CN202495477U - Anti-static LED - Google Patents
Anti-static LED Download PDFInfo
- Publication number
- CN202495477U CN202495477U CN2012200083532U CN201220008353U CN202495477U CN 202495477 U CN202495477 U CN 202495477U CN 2012200083532 U CN2012200083532 U CN 2012200083532U CN 201220008353 U CN201220008353 U CN 201220008353U CN 202495477 U CN202495477 U CN 202495477U
- Authority
- CN
- China
- Prior art keywords
- led
- thin wire
- led chip
- pin
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Led Device Packages (AREA)
Abstract
The utility model discloses an anti-static LED. The anti-static LED comprises an anode pin, a cathode pin and an LED chip. The LED chip is arranged on an insulation base station of a bowl at the top of the cathode pin. The LED chip sealed by solid crystal glue is arranged on the bowl. The height of the adhesive dispense of the solid crystal glue is less than half the height of the LED chip. A negative pole and a positive pole are arranged on the chip. The negative pole and the positive pole are welded with the cathode pin and the top of the anode pin through a first thin wire and a second thin wire respectively. A zener tube is arranged in the solid crystal glue. A metal joint is arranged on the zener tube. The metal joint is welded with the anode pin through a third thin wire. Although static can produce high voltage over ten thousand volts, the above connection mode of the LED and the arrangement of the zener tube form bidirectional pulses, and a bidirectional voltage V is equal to or greater than 5.6, thus the LED chip is protected, the high voltage generated by static is released, the service life of the LED is prolonged, and the LED is protected from the high voltage shock.
Description
Technical field
The utility model relates to the LED technical field, relates in particular to a kind of LED that can resist static, high-tension electricity is discharged, led chip is protected.
Background technology
LED uses more and more widely; And great power LED also favored by people gradually, and corresponding, people are also increasingly high to the requirement in led function and life-span; Requirement can improve life-span, the luminous flux when improving LED and using of LED, and also requires the cost of LED can not be higher simultaneously.
LED is a kind of solid-state semiconductor device that can electric energy be converted into visible light, and it can directly be converted into light to electricity.Because of advantage such as its luminous efficiency height, long service life, environmental protection, volume be little, be widely applied.Because LED is electrostatic sensitivity device, current when being applied in the high-end field, need the diode pair LED that adds Zener diode or play pressure stabilization function to do electrostatic protection, can promote the antistatic property of integral product like this.In addition, existing LED running current is 20mA, and clearly, if directly insert this LED on the current source of 50mA, led chip can shorten LED useful life because impressed current is excessive and breakdown, damage is perhaps serious.So, must protect the led chip in using, high-tension electricity is discharged.
The modal packaged type of existing LED is: fixed L ED chip on a pedestal; And be soldered on 2 terminal solder joints of pin through 2 thin wires (being generally gold thread); Form with the material package that sees through, what perhaps have also adds materials such as fluorescent glue in order to produce certain color before encapsulation again.
The weak point that existing LED device exists is: in installation or transportation, possibly receive electrostatic influence.The voltage of static is generally higher, and led chip can't bear the high voltage impact, damages the PN junction of LED device easily.
Summary of the invention
The purpose of the utility model is to solve existing problem among the existing LED, provides a kind of and can high-tension electricity be discharged, static discharges, the LED of protection led chip.
The utility model solves the technical scheme that its technical problem adopted: a kind of LED of antistatic; Be made up of anode pin, negative electrode pin and led chip, led chip places on the insulation base station of negative electrode pin top bowl cup, and the bowl cup is provided with the crystal-bonding adhesive packaging LED chips; The point glue height of crystal-bonding adhesive is less than 1/2 height of led chip; Chip is provided with negative electricity limit and positive electricity limit, and negative electricity limit and positive electricity limit through the top welding of first thin wire and second thin wire and negative electrode pin and anode pin, also are provided with a zener respectively in the crystal-bonding adhesive; Zener is provided with the metal solder joint, and the metal solder joint is through the 3rd thin wire and the welding of anode pin.Because producing, electrostatic energy surpasses ten thousand volts high-tension electricity; Being provided with of the mode of connection of above-mentioned LED and zener can form bidirectional pulse, and bi-directional voltage V >=5.6 can be protected led chip; The high-tension electricity of generation of static electricity is discharged, prolong the useful life of LED and do not receive the impact of high-tension electricity.
As the further design to the aforementioned techniques scheme: the gold goal diameter of aforesaid first thin wire, second thin wire and the 3rd thin wire pad is less than the diameter of positive electricity limit, negative electricity limit.
