CN202549925U - Light-emitting diode package and used PCB (Printed Circuit Board) type heat radiating base board - Google Patents

Abstract

The utility model relates to a light-emitting diode and a used PCB (Printed Circuit Board) type heat radiating base board. The PCB type heat radiating base board is formed by a printed circuit board manufacturing way and comprises an insulating layer, a first line layer and a second line layer, wherein the first line layer is arranged on the upper surface of the insulating layer and is electrically connected with LED crystal grains by using a flip chip or conductor way; and the second line layer is arranged on the lower surface of the insulating layer. At least one heat conducting hole is arranged in the insulating layer and penetrates between the upper and lower surfaces, and a copper plating layer is arranged on the inner wall of the heat conducting hole and is respectively connected with the first line layer and the second line layer so as to effectively increase the heat radiating coefficient; and a heat conducting material can be filled in the heat conducting hole to increase the heat radiating coefficient; the LED crystal grains can be selected according to the needs of the manufacturing process so as to be electrically connected with on the PCB type heat radiating base board in the flip chip or conductor way to complete the encapsulation of the LED; and the external part of the second line layer connects and fixedly arranges the LED package on the heat radiating bearing seat of the LED luminous device to become a light source of the LED luminous device via a bonding layer.

Description

LED package and employed PCB formula heat-radiating substrate

Technical field

Relevant a kind of LED package (LED package) of the utility model and employed PCB formula heat-radiating substrate; Especially refer to that a kind of printed circuit board (PCB) (PCB) production method that utilizes is to form a PCB formula heat-radiating substrate; Supply a LED crystal grain on this PCB formula heat-radiating substrate, to encapsulate, to reach good heat radiation function to accomplish a LED with flip-chip or lead mode electrical ties.

Background technology

Generally speaking; One LED crystal grain can need to select with flip chip (Flip Chip) or lead mode (Wire bond) with manufacturing process but not limit; Be provided with on the heat-radiating substrate of line layer to accomplish LED encapsulation (LED package) one with electrical ties; This LED encapsulation links the heat radiation bearing (or claiming radiator or lamp socket) that is installed in a light-emitting device again goes up to become the light source of this light-emitting device, so promptly accomplishes a LED light-emitting device, and wherein this line layer is in order to provide the positive and negative power supply of the luminous institute of this LED crystal grain palpus; And when utilizing a plurality of LED crystal grain to make light source, this line layer promptly must be through suitable design; Wherein this heat-radiating substrate provides enough radiating effects in order to the heat energy that when luminous, is produced to this led light source (LED crystal grain); Because if can not reach the good heat radiating effect, then can influence the service efficiency and the life-span of this LED encapsulation or LED light-emitting device relatively.Yet; Because LED crystal grain electrical ties is on the line layer of this heat-radiating substrate; Rely on the tin ball to come electrical ties as existing flip chip (Flip Chip) is promptly normal; The heat energy that when luminous, produced of this LED crystal grain also is through this electrical ties structure simultaneously, like the tin ball of existing flip chip (Flip Chip), to conduct to this heat-radiating substrate to carry out thermolysis; But because the insulating requirements that the design of the line layer of this heat-radiating substrate must reach between the positive and negative power supply is short-circuited avoiding; But but the heat radiation requirement that the thermolysis of this heat-radiating substrate has area of dissipation to be the bigger the better causes this heat-radiating substrate on the structural design of insulation function and heat sinking function, to produce suitable degree of difficulty.Therefore in LED encapsulation or LED encapsulation in the association areas such as employed heat-radiating substrate or LED light-emitting device, the problem that always all exists for a long time is exactly how under the situation that line layer can not be short-circuited and can reach the good heat radiating effect.

Existing LED encapsulation; With shown in Figure 1 one traditional chip upside-down mounting type LED encapsulation 100 is the example explanation; Wherein a LED crystal grain 101 utilizes two different electrode contacts 102 last with two the tie point 103a, the 103bs that separate and be electrically insulated of electrical ties on a line layer 103 like the tin ball, and this line layer 103 is preset on the aluminium base 104 and has at least two correspondence positions that separate and supplies and two different electrode contacts 102 electrical ties; Be typically provided with a binder couse 105 between the surface of this line layer 103 and this aluminium base 104 and be difficult for peeling off with firmly linking so that this line layer 103 can be installed on the surface of this aluminium base 104; This chip upside-down mounting type LED encapsulation 100 relends various mode of connection like welding but do not limit with on the heat radiation bearing (or claiming radiator or lamp socket) that is installed in a LED light-emitting device, with the light source (figure does not show) that becomes this LED light-emitting device; Yet; The traditional chip upside-down mounting type LED of above-mentioned this encapsulates in 100; The thermal conducting function of this binder couse 105 and this aluminium base 104 is not good, can't the heat energy that this LED crystal grain 101 is produced when luminous be conducted to effectively on the heat radiation bearing of this aluminium base 104 and/or LED light-emitting device and outwards heat radiation efficiently.

