CN202535318U - Substrate packaging structure of micro sound surface wave filter - Google Patents
Substrate packaging structure of micro sound surface wave filter Download PDFInfo
- Publication number
- CN202535318U CN202535318U CN 201220211454 CN201220211454U CN202535318U CN 202535318 U CN202535318 U CN 202535318U CN 201220211454 CN201220211454 CN 201220211454 CN 201220211454 U CN201220211454 U CN 201220211454U CN 202535318 U CN202535318 U CN 202535318U
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- substrate
- wave filter
- surface wave
- sound surface
- resin
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Abstract
The utility model relates to a substrate package structure of a micro sound surface wave filter. The substrate packaging structure comprises a substrate, wherein a resin shell is arranged on the substrate which is made of resin, the thermal expansion coefficient of the resin is 6.8-7.2ppm/k, and the thermal expansion coefficient of the substrate is basically consistent with that of the micro sound surface wave filter, so that welding points of the micro sound surface wave filter can not be damaged by pulling during expansion caused by heat and contraction caused by cold, a well-packaged micro sound surface wave filter is prevented from failure due to thermal mismatching, and the stability and the reliability of the well-packaged micro sound surface wave filter are improved; and the price of the resin substrate is lower than that of a ceramic substrate, so that the production cost of a product is reduced.
Description
Technical field
The utility model relates to the components and parts encapsulating structure, especially a kind of substrate encapsulation structure that is applicable to miniature SAW filter encapsulation.
Background technology
Existing miniature SAW filter all is that encapsulation gets up to use; Miniature SAW filter is installed in the substrate surface that ceramic material is processed; At the substrate surface back-off shell is installed then; Miniature SAW filter is arranged in shell, has realized the encapsulation of miniature SAW filter, and miniature SAW filter is hedged off from the outer world.
The existing substrate that miniature SAW filter is installed all be adopt ceramic material process (as: lithium tantalate (LiTaO3), thermal coefficient of expansion (CTE) is X=8ppm/k Y=16ppm/k; Aluminium oxide (AL2O3); Thermal coefficient of expansion (CTE) is 7.6ppm/k); The thermal coefficient of expansion of ceramic substrate and our chip material are approaching; Can effectively reduce the STRESS VARIATION that variations in temperature causes, prevent the excessive stress mismatch that causes of STRESS VARIATION, and draw the solder joint of bad SAW filter.
Along with the extensive employing of SAW filter, certainly will require the SAW filter price progressively to reduce, and the price of ceramic substrate can't satisfy the production in enormous quantities under the low price situation.
Summary of the invention
To the problems referred to above, the utility model provides a kind of thermal coefficient of expansion and backing material coupling of substrate, is suitable for installing the miniature SAW filter substrate encapsulation structure of miniature SAW filter.
To achieve these goals, the technical scheme of the utility model employing is following:
A kind of miniature SAW filter substrate encapsulation structure comprises substrate, on this substrate, resin enclosure is installed, and it is characterized in that, the material of said substrate is a resin, and the thermal coefficient of expansion of this resin is 6.8ppm/k～7.2ppm/k.
The good effect of the utility model:
The thermal coefficient of expansion basically identical of the thermal coefficient of expansion of substrate and miniature SAW filter; The Shi Buhui that expands with heat and contract with cold draws the solder joint of bad miniature SAW filter; Avoided because thermal mismatching causes packaged miniature SAW filter to lose efficacy, thereby improved the stability and the reliability of packaged miniature SAW filter.
The price of resin substrate is low than ceramic substrate, has reduced production cost of products, is convenient to produce in enormous quantities.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is that the installation of miniature SAW filter concerns sketch map.
Embodiment
Below in conjunction with specific embodiment the utility model is done further explain.
As depicted in figs. 1 and 2; A kind of miniature SAW filter substrate encapsulation structure; Comprise the substrate 1 that resin material is processed, a resin enclosure 2 is installed, the miniature SAW filter 3 that is welded on said substrate 1 upper surface is installed in this shell 2 at the upper surface of this substrate 1.
The material selection thermal coefficient of expansion of substrate 1 is the resin of 7ppm/k; This resin thermal coefficient of expansion and miniature SAW filter material coefficient of thermal expansion coefficient approaching; The Shi Buhui that expands with heat and contract with cold draws the solder joint 4 of bad miniature SAW filter; Avoided because thermal mismatching causes packaged miniature SAW filter to lose efficacy, thereby improved the stability and the reliability of packaged miniature SAW filter.Along with the research of resin material, the price of resin material reduces gradually, and the substrate price of the resin material that the utility model adopts has only 25% of ceramic substrate, greatly reduces the production cost of miniature SAW filter encapsulating structure, is convenient to product promotion and uses.
The foregoing description of the utility model only is to give an example for what explanation the utility model was done, and is not to be the qualification to the execution mode of the utility model.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation and changes.Here can't give exhaustive to all execution modes.Conspicuous variation that every technical scheme that belongs to the utility model is amplified out or change still are in the row of the protection range of the utility model.
Claims (1)
1. a miniature SAW filter substrate encapsulation structure comprises substrate (1), and resin enclosure (2) is installed on this substrate, it is characterized in that, the material of said substrate (1) is a resin, and the thermal coefficient of expansion of this resin is 6.8ppm/k～7.2ppm/k.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220211454 CN202535318U (en) | 2012-05-11 | 2012-05-11 | Substrate packaging structure of micro sound surface wave filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220211454 CN202535318U (en) | 2012-05-11 | 2012-05-11 | Substrate packaging structure of micro sound surface wave filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202535318U true CN202535318U (en) | 2012-11-14 |
Family
ID=47136471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220211454 Expired - Lifetime CN202535318U (en) | 2012-05-11 | 2012-05-11 | Substrate packaging structure of micro sound surface wave filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202535318U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114072965A (en) * | 2019-07-16 | 2022-02-18 | 瑞典爱立信有限公司 | Ceramic waveguide filter |
-
2012
- 2012-05-11 CN CN 201220211454 patent/CN202535318U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114072965A (en) * | 2019-07-16 | 2022-02-18 | 瑞典爱立信有限公司 | Ceramic waveguide filter |
| CN114072965B (en) * | 2019-07-16 | 2024-05-14 | 瑞典爱立信有限公司 | Ceramic waveguide filter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121114 |
|
| CX01 | Expiry of patent term |