CN113418547B - Soldering effect experimental device for testing chip packaging soldering flux at different temperatures - Google Patents
Soldering effect experimental device for testing chip packaging soldering flux at different temperatures Download PDFInfo
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- CN113418547B CN113418547B CN202110535355.0A CN202110535355A CN113418547B CN 113418547 B CN113418547 B CN 113418547B CN 202110535355 A CN202110535355 A CN 202110535355A CN 113418547 B CN113418547 B CN 113418547B
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- 238000005476 soldering Methods 0.000 title claims abstract description 46
- 230000000694 effects Effects 0.000 title claims abstract description 26
- 230000004907 flux Effects 0.000 title claims abstract description 22
- 238000012360 testing method Methods 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims description 12
- 238000002474 experimental method Methods 0.000 claims abstract description 51
- 230000007246 mechanism Effects 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000002457 bidirectional effect Effects 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/16—Elements for restraining, or preventing the movement of, parts, e.g. for zeroising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Abstract
The invention belongs to the technical field of soldering effect experimental devices, in particular to a soldering effect experimental device for testing soldering flux packaged by a chip at different temperatures, which aims at solving the problems that the current soldering effect experimental device cannot ensure that chips are carried out in a vacuum environment, dust or dirt in air exists in the experimental environment to influence the experiment and the chips with different sizes are inconvenient to fix during the experiment. The proposal is that the experimental box comprises a movable base, wherein the top end of the movable base is fixed with the experimental box, two placing plates are fixed in the experimental box, and vent holes are formed in the placing plates. In the clamping mechanism, the clamping and fastening can be performed on the plurality of chips through the arrangement of the clamping plate, the sliding block, the moving block and the second spring, so that loosening during moving and transportation is avoided, the stability of chip conveying is ensured, meanwhile, the clamping and fastening can be performed on chips with different sizes, and the application range is wide.
Description
Technical Field
The invention relates to the technical field of air soldering effect experimental devices, in particular to a soldering effect experimental device for testing chip packaging soldering flux at different temperatures.
Background
When performing a soldering effect experiment of a chip packaging soldering flux, a plurality of chips using the soldering flux are generally placed in an environment with a higher temperature or a lower temperature for performing the experiment, so that experimental data in different temperature environments can be obtained.
The current soldering effect experimental device cannot guarantee that the chip is carried out under the vacuum environment, so that dust or dirt in the air is easy to exist in the experimental environment, the experiment is influenced, the chip with different sizes is inconvenient to fix in the experiment, the application range is small, and the soldering effect experimental device for testing the chip packaging soldering flux at different temperatures is designed.
Disclosure of Invention
The invention provides a soldering effect experimental device for testing chip packaging soldering flux at different temperatures, which solves the problems that the existing soldering effect experimental device cannot ensure that chips are carried out in a vacuum environment, dust or dirt in air exists in the experimental environment, the experiment is influenced, and the chips with different sizes are inconvenient to fix during the experiment.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The utility model provides a test chip encapsulates soldering flux effect experimental apparatus under different temperatures, including removing the base, remove the top of base and be fixed with the experiment case, experiment incasement is fixed with two and places the board, all set up the air vent on the board of placing, the both sides of air vent all are equipped with the fixture of installing on placing the board, anticollision institution is all installed on the both sides wall of experiment case, the preceding terminal surface of experiment case articulates there is the sealing door, be connected with locking mechanism between sealing door and the experiment case, supporting mechanism is installed to the bottom of experiment case, anticollision institution includes the anticollision board, it has two symmetrical hinge plate I to articulate on the side wall of anticollision board towards the experiment case, hinge plate I's the other end all articulates there is the sliding seat, all set up on the side wall of experiment case with sliding seat matched with sliding tray, all be fixed with the slide bar in the sliding seat, the sliding seat all sliding sleeve is established in the slide bar outside that corresponds, be connected with spring I between the one end of sliding seat and the sliding tray tip that corresponds, spring I all movable sleeve is established on the slide bar that corresponds.
Preferably, the top of experiment case is fixed with the vacuum pump, and the air inlet of vacuum pump is connected with connecting pipe one, and the one end of connecting pipe one extends to the experiment incasement, and the gas outlet department of vacuum pump is connected with connecting pipe two, and the one end of connecting pipe two is connected with the exhaust hood, has seted up two symmetrical inner chambers on the interior diapire of experiment case.
Preferably, the fans are fixed on the inner bottom wall of the inner cavity, the heating plates and the semiconductor refrigerating components fixedly connected in the corresponding inner cavities are respectively arranged above the fans, a plurality of through holes are formed in the heating plates and the semiconductor refrigerating components, and the temperature sensors are fixed on the inner top wall of the experiment box.
Preferably, the supporting mechanism comprises a bottom supporting plate movably connected to the bottom of the experiment box, two symmetrical hinge plates II are hinged to the top end of the bottom supporting plate, and guide seats are hinged to the other ends of the hinge plates II.
Preferably, the guide way matched with two guide holders is all offered to the bottom of experimental box, and screw drive is connected with two-way lead screw on two guide holders, and two-way lead screw rotates to be connected in the guide way, and two-way lead screw's one end extends to the outside of experimental box to the rigid coupling has the knob piece.
Preferably, the clamping mechanism comprises two clamping plates, the bottom ends of the clamping plates are respectively fixed with a sliding block, and the top ends of the placing plates are respectively provided with a sliding groove matched with the sliding blocks.
Preferably, sliding columns are fixed in the sliding grooves, the sliding blocks are sleeved outside the corresponding sliding columns in a sliding mode, a second spring is connected between one ends of the sliding blocks and the corresponding sliding groove end portions, and the second spring is movably sleeved outside the corresponding sliding columns.
Preferably, the locking mechanism comprises a first fixed block fixed on one side wall of the experiment box, a second fixed block fixed on one side wall of the sealing door, a fixed cylinder fixed at one end of the first fixed block, which is away from the second fixed block, is connected with a movable block in a sliding manner in the fixed cylinder, a pull rod is fixed at one end of the movable block, and the pull rod is connected to the first fixed block and the fixed cylinder in a sliding and penetrating manner.
Preferably, a third spring is connected between one end of the movable block and the inner wall of one side of the fixed cylinder, the third spring is movably sleeved on the outer side of the pull rod, the outer side of the pull rod is rotatably sleeved with the rotating block, the second fixed block is movably sleeved on the outer side of the pull rod, a penetrating groove matched with the rotating block is formed in the second fixed block, and a pull ring is further fixed at one end of the pull rod.
Compared with the prior art, the invention has the beneficial effects that:
1. In the anti-collision mechanism, the force generated when the device is impacted by a foreign object can be buffered under the arrangement of the anti-collision plate, the hinge plate I, the sliding seat, the sliding rod and the spring I, so that the chip loosening caused by the impact force is prevented, and the experimental process is influenced.
2. In the supporting mechanism, under the arrangement of the bottom supporting plate, the hinge plate II, the guide seats and the bidirectional screw rods, the bidirectional screw rods are rotated by twisting the knob blocks, and the bidirectional screw rods are in spiral transmission connection with the two guide seats, so that the bottom supporting plate can support the ground, the stability of the experimental box when the experimental box is not moved is ensured, and random movement is avoided.
3. In the clamping mechanism, the clamping and fastening can be performed on the plurality of chips through the arrangement of the clamping plate, the sliding block, the moving block and the second spring, so that loosening during moving and transportation is avoided, the stability of chip conveying is ensured, meanwhile, the clamping and fastening can be performed on chips with different sizes, and the application range is wide.
4. In the locking mechanism, the sealing door and the experiment box can be conveniently locked under the arrangement of the first fixed block, the fixed cylinder, the movable block, the pull rod, the third spring, the rotating block, the second fixed block, the penetrating groove and the pull ring, so that the experiment can be perfectly carried out.
Drawings
Fig. 1 is a schematic diagram of a front view of an experimental device for testing soldering effects of a chip package soldering flux at different temperatures;
Fig. 2 is a schematic structural view showing the development of a sealing door of an experimental device for testing soldering effects of chip packaging soldering flux at different temperatures;
fig. 3 is an enlarged schematic diagram of a position a of a soldering effect experimental device for testing soldering flux packaged by a chip under different temperatures;
Fig. 4 is an enlarged schematic diagram of a structure of a position B of a soldering effect experimental device for testing soldering flux of a chip package at different temperatures;
Fig. 5 is a schematic view showing the structure of the through slot of the soldering effect experimental device for testing the soldering flux of the chip package at different temperatures.
In the figure: 1. a movable base; 2. an experiment box; 21. a vacuum pump; 22. a temperature sensor; 3. placing a plate; 4. sealing the door; 5. a blower; 6. a heating plate; 7. a semiconductor refrigeration assembly; 8. an anti-collision mechanism; 801. an anti-collision plate; 802. a first hinge plate; 803. a sliding seat; 804. a slide bar; 805. a first spring; 9. a support mechanism; 901. a bottom support plate; 902. a second hinge plate; 903. a guide seat; 904. a two-way screw rod; 10. a clamping mechanism; 1001. a clamping plate; 1002. a slide block; 1003. a movable block; 1004. a second spring; 11. a locking mechanism; 1101. a first fixed block; 1102. a fixed cylinder; 1103. a movable block; 1104. a pull rod; 1105. a third spring; 1106. a rotating block; 1107. a second fixed block; 1108. a through groove; 1109. and (5) a pull ring.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-5, an experimental device for testing soldering effects of chip packaging soldering flux at different temperatures comprises a movable base 1, an experimental box 2, a vacuum pump 21, a temperature sensor 22, a placing plate 3, a sealing door 4, a fan 5, a heating plate 6, a semiconductor refrigerating component 7, an anti-collision mechanism 8, an anti-collision plate 801, a hinge plate I802, a sliding seat 803, a sliding rod 804, a spring I805, a supporting mechanism 9, a bottom supporting plate 901, a hinge plate II 902, a guide seat 903, a bidirectional screw 904, a clamping mechanism 10, a clamping plate 1001, a sliding block 1002, a movable block 1003, a spring II 1004, a locking mechanism 11, a fixed block I1101, a fixed cylinder 1102, a movable block 1103, a pull rod 1104, a spring III, a rotating block 1106, a fixed block II 1107, a through groove 1108 and a pull ring 1109, wherein the experimental box 2 is fixed at the top end of the movable base 1, two placing plates 3 are fixed in the experimental box 2, the placing plate 3 is provided with vent holes, the two side walls of the experiment box 2 are provided with anti-collision mechanisms 8, the front end face of the experiment box 2 is hinged with a sealing door 4, each anti-collision mechanism 8 comprises an anti-collision plate 801, two symmetrical hinge plates I802 are hinged on one side wall of the anti-collision plate 801 facing the experiment box 2, the other ends of the hinge plates I802 are hinged with sliding seats 803, one side wall of the experiment box 2 is provided with sliding grooves matched with the sliding seats 803, sliding rods 804 are fixed in the sliding grooves, the sliding seats 803 are arranged on the outer sides of the corresponding sliding rods 804 in a sliding mode, one ends of the sliding seats 803 are connected with the corresponding end portions of the sliding grooves through springs I805, the springs I805 are movably sleeved on the corresponding sliding rods 804, elastic structures are formed between the sliding seats 803 and the corresponding end portions of the sliding grooves through the springs I805, the anti-collision plate 801, the hinge plates 803, the sliding seats 804, the first spring 805 can buffer the force of the device when being impacted by an external object, so as to prevent the chip from loosening caused by the impact force and influence the experimental process;
The top end of the experiment box 2 is fixedly provided with a vacuum pump 21, the air inlet of the vacuum pump 21 is connected with a first connecting pipe, one end of the first connecting pipe extends into the experiment box 2, the air outlet of the vacuum pump 21 is connected with a second connecting pipe, one end of the second connecting pipe is connected with an exhaust hood, two symmetrical inner cavities are formed on the inner bottom wall of the experiment box 2, a fan 5 is fixed on the inner bottom wall of the inner cavity, a heating plate 6 and a semiconductor refrigerating assembly 7 which are fixedly connected in the corresponding inner cavities are respectively arranged above the fan 5, a plurality of through holes are formed on the heating plate 6 and the semiconductor refrigerating assembly 7, a temperature sensor 22 is fixed on the inner top wall of the experiment box 2, the semiconductor refrigerating assembly 7 is a semiconductor refrigerating assembly 7 in the prior art, the model is TEC1-07108, each chip which is subjected to soldering by using soldering flux is placed on the two placement plates 3, in addition, the clamping plate 1001, the sliding block 1002, the moving block 1003 and the second spring 1004 can clamp and fasten a plurality of chips, so that loosening during moving and transportation is avoided, chip conveying stability is guaranteed, chips with different sizes can be clamped and fastened, the application range is wide, in addition, the sealing door 4 is locked, the vacuum pump 21 is started, the vacuum pump 21 is enabled to discharge air in the experiment box 2, dirt or dust in the air is prevented from affecting experiments of the chips, in addition, when the semiconductor refrigeration component 7 or the heating plate 6 is started, the inside of the experiment box 2 can be heated or refrigerated, experimental environments with different temperatures can be manufactured, and the arrangement of the two fans 5 is matched, so that cold air or hot air can be rapidly and uniformly distributed in the experiment box 2, experimental efficiency is improved, signals of the temperature sensor 22 are PT100, the temperature in the experiment box 2 can be monitored, a controller may also be disposed on the outer side wall of the experimental box 2, and an input end of the controller is electrically connected with an output end of the temperature sensor 22.
The supporting mechanism 9 is installed to the bottom of experimental box 2, supporting mechanism 9 includes swing joint in the bottom stay plate 901 of experimental box 2 bottom, the top of bottom stay plate 901 articulates there is two symmetrical articulated slab two 902, the other end of articulated slab two 902 all articulates there is guide holder 903, the guide way with two guide holders 903 matched with is all offered to the bottom of experimental box 2, screw drive is connected with two-way lead screw 904 on two guide holders 903, two-way lead screw 904 rotates to be connected in the guide way, the one end of two-way lead screw 904 extends to the outside of experimental box 2, and the rigid coupling has the knob piece, the convenient operating personnel of knob piece twists.
Under the setting of bottom stay 901, articulated slab two 902, guide holder 903, two-way lead screw 904, through twisting the knob piece for two-way lead screw 904 rotates, because two-way lead screw 904 is connected with two guide holders 903 screw drive, makes bottom stay 901 can support ground then, guarantees the stability of experimental box 2 when not removing, avoids random activity.
The fixture 10 of installing on placing board 3 is all equipped with to the both sides of air vent, fixture 10 includes two grip blocks 1001, the bottom of grip blocks 1001 all is fixed with slider 1002, place board 3's top all seted up with slider 1002 matched with spout, all be fixed with the traveller 1003 in the spout, slider 1002 all slip cap is established in the traveller 1003 outside that corresponds, be connected with spring two 1004 between the one end of slider 1002 all and the spout tip that corresponds, spring two 1004 all movable sleeve is established in the traveller 1003 outside that corresponds, the grip face of grip blocks 1001 is provided with the silica gel protection pad, avoid pressing from both sides the chip bad.