Be that example is explained but do not limited with another chip upside-down mounting type LED shown in Figure 2 encapsulation 200 again; Wherein a LED crystal grain 201 utilize two different electrode contacts 202 as the tin ball with electrical ties on a line layer 203 two separately and the tie point 203a, the 203b that are electrically insulated last, the surface that this line layer 203 is preset in the insulation laminate 204 that constitutes with the insulation material is gone up and is had at least two correspondence positions that separate and supplies and two different electrode contacts 202 electrical ties; This line layer 203 and through be located at least two louvres (thermal via) 205 of insulation in the laminate 204 when luminous to be linked to another lip-deep another line layer 206 that is located at insulation laminate 204, so that the heat energy that this LED crystal grain 201 is produced can outwards dispel the heat to conduct to this line layer 206 through the louvre (thermal via) 205 in electrode contact (tin ball) 202, line layer 203 and the insulation laminate 204; This chip upside-down mounting type LED encapsulation 200 relends various mode of connection like welding but do not limit with on the heat radiation bearing (or claiming radiator or lamp socket) that is installed in a LED light-emitting device, with the light source (figure does not show) that becomes this LED light-emitting device; Yet; This insulation laminate 204 and to be located at the thermal conducting function of the louvre (thermal via) 205 in this insulation laminate 204 not good in the above-mentioned traditional chip upside-down mounting type LED encapsulation 200 can't conduct to the heat energy that this LED crystal grain 201 is produced effectively on the heat radiation bearing of this insulation laminate 204, this line layer 206 and/or LED light-emitting device and also outwards dispel the heat efficiently when luminous; More and; This line layer 203, this louvre (thermal via) 205 and this line layer 206 must meet simultaneously insulating properties between the positive and negative power supply and require with the heat radiation requirement of avoiding being short-circuited and area of dissipation is the bigger the better in design; Cause this insulation laminate 204; Be regarded as comprising this line layer 203, this louvre (thermal via) 205 and this line layer 206 at this, go up the suitable degree of difficulty of generation in the structural design of insulation function and heat sinking function such as the layout of line layer (layout).

There have been multiple prior art at present in relevant LED encapsulation and employed heat-radiating substrate thereof, or chip upside-down mounting type LED element (flip-chip light emitting diode) or chip upside-down mounting type LED encapsulation or be applicable in the technical fields such as catoptric arrangement of chip upside-down mounting type LED, like TW573330, TW M350824, and US6,914,268, US8; 049,230, US7,985,979, US7,939,832, US7,713; 353, US7,642,121, US7,462,861, US7,393,411, US7; 335,519, US7,294,866, US7,087,526, US5,557; 115, US6,514,782, US6,497,944, US6,791,119; And US2002/0163302, US2004/0113156 etc.And above-mentioned prior art mostly is structure or its encapsulation (package) structure to a LED element; In problem that the aspect produced and disappearances such as luminous efficiency, heat sinking function, useful life, manufacturing cost, assembling yield, manufacturing process simplification, light decays, and proposition can solve the different techniques means of those problems and disappearance.Yet, just applicant's interpretation, the prior art that exists at present under the situation that line layer can not be short-circuited and can reach the problem of good heat radiating effect, does not propose effective solution to how.

By on can know that therefore the requirement when above-mentioned prior art constructions still is difficult to meet actual use in the association areas such as employed heat-radiating substrate or LED light-emitting device, still exists further improved desirability in LED encapsulation or LED encapsulation.The utility model is in limited field, this technical development space, proposes a kind of LED encapsulation and employed PCB formula heat-radiating substrate, so that this LED encapsulation and this light-emitting device can be reached good heat radiation function, and can avoid causing the puzzlement of short circuit.

Summary of the invention

The utility model main purpose is to provide a kind of LED encapsulation and employed PCB formula heat-radiating substrate, and wherein this PCB formula heat-radiating substrate utilizes the generation type of printed circuit board (PCB) (PCB, Printed Circuit Board) to process, and it comprises: an insulating barrier; One first line layer is located on the upper surface of this insulating barrier, supplies and light-emitting diode (LED) crystal grain flip-chip capable of using (Flip Chip) or lead (Wire bond) mode electrical ties; And one second line layer is located on the lower surface of this insulating barrier; At least one thermal hole wherein is set in this insulating barrier supplies to be located between its upper and lower surface, and the inwall of this at least one thermal hole is provided with a copper electroplating layer to be connected to this first line layer and this second line layer respectively, to improve coefficient of heat transfer effectively; Thus; When at least one LED crystal grain with flip chip or lead mode electrical ties on this heat-radiating substrate when accomplishing LED encapsulation; The heat sinking function that relies on this PCB formula heat-radiating substrate makes this LED encapsulation and the light-emitting device formed can be reached good heat radiation function.

The utility model purpose again is to provide a kind of LED encapsulation and employed PCB formula heat-radiating substrate; Wherein this PCB formula heat-radiating substrate can be in the copper electroplating layer of this at least one thermal hole; Further insert Heat Conduction Material such as tin cream, silver paste, thermal grease etc., in order to more to improve the coefficient of heat transfer of this PCB formula heat-radiating substrate.

Another purpose of the utility model is to provide a kind of LED encapsulation and employed PCB formula heat-radiating substrate; Wherein the upper end of this at least one thermal hole and this first line layer link; And the position of setting up of this at least one thermal hole is to be positioned at or to approach the centralized heat energy place on this first line layer; Like the electrical ties position of chip upside-down mounting type LED crystal grain on this first line layer; Or wire LED crystal grain is installed in the position on this PCB formula heat-radiating substrate, with the radiating effect of this LED encapsulation of promoting this PCB formula heat-radiating substrate and being accomplished.

