CN202587730U - 散热装置 - Google Patents
散热装置 Download PDFInfo
- Publication number
- CN202587730U CN202587730U CN 201220196454 CN201220196454U CN202587730U CN 202587730 U CN202587730 U CN 202587730U CN 201220196454 CN201220196454 CN 201220196454 CN 201220196454 U CN201220196454 U CN 201220196454U CN 202587730 U CN202587730 U CN 202587730U
- Authority
- CN
- China
- Prior art keywords
- feed tube
- heat abstractor
- temperature
- joint
- uniforming plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 14
- 239000012809 cooling fluid Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 8
- 239000012530 fluid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220196454 CN202587730U (zh) | 2012-05-02 | 2012-05-02 | 散热装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220196454 CN202587730U (zh) | 2012-05-02 | 2012-05-02 | 散热装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202587730U true CN202587730U (zh) | 2012-12-05 |
Family
ID=47257075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220196454 Expired - Lifetime CN202587730U (zh) | 2012-05-02 | 2012-05-02 | 散热装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202587730U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190234691A1 (en) * | 2018-01-26 | 2019-08-01 | Taiwan Microloops Corp. | Thermal module |
-
2012
- 2012-05-02 CN CN 201220196454 patent/CN202587730U/zh not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190234691A1 (en) * | 2018-01-26 | 2019-08-01 | Taiwan Microloops Corp. | Thermal module |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: COOLER MASTER INTERNATIONAL CO., LTD. Free format text: FORMER OWNER: XUNKAI INTERNATIONAL CO., LTD. Effective date: 20131209 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131209 Address after: Chinese Taiwan New Taipei City Patentee after: Cooler Master International Co., Ltd. Address before: Chinese Taiwan New Taipei City Patentee before: Xunkai International Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20121205 |