CN202492492U - Adhesive tape - Google Patents
Adhesive tape Download PDFInfo
- Publication number
- CN202492492U CN202492492U CN2012200257939U CN201220025793U CN202492492U CN 202492492 U CN202492492 U CN 202492492U CN 2012200257939 U CN2012200257939 U CN 2012200257939U CN 201220025793 U CN201220025793 U CN 201220025793U CN 202492492 U CN202492492 U CN 202492492U
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- conductive resin
- circuit board
- main body
- conductive rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 56
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 28
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000010923 batch production Methods 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 4
- 239000002362 mulch Substances 0.000 description 17
- 238000005096 rolling process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides an adhesive tape which is used for bonding mass-produced flexible circuit board. The adhesive tape comprises an adhesive tape main body and a conductive rubber, wherein the conductive rubber is printed on an adhesive surface of the adhesive tape main body and is distributed in a latticed shape. The adhesive tape, based on an adhesive surface of a traditional covering film which is used for protecting the flexible circuit board, prints a layer of conductive rubber which is distributed on the adhesive surface of the covering film in a latticed shape and the adhesive surface of the covering film is exposed from the latticed conductive rubber. On the basis of retaining the original function of the adhesive tape, the adhesive tape is capable of playing a conductive effect through the conductive rubber. Therefore, in the process of roll type production of the flexible circuit board, a circuit board roll which is formed by the bonding of the adhesive tape can be integrally put into a copper plating cylinder to carry out the disposable copper plating operation, and the working efficiency and quality of the flexible circuit board are greatly improved.
Description
Technical field
The utility model relates to the production technique of circuit card, relates in particular to a kind of adhesive tape.
Background technology
Fig. 1 is the structural representation of traditional adhesive tape; As shown in Figure 1, traditional adhesive tape all is combined to form by polyimide layer 1 and glue layer 2, and glue layer 2 is covered on the polyimide layer 1; Make adhesive tape prevent that external substance from damaging glue layer 2 and making it not lose viscosity through polyimide layer 1; Can play the adherent effect through glue layer 2 again, but when the flexible PCB of rolling production lot, if use the flexible PCB of this traditional bonding batch of insulation tape to make its built-up circuit coiled sheet that joins end to end; Then when follow-up heavy process for copper; Just can not make whole all conductions of circuit coiled sheet, promptly can not disposablely carry out the plating work of this circuit coiled sheet, have a strong impact on the quality of production and the efficient of flexible PCB during rolling is produced.
The utility model content
The purpose of the utility model provides a kind of adhesive tape, and its flexible PCB that is used for bonding batch is to realize the disposable copper-plating technique of monoblock circuit coiled sheet.
For solving the problems of the technologies described above; The utility model provides a kind of adhesive tape, and it is used for the flexible PCB of bonding batch process, and said adhesive tape comprises adhesive tape main body and conductive resin; Said conductive resin is printed on the glue face of said adhesive tape main body, and said conductive resin distributes as net shape.
Further, said adhesive tape main body comprises polyimide layer and glue layer, and said glue layer is covered on the said polyimide layer.
Further, said conductive resin is the silver slurry.
Compared with prior art, the utlity model has following beneficial effect:
The adhesive tape that provides in the utility model is the glue face that is used to protect the mulch film (Coverlayer) of flexible PCB original; Printed one deck conductive resin, this layer conductive resin distributes as net shape on the glue face of said mulch film, and the glue face of mulch film can expose between latticed conductive resin; Under the prerequisite that has kept the original adhesive function of adhesive tape; This adhesive tape can also play conductive effect through conductive resin, and this makes when the rolling of flexible PCB is produced, can be with circuit coiled sheet integral body that form is put into the electro-coppering cylinder by this adhesive tape is bonding; Carry out disposable copper facing work, improved the production efficiency and the quality of flexible PCB greatly.
Description of drawings
Below in conjunction with accompanying drawing the utility model is described further:
Fig. 1 is the structural representation of traditional adhesive tape;
The front view of the adhesive tape that Fig. 2 provides for the utility model embodiment;
The vertical view of the adhesive tape that Fig. 3 provides for the utility model embodiment.