Another purpose of the utility model is to provide a kind of LED encapsulation and employed PCB formula heat-radiating substrate; Wherein one following layer can be set like heat radiation paster or thermal grease on respect to the outer surface of this second line layer at this PCB formula heat-radiating substrate; Supply this LED to encapsulate to such an extent that rely on this following layer to be installed on the heat radiation bearing (radiator) of a LED light-emitting device with binding; This LED encapsulates or the radiating effect of LED light-emitting device to promote, and simplifies the assembling operation of this LED encapsulation or LED light-emitting device.

For reaching above-mentioned purpose; The utility model provides a kind of PCB formula heat-radiating substrate; Be applicable to light-emittingdiode (LED) encapsulation; Supply at least one LED crystal grain electrical ties on this PCB formula heat-radiating substrate, to encapsulate to form a LED, this PCB formula heat-radiating substrate comprises an insulating barrier, one first line layer and one second line layer, wherein:

This insulating barrier; Process with insulating material; And in this insulating barrier, be provided with at least one thermal hole; This at least one thermal hole is located between the upper surface and lower surface of this insulating barrier, and the inwall of this at least one thermal hole is provided with a copper electroplating layer, and it upwards is connected to this first line layer respectively and is connected to this second line layer downwards;

This first line layer; Be located on the upper surface of this insulating barrier; It comprises at least two separately and the nodes that are electrically connected of insulation supply with a LED crystal grain on the weld pad electrical ties accordingly of set different electrodes, with so that this LED crystal grain can also combine simultaneously to be arranged on this PCB formula heat-radiating substrate with the first line layer electrical ties;

This second line layer is located on the lower surface of this insulating barrier;

Wherein, luminous and when producing heat energy when this LED crystal grain, this heat energy through first line layer, this at least one thermal hole and in set copper electroplating layer, and conduct to this second line layer with outside heat radiation.

Described PCB formula heat-radiating substrate, wherein, this insulating barrier is ceramic substrate, glass substrate, quartz base plate or composite panel.

Described PCB formula heat-radiating substrate, wherein, this insulating barrier constitutes with a composite panel, and utilizes the laser drill mode to mold the perforation that upward and downward runs through, again on the inwall of this perforation electroforming one copper electroplating layer to constitute this thermal hole.

Described PCB formula heat-radiating substrate, wherein, the interior Heat Conduction Material that further is filled with of the copper electroplating layer of this at least one thermal hole.

Described PCB formula heat-radiating substrate, wherein, this Heat Conduction Material is tin cream, silver paste or thermal grease.

Described PCB formula heat-radiating substrate, wherein, the mode of this at least one LED crystal grain electrical ties on this heat-radiating substrate is flip chip or lead mode.

Described PCB formula heat-radiating substrate, wherein, this at least one thermal hole is positioned at or approaches the centralized heat energy place on this first line layer.

Described PCB formula heat-radiating substrate; Wherein, On at least two nodes that are electrically connected that separate and insulate of first line layer of this PCB formula heat-radiating substrate, this at least one thermal hole correspondence is linked to the node that is electrically connected near this first line layer to this LED crystal grain with the flip chip electrical ties.

Described PCB formula heat-radiating substrate; Wherein, This LED crystal grain with lead mode electrical ties at least two of first line layer of this PCB formula heat-radiating substrate separately and on the nodes that are electrically connected of insulation and the bottom of this LED crystal grain be installed on this first line layer of this PCB formula heat-radiating substrate, this at least one thermal hole correspondence is linked near the coupling position between the bottom of this first line layer and LED crystal grain.

Described PCB formula heat-radiating substrate, wherein, this PCB formula heat-radiating substrate further is provided with a following layer in the outside of this second line layer.

Described PCB formula heat-radiating substrate, wherein, this following layer forms with heat radiation paster or thermal grease.

The utility model also provides a kind of light-emitting diode (LED) encapsulation, comprises:

At least one LED crystal grain, each crystal grain is provided with the weld pad of at least two different electrodes; And

One heat-radiating substrate, it utilizes above-mentioned PCB formula heat-radiating substrate to constitute, and supplies this at least one LED crystal grain electrical ties on this PCB formula heat-radiating substrate, to encapsulate to form a LED;

Wherein luminous and when producing heat energy when this at least one LED crystal grain, this heat energy can rely on conduction and the outwards heat radiation of this heat-radiating substrate.

Utility model with structure, manufacturing process and the technical characterictic of the utility model, cooperates attached drawings to detail as the back for making the utility model clear and definite more full and accurate:

Description of drawings

Fig. 1 is the structural profile sketch map of an existing chip upside-down mounting type LED encapsulation;

Fig. 2 is the structural profile sketch map of another existing chip upside-down mounting type LED encapsulation;

Fig. 3 is the structural profile sketch map of PCB formula heat-radiating substrate one embodiment of the utility model;

Fig. 4 is applied to the structural profile sketch map of chip upside-down mounting type (Flip Chip) LED encapsulation for PCB formula heat-radiating substrate shown in Figure 3;

Fig. 5 is the structural profile sketch map of another embodiment of PCB formula heat-radiating substrate of the utility model;

Fig. 6 is applied to the structural profile sketch map of chip upside-down mounting type (Flip Chip) LED encapsulation for heat-radiating substrate shown in Figure 5;

Fig. 7 is the structural profile sketch map of another embodiment of PCB formula heat-radiating substrate of the utility model;

Fig. 8 is applied to the structural profile sketch map of wire (Wire bond) LED encapsulation for PCB formula heat-radiating substrate shown in Figure 7;

Fig. 9 is the heat-radiating substrate structural profile sketch map of another embodiment again of the utility model;

Figure 10 is applied to the structural profile sketch map of wire (Wire bond) LED encapsulation for heat-radiating substrate shown in Figure 9;

Figure 11 A-11E is respectively the PCB formula heat-radiating substrate manufacturing approach step sketch map of the utility model.

Description of reference numerals: 10-heat-radiating substrate; The two-sided copper clad laminate of 10c-; The 11-insulating barrier; The 11c-insulating barrier; 12-first line layer; 12a, the 12b-node that is electrically connected; 12c-first copper foil layer; 13-second line layer; 13c-second copper foil layer; 13d-copper window; The 14-thermal hole; The 14c-blind hole; The 15-copper electroplating layer; The 15c-copper electroplating layer; The 16-Heat Conduction Material; 30-LED crystal grain; The 31-electrode contact; The 32-lead; The 33-bottom; The 34-adhesion layer; 40,50,60,70-LED encapsulation; The 80-following layer; The 90-bearing of dispelling the heat.

Embodiment

Shown in figure 3-10, it is respectively PCB formula heat-radiating substrate of the utility model and the structural profile sketch map that formed LED encapsulates a plurality of embodiment of (LED package).The PCB formula heat-radiating substrate 10 of the utility model is as shown in Figure 3; Be to utilize a printed circuit board (PCB) (PCB; Printed Circuit Board) generation type is processed shown in Figure 11 A-11E (Rong Houshu), and it comprises an insulating barrier 11, one first line layer 12 and one second line layer 13; Wherein this first line layer 12 is provided in a side of on the upper surface of this insulating barrier 11; Supply with light-emitting diode (LED) crystal grain 30 can with flip-chip (Flip Chip) mode as Fig. 4, shown in 6 or lead (Wire bond) mode like Fig. 8, shown in 10, electrical ties on this PCB formula heat-radiating substrate 10 to form LED encapsulation like Fig. 4, the chip upside-down mounting type LED encapsulation 40,50 shown in 6 or like Fig. 8, the wire LED encapsulation 60,70 shown in 10; Wherein this second line layer 13 is provided in a side of on the lower surface of this insulating barrier 11; At least one thermal hole 14 wherein is set in this insulating barrier 11; This at least one thermal hole 14 is to be located between the upper and lower surface of this insulating barrier 11; And the inwall of this at least one thermal hole 14 is provided with a copper electroplating layer 15 upwards to be connected to this first line layer 12 respectively and to be connected to this second line layer 13 downwards; So that this LED that is accomplished encapsulation (LED package) 40,50,60,70 and the LED light-emitting device (figure does not show) formed can be reached good heat radiation function, and avoid line layer to cause the puzzlement of short circuit.

Shown in figure 3-4, it is respectively the structural profile sketch map after encapsulating before the encapsulation of PCB formula heat-radiating substrate one embodiment of the utility model and with flip-chip (Flip Chip) mode.The PCB formula heat-radiating substrate 10 of the utility model is shown in Fig. 3-4, and it utilizes the generation type of printed circuit board (PCB) (PCB, Printed Circuit Board) to process, and mainly comprises an insulating barrier 11, one first line layer 12 and one second line layer 13.

Wherein this insulating barrier 11 is to process with insulating material; Can comprise ceramic substrate, glass substrate, quartz base plate, composite panel etc. but do not limit; Wherein to be usually used in as printed circuit board (PCB) (PCB; The composite panel of substrate Printed Circuit Board) is best; As be usually used in substrate (containing resin pickup, glass epoxy substrate) so that this PCB formula heat-radiating substrate 10 can utilize the generation type of printed circuit board (PCB) (PCB, Printed Circuit Board) to process (its method for making repeats after holding) easily like glass fiber as copper clad laminate (Copper Clad Laminate).

Wherein this first line layer 12 is provided in a side of on the upper surface of this insulating barrier 11; Its weld pad that comprises at least two set different electrodes separately and on be electrically connected node 12a and 12b energy supply and the LED crystal grain 30 of insulation is electrical ties accordingly, with so that this LED crystal grain 30 can also combine simultaneously to be arranged on this PCB formula heat-radiating substrate 10 with first line layer, 12 electrical ties; The configuration of this first line layer 12 (circuit layout) does not limit; Can make different layout designs with the needs of LED encapsulation or LED light-emitting device; For at least one LED crystal grain 30 electrical ties, in Fig. 3-4, be example explanation but non-only in order to limit the utility model with a LED crystal grain 30.Wherein this second line layer 13 is provided in a side of on the lower surface of this insulating barrier 11.

