CN102573284A - Flexible light bar board and manufacturing method thereof - Google Patents
Flexible light bar board and manufacturing method thereof Download PDFInfo
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- CN102573284A CN102573284A CN2011104599530A CN201110459953A CN102573284A CN 102573284 A CN102573284 A CN 102573284A CN 2011104599530 A CN2011104599530 A CN 2011104599530A CN 201110459953 A CN201110459953 A CN 201110459953A CN 102573284 A CN102573284 A CN 102573284A
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Abstract
The invention relates to a flexible light bar board comprising an insulation layer and a circuit layer arranged on the surface of the insulation layer, wherein the circuit layer is provided with a bonding pad for installation of an LED (Light Emitting Diode) and a groove for installation of a resistor, a printing resistor is formed in the groove by printing and curing resistance paste, and a protective film covers the outer side of the circuit layer and the outer side of the printing resistor and is provided with a window at a position at which the bonding pad is arranged. According to the flexible light bar board disclosed by the invention, the printing resistor is adopted and is covered with the protective film, so that the stability of the resistor can be enhanced effectively, and the manufacturing cost and the manufacturing difficulty of the flexible light bar board can be reduced. The invention further relates to a manufacturing method of the flexible light bar board, and the manufacturing method has the advantages of reducing the manufacturing cost and the manufacturing difficulty of the flexible light bar board, optimizing the manufacturing flow of the flexible light bar board and shortening the manufacturing period of the light bar board, thus improving the production efficiency of the flexible light bar board.
Description
Technical field
The present invention relates to a kind of lamp batten, relate in particular to a kind of flexible light batten and preparation method thereof.
Background technology
In recent years, the competition more and more fierce of flexible light batten manufacturing works on the market directly causes its price in continuous reduction, and this just requires the cost of manufacture of flexible lamp strip plate constantly to reduce could tackle change of market and demand.
The main material of flexible light batten is the single or double flexibility coat copper plate; Generally all need on the good circuit of etching, cover layer protecting film; The diaphragm material is generally polyimides, and its insulation property are better, combines closely with wiring board under HTHP through the heat cured glue of one deck; Be pressed together on the circuit surface and play a protective role, for wiring board provides insulation and electric property steady in a long-term.Simultaneously, have some windows on the diaphragm and expose pad,, weld resistance and LED lamp, reach the purpose of electric intercommunication through after the surface treatment.The way of tradition flexible light batten is at first to paste epiphragma protection to making the later lamp batten of circuit, the exposed pad position, and surface treatment is with after operations such as print solder paste, paster, inspection, SMT are installed resistance and LED lamp.The manufacture method of tradition flexible light batten exists following shortcoming: SMT to install in the resistance process, because the poor stability of lamp batten takes place the bad situation such as the LED lamp does not work, loose contact that cause easily of resistance welded; Coverlay need be offered window in the pad locations of welding resistance, and this window is offered position generation deviation and can be caused resistance welded bad; Whole fabrication cycle is long, and difficulty is big, causes cost height and production efficiency low.
Summary of the invention
The object of the present invention is to provide a kind of flexible light batten, adopt printed resistor and covered with protective film, can strengthen the stability of resistance effectively, and reduce the manufacturing cost and the difficulty of flexible light batten.
Another purpose of the present invention is to provide a kind of above-mentioned flexible lamp strip board manufacturing method; Adopt the printed resistor slurry to make printed resistor, avoided the appearance of failure welding situation in the resistance installation process, strengthened the stability of resistance at line layer; The manufacturing cost and the difficulty of flexible light batten have been reduced simultaneously; Optimize the making flow process of flexible light batten, shortened the fabrication cycle of flexible light batten, thereby improved the production efficiency of flexible light batten.
For realizing above-mentioned purpose; The present invention provides a kind of flexible light batten; Comprise insulating barrier and be located at the line layer of said surface of insulating layer, said line layer is provided with the groove that is used to that the pad of LED is installed and is used to install resistance, in the said groove through the printed resistor slurry and solidify to form printed resistor; The outer side covers of said line layer and printed resistor has diaphragm, and said diaphragm offers window in the pad place.
Said resistance slurry is adhesive or conduction system, and its time resistivity at 0 ℃ is 1000-3000 Ω m.
Said diaphragm comprises insulating basement membrane layer and insulation glue-line, and said insulating cement laminating is combined on line layer and the printed resistor, and said insulating basement membrane layer is positioned at the outside of insulation glue-line.
The material of said insulating basement membrane layer is polyimides (PI), polyester (PET), gathers naphthalene ester (PEN) or liquid crystal polymer (LCP) that the thickness of said insulating basement membrane layer is 10-100 μ m.
The material of said insulation glue-line is epoxide-resin glue system, SGA system, polyester glue system, polyurethane adhesive system or polyimides glue system, and the thickness of said insulation glue-line is 10-50 μ m.
Said diaphragm is white coverlay, and said diaphragm also comprises the white layer that is positioned at the insulating basement membrane layer outside.
Said insulating barrier is provided with line layer for one side or the two sides is equipped with line layer.
The present invention also provides a kind of manufacture method of flexible light batten, comprises the steps:
Step 1: flexibility coat copper plate is provided, flexibility coat copper plate is carried out etching form line layer, said line layer is provided with the groove that is used to that the pad of LED is installed and is used to install resistance;
Step 2: printing one deck resistance slurry and solidifying in line layer need be installed the groove of resistance forms printed resistor;
Step 3: at line layer and the printed resistor of that side pressure unification layer diaphragm to cover this side of the route layer that is formed with printed resistor, said diaphragm offers window in the pad place.
In the said step 2, the resistance slurry that is adopted is adhesive or conduction system, and its time resistivity at 0 ℃ is 1000-3000 Ω m in resistivity.
In the said step 3; The diaphragm of institute's pressing comprises insulating basement membrane layer and insulation glue-line; Said insulating cement laminating is combined on line layer and the printed resistor; Said insulating basement membrane layer is positioned at the outside of insulation glue-line, and the material of said insulating basement membrane layer is polyimides (PI), polyester (PET), gathers naphthalene ester (PEN) or liquid crystal polymer (LCP) that the thickness of said insulating basement membrane layer is 10-100 μ m; The material of said insulation glue-line is epoxide-resin glue system, SGA system, polyester glue system, polyurethane adhesive system or polyimides glue system, and the thickness of said insulation glue-line is 10-50 μ m.
Beneficial effect of the present invention: flexible light batten of the present invention, through adopt printed resistor and on printed resistor covered with protective film, can strengthen the stability of resistance effectively, and reduce the manufacturing cost and the difficulty of flexible light batten; The manufacture method of flexible light batten of the present invention; Manufacture method than existing flexible light batten; Owing to adopt the printed resistor mode to replace traditional welding resistive technologies; Avoided situation such as the bad LED lamp that causes of resistance welded is bad, loose contact, strengthened flexible light batten quality of stability, production process minimizing simultaneously, manufacture difficulty reduce; Therefore production cost declines to a great extent, fabrication cycle shortens to some extent, production efficiency significantly improves, and on the price of finished product, possesses remarkable advantages.
For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effects obvious.
In the accompanying drawing,
Fig. 1 is the structural representation of flexible light batten one preferred embodiment of the present invention;
Fig. 2 and Fig. 3 are for showing the structural representation of flexible light batten manufacturing process of the present invention.
Embodiment
As shown in Figure 1, be a preferred embodiment of flexible light batten of the present invention.
Please consult Fig. 2 and Fig. 3 simultaneously; This flexible light batten; Comprise insulating barrier 11 and be located at the line layer 12 on said insulating barrier 11 relative two sides, said line layer 12 is provided with the groove 122 that is used to that the pad 121 of LED is installed and is used to install resistance, in the said groove 122 through the printed resistor slurry and solidify to form printed resistor 123; The outer side covers of said line layer 12 and printed resistor 123 has diaphragm 13, and said diaphragm 13 offers window 130 in pad 121 places.In the present embodiment, the two sides of the insulating barrier 11 of said flexible light batten all is formed with line layer 12, and promptly adopting double side flexible copper coated board is that base material is made.In other embodiments, said flexible light batten also can be only to be formed with line layer 12 in the one side of insulating barrier 11, and promptly adopting the single face flexibility coat copper plate is that base material is made.
Said resistance slurry is adhesive or conduction system; Its time resistivity at 0 ℃ is 1000-3000 Ω m; The size of the resistance value of formed printed resistor 123 depends on live width, resistance slurry thickness and resistance slurry composition, can select according to actual needs.
Said diaphragm 13 comprises insulating basement membrane layer 131 and insulation glue-line 132, and said insulation glue-line 132 is fitted on line layer 12 and the printed resistor 123, and said insulating basement membrane layer 131 is positioned at the outside of insulation glue-line 132.Wherein, the material of said insulating basement membrane layer 131 is polyimides (PI), polyester (PET), gathers naphthalene ester (PEN) or liquid crystal polymer (LCP) that the thickness of said insulating basement membrane layer 131 is 10-100 μ m; The material of said insulation glue-line 132 is epoxide-resin glue system, SGA system, polyester glue system, polyurethane adhesive system or polyimides glue system, and the thickness of said insulation glue-line 132 is 10-50 μ m.