In Fig. 1 to Fig. 3,
1: polyimide layer; 2: glue layer; 3: conductive resin.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the adhesive tape that the utility model proposes is done further explain.According to following explanation and claims, advantage of the utility model and characteristic will be clearer.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
The core concept of the utility model is, a kind of adhesive tape is provided, and it is used for the flexible PCB of bonding batch process; Said adhesive tape comprises adhesive tape main body and conductive resin, and said conductive resin is printed on the glue face of said adhesive tape main body, and said conductive resin distributes as net shape; The adhesive tape that provides in the utility model is the glue face that is used to protect the mulch film (Coverlayer) of flexible PCB original; Printed one deck conductive resin, this layer conductive resin distributes as net shape on the glue face of said mulch film, and the glue face of mulch film can expose between latticed conductive resin; Under the prerequisite that has kept the original adhesive function of adhesive tape; This adhesive tape can also play conductive effect through conductive resin, and this makes when the rolling of flexible PCB is produced, can be with circuit coiled sheet integral body that form is put into the electro-coppering cylinder by this adhesive tape is bonding; Carry out disposable copper facing work, improved the production efficiency and the quality of flexible PCB greatly.
Please refer to Fig. 2 and Fig. 3, Fig. 2 and Fig. 3 are respectively the front view and the vertical view of the adhesive tape that the utility model embodiment provides.
The utility model embodiment provides a kind of adhesive tape, and it is used for the flexible PCB of bonding batch process, and said adhesive tape comprises adhesive tape main body and conductive resin 3, and said conductive resin 3 is printed on the glue face of said adhesive tape main body, and said conductive resin 3 distributes as net shape.
Further, said adhesive tape main body comprises polyimide layer 1 and glue layer 2, and said glue layer 2 is covered on the said polyimide layer 1.
Further, the manufacturing materials of said conductive resin 3 is the silver slurry, and silver is good conductor, and latticed silver is starched the electroconductibility that can strengthen this adhesive tape on the glue face that is printed on adhesive tape main body (being mulch film) greatly.
The making method of the adhesive tape that provides in the utility model is:
Step 1: mulch film (Coverlayer) material of package is taken out, it is cut into the material of number of plate-shaped, with these flaky mulch films as the adhesive tape main body.
Step 2: tear the separate-type paper on this number of plate-shaped mulch film off, make these mulch films all expose the glue face.
Step 3: on the glue face of said some mulch films, all print one deck conductive resin 3, this layer conductive resin 3 distributes as net shape on the glue face of said some mulch films.
Step 4: said number of plate-shaped mulch film is cut into the suitable strip of width, is used for the flexible PCB of bonding batch.
The adhesive tape that provides in the utility model is the glue face that is used to protect the mulch film (Coverlayer) of flexible PCB original; Printed one deck conductive resin 3; This layer conductive resin 3 distributes as net shape on the glue face of said mulch film; The glue face of mulch film can expose between latticed conductive resin, makes this adhesive tape under the prerequisite that has kept the original adhesive function of adhesive tape, can also play conductive effect through conductive resin 3; This makes when the rolling of flexible PCB is produced; Can be with circuit coiled sheet integral body that form to be put into the electro-coppering cylinder by this adhesive tape is bonding, whole group circuit coiled sheet is disposable to carry out copper facing, has improved the production efficiency and the quality of flexible PCB greatly.
Obviously, those skilled in the art can carry out various changes and distortion to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.
Claims (3)
1. adhesive tape is used for the flexible PCB of bonding batch process, it is characterized in that comprise adhesive tape main body and conductive resin, said conductive resin is printed on the glue face of said adhesive tape main body, and said conductive resin distributes as net shape.
2. according to the said adhesive tape of claim 1, it is characterized in that said adhesive tape main body comprises polyimide layer and glue layer, said glue layer is covered on the said polyimide layer.
3. according to claim 1 or 2 said adhesive tapes, it is characterized in that said conductive resin is the silver slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200257939U CN202492492U (en) | 2012-01-19 | 2012-01-19 | Adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200257939U CN202492492U (en) | 2012-01-19 | 2012-01-19 | Adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202492492U true CN202492492U (en) | 2012-10-17 |
Family
ID=46998728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200257939U Expired - Fee Related CN202492492U (en) | 2012-01-19 | 2012-01-19 | Adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202492492U (en) |
-
2012
- 2012-01-19 CN CN2012200257939U patent/CN202492492U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121017 Termination date: 20210119 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |