CN202471756U - Vacuum dust removal structure on chip test machine - Google Patents
Vacuum dust removal structure on chip test machine Download PDFInfo
- Publication number
- CN202471756U CN202471756U CN2011204561863U CN201120456186U CN202471756U CN 202471756 U CN202471756 U CN 202471756U CN 2011204561863 U CN2011204561863 U CN 2011204561863U CN 201120456186 U CN201120456186 U CN 201120456186U CN 202471756 U CN202471756 U CN 202471756U
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- cylinder
- vacuum cleaning
- testing machine
- chip testing
- pad
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- Expired - Fee Related
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Abstract
The utility model relates to a vacuum dust removal structure, and especially relates to the vacuum dust removal structure on a chip test machine. The vacuum dust removal structure is arranged at a front end of a test position of the chip test machine, and comprises a flange plate fixed to the chip test machine; wherein, a hinge base and a top plate are arranged on the flange plate, a support plate is arranged on the hinge base and the top plate; the support plate is provided with a cylinder, a driving shaft of the cylinder is connected with a front adsorption head, and a front end of the front adsorption head is provided with a vacuum dust-absorbing head. The vacuum dust removal structure on the chip test machine in the utility model has the beneficial effects that: by utilizing the cylinder to drive a dust-absorbing structure to telescope, an active dust removal operation for each chip placing position can be realized; in addition, a detection process is not influenced, thus a test accuracy can be raised.
Description
Technical field
The utility model relates to the vacuum cleaning structure on a kind of vacuum cleaning structure, the especially chip testing machine.
Background technology
On chip testing machine during test chip; Because the pin of many test pin contact chips is tested; Because test is very meticulous, so measuring accuracy is affected by environment bigger, general processing mode is in a dustless workplace, to test now; Reducing the influence of dust, but be relative dustless in the dustless workplace environment to test; Chip pin, tin ball have release materials, scaling powder residue, therefore use the dust absorbing structure vacuum cleaning, satisfy the chip testing demand of present high-precision high-speed degree.
Summary of the invention
The purpose of the utility model provides the vacuum cleaning structure on a kind of chip testing machine of initiatively dedusting.
To achieve these goals, the utility model adopts following technical scheme:
It is installed on chip testing machine test position front end; Comprise and the fixing flanged plate of chip testing machine; One hinge seat and a top board are installed on the said flanged plate, a back up pad is installed on said hinge seat and the top board, back up pad is provided with a cylinder; The driving shaft of said cylinder connects an anterior adsorption head, and anterior adsorption head front end is provided with the vacuum cleaning head.
Preferably, described vacuum cleaning head comprises a rectangular shaped rim, is respectively equipped with the pore of horizontal direction on the front and back frame of described rectangular shaped rim, and the horizontal pore of front bezel is communicated with downward vertical pore, on the upper surface of rectangular shaped rim, is provided with a cover plate.
Preferably, described cylinder is installed on the back up pad through a cylinder holder, and described cylinder holder is that a base plate reaches the inverted T-shaped of forming perpendicular to the cylinder connecting portion of base plate, and described cylinder connecting portion is provided with an axis hole.
Preferably, on the described back up pad left and right sides be respectively equipped with one protrude in the back up pad plane lug boss, be separately installed with slide rail on the described lug boss, anterior adsorption head is fixed on the slide rail.
Preferably, described anterior adsorption head is fixed with the web member that is connected with cylinder, and described cylinder driving shaft is connected with web member through a universal joint.
Preferably, the position that is positioned at the cylinder below on the described back up pad is provided with one or more location notch holes, and said cylinder bottom is provided with the reference column that matches with location notch hole.
It is flexible that vacuum cleaning structure on the chip testing machine of the utility model drives dust absorbing structure through cylinder, and when chip detection, cylinder control vacuum cleaning head shrinks; Be the chip detection vacating space, when core assembly sheet detection finished, cylinder control vacuum cleaning head stretched; The vacuum cleaning head arrives chip and places the position, carry out the dust suction operation after, under the control of cylinder, shrinking; The chip detection machine carries out next step chip detection; So realized each chip is placed the active dust removal operation of position, and testing process do not exerted an influence, improved measuring accuracy.
Description of drawings
Fig. 1 is the blast structural representation of the utility model embodiment;
Fig. 2 is the assembly structure synoptic diagram of the utility model embodiment.
The utility model purpose, function and advantage will combine embodiment, further specify with reference to accompanying drawing.
Embodiment
In conjunction with illustrated in figures 1 and 2; Vacuum cleaning structure on the chip testing machine of present embodiment is installed on chip testing machine test position front end, comprises and the fixing flanged plate 1 of chip testing machine, and a hinge seat 2 and a top board 3 are installed on the said flanged plate 1; On said hinge seat 2 and the top board 3 back up pad 4 is installed; Back up pad 4 is provided with a cylinder 5, and the driving shaft of said cylinder 5 connects an anterior adsorption head 6, and anterior adsorption head 6 front ends are provided with vacuum cleaning 7.
In the said structure; Described vacuum cleaning 7 comprises a rectangular shaped rim 71; Be respectively equipped with the pore 72 of horizontal direction on the front and back frame of described rectangular shaped rim 71; The horizontal pore of front bezel is communicated with downward vertical pore (angular relationship is not shown), on the upper surface of rectangular shaped rim, is provided with a cover plate 73.
