CN202587369U - Mems microphone - Google Patents
Mems microphone Download PDFInfo
- Publication number
- CN202587369U CN202587369U CN 201220108080 CN201220108080U CN202587369U CN 202587369 U CN202587369 U CN 202587369U CN 201220108080 CN201220108080 CN 201220108080 CN 201220108080 U CN201220108080 U CN 201220108080U CN 202587369 U CN202587369 U CN 202587369U
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- China
- Prior art keywords
- annular boss
- hole
- substrate
- shed face
- mems
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Abstract
Provided is an MEMS microphone, comprising a substrate, a housing that cooperates with the substrate to form a receiving chamber, and an MEMS chip and an ASIC chip which are contained in the receiving chamber, wherein the substrate is provided with an annular boss; the annular boss is provided with a through hole; the MEMS chip is fixed upon the annular boss and covers the through hole; and the through hole forms an additional back chamber of the MEMS chip. The added annular boss of the utility model effectively increases the back chamber of the MEMS chip, thereby improving the sensitivity and frequency response of the MEMS microphone. In addition, the processing of the annular boss is much simpler that the operation of arranging grooves in the substrate, and the cost is cut down.
Description
[technical field]
The utility model relates to a kind of acoustic-electrical transducer, relates in particular in a kind of electroacoustic transducer the MEMS microphone that voice signal is converted into the signal of telecommunication.
[background technology]
Development along with wireless telecommunications; Global Mobile Phone Users is more and more, and the user not only is satisfied with conversation to the requirement of mobile phone, and wants high-quality communication effect can be provided; Especially at present the development of mobile multimedia technology; The speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.
And the microphone of using more and better performances at present is MEMS (Micro-Electro-Mechanical-System Microphone) microphone; Sensitivity and the frequency response of existing MEMS microphone in order to improve the MEMS microphone, recessing on the substrate of being everlasting, and the MEMS microphone is done very for a short time usually; Thickness is also thin; Cause the complex procedures of recessing on substrate, thereby increased production cost, reduced production efficiency.
Therefore, be necessary a kind of new MEMS microphone to be provided to above-mentioned shortcoming.
[utility model content]
The purpose of the utility model be to solve above-mentioned MEMS microphone for improve sensitivity and frequency and ring thereby on substrate recessing cause complex process, production cost is high, production efficiency is low deficiency, and a kind of MEMS microphone is provided.
A kind of MEMS microphone; Comprise substrate, cooperate the shell that forms host cavity with substrate, be contained in MEMS chip and asic chip in the host cavity; Said substrate is provided with annular boss; Said annular boss comprises the through hole of upper shed face, relative under shed face and the upper shed face of perforation and under shed face; The under shed face of said annular boss is immobilizated in substrate, and said MEMS chip is immobilizated in the upper shed face of said annular boss and covers through hole, and the through hole of said annular boss forms the additional back of the body chamber of MEMS chip.
Preferably, said annular boss is the ring quadrangle.
Preferably; Said annular boss is outwards derived from the side and is extended second annular boss; Said second annular boss comprises the second upper shed face, the relative second under shed face and connects the second upper shed face and second through hole of the second under shed face; The second under shed face of said second annular boss is immobilizated in substrate; Said asic chip is immobilizated in the second upper shed face of said second annular boss and covers said second through hole, and second through hole of said second annular boss and the through hole of annular boss connect.
Preferably, said second annular boss is the ring quadrangle.
Preferably, be provided with through slot between second through hole of said second annular boss and the through hole of annular boss, connect through said through slot.
The beneficial effect of the utility model is: the annular boss that the utility model increases has increased the back of the body chamber of MEMS chip effectively; Thereby the sensitivity and the frequency response of MEMS microphone have been improved; And before the processing of annular boss relatively on substrate recessing simpler, save cost.
[description of drawings]
Fig. 1 is the cutaway view of the utility model MEMS microphone first embodiment;
Fig. 2 is the cutaway view of the utility model MEMS microphone second embodiment;
Fig. 3 is the annular boss stereogram of MEMS microphone among Fig. 1
Fig. 4 is the annular boss and the second annular boss stereogram of MEMS microphone among Fig. 2.
[embodiment]
Below in conjunction with accompanying drawing and execution mode the utility model is described further.
See also Fig. 1 and Fig. 3; The utility model provides a kind of MEMS microphone 1, comprises substrate 10, cooperates the shell 11 that forms host cavity with substrate 10, is contained in MEMS chip 12 and the asic chip 13 in the host cavity and is immobilizated in the annular boss 14 on the substrate 10.Said annular boss 14 comprises upper shed face 141, relative under shed face 142 and the through hole 143 that connects upper shed face 141 and under shed face 142; The under shed face 142 of said annular boss 14 is immobilizated in substrate 10; Said MEMS chip 12 is immobilizated in 141 of the upper sheds of said annular boss 14 and covers through hole 143 and this through hole 143 is communicated with the back of the body cavity space of MEMS chip 12, and the through hole 143 of said annular boss 14 forms the additional back of the body chamber of MEMS chips 12.Said annular boss 14 is the ring quadrangle, and the through hole 143 in the annular boss 14 can be circular apertures, elliptical aperture, polygonal hole or the like.