Said diaphragm 13 can be common coverlay, black coverlay or white coverlay.In the present embodiment, said diaphragm 13 is white coverlay, and it also comprises the white layer 133 that is positioned at insulating basement membrane layer 131 outside.
Flexible light batten of the present invention, through adopt printed resistor and on printed resistor covered with protective film, can strengthen the stability of resistance effectively, and reduce the manufacturing cost and the difficulty of flexible light batten
See also Fig. 1 to Fig. 3, the manufacture method of flexible light batten of the present invention comprises the steps:
Step 1: flexibility coat copper plate is provided; Flexibility coat copper plate is carried out etching form line layer 12; Said line layer 12 is provided with the groove 122 that is used to that the pad 121 of LED is installed and is used to install resistance, and wherein, said flexibility coat copper plate is selected single face flexibility coat copper plate or double side flexible copper coated board for use;
Step 2: need print one deck resistance slurry and solidify formation printed resistor 123 in the groove 122 of installation resistance at line layer 12;
Step 3: be formed with line layer 12 and the printed resistor 123 of that side pressure unification layer diaphragm 13 to cover this side of printed resistor 123.
In the said step 2, the resistance slurry that is adopted is adhesive or conduction system, and its time resistivity at 0 ℃ is 1000-3000 Ω m.
In the said step 3; The diaphragm 13 of institute's pressing comprises insulating basement membrane layer 131 and insulation glue-line 132; Said insulation glue-line 132 is fitted on line layer 12 and the printed resistor 123; Said insulating basement membrane layer 131 is positioned at the outside of insulation glue-line 132, and the material of said insulating basement membrane layer 131 is polyimides (PI), polyester (PET), gathers naphthalene ester (PEN) or liquid crystal polymer (LCP) that the thickness of said insulating basement membrane layer 131 is 10-100 μ m; The material of said insulation glue-line 132 is epoxide-resin glue system, SGA system, polyester glue system, polyurethane adhesive system or polyimides glue system, and the thickness of said insulation glue-line 132 is 10-50 μ m.
The manufacture method of flexible light batten of the present invention; Manufacture method than existing flexible light batten; Owing to adopt the printed resistor mode to replace traditional welding resistive technologies; Avoided situation such as the bad LED lamp that causes of resistance welded is bad, loose contact, strengthened flexible light batten quality of stability, production process minimizing simultaneously, manufacture difficulty reduce; Therefore production cost declines to a great extent, fabrication cycle shortens to some extent, production efficiency significantly improves, and on the price of finished product, possesses remarkable advantages.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (10)
1. flexible light batten; Comprise insulating barrier and be located at the line layer of said surface of insulating layer; Said line layer is provided with the groove that is used to that the pad of LED is installed and is used to install resistance, it is characterized in that, in the said groove through the printed resistor slurry and solidify to form printed resistor; The outer side covers of said line layer and printed resistor has diaphragm, and said diaphragm offers window in the pad place.
2. flexible light batten as claimed in claim 1 is characterized in that, said resistance slurry is adhesive or conduction system, and its time resistivity at 0 ℃ is 1000-3000 Ω m.
3. flexible light batten as claimed in claim 1 is characterized in that, said diaphragm comprises insulating basement membrane layer and insulation glue-line, and said insulating cement laminating is combined on line layer and the printed resistor, and said insulating basement membrane layer is positioned at the outside of insulation glue-line.
4. flexible light batten as claimed in claim 3 is characterized in that, the material of said insulating basement membrane layer is polyimides, polyester, gathers naphthalene ester or liquid crystal polymer that the thickness of said insulating basement membrane layer is 10-100 μ m.
5. like claim 3 or 4 described flexible light battens, it is characterized in that the material of said insulation glue-line is epoxide-resin glue system, SGA system, polyester glue system, polyurethane adhesive system or polyimides glue system, the thickness of said insulation glue-line is 10-50 μ m.
6. flexible light batten as claimed in claim 3 is characterized in that, said diaphragm is white coverlay, and said diaphragm also comprises the white layer that is positioned at the insulating basement membrane layer outside.
7. flexible light batten as claimed in claim 1 is characterized in that, said insulating barrier is provided with line layer for one side or the two sides is equipped with line layer.
8. the manufacture method of a flexible light batten is characterized in that, comprises the steps:
Step 1: flexibility coat copper plate is provided, flexibility coat copper plate is carried out etching form line layer, said line layer is provided with the groove that is used to that the pad of LED is installed and is used to install resistance;
Step 2: printing one deck resistance slurry and solidifying in line layer need be installed the groove of resistance forms printed resistor;
Step 3: at line layer and the printed resistor of that side pressure unification layer diaphragm to cover this side of the route layer that is formed with printed resistor, said diaphragm offers window in the pad place.