For the ease of the installation of cylinder 5 on back up pad 4; Described cylinder 5 is installed on the back up pad 4 through a cylinder holder 8; Described cylinder holder 8 is that a base plate 81 reaches the inverted T-shaped of forming perpendicular to the cylinder connecting portion 82 of base plate 81, and described cylinder connecting portion 82 is provided with an axis hole 83.
On the described back up pad 4 left and right sides be respectively equipped with one protrude in the back up pad plane lug boss 41, be separately installed with slide rail 9 on the described lug boss 41, anterior adsorption head 6 is fixed on the slide rail 9.
Because the matching relationship of each parts is more; In order to eliminate the transmission that tolerance brings and the influence of assembling; Present embodiment is fixed with the web member 10 that is connected with cylinder at described anterior adsorption head 6, and described cylinder driving shaft is connected with web member 10 through a universal joint 11.
The position that is positioned at the cylinder below on the described back up pad 4 is provided with one or more location notch holes 42, and said cylinder 5 bottoms are provided with the reference column 51 that matches with location notch hole 42.
When chip detection, cylinder 5 control vacuum cleanings 7 contraction are the chip detection vacating space; When core assembly sheet detection finishes; Cylinder control vacuum cleaning head stretches, and vacuum cleaning 7 arrives chips and places the position, carry out the dust suction operation after; Under the control of cylinder 5, shrinking, the chip detection machine carries out next step chip detection.
The above is merely the preferred embodiment of the utility model; Be not thus the restriction the utility model claim; Every equivalent structure or equivalent flow process conversion that utilizes the utility model instructions and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the utility model.
Claims (6)
1. the vacuum cleaning structure on the chip testing machine; Be installed on chip testing machine test position front end, it is characterized in that: comprise and the fixing flanged plate of chip testing machine, a hinge seat and a top board are installed on the said flanged plate; One back up pad is installed on said hinge seat and the top board; Back up pad is provided with a cylinder, and the driving shaft of said cylinder connects an anterior adsorption head, and anterior adsorption head front end is provided with the vacuum cleaning head.
2. the vacuum cleaning structure on the described chip testing machine as claimed in claim 1; It is characterized in that: cylinder is installed on the back up pad through a cylinder holder; Described cylinder holder is that a base plate reaches the inverted T-shaped of forming perpendicular to the cylinder connecting portion of base plate, and described cylinder connecting portion is provided with an axis hole.
3. the vacuum cleaning structure on the described chip testing machine as claimed in claim 1; It is characterized in that: on the described back up pad left and right sides be respectively equipped with one protrude in the back up pad plane lug boss; Be separately installed with slide rail on the described lug boss, anterior adsorption head is fixed on the slide rail.
4. the vacuum cleaning structure on the described chip testing machine as claimed in claim 1 is characterized in that: described anterior adsorption head is fixed with the web member that is connected with cylinder, and described cylinder driving shaft is connected with web member through a universal joint.
5. the vacuum cleaning structure on the described chip testing machine as claimed in claim 1; It is characterized in that: the position that is positioned at the cylinder below on the described back up pad is provided with one or more location notch holes, and said cylinder bottom is provided with the reference column that matches with location notch hole.
6. the vacuum cleaning structure on the described chip testing machine as claimed in claim 1; It is characterized in that: described vacuum cleaning head comprises a rectangular shaped rim; Be respectively equipped with the pore of horizontal direction on the front and back frame of described rectangular shaped rim; The horizontal pore of front bezel is communicated with downward vertical pore, on the upper surface of rectangular shaped rim, is provided with a cover plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204561863U CN202471756U (en) | 2011-11-16 | 2011-11-16 | Vacuum dust removal structure on chip test machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204561863U CN202471756U (en) | 2011-11-16 | 2011-11-16 | Vacuum dust removal structure on chip test machine |
Publications (1)
Publication Number | Publication Date |
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CN202471756U true CN202471756U (en) | 2012-10-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011204561863U Expired - Fee Related CN202471756U (en) | 2011-11-16 | 2011-11-16 | Vacuum dust removal structure on chip test machine |
Country Status (1)
Country | Link |
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CN (1) | CN202471756U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106653637A (en) * | 2016-11-29 | 2017-05-10 | 芜湖赋兴光电有限公司 | Camera chip cleaning detection device |
CN113418547A (en) * | 2021-05-17 | 2021-09-21 | 上海旺德实业有限公司 | Experimental device for testing soldering flux assisting effect of chip packaging at different temperatures |
-
2011
- 2011-11-16 CN CN2011204561863U patent/CN202471756U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106653637A (en) * | 2016-11-29 | 2017-05-10 | 芜湖赋兴光电有限公司 | Camera chip cleaning detection device |
CN113418547A (en) * | 2021-05-17 | 2021-09-21 | 上海旺德实业有限公司 | Experimental device for testing soldering flux assisting effect of chip packaging at different temperatures |
CN113418547B (en) * | 2021-05-17 | 2024-04-26 | 旺德新材料(苏州)有限公司 | Soldering effect experimental device for testing chip packaging soldering flux at different temperatures |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Kun Kun science and Technology Industrial Co., Ltd. Assignor: Jin Yingjie Contract record no.: 2012440020281 Denomination of utility model: Vacuum dust removal structure on chip test machine Granted publication date: 20121003 License type: Exclusive License Record date: 20121109 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20141116 |
|
EXPY | Termination of patent right or utility model |