As to the aforementioned techniques scheme more further the design: aforesaid first thin wire, second thin wire and the 3rd thin wire are Herba Anoectochili roxburghii.
In sum; Being provided with of the mode of connection of the LED LED of the utility model and zener can form bidirectional pulse, and bi-directional voltage V >=5.6 can be protected led chip; The high-tension electricity of generation of static electricity is discharged, prolong the useful life of LED and do not receive the impact of high-tension electricity.When using LED, led chip can electrostatic damage, and can set electrical parameter according to specific requirement, improves LED useful life, greatly reduces cost, has practiced thrift energy consumption.
Description of drawings
Fig. 1 is the sketch map of the LED of embodiment 1;
Fig. 2 is another sketch map of the LED of embodiment 1.
Embodiment
The LED of a kind of antistatic of present embodiment 1 like Fig. 1, shown in Figure 2, is made up of anode pin 1, negative electrode pin 2 and led chip 3; Led chip places on the insulation base station of negative electrode pin top bowl cup; The bowl cup is provided with the crystal-bonding adhesive packaging LED chips, and the some glue height of crystal-bonding adhesive is less than 1/2 height of led chip, and chip is provided with negative electricity limit 4 and positive electricity limit 5; Negative electricity limit and positive electricity limit are welded with the top of negative electrode pin and anode pin through first thin wire 6 and second thin wire 7 respectively; Also be provided with a zener 8 in the crystal-bonding adhesive, zener is provided with metal solder joint 9, and the metal solder joint is through the 3rd thin wire 10 and the welding of anode pin.The gold goal diameter of first thin wire, second thin wire and the 3rd thin wire pad is less than the diameter of positive electricity limit, negative electricity limit.First thin wire, second thin wire and the 3rd thin wire are Herba Anoectochili roxburghii.Because producing, electrostatic energy surpasses ten thousand volts high-tension electricity; Being provided with of the mode of connection of above-mentioned LED and zener can form bidirectional pulse, and bi-directional voltage V >=5.6 can be protected led chip; The high-tension electricity of generation of static electricity is discharged, prolong the useful life of LED and do not receive the impact of high-tension electricity.
The above only is the preferred embodiment of the utility model, is not the technology contents of the utility model is done any pro forma restriction.Every technical spirit according to the utility model is to any simple modification, equivalent variations and modification that above embodiment did, all still belongs in the scope of technical scheme of the utility model.
Claims (3)
1. the LED of an antistatic; Form by anode pin (1), negative electrode pin (2) and led chip (3); Led chip places on the insulation base station of negative electrode pin top bowl cup; The bowl cup is provided with the crystal-bonding adhesive packaging LED chips, and the some glue height of crystal-bonding adhesive is less than 1/2 height of led chip, and chip is provided with negative electricity limit (4) and positive electricity limit (5); Negative electricity limit and positive electricity limit are welded with the top of negative electrode pin and anode pin through first thin wire (6) and second thin wire (7) respectively; It is characterized in that: also be provided with a zener (8) in the described crystal-bonding adhesive, zener is provided with metal solder joint (9), and the metal solder joint is through the 3rd thin wire (10) and the welding of anode pin.
2. LED according to claim 1 is characterized in that: the gold goal diameter of described first thin wire, second thin wire and the 3rd thin wire pad is less than the diameter of positive electricity limit, negative electricity limit.
3. LED according to claim 1 and 2 is characterized in that: described first thin wire, second thin wire and the 3rd thin wire are Herba Anoectochili roxburghii.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200083532U CN202495477U (en) | 2012-01-10 | 2012-01-10 | Anti-static LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200083532U CN202495477U (en) | 2012-01-10 | 2012-01-10 | Anti-static LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202495477U true CN202495477U (en) | 2012-10-17 |
Family
ID=47001690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200083532U Expired - Lifetime CN202495477U (en) | 2012-01-10 | 2012-01-10 | Anti-static LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202495477U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105257929A (en) * | 2015-10-09 | 2016-01-20 | 陕西省石油化工研究设计院 | Static discharging system connected with pipeline equipment made of two materials |
-
2012
- 2012-01-10 CN CN2012200083532U patent/CN202495477U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105257929A (en) * | 2015-10-09 | 2016-01-20 | 陕西省石油化工研究设计院 | Static discharging system connected with pipeline equipment made of two materials |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: JIANGMEN JIANGHAI DISTRICT KAIHUI PHOTOELECTRIC EQUIPMENT CO., LTD. Assignor: Chen Yening Contract record no.: 2013440000567 Denomination of utility model: Anti-static LED Granted publication date: 20121017 License type: Exclusive License Record date: 20131224 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121017 |