CN202643827U - Unbalanced closed field magnetron sputtering ion plating equipment - Google Patents
Unbalanced closed field magnetron sputtering ion plating equipment Download PDFInfo
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- CN202643827U CN202643827U CN 201220233276 CN201220233276U CN202643827U CN 202643827 U CN202643827 U CN 202643827U CN 201220233276 CN201220233276 CN 201220233276 CN 201220233276 U CN201220233276 U CN 201220233276U CN 202643827 U CN202643827 U CN 202643827U
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- ion plating
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- plating equipment
- vacuum chamber
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Abstract
The utility model discloses unbalanced closed field magnetron sputtering ion plating equipment, which comprises a vacuum chamber (1) and a control cabinet (3). A vacuum control cabinet (2) is arranged below the vacuum chamber (1); the control cabinet (3) is provided with a manual operation interface (4) and a full-automatic operation interface (5); the vacuum chamber (1) is provided with a side-open furnace door (18); an argon bottle (8) and a nitrogen bottle (9) are arranged at the rear of the vacuum control cabinet (2); the back face of the vacuum control cabinet (2) is provided with a gas pressure gage (10); and a gas flow feedback system (16) is also arranged in the vacuum control cabinet (2) and is connected with the gas pressure gage (10). As the unbalanced closed field magnetron sputtering ion plating equipment is provided with the gas flow feedback system, the concentration of reaction gas is determined through a spectral signal of glow discharge, and therefore, the adjustment range of gas flow rate is analyzed and judged; and a gas flow controller is accurately adjusted, so that the pressure of inlet gas is kept at the best state, and the compactness and the adhesiveness of a thin film are ensured.
Description
Technical field
The utility model relates to a kind of non-equilibrium closed field magnetic controlled sputtering ion plating equipment, belongs to the Prepared by Unbalanced Magnetron Sputtering Method technical field.
Background technology
Now a lot of materials all need to carry out coating film treatment before use.Almost any material can be coated on the other materials surface by vacuum coating technology now, for more wide prospect has been opened up in the application of vacuum coating technology in various industrial circles.On material surface, block thin film, just can make that material has many new material resources and chemical property in this.Prepare film under the vacuum, clean environment, film is vulnerable to pollution not, can obtain that compactness is good, purity is high, the coating of uniform film thickness.The particle energy that magnetic control sputtering vacuum coating sputters out is tens electron-volts, and particle energy is large, thereby film is combined with matrix better, and it is higher that film causes your degree; Sedimentation rate is high after the sputter, and the matrix temperature rise is little; Can deposit refractory metal, alloy and compound-material, the sputter scope is wide; Can realize the sputtering sedimentation of large-area target, and depositional area is large, good uniformity; Simple to operate, good process repeatability is easy to realize the technology controlling and process automatization.These more magnetron sputtering objectively development prospect is provided very.
Film deposition techniques mainly comprises chemical vapour deposition and material resources vapour deposition, chemical vapour deposition makes its application be subject to certain restriction because depositing temperature is high, and the material resources vapour deposition is because depositing temperature is low, applicable base material range is wide, and film quality also is easy to control relatively; The material resources vapour deposition mainly comprises vacuum plating and sputtering sedimentation, the sputter mode has radio-frequency sputtering, triode sputtering and magnetron sputtering, magnetron sputtering has higher plated film speed with respect to other two kinds of sputter modes, magnetron sputtering develops into the balance-dividing magnetic control from initial common magnetic control, unbalanced magnetron, at present non-equilibrium magnetic controlledly be combined with the multi-source closed magnetic field, the gas ions density of vacuum chamber is improved, and the ion bombardment effect strengthens, and can obtain better coating quality.
