CN202209564U - LED device capable of improving yield - Google Patents
LED device capable of improving yield Download PDFInfo
- Publication number
- CN202209564U CN202209564U CN2011203420196U CN201120342019U CN202209564U CN 202209564 U CN202209564 U CN 202209564U CN 2011203420196 U CN2011203420196 U CN 2011203420196U CN 201120342019 U CN201120342019 U CN 201120342019U CN 202209564 U CN202209564 U CN 202209564U
- Authority
- CN
- China
- Prior art keywords
- bonding wire
- ppa
- film district
- negative pole
- machine body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses an LED device capable of improving yield; the LED device comprises a machine body, wherein a positive pole pin is arranged at the left side of the machine body, and a negative pole pin is arranged at the right side of the machine body. In addition, a PPA membrane area is arranged at the lower surface of the machine body, two positive pole bonding wire sheets are symmetrically arranged at the left side of the PPA membrane area, two negative pole bonding wire sheets are symmetrically arranged at the right side of the PPA membrane area, and a circular copper seat is arranged in the middle of the machine body and is fixedly provided with four chips which are arranged in an array manner. In the utility model, welding and shape of a gold line is modulated, so that the yield after the fluorescent powder is spotted is improved, and the lamp can be produced normally; therefore, the LED device has positive meaning in promoting production, and the use of LEDs with the power on application products is better facilitated.
Description
Technical field
The utility model relates to the LED matrix technical field, concrete relates to a kind of LED matrix that improves yield.
Background technology
In more and more advocating energy-conservation current social, the LED lamp has caused concern more and more widely with its many advantage and progressively has been applied in the middle of numerous lighting fields.LED is a kind of new type of solid state light source, has advantages such as simple in structure, in light weight, that volume is little, consume energy less, response is fast, shock resistance is good, easy to use, belongs to energy-conservation environmental protection lighting device.Under same intensity of illumination, the power consumption of LED light fixture and life-span thereof all obviously are superior to incandescent lamp, are a kind of light sources of tool development prospect of 21 century.But also there are many deficiencies at present in the LED lamp, and for example, the multicore white light of partial L ED lamp is after making and having put fluorescent material, and finding has more gold thread undesired, makes that the shipment yield is lower, and causing can't volume production, has influenced it and has promoted the use of.
The utility model content
The purpose of the utility model is to solve the problem that exists in the prior art, and a kind of LED matrix that improves yield is provided.
The utility model is achieved through following technical scheme:
A kind of LED matrix that improves yield comprises body, and the body left side is provided with anodal pin, and the body right side is provided with the negative pole pin simultaneously.
In addition, the body lower surface is provided with PPA film district.Wherein, the left side in PPA film district is symmetrically arranged with 2 anodal bonding wire sheets, and the right side in PPA film district is symmetrically arranged with 2 negative pole bonding wire sheets.
The body middle part is provided with circular copper seat, is fixed with on the copper seat to be 4 chip blocks that matrix form is arranged.
Connect successively through gold thread between the negative pole bonding wire sheet on an anodal bonding wire sheet in left side, PPA film district, two chip blocks of copper seat upside and right side, PPA film district; Simultaneously, PPA film district left side another negative pole bonding wire sheet on two chip blocks and right side, PPA film district of another anodal bonding wire sheet, copper seat downside between connect successively through gold thread.
The body upside is provided with the bulb lid, and bulb lid lower end is provided with bulb lid pedestal simultaneously.
The utility model usefulness is:
The device of the utility model is adjusted through the welding to gold thread; With the gold thread Adjusting Shape, the yield behind a little good fluorescent material is improved, make normally volume production of light fixture; Have positive meaning to promoting to produce, also help the use of this power LED on application product more.
Description of drawings
To combine embodiment and accompanying drawing that the utility model is done further to describe in detail below:
Fig. 1 is the overall structure sketch map of the utility model;
Fig. 2 is the side-looking structural representation of the utility model;
Fig. 3 is the plan structure sketch map of the utility model.
The specific embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Like Fig. 1～a kind of LED matrix that improves yield shown in Figure 3, comprise body 1, body 1 left side is provided with anodal pin 4, and body 1 right side is provided with negative pole pin 3 simultaneously.
In addition, body 1 lower surface is provided with PPA film district 2.
Wherein, the left side in PPA film district 2 is symmetrically arranged with 2 anodal bonding wire sheets 5, and the right side in PPA film district 2 is symmetrically arranged with 2 negative pole bonding wire sheets 7.
Connect successively through gold thread between two chip blocks 6 of the anodal bonding wire sheet of of 2 left sides, PPA film district 5, copper seat 8 upsides and the negative pole bonding wire sheet 7 on 2 right sides, PPA film district.
Simultaneously, 2 left sides, PPA film district another negative pole bonding wire sheets 7 on two chip blocks 6 and 2 right sides, PPA film district of another anodal bonding wire sheet 5, copper seat 8 downsides between connect successively through gold thread.
Claims (3)
1. a LED matrix that improves yield comprises body (1), it is characterized in that body (1) left side is provided with anodal pin (4), and body (1) right side is provided with negative pole pin (3) simultaneously; In addition, body (1) lower surface is provided with PPA film district (2); Wherein, the left side in PPA film district (2) is symmetrically arranged with 2 anodal bonding wire sheets (5), and the right side in PPA film district (2) is symmetrically arranged with 2 negative pole bonding wire sheets (7); Body (1) middle part is provided with circular copper seat (8), is fixed with on the copper seat (8) to be 4 chip blocks (6) that matrix form is arranged.
2. the LED matrix of raising yield according to claim 1 is characterized in that being positioned between the negative pole bonding wire sheet (7) on two chip blocks (6) and right side, PPA film district (2) of an anodal bonding wire sheet (5), copper seat (8) upside in left side, described PPA film district (2) and connects successively through gold thread; Simultaneously, be positioned at PPA film district (2) left side another negative pole bonding wire sheet (7) on two chip blocks (6) and right side, PPA film district (2) of another anodal bonding wire sheet (5), copper seat (8) downside between connect successively through gold thread.
3. the LED matrix of raising yield according to claim 1 is characterized in that described body (1) upside is provided with bulb lid (12), and bulb lid (12) lower end is provided with bulb lid pedestal (11) simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203420196U CN202209564U (en) | 2011-09-13 | 2011-09-13 | LED device capable of improving yield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203420196U CN202209564U (en) | 2011-09-13 | 2011-09-13 | LED device capable of improving yield |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202209564U true CN202209564U (en) | 2012-05-02 |
Family
ID=45989111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203420196U Expired - Fee Related CN202209564U (en) | 2011-09-13 | 2011-09-13 | LED device capable of improving yield |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202209564U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106939969A (en) * | 2017-05-04 | 2017-07-11 | 京东方科技集团股份有限公司 | A kind of light source, backlight and display device |
-
2011
- 2011-09-13 CN CN2011203420196U patent/CN202209564U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106939969A (en) * | 2017-05-04 | 2017-07-11 | 京东方科技集团股份有限公司 | A kind of light source, backlight and display device |
| CN106939969B (en) * | 2017-05-04 | 2019-07-23 | 京东方科技集团股份有限公司 | A kind of light source, backlight and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120502 Termination date: 20200913 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |