CN202585406U - Novel rectifier bridge - Google Patents
Novel rectifier bridge Download PDFInfo
- Publication number
- CN202585406U CN202585406U CN2012202596701U CN201220259670U CN202585406U CN 202585406 U CN202585406 U CN 202585406U CN 2012202596701 U CN2012202596701 U CN 2012202596701U CN 201220259670 U CN201220259670 U CN 201220259670U CN 202585406 U CN202585406 U CN 202585406U
- Authority
- CN
- China
- Prior art keywords
- wire
- chip
- face
- positive
- jumper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Abstract
The utility model relates to an improvement of rectifier bridge structures and provides a novel rectifier bridge which enables loading procedure operation to be simple and convenient and improves integral radiating effect. The novel rectifier bridge comprises four chips, a positive wire, a negative wire, a first alternating-current wire, a second alternating-current wire, a package and three jumper wires. The negative pole surfaces of a first chip and a second chip are respectively fixedly connected onto the surface of the positive wire, the negative pole surface of a third chip is fixedly connected onto the first alternating-current wire, and the negative pole surface of a fourth chip is fixedly connected onto the second alternating-current wire. A first jumper wire is connected with the positive pole surface of the first chip and the positive wire, a second jumper wire is connected with the positive pole surface of the third chip, the positive pole surface of the fourth chip and the negative wire, and a third jumper wire is connected with the positive pole surface of the second chip and the second alternating-current wire. According to the novel rectifier bridge, wire structures are improved and the number of the jumper wires is adjusted so that the four chips in the rectifier bridge are led to be identical in orientation. The novel rectifier bridge can greatly reduce labor intensity of operators.
Description
Technical field
The utility model relates to the improvement to the rectifier bridge structure.
Background technology
Present rectifier bridge structure is that four chips weld through two wire jumpers (like Fig. 8, shown in 9, wire jumper A38, wire jumper B39) are continuous, and under this kind version, two chips faces up the welding that faces down of two chips in addition in four chips.The structure that this kind is traditional exists the two sides all to produce the situation of heat, when using owing to rectifier bridge is whole, can only have the environment of single face heat radiation, and therefore, there is the bad hidden danger of dispelling the heat in the rectifier bridge of this kind structure.Simultaneously, when completed knocked down products, need carry out the positive and negative of Artificial Cognition's chip, make the filling operation comparatively complicated, labor intensive is more; Operating personnel are not to chip (being of a size of 0.8-10mm waits), and when especially the less chip of size carried out identification, labour intensity was very big.
The utility model content
The utility model provides a kind of filling process operations that makes easy to above problem, promotes the novel rectifying bridge of integral heat sink effect.
The technical scheme of the utility model is: comprise chip one ~ four, positive wire, negative wire, interchange lead-in wire one, exchange lead-in wire two and packaging body, also comprise wire jumper one ~ three;
The negative pole face of said chip one and chip two is fixedly connected on the said positive wire surface, and the negative pole face of said chip three is fixedly connected on the said interchange lead-in wire one, and the negative pole face of said chip four is fixedly connected on the said interchange lead-in wire two;
Said wire jumper one connects the positive pole-face and the positive wire one of said chip one;
Said wire jumper two connects the positive pole-face and the negative wire of said chip three, chip four;
Said wire jumper three connects said chip two positive pole-faces and exchanges lead-in wire two.
Said interchange lead-in wire two is provided with convexity and connects and draw face one; It is consistent that said convexity connects the positive pole-face height that draws chip two on face one apparent height and the said positive wire, and the positive pole-face and the said convexity that make said wire jumper three connect said chip two in level connect draws face one.
Said negative wire is provided with convexity and connects and draw face two; It is consistent that said convexity connects the positive pole-face height that draws chip three on face two apparent heights and the said interchange lead-in wire one, exchanges chip four on the lead-in wire two, and the positive pole-face and the convexity that make said wire jumper two connect said chip three, chip four in level connect draws face two.
The utility model is through to the improvement of pin configuration and the adjustment of wire jumper quantity, makes interior four chips of rectifier bridge towards unanimity.For whole operation, reduced the operation of chip positive and negative identification.Can alleviate operator's labour intensity greatly.Although increased a wire jumper, the total consumption of jumper material does not increase, and is particularly suitable for continuous productive process from now on, the development trend of automated job.
Description of drawings
Fig. 1 is the structural representation of the utility model,
Fig. 2 is an A-A cutaway view among Fig. 1,
Fig. 3 is a B-B cutaway view among Fig. 1,
Fig. 4 is the structural representation of four lead-in wires of the utility model,
Fig. 5 is the schematic diagram of the utility model,
Fig. 6 is the structural representation after the utility model assembling,
Fig. 7 is the left view of Fig. 6,
Fig. 8 is the sketch map of the utility model background technology,
Fig. 9 is the left view of Fig. 8;
11 is positive wires among the figure, the 12nd, exchange lead-in wire one, 13rd, and exchange lead-in wire two, 131st, convexity connects draws face one; The 14th, negative wire, the 141st, convexity connects draws face two, 21st, chip one, 22nd, chip two; The 23rd, chip three, 24th, chip four, 31st, wire jumper one, 32nd, wire jumper two; The 33rd, wire jumper three, 38th, wire jumper A, the 39th, wire jumper B, the 4th, packaging body.
Embodiment
The utility model comprises chip one ~ four (21,22,23,24), positive wire 11, negative wire 14, exchanges lead-in wire 1, exchanges lead-in wire 2 13 and packaging body 4 shown in Fig. 1-7, also comprises wire jumper one ~ three (31,32,33);
The negative pole face of said chip 1 and chip 2 22 is fixedly connected on said positive wire 11 surfaces; The negative pole face of said chip 3 23 is fixedly connected on said interchange and goes between on one 12, and the negative pole face of said chip 4 24 is fixedly connected on said interchange and goes between on 2 13;
Said wire jumper 1 connects the positive pole-face and the positive wire 1 of said chip 1;
Said wire jumper 2 32 connects the positive pole-face and the negative wire 14 of said chip 3 23, chip 4 24;
Said wire jumper 3 33 connects said chip 2 22 positive pole-faces and exchanges lead-in wire 2 13.
Said interchange goes between and 2 13 is provided with convexity and connects and draw face 1; It is consistent that said convexity connects the positive pole-face height that draws chip 2 22 on face one 131 apparent heights and the said positive wire 11, and the positive pole-face and the said convexity that make said wire jumper 3 33 connect said chip 2 22 in level connect draws face 1.
Said negative wire 14 is provided with convexity and connects and draw face 2 141; Said convexity connects draws that face 2 141 apparent heights and said interchange go between chip 3 23 on one 12, the positive pole-face height that exchanges chip 4 24 on the lead-in wire 2 13 is consistent, and the positive pole-face and the convexity that make said wire jumper 2 32 connect said chip 3 23, chip 4 24 in level connect draws face 2 141.
Claims (3)
1. the novel rectifying bridge comprises chip one ~ four, positive wire, negative wire, interchange lead-in wire one, exchanges lead-in wire two and packaging body, it is characterized in that, also comprises wire jumper one ~ three;
The negative pole face of said chip one and chip two is fixedly connected on the said positive wire surface, and the negative pole face of said chip three is fixedly connected on the said interchange lead-in wire one, and the negative pole face of said chip four is fixedly connected on the said interchange lead-in wire two;
Said wire jumper one connects the positive pole-face and the positive wire one of said chip one;
Said wire jumper two connects the positive pole-face and the negative wire of said chip three, chip four;
Said wire jumper three connects said chip two positive pole-faces and exchanges lead-in wire two.
2. novel rectifying bridge according to claim 1; It is characterized in that; Said interchange lead-in wire two is provided with convexity and connects and draw face one; It is consistent that said convexity connects the positive pole-face height that draws chip two on face one apparent height and the said positive wire, and the positive pole-face and the said convexity that make said wire jumper three connect said chip two in level connect draws face one.
3. novel rectifying bridge according to claim 1; It is characterized in that; Said negative wire is provided with convexity and connects and draw face two; It is consistent that said convexity connects the positive pole-face height that draws chip three on face two apparent heights and the said interchange lead-in wire one, exchanges chip four on the lead-in wire two, and the positive pole-face and the convexity that make said wire jumper two connect said chip three, chip four in level connect draws face two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202596701U CN202585406U (en) | 2012-06-04 | 2012-06-04 | Novel rectifier bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202596701U CN202585406U (en) | 2012-06-04 | 2012-06-04 | Novel rectifier bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202585406U true CN202585406U (en) | 2012-12-05 |
Family
ID=47254788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202596701U Expired - Lifetime CN202585406U (en) | 2012-06-04 | 2012-06-04 | Novel rectifier bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202585406U (en) |
-
2012
- 2012-06-04 CN CN2012202596701U patent/CN202585406U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121205 |