The major technique of the PCB formula heat-radiating substrate 10 of the utility model is characterised in that: at least one thermal hole 14 wherein is set in this insulating barrier 11; This at least one thermal hole 14 is to be located between the upper and lower surface of this insulating barrier 11; And the inwall of this at least one thermal hole 14 is provided with a copper electroplating layer 15; This copper electroplating layer 15 is upwards to be connected to this first line layer 12 respectively and to be connected to this second line layer 13 downwards; Make when this LED crystal grain 30 luminous and when producing heat energy; The heat conduction that relies on this PCB formula heat-radiating substrate 10 the to be had insulation function of holding concurrently; Just should heat can rely on set copper electroplating layer 15 in this at least one thermal hole 14 and conduct to this second line layer 13 efficiently and outwards heat radiation again, make this PCB formula heat-radiating substrate 10 can have higher coefficient of heat transfer, and can produce good heat radiation function with respect to this LED crystal grain 30 by first line layer 12.

In addition, shown in figure 3-10, the PCB formula heat-radiating substrate 10 of the utility model further can be provided with a following layer 80 in the outside of this second line layer 13 again except comprising above-mentioned insulating barrier 11, first line layer 12 and second line layer 13; This following layer 80 forms with heat radiation paster or thermal grease but does not limit; Mainly in order to encapsulating 40-70 by means of this LED that PCB formula heat-radiating substrate 10 is accomplished like Fig. 4,6,8, shown in 10; Can link again easily on the heat radiation bearing (or being called radiator or lamp socket) 90 that is installed in a LED light-emitting device, use so that this LED encapsulation 40-70 becomes the light source of this LED light-emitting device.Because multiple different assembling mode capable of using carries out between the heat radiation bearing (or being called radiator or lamp socket) of LED encapsulation 40-70 and a LED light-emitting device; And also can produce multiple various structure kenel; But assembling mode therebetween or structure kenel are not the demand emphasis of the utility model, so repeat no more at this.

With reference to shown in the figure 5-6, it is the structural profile sketch map of another embodiment of PCB formula heat-radiating substrate of the utility model again.The PCB formula heat-radiating substrate 10 of present embodiment is roughly the same with PCB formula heat-radiating substrate 10 shown in Figure 4, mainly also comprises an insulating barrier 11, one first line layer 12 and one second line layer 13; At least one thermal hole 14 wherein is set in this insulating barrier 11; This at least one thermal hole 14 is to be located between the upper and lower surface of this insulating barrier 11, and the inwall of this at least one thermal hole 14 is provided with a copper electroplating layer 15 upwards to be connected to this first line layer 12 respectively and to be connected to this second line layer 13 downwards.Main difference point between the PCB formula heat-radiating substrate 10 of present embodiment and the PCB formula heat-radiating substrate 10 shown in Figure 3 is: shown in figure 5-6; The PCB formula heat-radiating substrate 10 of the utility model can be in the copper electroplating layer 15 of this at least one thermal hole 14; Further insert Heat Conduction Material 16 like tin cream, silver paste, thermal grease etc., in order to more to improve the coefficient of heat transfer of this PCB formula heat-radiating substrate 10.

On the PCB formula heat-radiating substrate 10 of the utility model, the number of at least one thermal hole 14 of set this does not limit.Shown in Fig. 3-6, be provided with two thermal holes 14 but do not limit.Does not limit the position of setting up of this at least one thermal hole 14 again; But to be connected near the be electrically connected position of node 12a, 12b of this first line layer 12 and LED crystal grain 30 be the best to be located at correspondence to set up the position; Node 12a, 12b are main heat energy generation place because those are electrically connected; When those thermal holes 14 are arranged near heat energy generation place, can promote thermolysis relatively.Shown in Fig. 3-6; The PCB formula heat-radiating substrate 10 of the utility model is provided with two thermal holes 14 but does not limit; These two thermal holes 14 are corresponding respectively to be linked at least two be electrically connected node 12a, 12b that separate and insulate that comprised near this first line layer 12, but those thermal holes 14 shown in Fig. 3-6 are not in order to restriction the utility model.

Shown in figure 11A-11E, the PCB formula heat-radiating substrate 10 of the utility model is to utilize the generation type of printed circuit board (PCB) (PCB, Printed Circuit Board) to process, and these PCB formula heat-radiating substrate 10 manufacturing approaches comprise following steps:

Provide double-surface copper foil substrate (Copper Clad Laminate) 10c shown in Figure 11 A; This two-sided copper clad laminate comprises an insulating barrier 11c, one first copper foil layer 12c and one second copper foil layer 13c; Wherein this insulating barrier (substrate) 11c is a composite panel, and commonly used comprise glass fiber with the substrate 11c as copper clad laminate 10c and contain resin pickup, glass epoxy substrate etc. but do not limit;

On this second copper foil layer 13c, offer the operation of copper window shown in Figure 11 B; The copper window operation of offering of this step is established the position of this at least one thermal hole 14 and on this second copper foil layer 13c, is offered corresponding copper window 13d according to desire on this PCB formula heat-radiating substrate 10; As printed circuit board (PCB) (PCB utilizing; Printed Circuit Board) the etching operation in the generation type is at least one copper window of etching forming 13d on this second copper foil layer 13c; Totally two copper window 13d but do not limit shown in Figure 11 B, promptly the second copper foil layer 13c of this copper window 13d position is removed to expose this insulating barrier 11c;

