CN202475922U

CN202475922U - Circuit board

Info

Publication number: CN202475922U
Application number: CN2011205639028U
Authority: CN
Inventors: 王富民; 李建华
Original assignee: TRULY SEMICONDUCTORS (SHANWEI) CO Ltd
Current assignee: Truly Opto Electronics Ltd
Priority date: 2011-12-28
Filing date: 2011-12-28
Publication date: 2012-10-03
Anticipated expiration: 2021-12-28

Abstract

The utility model discloses a circuit board, which comprises welding spots arranged in multiple columns and multiple rows. Furthermore, only one welding spot is contained in each row. The welding spots are connected with a sensor through gold threads. According to a preferable scheme, provided are multiple welding spots arranged in two columns and in multiple rows, and only one welding spot is contained in each row. In the disclosed circuit board, distances between welding spots are increased; when the welding spots are connected with the sensor through gold threads, problems of over concentration of the gold threads and over-large binding angles of the gold threads are prevented, and thus qualified rate of the bound circuit board is improved.

Description

A kind of circuit board

Technical field

The utility model relates to little encapsulation IC gold thread and binds field, particularly a kind of circuit board (PCB).

Background technology

At present, in little encapsulation IC gold thread binding field, when circuit board is linked to each other with other electric elements; Usually connect through solder joint; As shown in Figure 1, when needs link to each other transducer with circuit board, need the solder joint 11 that be provided with on the solder joint 12 of transducer and the PCB circuit board be linked to each other through gold thread.

But, since the solder joint 11 on the PCB circuit board too intensive be arranged at a certain zone, cause when the solder joint 12 that utilizes gold thread with transducer links to each other with solder joint 11, line is too intensive, the qualification rate of the circuit board after the binding is lower.

The utility model content

The utility model problem to be solved is: a kind of circuit board is provided, the problem that the qualification rate of the circuit board after the binding that causes to solve gold thread binding of the prior art lowers.

The utility model provides a kind of circuit board, comprises a plurality of solder joints that are provided with according to the multiple row multirow, only comprises a solder joint on each row, and solder joint links to each other with transducer through gold thread.

Preferably, according to a plurality of solder joints that two row multirows are provided with, only comprise a solder joint on each row.

Preferably, said transducer is the COMS transducer.

Preferably, said transducer is a ccd sensor.

Can find out from above technical scheme; In the utility model, the circuit board that provides will be divided into the form that only comprises a solder joint on multiple row multirow and each row by too intensive solder joint in a certain zone; Increased the distance between solder joint; In gold thread connection welding and transducer, gold thread is overstocked binds the excessive problem of angle with gold thread with regard to not occurring because of the intensive of solder joint, thereby has improved the qualification rate of binding the back circuit board like this.

Description of drawings

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiment that put down in writing in the utility model, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.

Fig. 1 is the circuit-board connecting structure sketch map of prior art;

Fig. 2 is the structural representation of the utility model embodiment one disclosed circuit board;

Fig. 3 is the structural representation of the utility model embodiment two disclosed circuit boards;

Fig. 4 is the whole syndeton sketch map of the utility model embodiment two disclosed circuit boards.

Embodiment

Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is carried out clear, intactly description, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the protection range of the utility model.

Disclosed board structure of circuit is as shown in Figure 2 among the utility model embodiment one; Circuit board solder joint 21 too intensive in a certain zone on the circuit board is divided on three row multirows and each row only comprises a solder joint, utilize gold thread to bind the solder joint 22 on circuit board solder joint 21 and the transducer.This moment 21 of circuit board solder joints distance because corresponding the increase, can not occur therefore that gold thread is overstocked binds the excessive problem of angle with gold thread, thereby improve the qualification rate of binding the back circuit board.And, since the increase of the spacing between the circuit board solder joint, the size of increase circuit board solder joint that can be suitable, thus avoid causing the problem that can differ from owing to the too little circuit connectivity that causes of circuit board welding spot size.

Transducer in the present embodiment is complementary metal oxide semiconductors (CMOS) COMS transducer or charge coupled cell ccd sensor.

Can find out by the above embodiments; Solder joint on the circuit board can be according to a plurality of solder joints of three row multirows; Only comprise a solder joint on each row, can solve like this that gold thread in the prior art is bound and the qualification rate of circuit board reduces after the binding that causes problem, the volume of circuit board is strengthened to a certain extent because the circuit board solder joint is divided into multiple row setting; Therefore work as columns more for a long time, be not easy to the miniaturization of circuit board.

In order further to optimize this programme; The utility model embodiment two disclosed board structure of circuit are as shown in Figure 3; Circuit board solder joint 31 too intensive in a certain zone on the circuit board is divided on two row multirows and each row only comprises a solder joint, utilize gold thread to bind the solder joint 32 on circuit board solder joint 31 and the transducer.This moment, the distance of 31 of solder joints on the circuit board increased accordingly, had avoided occurring that gold thread is overstocked binds the excessive problem of angle with gold thread, thereby had improved the qualification rate of binding the back circuit board.And, since only with its branch for two row, also avoided increasing the problem of circuit board volume, requirement that can adaptive circuit plate miniaturization.Simultaneously can not cause the problem of switching performance difference owing to the too intensive size that causes is too little yet.

Transducer in the present embodiment can be the COMS transducer equally, or ccd sensor.

The whole syndeton of the disclosed circuit board of present embodiment is as shown in Figure 4, and the disclosed circuit board of the utility model embodiment, the welding spot size on the circuit board can be not too small, and the dense degree of gold thread and slope all have decline, have improved the qualification rate of circuit board.

Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed device of embodiment, because it is corresponding with the embodiment disclosed method, so description is fairly simple, relevant part is partly explained referring to method and is got final product.

To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment is conspicuous to those skilled in the art, and defined General Principle can realize under the situation of spirit that does not break away from the utility model or scope in other embodiments among this paper.Therefore, the utility model will can not be restricted to these embodiment shown in this paper, but will meet and principle disclosed herein and the corresponding to wide region of features of novelty.

Claims

1. a circuit board is characterized in that, comprising: according to a plurality of solder joints that the multiple row multirow is provided with, only comprise a solder joint on each row;

Said solder joint links to each other with transducer through gold thread.

2. circuit board according to claim 1 is characterized in that, according to a plurality of solder joints that two row multirows are provided with, only comprises a solder joint on each row.

3. circuit board according to claim 1 is characterized in that, transducer is the COMS transducer.

4. circuit board according to claim 1 is characterized in that, transducer is a ccd sensor.