Like Fig. 2 and shown in Figure 4; Said said annular boss 14 is outwards derived from the side and is extended second annular boss 15; Said second annular boss 15 comprises the second upper shed face 151, the relative second under shed face 152 and connects the second upper shed face 151 and second through hole 153 of the second under shed face 152; The second under shed face 152 of said second annular boss 15 is immobilizated in substrate 10; Said asic chip 13 is immobilizated in the second upper shed face 151 of said second annular boss 15 and covers said second through hole 153, and second through hole 153 of said second annular boss 15 connects with the through hole 143 of annular boss 14.Be provided with through slot 154 between second through hole 153 of said second annular boss 15 and the through hole 143 of annular boss 14, connect through said through slot 154.Said second annular boss 15 is the ring quadrangle, and second through hole 153 in second annular boss 15 can be circular apertures, elliptical aperture, polygonal hole or the like.
Said MEMS chip 12 is immobilizated in upper shed face 141; Asic chip 13 is immobilizated in the second upper shed face 151; Thereby make through hole 143 and second through hole, 153 formation inner spaces, and through hole 143 is communicated with the back of the body chamber of MEMS chip 12, this inner space promptly forms the additional back of the body chamber of MEMS chip 12.Can effectively increase the back of the body chamber of MEMS chip 12 through said annular boss 14 extended second annular boss 15 of deriving; And the size that can regulate MEMS chip 12 additional back of the body chambeies as required; Recessing on substrate 10 relatively, the improvement project that the utility model provides realize that easily production cost reduces; Regulate the back of the body cavity space size of MEMS chip 12 neatly, the sensitivity and the frequency response that have improved MEMS chip 12.
Above-described only is the preferred embodiments of the utility model; Should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite that does not break away from the utility model creation design; Can also make improvement, but these all belong to the protection range of the utility model.
Claims (5)
1. MEMS microphone; Comprise substrate, cooperate the shell that forms host cavity with substrate, be contained in MEMS chip and asic chip in the host cavity; It is characterized in that: said substrate is provided with annular boss; Said annular boss comprises the through hole of upper shed face, relative under shed face and the upper shed face of perforation and under shed face; The under shed face of said annular boss is immobilizated in substrate, and said MEMS chip is immobilizated in the upper shed face of said annular boss and covers through hole, and the through hole of said annular boss forms the additional back of the body chamber of MEMS chip.
2. MEMS microphone according to claim 1 is characterized in that: said annular boss is the ring quadrangle.
3. MEMS microphone according to claim 1 and 2; It is characterized in that: said annular boss is outwards derived from the side and is extended second annular boss; Said second annular boss comprises the second upper shed face, the relative second under shed face and connects the second upper shed face and second through hole of the second under shed face; The second under shed face of said second annular boss is immobilizated in substrate; Said asic chip is immobilizated in the second upper shed face of said second annular boss and covers said second through hole, and second through hole of said second annular boss and the through hole of annular boss connect.
4. MEMS microphone according to claim 3 is characterized in that: said second annular boss is the ring quadrangle.
5. MEMS microphone according to claim 3 is characterized in that: be provided with through slot between second through hole of said second annular boss and the through hole of annular boss, connect through said through slot.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220108080 CN202587369U (en) | 2012-03-21 | 2012-03-21 | Mems microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220108080 CN202587369U (en) | 2012-03-21 | 2012-03-21 | Mems microphone |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202587369U true CN202587369U (en) | 2012-12-05 |
Family
ID=47256722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220108080 Expired - Lifetime CN202587369U (en) | 2012-03-21 | 2012-03-21 | Mems microphone |
Country Status (1)
Country | Link |
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CN (1) | CN202587369U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104219610A (en) * | 2013-05-29 | 2014-12-17 | 山东共达电声股份有限公司 | MEMS microphone |
WO2017070950A1 (en) * | 2015-10-30 | 2017-05-04 | Goertek.Inc | Band-pass acoustic filter and acoustic sensing apparatus |
CN108260060A (en) * | 2016-12-29 | 2018-07-06 | 碁鼎科技秦皇岛有限公司 | MEMS microphone package structure and preparation method thereof |
-
2012
- 2012-03-21 CN CN 201220108080 patent/CN202587369U/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104219610A (en) * | 2013-05-29 | 2014-12-17 | 山东共达电声股份有限公司 | MEMS microphone |
WO2017070950A1 (en) * | 2015-10-30 | 2017-05-04 | Goertek.Inc | Band-pass acoustic filter and acoustic sensing apparatus |
US10412491B2 (en) | 2015-10-30 | 2019-09-10 | Goertek, Inc. | Band-pass acoustic filter and acoustic sensing apparatus |
CN108260060A (en) * | 2016-12-29 | 2018-07-06 | 碁鼎科技秦皇岛有限公司 | MEMS microphone package structure and preparation method thereof |
CN108260060B (en) * | 2016-12-29 | 2020-09-15 | 碁鼎科技秦皇岛有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20121205 |