Utilize laser blind hole (blind via) processing mode to be shaped corresponding blind hole (blind via) 14c respectively at this copper window 13d place shown in Figure 11 C again; This step is to utilize the laser drill processing mode to carry out the laser-fused operation to be formed separately blind hole (blind via) 14c of a correspondence to this insulating barrier 11c that exposes in this copper window 13d position; Being defined herein as blind hole (blind via) 14c is not penetrate this first copper foil layer 12c that is positioned at this insulating barrier 11c opposite side because of this blind hole (blind via) 14c can touch;

Again this at least one blind hole (blind via) 14c is carried out electroplating activity on the inwall of this at least one blind hole (blind via) 14c, a copper electroplating layer 15c to be set shown in Figure 11 D; This step utilizes electroplating activity on the inwall of this at least one blind hole (blind via) 14c, forming a copper electroplating layer 15c, and makes this copper electroplating layer 15c can upwards be connected to this first copper foil layer 12c and be connected to this second copper foil layer 13c downwards; And

Again this first copper foil layer 12c and this second copper foil layer 13c are carried out the circuit equalization shown in Figure 11 E at last; This step is utilized the generation type of printed circuit board (PCB) (PCB); And attend institute's desire according to this PCB formula heat-radiating substrate 10 and establish the configuration of this first line layer 12 (circuit layout) needs and carry out the circuit equalization, so that this first copper foil layer 12c and first line layer 12 and second line layer 13 of this second copper foil layer 13c patterning to form this PCB formula heat-radiating substrate 10; The PCB formula heat-radiating substrate 10 of promptly accomplishing the utility model is shown in Figure 11 E; This PCB formula heat-radiating substrate 10 has an insulating barrier 11, one first line layer 12 and one second line layer 13; Wherein be provided with at least one thermal hole 14 in this insulating barrier 11; It is located between the upper and lower surface of this insulating barrier 11, and the inwall of this at least one thermal hole 14 is provided with a copper electroplating layer 15 upwards to be connected to this first line layer 12 respectively and to be connected to this second line layer 13 downwards.

In addition, these PCB formula heat-radiating substrate 10 manufacturing approaches further comprise next step:

To this PCB formula heat-radiating substrate 10 of accomplishing, further in the copper electroplating layer 15 of this thermal hole 14, insert Heat Conduction Material 16 like tin cream, silver paste, thermal grease etc., in order to the coefficient of heat transfer that more improves this PCB formula heat-radiating substrate 10 like Fig. 5, shown in 9.

With reference to figure 4, shown in 6; The structural profile sketch map of two embodiment that its chip upside-down mounting type (Flip Chip) LED that is respectively the utility model encapsulates, Fig. 4,6 is applied to the combining structure that chip upside-down mounting type LED encapsulates in order to the PCB formula heat-radiating substrate 10 that the utility model is described respectively like Fig. 3, shown in 5.When the PCB formula heat-radiating substrate 10 of the utility model was applied to chip upside-down mounting type LED encapsulation, this LED crystal grain 30 was last at least two the node 12a that is electrically connected, 12b that separate and insulate of first line layer 12 of this PCB formula heat-radiating substrate 10 with the flip chip electrical ties; Like Fig. 4, shown in 6; This LED crystal grain 30 utilizes two different electrode contacts 31 like the tin ball but do not limit; Last with electrical ties at two the node 12a that is electrically connected, 12b that separate and be electrically insulated of this first line layer 12, to accomplish chip upside-down mounting type LED encapsulation 40,50.This LED encapsulation 40,50 can rely on this following layer 80 to be installed on the LED light-emitting device heat radiation bearing (or being called radiator or lamp socket) 90 of (figure does not show) with binding again, so that this LED encapsulation 40,50 becomes the light source of this LED light-emitting device.Luminous and when producing heat energy when this LED crystal grain 30; This heat energy promptly conducts to this first line layer 12 by this electrode contact 31 (like the tin ball); And rely on these two thermal holes 14 that include copper electroplating layer 15 as shown in Figure 4 again; Or rely on those thermal holes 14 and the Heat Conduction Material 16 inserted in this thermal hole 14 as shown in Figure 6; The heat conduction function that is had with thermal energy conduction to this second line layer 13 that this LED crystal grain 30 was produced and rely on outwards heat radiation on the heat radiation bearing 90 of this light-emitting device that this following layer 80 was linked, so can make this LED encapsulation 40,50 and/or this light-emitting device (figure does not show) reach good heat radiation function with effectively.

Shown in figure 7-10; The structural profile sketch map of two embodiment that its lead (Wire bond) formula LED that is respectively the utility model encapsulates, Fig. 7-10 are applied to the combining structure of wire LED encapsulation (60,70) in order to the PCB formula heat-radiating substrate 10 (like Fig. 3, shown in 5) of explanation the utility model.When the PCB formula heat-radiating substrate 10 of the utility model is applied to wire LED encapsulation; The bottom 33 of this LED crystal grain 30 is installed on this first line layer 12 of this PCB formula heat-radiating substrate 10; Utilize an adhesion layer (like elargol) 34 glutinous being located on this first line layer 12 like bottom 33 (like the bottom of a sapphire substrate) in this LED crystal grain 30, last with lead mode electrical ties again at two the node 12a that is electrically connected, 12b that separate and be electrically insulated of this first line layer 12.This LED crystal grain 30 utilizes two different leads 32 like gold thread but do not limit shown in Fig. 7-10, with electrical ties two of this first line layer 12 separately and the node 12a that is electrically connected, the 12b that are electrically insulated last, to accomplish wire LED encapsulation 60,70.This LED encapsulation 60,70 can rely on this following layer 80 to be installed on the LED light-emitting device heat radiation bearing 90 of (figure does not show), to become the light source of this LED light-emitting device so that this LED encapsulation 60,70 is linked again.As this LED crystal grain 30 luminous x and when producing heat energy; This heat energy promptly conducts to this first line layer 12 by the bottom 33 of this lead 32 (like gold thread) and this LED crystal grain 30; And rely on these two thermal holes 14 (including copper electroplating layer 15) again like Fig. 7, shown in 8; Or in these two thermal holes 14 and the thermal hole 14 institute's Heat Conduction Materials of inserting 16 like Fig. 9, shown in 10; The heat conduction function that is had; With thermal energy conduction to this second line layer 13 that this LED crystal grain 30 was produced and rely on outwards heat radiation on the heat radiation bearing 90 of this light-emitting device that this following layer 80 was linked, so can make this LED encapsulation 60,70 and/or this light-emitting device (figure does not show) reach good heat radiation function with effectively.

The upper end of set at least one thermal hole 14 and this first line layer link on the PCB formula heat-radiating substrate 10 of the utility model; And the position of setting up of this at least one thermal hole is to be positioned at or to approach the centralized heat energy place on this first line layer 12; Like the position of be electrically connected node 12a, the 12b of chip upside-down mounting type LED crystal grain 30 on this first line layer 12 shown in Fig. 3-6; Or the bottom 33 of wire LED crystal grain 30 is installed in position on this PCB formula heat-radiating substrate 10 shown in Fig. 7-10, with the radiating effect of the LED encapsulation promoting this PCB formula heat-radiating substrate 10 and accomplished.Shown in figure 7-10; When the PCB of the utility model formula heat-radiating substrate 10 is applied to lead (Wire bond) formula LED encapsulation 60,70; The heat energy that this LED crystal grain 30 is produced when luminous can major part be present in the bottom 33 of this LED crystal grain 30; Therefore on using; The thermal hole 14 that this PCB formula heat-radiating substrate 10 is had set up the position; Be connected near the position of this first line layer 12 and be electrically connected node 12a, the 12b of LED crystal grain 30 (shown in figure 3-6) except that being located at correspondence, can further be located at correspondence and be connected near the coupling position between the bottom 33 of this first line layer 12 and LED crystal grain 30, promptly the bottom 33 of this LED crystal grain 30 is installed in the position on this first line layer 12 of this PCB formula heat-radiating substrate 10; Shown in Fig. 7-10; Further be provided with two thermal holes 14 on the PCB formula heat-radiating substrate 10 of the utility model but do not limit; And these two thermal holes 14 are corresponding respectively to be linked near the coupling position of this first line layer 12 with the bottom 33 of this LED crystal grain 30, but the PCB formula heat-radiating substrate 10 shown in Fig. 7-10 and last those set thermal holes 14 thereof are not in order to restriction the utility model.The structure arrangement of the PCB formula heat-radiating substrate 10 shown in Fig. 7-10; Can make most of heat energy of the bottom 33 that is present in this LED crystal grain 30; Rely on the PCB formula heat-radiating substrate 10 of the utility model and outwards conduct and dispel the heat, so that this LED encapsulation 60,70 and/or this light-emitting device (scheming not show) are reached good heat radiation function.

The PCB formula heat-radiating substrate 10 of the utility model and use the LED encapsulation (40,50,60,70) that this PCB formula heat-radiating substrate 10 constituted; Compare with the state of the art; Its main distinction is characterised in that: this PCB formula heat-radiating substrate 10 utilizes the printed circuit board (PCB) mode to form, and comprises: an insulating barrier 11; One first line layer 12 is located on the upper surface of this insulating barrier 10, supplies and light-emitting diode (LED) crystal grain flip-chip capable of using (Flip Chip) or lead (Wire bond) mode electrical ties; And one second line layer 13 is located on the lower surface of this insulating barrier 10; Wherein having at least one thermal hole 14 in this insulating barrier 11 is located between its upper and lower surface; And the inwall of this at least one thermal hole 14 is provided with a copper electroplating layer 15 to be connected to this first line layer 12 and this second line layer 13 respectively, to improve coefficient of heat transfer effectively; And the good heat conduction function that relies on this PCB formula heat-radiating substrate 10 to be had, can effectively the heat that this LED crystal grain 30 produced conduct via this PCB formula heat-radiating substrate 10 and dispel the heat in outside can reach good heat radiation function so that this LED encapsulates.

A PCB formula heat-radiating substrate 10 of the utility model and a distinguishing characteristics again of using the LED encapsulation (40,50,60,70) that this PCB formula heat-radiating substrate 10 constituted are: this PCB formula heat-radiating substrate 10 of the utility model further can be in the copper electroplating layer 15 of this at least one thermal hole 14; Insert Heat Conduction Material such as tin cream, silver paste, thermal grease etc. again, in order to more to improve the coefficient of heat transfer of this PCB formula heat-radiating substrate 10.

The PCB formula heat-radiating substrate 10 of the utility model and another distinguishing characteristics of using the LED encapsulation (40,50,60,70) that this PCB formula heat-radiating substrate 10 constituted are: the upper end system of this at least one thermal hole 14 of this PCB formula heat-radiating substrate 10 of the utility model and this first line layer, 12 bindings; And the position of setting up of this at least one thermal hole 14 is to be positioned at or to approach the centralized heat energy place on this first line layer 12; Like the electrical ties position of chip upside-down mounting type LED crystal grain on this first line layer; Or wire LED crystal grain is installed in the position on this PCB formula heat-radiating substrate, with the radiating effect of this LED encapsulation of promoting this PCB formula heat-radiating substrate and being accomplished.

More than shown in be merely the preferred embodiment of the utility model, only be illustrative as far as the utility model, and nonrestrictive.Understand the common knowledge personnel of this professional skill field tool, in spirit that the utility model claim is limited and scope, can carry out many changes, revise it, even equivalent change, but all will fall in the protection range of the utility model.

Claims (11)

1. PCB formula heat-radiating substrate is characterized in that: supply at least one LED crystal grain electrical ties on this PCB formula heat-radiating substrate to form LED encapsulation, this PCB formula heat-radiating substrate comprises an insulating barrier, one first line layer and one second line layer, wherein:

This insulating barrier; Process with insulating material; And in this insulating barrier, be provided with at least one thermal hole; This at least one thermal hole is located between the upper surface and lower surface of this insulating barrier, and the inwall of this at least one thermal hole is provided with a copper electroplating layer, and it upwards is connected to this first line layer respectively and is connected to this second line layer downwards;

This first line layer; Be located on the upper surface of this insulating barrier; It comprises at least two separately and the nodes that are electrically connected of insulation supply with a LED crystal grain on the weld pad electrical ties accordingly of set different electrodes, with so that this LED crystal grain can also combine simultaneously to be arranged on this PCB formula heat-radiating substrate with the first line layer electrical ties;

This second line layer is located on the lower surface of this insulating barrier;

Wherein, luminous and when producing heat energy when this LED crystal grain, this heat energy through first line layer, this at least one thermal hole and in set copper electroplating layer, and conduct to this second line layer with outside heat radiation.

2. PCB formula heat-radiating substrate as claimed in claim 1 is characterized in that this insulating barrier is ceramic substrate, glass substrate, quartz base plate or composite panel.

3. PCB formula heat-radiating substrate as claimed in claim 1; It is characterized in that; This insulating barrier constitutes with a composite panel, and utilizes the laser drill mode to mold the perforation that upward and downward runs through, again on the inwall of this perforation electroforming one copper electroplating layer to constitute this thermal hole.

4. PCB formula heat-radiating substrate as claimed in claim 1 is characterized in that, the interior Heat Conduction Material that further is filled with of the copper electroplating layer of this at least one thermal hole.

5. PCB formula heat-radiating substrate as claimed in claim 4 is characterized in that this Heat Conduction Material is tin cream, silver paste or thermal grease.

6. PCB formula heat-radiating substrate as claimed in claim 1 is characterized in that, the mode of this at least one LED crystal grain electrical ties on this heat-radiating substrate is flip chip or lead mode.

7. PCB formula heat-radiating substrate as claimed in claim 1; It is characterized in that; On at least two nodes that are electrically connected that separate and insulate of first line layer of this PCB formula heat-radiating substrate, this at least one thermal hole correspondence is linked to the node that is electrically connected near this first line layer to this LED crystal grain with the flip chip electrical ties.

8. PCB formula heat-radiating substrate as claimed in claim 1; It is characterized in that; This LED crystal grain with lead mode electrical ties at least two of first line layer of this PCB formula heat-radiating substrate separately and on the nodes that are electrically connected of insulation and the bottom of this LED crystal grain be installed on this first line layer of this PCB formula heat-radiating substrate, this at least one thermal hole correspondence is linked near the coupling position between the bottom of this first line layer and LED crystal grain.

9. PCB formula heat-radiating substrate as claimed in claim 1 is characterized in that, this PCB formula heat-radiating substrate further is provided with a following layer in the outside of this second line layer.

10. PCB formula heat-radiating substrate as claimed in claim 9 is characterized in that, this following layer forms with heat radiation paster or thermal grease.

11. a LED package is characterized in that, comprises:

At least one LED crystal grain, each crystal grain is provided with the weld pad of at least two different electrodes; And

One heat-radiating substrate, it utilizes, and each described PCB formula heat-radiating substrate constitutes in the claim 1 to 10, supplies this at least one LED crystal grain electrical ties on this PCB formula heat-radiating substrate, to encapsulate to form a LED;

Wherein luminous and when producing heat energy when this at least one LED crystal grain, this heat energy can rely on conduction and the outwards heat radiation of this heat-radiating substrate.

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