But the gas flow to argon gas and nitrogen in real work is difficult for controlling, and gas dividing potential drop size is the important factor that affects film quality and adhere to speed.Sputtering pressure hour, the atom that sputters out and the collision frequency of gas molecule reduce, expended energy is less, can improve deposition and atomic and basic diffusibility, thereby density and the tack of raising film; If sputter gas pressure is too small, cause the sputtering target material atom number very few, film deposition rate reduces, and build-up of luminance is not enough; If sputtering pressure is too high, target atom and gas collisions number of times increase, and expended energy is too much, causes the target atom energy of depositing base excessively low, affects sensitization and the sticking power of rete.After normally passing through experimental analysis, the manual regulation gas flow controller can not adjust fully accurately gas and pass into rear pressure an optimum regime in the past.
The utility model content
The purpose of this utility model is, a kind of non-equilibrium closed field magnetic controlled sputtering ion plating equipment is provided, it is provided with the gas flow feedback system, spectral signal by glow discharge is determined reacting gas concentration, analyze, judge the setting range of gas flow speed, accurately gas flow controller is adjusted, made to pass into gaseous tension and remain on optimum regime, guarantee density and the tack of film.
The technical solution of the utility model: a kind of non-equilibrium closed field magnetic controlled sputtering ion plating equipment, comprise vacuum chamber and housing, the vacuum chamber below is provided with the vacuum control cabinet, housing is provided with manual operation interface and unattended operation interface, vacuum chamber is provided with laterally opened fire door, vacuum control cabinet rear is provided with argon bottle and nitrogengas cylinder, and vacuum control cabinet back is provided with gas-pressure meter, is provided with the gas flow feedback system in going back and links to each other with gas-pressure meter.Owing to being provided with the gas flow feedback system, can determine gas concentration by the spectral signal of glow discharge, analyze, judge the setting range of gas flow speed, accurately gas flow controller is adjusted, make to pass into gaseous tension in a suitable scope, guarantee density and the tack of film.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, vacuum control is provided with inert gas flowmeter and monochromator cashier's office in a shop, and the vacuum chamber top is provided with vacuumometer.Because being provided with monochromator can monitor the metal that sputters in the vacuum chamber, provides the flow of signal control reactant gases; The vacuum signal of vacuum chamber can be passed to the vacuum view owing to being provided with vacuumometer.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, the manual operation interface is provided with vacuum view, gas flow controller, reflection Gas controller, hand control and automation change-over switch and bias detector.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, the gas flow feedback system comprises spectrograph, spectrometer and optical spectral monitors, and spectrograph is located in the vacuum chamber, and spectrograph links to each other with spectrometer, spectrometer links to each other with optical spectral monitors, and optical spectral monitors links to each other with gas flow controller.Owing to being provided with spectrograph, can the optical signal that the glow discharge on the target produces being caught; Owing to being provided with spectrometer, can filter spectrum, preserve characteristic spectrum; Owing to being provided with optical spectral monitors, the analytical results of characteristic spectrum can be shown, more clearly reflect setting range.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, vacuum tightness is 10-1Pa～10-2Pa in the vacuum chamber.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, laterally opened fire door is provided with the disk handle outward.Because laterally opened fire door is provided with the disk handle, can make the convenient unlatching of fire door.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, be provided with the locking handle on the disk handle, disk is the upper viewing window that also is provided with.Owing to being provided with viewing window, more being convenient to the observation of sputter procedure in the vacuum chamber.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, be provided with support platform in the vacuum chamber, the support platform top is provided with falsework, and the support platform below is provided with the sliding rail platform, and rail plate platform below is provided with heating tube.Owing to being provided with track, having made things convenient for picking and placeing falsework.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, be provided with the magnetic target around the vacuum chamber, target is provided with pin, target handle and water-cooled tube.Because being provided with the target handle has made things convenient for picking and placeing of target, owing to being provided with water-cooled tube, making in the target work and can obtain circulating cooling.
In the aforesaid non-equilibrium closed field magnetic controlled sputtering ion plating equipment, the vacuum control cabinet comprises diffusion pump, lobe pump and mechanical pump.In order to satisfy the requirement of vacuum chamber high vacuum, be made as three grades of air extractors.
In the aforementioned non-equilibrium closed field magnetic controlled sputtering ion plating equipment, voltage rating is 100V～500V in the sputter body of heater, and rated output is 50KW.
Compared with prior art, the utility model is owing to being provided with the gas flow feedback system, can determine gas concentration by the spectral signal of glow discharge, analyze, judge the setting range of gas flow speed, accurately gas flow controller is adjusted, make to pass into gaseous tension in a suitable scope, guarantee density and the tack of film; Because being provided with monochromator can monitor the metal that sputters in the vacuum chamber, provides the flow of signal control reactant gases; The vacuum signal of vacuum chamber can be passed to the vacuum view owing to being provided with vacuumometer; Owing to being provided with spectrograph, can the optical signal that the glow discharge on the target produces being caught; Owing to being provided with spectrometer, can filter spectrum, preserve characteristic spectrum; Owing to being provided with optical spectral monitors, the analytical results of characteristic spectrum can be shown, more clearly reflect setting range; Because laterally opened fire door is provided with the disk handle, can make the convenient unlatching of fire door; Owing to being provided with viewing window, more being convenient to the observation of sputter procedure; Owing to being provided with track, having made things convenient for picking and placeing falsework; Because being provided with the target handle has made things convenient for picking and placeing of target, owing to being provided with water-cooled tube, making in the target work and can obtain circulating cooling; In order to satisfy the requirement of vacuum chamber high vacuum, be made as three grades of air extractors.
Description of drawings
Fig. 1 is one-piece construction schematic diagram of the present utility model;
Fig. 2 is rear view of the present utility model;
Fig. 3 is the structural representation of the utility model housing;
Fig. 4 is the utility model gas feedback system figure;
Fig. 5 is the structural representation of the utility model vacuum chamber upside open type fire door;
Fig. 6 is the structural representation of side door handle of the present utility model;
Fig. 7 is vacuum chamber internal structure schematic diagram of the present utility model;
Fig. 8 is the utility model target material structure schematic diagram.
Being labeled as in the accompanying drawing: 1-vacuum chamber, 2-vacuum control cabinet, 3-housing, 4-manual operation interface, 5-unattended operation interface, 6-monochromator, the 7-vacuumometer, 8-argon bottle, 9-nitrogengas cylinder, the 10-gas-pressure meter, 11-inert gas flowmeter, 12-vacuum view, the 13-gas flow controller, 14-reflects Gas controller, 15-hand control and automation change-over switch, the 16-bias detector, 17-gas flow feedback system, 18-spectrograph, the 19-spectrometer, 20-optical spectral monitors, the laterally opened fire door of 21-, 22-disk handle, 23-locks handle, 24-viewing window, 25-sliding rail platform, the 26-heating tube, 27-support platform, 28-falsework, the 29-pin, 30-target handle, 31-water-cooled tube, 32-target.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described, but not as the foundation to the utility model restriction.
As shown in Figure 3, manual operation interface 4 is provided with vacuum view 12, gas flow trip switch 13, reflection Gas controller 14, hand control and automation change-over switch 15 and bias detector 16.
As shown in Figure 4, gas flow feedback system 17 comprises spectrograph 18, spectrometer 19 and optical spectral monitors 20, and spectrograph 18 is located in the vacuum chamber 1, and spectrograph 18 links to each other with spectrometer 19, spectrometer 19 links to each other with optical spectral monitors 20, and optical spectral monitors 20 links to each other with gas-pressure meter 10.
As shown in Figure 5, the laterally opened fire door 21 outer disk handles 22 that are provided with.
As shown in Figure 6,22 be provided with locking 23 and viewing window 24 on the disk handle.
As shown in Figure 7, be provided with support platform 27 in the vacuum chamber 1, the support platform top is provided with falsework 28, and support platform 27 belows are provided with sliding rail platform 25, and rail plate platform 25 belows are provided with heating tube 26.
As shown in Figure 8, laterally opened fire door 23 places are provided with target 32, and target 32 is provided with pin 29, target handle 30 and water-cooled tube 31.
As shown in Figure 3, manual operation interface 4 is provided with vacuum view 12, gas flow trip switch 13, reflection Gas controller 14, hand control and automation change-over switch 15 and bias detector 16.
As shown in Figure 4, gas flow feedback system 17 comprises spectrograph 18, spectrometer 19 and optical spectral monitors 20, and spectrograph 18 is located in the vacuum chamber 1, and spectrograph 18 links to each other with spectrometer 19, spectrometer 19 links to each other with optical spectral monitors 20, and optical spectral monitors 20 links to each other with gas-pressure meter 10.
As shown in Figure 5, the laterally opened fire door 21 outer disk handles 22 that are provided with.
As shown in Figure 6,22 be provided with locking 23 and viewing window 24 on the disk handle.
As shown in Figure 7, be provided with support platform 27 in the vacuum chamber 1, the support platform top is provided with falsework 28, and support platform 27 belows are provided with sliding rail platform 25, and rail plate platform 25 belows are provided with heating tube 26.
As shown in Figure 8, laterally opened fire door 23 places are provided with target 32, and target 32 is provided with pin 29, target handle 30 and water-cooled tube 31.
As shown in Figure 3, manual operation interface 4 is provided with vacuum view 12, gas flow trip switch 13, reflection Gas controller 14, hand control and automation change-over switch 15 and bias detector 16.
As shown in Figure 4, gas flow feedback system 17 comprises spectrograph 18, spectrometer 19 and optical spectral monitors 20, and spectrograph 18 is located in the vacuum chamber 1, and spectrograph 18 links to each other with spectrometer 19, spectrometer 19 links to each other with optical spectral monitors 20, and optical spectral monitors 20 links to each other with gas-pressure meter 10.
As shown in Figure 5, the laterally opened fire door 21 outer disk handles 22 that are provided with.
As shown in Figure 6,22 be provided with locking 23 and viewing window 24 on the disk handle.
As shown in Figure 7, be provided with support platform 27 in the vacuum chamber 1, the support platform top is provided with falsework 28, and support platform 27 belows are provided with sliding rail platform 25, and rail plate platform 25 belows are provided with heating tube 26.
As shown in Figure 8, laterally opened fire door 23 places are provided with target 32, and target 32 is provided with pin 29, target handle 30 and water-cooled tube 31.
Principle of work of the present utility model: after vacuum chamber 1 is evacuated to high vacuum, open flow director 13, pass into argon gas and nitrogen, gas-pressure meter 10 shows vacuum chamber 1 interior gaseous tension, detect by the argon gas amount in 17 pairs of vacuum chambers of gas flow feedback system 1, control argon flow amount controller 13, guarantee that vacuum tightness is at 10-1～10-3Pa, sputtering target material applies the negative voltage of 50-500V, produce glow discharge, argon ion bombardment sputtering target material surface makes the sputtering target material atom get off from the target surface sputtering, moves to substrate.Part is ionized in the transition process, and in the effect deposit of Substrate negative bias voltage in substrate, form rete.Can observe by viewing window in the coating process.
Claims (9)
1. non-equilibrium closed field magnetic controlled sputtering ion plating equipment, comprise vacuum chamber (1) and housing (3), it is characterized in that: vacuum chamber (1) below is provided with vacuum control cabinet (2), housing (3) is provided with manual operation interface (4) and unattended operation interface (5), vacuum chamber (1) is provided with laterally opened fire door (23), vacuum control cabinet (2) rear is provided with argon bottle (8) and nitrogengas cylinder (9), vacuum control cabinet (2) back is provided with gas-pressure meter (10), is provided with gas flow feedback system (16) in going back and links to each other with gas-pressure meter (10).
2. described non-equilibrium closed field magnetic controlled sputtering ion plating equipment according to claim 1, it is characterized in that: vacuum control cabinet (2) is provided with inert gas flowmeter (11) and monochromator (6), and vacuum chamber (1) top is provided with vacuumometer (7).
3. described non-equilibrium closed field magnetic controlled sputtering ion plating equipment according to claim 2, it is characterized in that: manual operation interface (4) are provided with vacuum view (12), gas flow controller (13), reflection Gas controller (14), hand control and automation change-over switch (15) and bias detector (16).
4. described non-equilibrium closed field magnetic controlled sputtering ion plating equipment according to claim 3, it is characterized in that: gas flow feedback system (17) comprises spectrograph (18), spectrometer (19) and optical spectral monitors (20), spectrograph (18) is located in the vacuum chamber (1), spectrograph (18) links to each other with spectrometer (19), spectrometer (19) links to each other with optical spectral monitors (20), and optical spectral monitors (20) links to each other with gas flow controller (13).
5. described non-equilibrium closed field magnetic controlled sputtering ion plating equipment according to claim 4 is characterized in that: the outer disk handle (22) that is provided with of laterally opened fire door (21).
6. described non-equilibrium closed field magnetic controlled sputtering ion plating equipment according to claim 5, it is characterized in that: (22) are provided with locking (23) and a viewing window (24) on the disk handle.
7. described non-equilibrium closed field magnetic controlled sputtering ion plating equipment according to claim 6, it is characterized in that: be provided with support platform (27) in the vacuum chamber (1), the support platform top is provided with falsework (28), support platform (27) below is provided with sliding rail platform (25), and rail plate platform (25) below is provided with heating tube (26).
8. described non-equilibrium closed field magnetic controlled sputtering ion plating equipment according to claim 7, it is characterized in that: laterally opened fire door (23) locates to be provided with target (32), and target (32) is provided with pin (29), target handle (30) and water-cooled tube (31).
9. described non-equilibrium closed field magnetic controlled sputtering ion plating equipment according to claim 1, it is characterized in that: vacuum control cabinet (2) comprises diffusion pump, lobe pump and mechanical pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220233276 CN202643827U (en) | 2012-05-23 | 2012-05-23 | Unbalanced closed field magnetron sputtering ion plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220233276 CN202643827U (en) | 2012-05-23 | 2012-05-23 | Unbalanced closed field magnetron sputtering ion plating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202643827U true CN202643827U (en) | 2013-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220233276 Expired - Fee Related CN202643827U (en) | 2012-05-23 | 2012-05-23 | Unbalanced closed field magnetron sputtering ion plating equipment |
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| CN (1) | CN202643827U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102677011A (en) * | 2012-05-23 | 2012-09-19 | 文晓斌 | Non-balanced closed field magnetron sputtering ion plating equipment |
| CN105200385A (en) * | 2015-10-27 | 2015-12-30 | 中国科学院兰州化学物理研究所 | Pinch-magnetic-field-assisted magnetron sputtering coating apparatus |
-
2012
- 2012-05-23 CN CN 201220233276 patent/CN202643827U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102677011A (en) * | 2012-05-23 | 2012-09-19 | 文晓斌 | Non-balanced closed field magnetron sputtering ion plating equipment |
| CN102677011B (en) * | 2012-05-23 | 2014-08-20 | 文晓斌 | Non-balanced closed field magnetron sputtering ion plating equipment |
| CN105200385A (en) * | 2015-10-27 | 2015-12-30 | 中国科学院兰州化学物理研究所 | Pinch-magnetic-field-assisted magnetron sputtering coating apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Kingmag Precision Technology Co., Ltd. Assignor: Wen Xiaobin Contract record no.: 2013440020435 Denomination of utility model: Non-balanced closed field magnetron sputtering ion plating equipment Granted publication date: 20130102 License type: Exclusive License Record date: 20131230 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Kingmag Precision Technology Co., Ltd. Assignor: Wen Xiaobin Contract record no.: 2013440020435 Denomination of utility model: Non-balanced closed field magnetron sputtering ion plating equipment Granted publication date: 20130102 License type: Exclusive License Record date: 20131230 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20140523 |