CN202651103U - Lead frame structure with pressure welding area having projection or groove - Google Patents

Lead frame structure with pressure welding area having projection or groove Download PDF

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Publication number
CN202651103U
CN202651103U CN2012202741404U CN201220274140U CN202651103U CN 202651103 U CN202651103 U CN 202651103U CN 2012202741404 U CN2012202741404 U CN 2012202741404U CN 201220274140 U CN201220274140 U CN 201220274140U CN 202651103 U CN202651103 U CN 202651103U
Authority
CN
China
Prior art keywords
pressure welding
welding area
groove
projection
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2012202741404U
Other languages
Chinese (zh)
Inventor
李明芬
刘红军
陈益新
朱悦
李付成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changjiang Electronics Technology (suqian) Co Ltd
Original Assignee
Changjiang Electronics Technology (suqian) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changjiang Electronics Technology (suqian) Co Ltd filed Critical Changjiang Electronics Technology (suqian) Co Ltd
Priority to CN2012202741404U priority Critical patent/CN202651103U/en
Application granted granted Critical
Publication of CN202651103U publication Critical patent/CN202651103U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model relates to a lead frame structure with a pressure welding area having a projection or a groove and belongs to the technical field of semiconductor packaging. The lead frame structure with the pressure welding area having the projection or the groove comprises a basic island (1) and a pin (2), wherein a surface of the pressure welding area (3) of the pin (2) is provided with the projection or the groove (6). According to the lead frame structure with the pressure welding area having the projection or the groove, the surface of the pressure welding area is provided with the projection or the groove, so frictional force of the welding wire and the pressure welding area is improved; combination secureness of the welding wire and the pressure welding area is improved; occurrence of insecureness of the welding wire and the pressure welding area caused by shearing force during subsequent usage of products is reduced; and package reliability of the products is improved.

Description

The lead frame structure of pressure welding area band projection or groove
Technical field
The utility model relates to the lead frame structure of a kind of pressure welding area band projection or groove, belongs to the semiconductor packaging field.
Background technology
The traditional bonding mode of aluminum steel or aluminium strip is in integrated circuit or the discrete device: utilize the conditions such as ultrasonic wave, pressure that bonding wire and pressure welding area are linked together (as shown in Figure 3).Under this kind technique, traditional lead frame pressure welding point all requires surfacing (upper limit of surface roughness requires to be generally 25 μ m), rely on two burnishing surfaces of bonding wire and pressure welding area to be combined (such as Fig. 1, Fig. 2, shown in Figure 3) fully in conjunction with firmness, but in the product use procedure, the formation shearing forces such as lead frame, the different factors of bonding wire expanded by heating coefficient cause bonding wire and pressure welding area in conjunction with not firm, can cause that product reliability is bad.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and the lead frame structure of a kind of pressure welding area band projection or groove is provided, and bonding wire and pressure welding area are combined closely, and can effectively prevent and the damage of shearing force.
The purpose of this utility model is achieved in that the lead frame structure of a kind of pressure welding area band projection or groove, and it comprises Ji Dao and pin, and the pressure welding area surface of described pin is provided with projection or groove.
Described projection or groove be shaped as cylinder, square body or centrum.
The height of described projection or groove or the degree of depth are greater than 30 μ m.
Compared with prior art, the utlity model has following beneficial effect:
The lead frame structure of the utility model a kind of pressure welding area band projection or groove, its pressure welding area surface is with projection or groove, can increase the frictional force of bonding wire and pressure welding area, increase bonding wire and pressure welding area ground contact area, improve the binding strength of bonding wire and pressure welding area, reduce the bonding wire and the pressure welding area that cause because of shearing force when product is follow-up to be used not firm, improve the product package reliability.
Description of drawings
Fig. 1 is the structural representation of former lead frame.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is the routing schematic diagram of former lead frame.
Fig. 4 is the schematic diagram of the lead frame structure of the utility model a kind of pressure welding area band projection or groove.
Fig. 5 is the I section enlarged drawing of Fig. 4.
Fig. 6 is the A-A cutaway view of Fig. 5.
Fig. 7 is the routing schematic diagram of the lead frame structure of the utility model a kind of pressure welding area band projection or groove.
Fig. 8 ~ Figure 10 is that other three kinds of Fig. 6 are implemented illustration.
Wherein:
Base island 1
Pin 2
Pressure welding area 3
Bonding wire 4
Chip 5
Projection or groove 6.
Embodiment
Referring to Fig. 4 ~ Figure 10, the lead frame structure of the utility model a kind of pressure welding area band projection or groove, it comprises basic island 1 and pin 2, pressure welding area 3 surfaces of described pin 2 are provided with projection or groove 6, also can the projection and groove have concurrently, projection or groove 6 can be the various shapes such as cylinder, square body or centrum.The height of described projection or groove 6 or the degree of depth are greater than 30 μ m.

Claims (3)

1. the lead frame structure of a pressure welding area band projection or groove, it is characterized in that: it comprises Ji Dao (1) and pin (2), pressure welding area (3) surface of described pin (2) is provided with projection or groove (6).
2. the lead frame structure of a kind of pressure welding area band projection according to claim 1 or groove is characterized in that: described projection or groove (6) be shaped as cylinder, square body or centrum.
3. the lead frame structure of a kind of pressure welding area band projection according to claim 1 or groove, it is characterized in that: the height of described projection or groove (6) or the degree of depth are greater than 30 μ m.
CN2012202741404U 2012-06-12 2012-06-12 Lead frame structure with pressure welding area having projection or groove Expired - Lifetime CN202651103U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012202741404U CN202651103U (en) 2012-06-12 2012-06-12 Lead frame structure with pressure welding area having projection or groove

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012202741404U CN202651103U (en) 2012-06-12 2012-06-12 Lead frame structure with pressure welding area having projection or groove

Publications (1)

Publication Number Publication Date
CN202651103U true CN202651103U (en) 2013-01-02

Family

ID=47420165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012202741404U Expired - Lifetime CN202651103U (en) 2012-06-12 2012-06-12 Lead frame structure with pressure welding area having projection or groove

Country Status (1)

Country Link
CN (1) CN202651103U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20130102

CX01 Expiry of patent term