9. the manufacture method of flexible light batten as claimed in claim 8 is characterized in that, in the said step 2, the resistance slurry that is adopted is adhesive or conduction system, and its time resistivity at 0 ℃ is 1000-3000 Ω m.
10. the manufacture method of flexible light batten as claimed in claim 8; It is characterized in that in the said step 3, the diaphragm of institute's pressing comprises insulating basement membrane layer and insulation glue-line; Said insulating cement laminating is combined on line layer and the printed resistor; Said insulating basement membrane layer is positioned at the outside of insulation glue-line, and the material of said insulating basement membrane layer is polyimides, polyester, gathers naphthalene ester or liquid crystal polymer that the thickness of said insulating basement membrane layer is 10-100 μ m; The material of said insulation glue-line is epoxide-resin glue system, SGA system, polyester glue system, polyurethane adhesive system or polyimides glue system, and the thickness of said insulation glue-line is 10-50 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104599530A CN102573284A (en) | 2011-12-30 | 2011-12-30 | Flexible light bar board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104599530A CN102573284A (en) | 2011-12-30 | 2011-12-30 | Flexible light bar board and manufacturing method thereof |
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| CN102573284A true CN102573284A (en) | 2012-07-11 |
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| CN2011104599530A Pending CN102573284A (en) | 2011-12-30 | 2011-12-30 | Flexible light bar board and manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106590458A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Manufacturing method of novel ultra-thin white covering film |
| CN108617110A (en) * | 2016-12-13 | 2018-10-02 | Si弗莱克斯有限公司 | Use flexible printed circuit board manufacturing method and flexible printed circuit board of the internal layer without masking mode |
| CN109140262A (en) * | 2018-10-16 | 2019-01-04 | 江门市联森电子科技有限公司 | A kind of LED lamp panel with impedance carbon oil printed resistor |
| CN109548322A (en) * | 2017-09-21 | 2019-03-29 | 鹤山市得润电子科技有限公司 | A kind of manufacturing method and production equipment of multi-layer soft circuit board |
| CN112867270A (en) * | 2021-02-02 | 2021-05-28 | 沪士电子股份有限公司 | Method for printing high-speed circuit board by using conductive paste and high-speed circuit board |
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| US20030150101A1 (en) * | 2001-12-04 | 2003-08-14 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with buried resistor and manufacturing method thereof |
| US6619831B2 (en) * | 2000-04-26 | 2003-09-16 | Koichi Kanesaka | Strip light emitter |
| CN1615070A (en) * | 2003-11-05 | 2005-05-11 | 三星电机株式会社 | Manufacture of PCB with resistors embedded |
| CN201813610U (en) * | 2010-03-31 | 2011-04-27 | 王定锋 | Double-sided circuit board and led lamp belt |
| CN102079959A (en) * | 2010-12-18 | 2011-06-01 | 广东生益科技股份有限公司 | High-heat-conductivity white adhesive composition, high-heat-conductivity white cover film made from same and preparation method thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6619831B2 (en) * | 2000-04-26 | 2003-09-16 | Koichi Kanesaka | Strip light emitter |
| US20030150101A1 (en) * | 2001-12-04 | 2003-08-14 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with buried resistor and manufacturing method thereof |
| CN1615070A (en) * | 2003-11-05 | 2005-05-11 | 三星电机株式会社 | Manufacture of PCB with resistors embedded |
| CN201813610U (en) * | 2010-03-31 | 2011-04-27 | 王定锋 | Double-sided circuit board and led lamp belt |
| CN102079959A (en) * | 2010-12-18 | 2011-06-01 | 广东生益科技股份有限公司 | High-heat-conductivity white adhesive composition, high-heat-conductivity white cover film made from same and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617110A (en) * | 2016-12-13 | 2018-10-02 | Si弗莱克斯有限公司 | Use flexible printed circuit board manufacturing method and flexible printed circuit board of the internal layer without masking mode |
| CN108617110B (en) * | 2016-12-13 | 2020-12-15 | Si弗莱克斯有限公司 | Flexible printed circuit board manufacturing method using inner layer non-shielding mode and flexible printed circuit board |
| CN106590458A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Manufacturing method of novel ultra-thin white covering film |
| CN109548322A (en) * | 2017-09-21 | 2019-03-29 | 鹤山市得润电子科技有限公司 | A kind of manufacturing method and production equipment of multi-layer soft circuit board |
| CN109140262A (en) * | 2018-10-16 | 2019-01-04 | 江门市联森电子科技有限公司 | A kind of LED lamp panel with impedance carbon oil printed resistor |
| CN112867270A (en) * | 2021-02-02 | 2021-05-28 | 沪士电子股份有限公司 | Method for printing high-speed circuit board by using conductive paste and high-speed circuit board |
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Application publication date: 20120711 |