CN202613117U

CN202613117U - Light-emitting diode (LED) lamp with white-light patches

Info

Publication number: CN202613117U
Application number: CN2012201455087U
Authority: CN
Inventors: 黄少彬
Original assignee: HAN TANG GAO JING OPTOELECTRONICS CO Ltd
Current assignee: HAN TANG GAO JING OPTOELECTRONICS CO Ltd
Priority date: 2012-04-09
Filing date: 2012-04-09
Publication date: 2012-12-19
Anticipated expiration: 2022-04-09

Abstract

The utility model discloses a light-emitting diode (LED) lamp with white-light patches and relates to an improved technology of an LED lamp structure. The LED lamp with the white-light patches comprises an LED luminous chip (1). The surface of the LED luminous chip (1) is coated with a transparent heat-conduction silicon rubber layer (2). The exterior of the transparent heat-conduction silicon rubber layer (2) is coated with a fluorescent powder silicon rubber layer (3). The width of the transparent heat-conduction silicon rubber layer (2) is 0.1 millimeter to 0.5 millimeter. The width of the fluorescent powder silicon rubber layer (3) is 0.1 millimeter to 1 millimeter. The LED lamp with the white-light patches solves the problems that heat produced during use of an existing LED lamp has an effect on fluorescent powder and luminous effect of the LED lamp is lowered.

Description

The LED lamp that the white light paster is arranged

Technical field

The utility model relates to the improvement technology of LED modulated structure.

Background technology

Existing LED lamp is on chip, to apply the layer of fluorescent powder silica gel layer, but because chip is to generate heat in use, heat is influential to fluorescent material, thereby reduces the illumination effect of LED lamp.

Summary of the invention

The utility model provides a kind of LED lamp that the white light paster is arranged, and the heat that the utility model has solved in the existing LED lamp use is influential to fluorescent material, thereby reduces the problem of the illumination effect of LED lamp.

For addressing the above problem; The utility model adopts following technical scheme: the LED lamp that the white light paster is arranged; Comprise LED luminescence chip 1, be covered with transparent thermal conductive silicon glue-line 2 in LED luminescence chip 1 surfaces coated, transparent thermal conductive silicon glue-line 2 outsides are coated with fluorescent powder silica gel layer 3; The thickness of said transparent thermal conductive silicon glue-line 2 is the 0.1-0.5 millimeter, and the thickness of said fluorescent powder silica gel layer 3 is the 0.1-1 millimeter.

The elder generation of the utility model applies layer of transparent above the blue chip of LED lamp heat conductive silica gel forms the white light paster, and the white light paster wraps up chip fully.Then above silica gel, apply the silica gel layer of layer of fluorescent powder again, the photostimulable phosphor layer that blue chip penetrates reaches the effect of preparation white light.The design feature of the utility model is: fluorescent material and chip are isolated, and it is minimum that the back influence to fluorescent material of chip heating is dropped to, and then improve the serviceability of product.

Description of drawings

Fig. 1 is the utility model structural representation.

Symbol description among the figure: LED luminescence chip 1, transparent thermal conductive silicon glue-line 2, fluorescent powder silica gel layer 3.

The specific embodiment

With illustrated embodiments the utility model is done detailed explanation below.

As shown in Figure 1; The LED lamp that the white light paster is arranged; Comprise LED luminescence chip 1, be covered with transparent thermal conductive silicon glue-line 2 in LED luminescence chip 1 surfaces coated, transparent thermal conductive silicon glue-line 2 outsides are coated with fluorescent powder silica gel layer 3; The thickness of said transparent thermal conductive silicon glue-line 2 is the 0.1-0.5 millimeter, and the thickness of said fluorescent powder silica gel layer 3 is the 0.1-1 millimeter.

What should explain at last is: obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not qualification to embodiment.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all embodiments.And conspicuous variation of being amplified out thus or change still are among the protection domain of the utility model.

Claims

1. the LED lamp that the white light paster is arranged; Comprise LED luminescence chip (1); It is characterized in that, be covered with transparent thermal conductive silicon glue-line (2) in LED luminescence chip (1) surfaces coated, transparent thermal conductive silicon glue-line (2) outside is coated with fluorescent powder silica gel layer (3); The thickness of said transparent thermal conductive silicon glue-line (2) is the 0.1-0.5 millimeter, and the thickness of said fluorescent powder silica gel layer (3) is the 0.1-1 millimeter.