is reprocessed device.
Embodiment
For the ease of those skilled in the art's understanding, structural principle of the present utility model is described in further detail below in conjunction with specific embodiment and accompanying drawing:
As shown in Figure 1, a kind of SMT product is reprocessed the tool of device, comprise bottom support mechanism, described bottom support mechanism comprises that bottom tuyeres bayonet socket 1 and the support that is fixed on the air port take over a business, described bottom tuyeres is provided with the card 2 that keeps out the wind, between keep out the wind card 2 and support take over a business 5, be connected with studdle 4, nut 3 is installed on studdle 4.And screw flight just with bottom tuyeres keep out the wind card hold-down nut match, can directly install.And realize supporting the function of free adjustment height by rotary screw.The screw rod that described support takes over a business to be connected is fixedly connected, and vertical mutually.5 studdles that link to each other 4 and the bottom tuyeres type that is in line is taken over a business in described support, and vertical mutually.Described support is taken over a business 5 studdle and the bottom tuyeres that link to each other and is provided with screw thread, and studdle 4 realizes that with bottom tuyeres turn is connected.
Operation principle of the present utility model: during use that the air port bayonet socket 1 of supporting mechanism and the snap ring reprocessed on the heat-generating system of platform bottom is stuck mutually, the phenomenon of left rotation and right rotation can not be arranged.Before adjusting bearing height, the PCBA that will reprocess is put into anti-BGA and reprocesses on the anchor clamps of platform and clip earlier, again the BGA element is moved on to the bottom support system directly over, and check the height that supports apart from the PCBA base plate.Adjust when supporting height, the Luo bar is supported in turn slowly, allow as the support and the PCBA base plate at a distance of 2-3MM (having element then to be as the criterion) with element as the bottom, because PCBA is the meeting softening transform after being heated, simultaneously owing to the temperature difference and the reason of expanding with heat and contract with cold, the residing position of BGA element deflection maximum, simultaneously owing to heavy reason, PCBA is bound to be out of shape downwards, after PCBA is deformed to certain Cheng Du downwards, support is taken over a business and PCBA can be propped up, and makes the BGA element be in a relative plane and is heated and reprocesses welding.If support is taken over a business directly PCAB bottom dieback, be heated owing to expand with heat and contract with cold as PCBA, PCBA can produce internal stress, simultaneously BGA reprocess platform anchor clamps firmly PCBA clamp, PCBA can't be out of shape downwards have to be to the distortion of arching upward.Therefore when supporting height, adjusting the PCBA bottom can be made extremely full scarcely.If the PCBA plate of extra large size also can add the support system that board carries, effect can be better like this.Because PCBA is when being heated, not only the tile position at BGA element place can be out of shape, and other position can be out of shape equally, simultaneously can large deformation also can be big more more along with the PCBA area, at this moment not only to control the distortion of the not piece position at BGA element place, also will control the deflection of whole PCBA simultaneously.
Foregoing is preferred embodiment of the present utility model only, is not to be used to limit embodiment of the present utility model, and those skilled in the art are according to design of the present utility model, and appropriate adaptation of having done or modification all should be within protection ranges of the present utility model.

Claims (4)

1. a SMT product is reprocessed the tool of device, comprise bottom support mechanism, it is characterized in that: described bottom support mechanism comprises that bottom tuyeres bayonet socket and the support that is fixed on the air port take over a business, described bottom tuyeres is provided with the card that keeps out the wind, between keep out the wind card and support are taken over a business, be connected with studdle, nut is installed on studdle.
2. SMT product according to claim 1 is reprocessed the tool of device, it is characterized in that: continuous studdle and the bottom tuyeres type that is in line is taken over a business in described support, and vertical mutually.
3. SMT product according to claim 1 and 2 is reprocessed the tool of device, it is characterized in that: continuous studdle is taken over a business in described support and bottom tuyeres is provided with screw thread, and studdle realizes that with bottom tuyeres turn is connected.
4. SMT product according to claim 1 and 2 is reprocessed the tool of device, it is characterized in that: the studdle that described support takes over a business to be connected is fixedly connected, and vertical mutually.
CN2010205799361U 2010-10-26 2010-10-26 Jig of subminia-ture tube (SMT) product repairing device Expired - Lifetime CN201878492U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205799361U CN201878492U (en) 2010-10-26 2010-10-26 Jig of subminia-ture tube (SMT) product repairing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205799361U CN201878492U (en) 2010-10-26 2010-10-26 Jig of subminia-ture tube (SMT) product repairing device

Publications (1)

Publication Number Publication Date
CN201878492U true CN201878492U (en) 2011-06-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205799361U Expired - Lifetime CN201878492U (en) 2010-10-26 2010-10-26 Jig of subminia-ture tube (SMT) product repairing device

Country Status (1)

Country Link
CN (1) CN201878492U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104325206A (en) * 2014-11-06 2015-02-04 袁田 BGA rework station upper-lower-part hot air temperature conditioning processing technology
CN108453335A (en) * 2017-02-20 2018-08-28 迈普通信技术股份有限公司 The anti-short-circuit support jig of BGA Rework stations, support construction and application method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104325206A (en) * 2014-11-06 2015-02-04 袁田 BGA rework station upper-lower-part hot air temperature conditioning processing technology
CN108453335A (en) * 2017-02-20 2018-08-28 迈普通信技术股份有限公司 The anti-short-circuit support jig of BGA Rework stations, support construction and application method

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: GUANGDONG PANGU INFORMATION TECHNOLOGY CO., LTD.

Free format text: FORMER NAME: DONGGUAN CITY SITECH ELECTRONIC TECHNOLOGY CO., LTD.

CP03 Change of name, title or address

Address after: 523000 Guangdong province Dongguan Nancheng District week Xilong Xi Road No. 5, Goldman Technology Park building B room 302-303

Patentee after: Guangdong Pangu Mdt InfoTech Ltd

Address before: 523070 Guangdong province Dongguan City Nancheng Hongfu Road International Chamber of Commerce building, room 1809

Patentee before: Dongguan Sitech Electronics Technology Co., Ltd.

CP01 Change in the name or title of a patent holder

Address after: 523000 Guangdong province Dongguan Nancheng District week Xilong Xi Road No. 5, Goldman Technology Park building B room 302-303

Patentee after: Guangdong Pangu information Polytron Technologies Inc

Address before: 523000 Guangdong province Dongguan Nancheng District week Xilong Xi Road No. 5, Goldman Technology Park building B room 302-303

Patentee before: Guangdong Pangu Mdt InfoTech Ltd

CP01 Change in the name or title of a patent holder
CX01 Expiry of patent term

Granted publication date: 20110622

CX01 Expiry of patent term