CN202614409U - Thermistor packaging body and circuit board - Google Patents
Thermistor packaging body and circuit board Download PDFInfo
- Publication number
- CN202614409U CN202614409U CN201220249277.4U CN201220249277U CN202614409U CN 202614409 U CN202614409 U CN 202614409U CN 201220249277 U CN201220249277 U CN 201220249277U CN 202614409 U CN202614409 U CN 202614409U
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- CN
- China
- Prior art keywords
- thermistor
- base plate
- circuit board
- packaging body
- heat conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a thermistor packaging body and a circuit board. The thermistor packaging body comprises a thermistor, a thermal conductor and a metal pedestal. The thermistor comprises a temperature-sensitive portion and two electrodes. The temperature-sensitive portion of the thermistor is wrapped by the thermal conductor, and each of the two electrodes is provided with a leading-out end exposed out of the thermal conductor. The thermal conductor is attached to the metal pedestal, which is further contacted with an external heat source. The utility model is advantageous in that the temperature-sensitive portion of the thermistor is wrapped by the thermal conductor, and the thermal conductor is attached to the metal pedestal, which is further contacted with the external heat source; the thermal conductor is tightly attached to the metal pedestal, and the heat of the external heat source can be transferred to the temperature-sensitive portion of the thermistor by the "metal pedestal- thermal conductor" transmission path, which is a sensitive temperature sensing mode.
Description
Technical field
The utility model relates to the electronic devices and components field, relates in particular to a kind of thermistor packaging body of accurately sense temperature and the circuit board that this thermistor packaging body is installed.
Background technology
In product, settling thermistor to obtain the temperature in somewhere, and then control the behavior of electronic devices and components, is a kind of technological means that generally adopts at present.For example adopt negative tempperature coefficient thermistor (NTC) to control the WV of the DC fan that is used for the cool electronic product, to reach the purpose that lets DC fan be operated in suitable rotating speed.Therefore, in application, need thermistor efficiently to work promptly, to reach accurate control purpose.
Be the mounting means synoptic diagram of a kind of thermistor of the prior art shown in accompanying drawing 1A and the 1B, wherein accompanying drawing 1A is a stereographic map, and accompanying drawing 1B is the sectional view of accompanying drawing 1A along the A-A direction.Thermistor 11 is fixed on the heat radiator 13 through viscose glue, and heat radiator 13 further contacts with the Copper Foil of circuit board 15 again.When the temperature of electronic product raises, the corresponding rising of Copper Foil temperature of circuit board 15, heat radiator 13 conducts to thermistor 11 with the heat of Copper Foil, thereby causes the change in resistance of thermistor 11.Also can fix between thermistor 11 and the heat radiator 13 through extra shelf.
In this structure between thermistor 11 and the heat radiator 13 fixedly is to realize that through viscose glue or extra shelf this mode can not reach the effect of abundant contact, makes thermistor 11 temperature of perception heat radiator 13 accurately.Especially after working long hours, in case viscose glue or shelf take place to become flexible, the temperature perception of 11 pairs of heat radiator 13 of thermistor is just more insensitive.
So, needing a kind of technical scheme really, can solve owing to the insecure insensitive problem of temperature perception that causes of contact.
The utility model content
The utility model technical matters to be solved is that a kind of thermistor packaging body of accurately sense temperature and the circuit board that this thermistor packaging body is installed are provided.
In order to address the above problem, the utility model provides a kind of thermistor packaging body, comprises a thermistor, a heat conductor and a metal base; Said thermistor comprises a temperature-sensitive portion and two electrodes; Said heat conductor coats the said temperature-sensitive portion of said thermistor, and said two electrodes have the exit that is exposed to outside the heat conductor separately; Said heat conductor and said metal base are fitted each other, and said metal base further contacts with the thermal source in the external world.
Optional, said metal base further comprises a base plate and biside plate, said biside plate is relatively arranged on the homonymy of said base plate; Said heat conductor is arranged in the space that said biside plate and said base plate crowd around, and fits each other with said biside plate and said base plate; Said base plate further contacts with the thermal source in the external world.
Optional, said base plate further is provided with pin, and said base plate further is to contact with extraneous thermal source through said pin.
Optional, said thermistor is a negative tempperature coefficient thermistor.
Optional, the material of said heat conductor is pottery, spun glass, epoxy or epoxy synthetic material.
The utility model further provides a kind of circuit board; Said circuit board comprises an above-mentioned thermistor packaging body at least; Copper Foil contacts on the said metal base of said thermistor packaging body and the said circuit board, and the heat of said Copper Foil is conducted to the said temperature-sensitive portion of said thermistor through said metal base.
Optional, said metal base further comprises a base plate and biside plate, said biside plate is relatively arranged on the homonymy of said base plate; Said heat conductor is arranged in the space that said biside plate and said base plate crowd around, and fits each other with said biside plate and said base plate; Said base plate further with said circuit board on Copper Foil contact.
Optional, said base plate further is provided with pin, and said base plate further is to contact through Copper Foil on said pin and the said circuit board.
Optional, said thermistor is a negative tempperature coefficient thermistor.
Optional, the material of said heat conductor is pottery, spun glass, epoxy or epoxy synthetic material.
The advantage of the utility model is; Said heat conductor coats the said temperature-sensitive portion of said thermistor, and said heat conductor and said metal base are fitted each other, and said metal base further contacts with the thermal source in the external world; Fit tightly between heat conductor and the metal base; The heat of extraneous thermal source is delivered to the temperature-sensitive portion of thermistor through the transmission path of " metal base-heat conductor ", is a kind of warming method of sensitivity.
Description of drawings
Accompanying drawing 1A and 1B are the mounting means synoptic diagram of a kind of thermistor of the prior art, and wherein accompanying drawing 1A is a stereographic map, and accompanying drawing 1B is the sectional view of accompanying drawing 1A along the A-A direction.
Accompanying drawing 2 is the described structural representations of the said thermistor packaging body of the utility model embodiment.
Accompanying drawing 3A and 3B are the structural representations of the embodiment of the said circuit board of the utility model, and wherein accompanying drawing 3A is a stereographic map, and accompanying drawing 3B is the sectional view of accompanying drawing 3A along the A-A direction.
Embodiment
The thermistor packaging body that the utility model is provided below in conjunction with accompanying drawing and the embodiment of circuit board elaborate.
At first combine accompanying drawing to provide the embodiment of the said thermistor packaging body of the utility model.
It shown in the accompanying drawing 2 structural representation of the thermistor packaging body that provides of this embodiment.
With reference to accompanying drawing 2, said packaging body comprises thermistor 21, heat conductor 23 and metal base 25; Said thermistor 21 comprises a temperature-sensitive portion 213 and two electrodes 211 and 212.
Said heat conductor 23 coats the said temperature-sensitive portion 213 of said thermistor 21.The material of said heat conductor 23 is pottery, spun glass, epoxy or epoxy synthetic material, the characteristics of above-mentioned material be high temperature resistant, insulate and have high thermal conduction characteristic, can promptly external heat be conducted to temperature-sensitive portion 213.Said heat conductor 23 is highly heat-conductive materials, can the heat source temperature in the external world directly be delivered to thermistor 21 rapidly by Copper Foil, makes it experience the variation of the heat source temperature in the said external world.Said two electrodes 211 and 212 have the exit that is exposed to outside the heat conductor 23 separately.Two electrodes 211 and 212 are used to draw the electric signal of thermistor temperature-sensitive portion 213, supply external testing circuit to detect.
Said heat conductor 23 is fitted with said metal base 25 each other, and said metal base 25 further contacts with the thermal source in the external world.Metal base 25 also is the good conductor of heat obviously owing to adopt metal material, has high thermal conduction characteristic.Fit tightly between heat conductor 23 and the metal base 25.Through such setting, the heat of extraneous thermal source is delivered to the temperature-sensitive portion 213 of thermistor 21 through the transmission path of " metal base 25-heat conductor 23 ", is a kind of warming method of sensitivity.
In this embodiment, said metal base 25 further comprises a base plate 251 and biside plate 252 and 253, and said base plate 251 further is provided with pin 2511, and said biside plate 252 and 253 is relatively arranged on the homonymy of said base plate 251.Said heat conductor 23 is arranged in the space that said biside plate 252 and 253 crowds around with said base plate 251, and with said biside plate 252 with 253 and said base plate 251 fit each other; Said base plate 251 further is to contact with extraneous thermal source through said pin 2511.Above set-up mode can guarantee to be combining between heat conductor 23 and the metal base 25 close and firm more.
In this embodiment, said thermistor 21 is a negative tempperature coefficient thermistor.In other embodiment, thermistor 21 also can be the thermistor of positive temperature coefficient (PTC) or other types.
Next combine accompanying drawing to provide the embodiment of the said circuit board of the utility model.
Be the structural representation of the said circuit board of this embodiment shown in accompanying drawing 3A and the accompanying drawing 3B, wherein accompanying drawing 3A is a stereographic map, and accompanying drawing 3B is the sectional view of accompanying drawing 3A along the A-A direction.Said circuit board surface has Copper Foil 31, and comprises an above-mentioned thermistor packaging body at least.Said packaging body comprises thermistor 21, heat conductor 23 and metal base 25; Said thermistor 21 comprises a temperature-sensitive portion 213 (by heat conductor 23 parcels) and two electrodes 211 and 212.
Said heat conductor 23 coats the said temperature-sensitive portion of said thermistor 21, and said two electrodes 211 and 212 have the exit that is exposed to outside the heat conductor separately.Said heat conductor 23 is fitted with said metal base 25 each other, and said metal base 25 further contacts with Copper Foil 31.Copper Foil 31 contacts on the said metal base 25 of said thermistor packaging body and the said circuit board, and through said metal base 25 heat of said Copper Foil 31 is conducted to the said temperature-sensitive portion 213 of said thermistor and then the temperature of perception circuit board.
With reference to the narration of last embodiment, said metal base 25 further comprises a base plate 251 and biside plate 252 and 253, and said base plate 251 further is provided with pin 2511.Said base plate 251 further is to contact with Copper Foil 31 through said pin 2511.
The above only is the preferred implementation of the utility model; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; Can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection domain of the utility model.
Claims (10)
1. a thermistor packaging body is characterized in that, comprises a thermistor, a heat conductor and a metal base; Said thermistor comprises a temperature-sensitive portion and two electrodes; Said heat conductor coats the said temperature-sensitive portion of said thermistor, and said two electrodes have the exit that is exposed to outside the heat conductor separately; Said heat conductor and said metal base are fitted each other, and said metal base further contacts with the thermal source in the external world.
2. thermistor packaging body according to claim 1 is characterized in that said metal base further comprises a base plate and biside plate, and said biside plate is relatively arranged on the homonymy of said base plate; Said heat conductor is arranged in the space that said biside plate and said base plate crowd around, and fits each other with said biside plate and said base plate; Said base plate further contacts with the thermal source in the external world.
3. thermistor packaging body according to claim 2 is characterized in that said base plate further is provided with pin, and said base plate further is to contact with extraneous thermal source through said pin.
4. thermistor packaging body according to claim 1 is characterized in that, said thermistor is a negative tempperature coefficient thermistor.
5. thermistor packaging body according to claim 1 is characterized in that, the material of said heat conductor is pottery, spun glass, epoxy or epoxy synthetic material.
6. circuit board; It is characterized in that; Said circuit board comprises the described thermistor packaging body of a claim 1 at least; Copper Foil contacts on the said metal base of said thermistor packaging body and the said circuit board, and the heat of said Copper Foil is conducted to the said temperature-sensitive portion of said thermistor through said metal base.
7. circuit board according to claim 6 is characterized in that said metal base further comprises a base plate and biside plate, and said biside plate is relatively arranged on the homonymy of said base plate; Said heat conductor is arranged in the space that said biside plate and said base plate crowd around, and fits each other with said biside plate and said base plate; Said base plate further with said circuit board on Copper Foil contact.
8. circuit board according to claim 7 is characterized in that said base plate further is provided with pin, and said base plate further is to contact through Copper Foil on said pin and the said circuit board.
9. circuit board according to claim 6 is characterized in that, said thermistor is a negative tempperature coefficient thermistor.
10. circuit board according to claim 6 is characterized in that, the material of said heat conductor is pottery, spun glass, epoxy or epoxy synthetic material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220249277.4U CN202614409U (en) | 2012-05-30 | 2012-05-30 | Thermistor packaging body and circuit board |
| TW101214106U TWM444591U (en) | 2012-05-30 | 2012-07-20 | Thermistor package and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220249277.4U CN202614409U (en) | 2012-05-30 | 2012-05-30 | Thermistor packaging body and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202614409U true CN202614409U (en) | 2012-12-19 |
Family
ID=47348098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220249277.4U Expired - Fee Related CN202614409U (en) | 2012-05-30 | 2012-05-30 | Thermistor packaging body and circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202614409U (en) |
| TW (1) | TWM444591U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019014934A1 (en) * | 2017-07-21 | 2019-01-24 | 深圳和而泰智能控制股份有限公司 | Electromagnetic heating coil plate and electromagnetic heating device |
-
2012
- 2012-05-30 CN CN201220249277.4U patent/CN202614409U/en not_active Expired - Fee Related
- 2012-07-20 TW TW101214106U patent/TWM444591U/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019014934A1 (en) * | 2017-07-21 | 2019-01-24 | 深圳和而泰智能控制股份有限公司 | Electromagnetic heating coil plate and electromagnetic heating device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM444591U (en) | 2013-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121219 Termination date: 20140530 |