The locking mechanism 11 is connected between the sealing door 4 and the experiment box 2, the locking mechanism 11 comprises a first fixed block 1101 fixed on one side wall of the experiment box 2, a second fixed block 1107 fixed on one side wall of the sealing door 4, one end, deviating from the second fixed block 1107, of the first fixed block 1101 is fixed with a fixed cylinder 1102, a movable block 1103 is connected in the fixed cylinder 1102 in a sliding mode, one end of the movable block 1103 is fixed with a pull rod 1104, the pull rod 1104 is connected to the first fixed block 1101 and the fixed cylinder 1102 in a sliding and penetrating mode, a spring three 1105 is connected between one end of the movable block 1103 and one side inner wall of the fixed cylinder 1102, the spring three 1105 is movably sleeved outside the pull rod 1104, a rotating block 1106 is sleeved on the outer side of the pull rod 1104 in a rotating mode, a penetrating groove 1108 matched with the rotating block 1106 is formed in the second fixed block 1107 in a movable mode, one end of the pull rod 1104 is further fixed with 1109, the penetrating groove 1108 is larger than the cross-section area of the rotating block 1106, the first fixed block 1101, the movable block 1103, the pull rod 1104, the spring three, the rotating block 1105, the second fixed block 1106 and the penetrating groove 1109 are arranged on one side of the fixed block 1102 can be conveniently locked with the experiment box 1104, and the experiment box can be conveniently locked.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (6)
1. The utility model provides a test chip encapsulates soldering flux effect experimental apparatus under different temperatures, includes mobile base (1), its characterized in that, the top of mobile base (1) is fixed with experiment case (2), experiment case (2) internal fixation has two to place board (3), all set up the air vent on placing board (3), both sides of air vent all are equipped with fixture (10) of installing on placing board (3), anticollision institution (8) are all installed on the both sides wall of experiment case (2), the preceding terminal surface of experiment case (2) articulates has sealing door (4), be connected with locking mechanism (11) between sealing door (4) and experiment case (2), the bottom end of the experiment box (2) is provided with a supporting mechanism (9), the anti-collision mechanism (8) comprises an anti-collision plate (801), two symmetrical hinge plates I (802) are hinged on one side wall of the anti-collision plate (801) towards the experiment box (2), the other end of each hinge plate I (802) is hinged with a sliding seat (803), one side wall of the experiment box (2) is provided with sliding grooves matched with the sliding seats (803), sliding rods (804) are fixed in the sliding grooves, the sliding seats (803) are sleeved outside the corresponding sliding rods (804) in a sliding manner, one ends of the sliding seats (803) are connected with springs I (805) between the corresponding sliding groove ends, the first springs (805) are movably sleeved on the corresponding sliding rods (804);
The experimental box is characterized in that a vacuum pump (21) is fixed at the top end of the experimental box (2), a first connecting pipe is connected to an air inlet of the vacuum pump (21), one end of the first connecting pipe extends into the experimental box (2), a second connecting pipe is connected to an air outlet of the vacuum pump (21), an exhaust hood is connected to one end of the second connecting pipe, and two symmetrical inner cavities are formed in the inner bottom wall of the experimental box (2);
A fan (5) is fixed on the inner bottom wall of the inner cavity, a heating plate (6) and a semiconductor refrigerating assembly (7) which are fixedly connected in the corresponding inner cavity are respectively arranged above the fan (5), a plurality of through holes are formed in the heating plate (6) and the semiconductor refrigerating assembly (7), and a temperature sensor (22) is fixed on the inner top wall of the experiment box (2);
The experimental box is characterized in that the supporting mechanism (9) comprises a bottom supporting plate (901) movably connected to the bottom of the experimental box (2), two symmetrical hinge plates II (902) are hinged to the top end of the bottom supporting plate (901), and guide bases (903) are hinged to the other ends of the hinge plates II (902).
2. The device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 1, wherein guide grooves matched with the two guide seats (903) are formed in the bottom end of the test box (2), a bidirectional screw rod (904) is connected to the two guide seats (903) in a spiral transmission mode, the bidirectional screw rod (904) is rotatably connected in the guide grooves, and one end of the bidirectional screw rod (904) extends to the outer side of the test box (2) and is fixedly connected with a knob block.
3. The device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 1, wherein the clamping mechanism (10) comprises two clamping plates (1001), sliding blocks (1002) are fixed at the bottom ends of the clamping plates (1001), and sliding grooves matched with the sliding blocks (1002) are formed in the top ends of the placing plates (3).
4. The device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 3, wherein sliding columns (1003) are fixed in the sliding grooves, the sliding blocks (1002) are sleeved on the outer sides of the corresponding sliding columns (1003) in a sliding mode, a second spring (1004) is connected between one end of each sliding block (1002) and the end portion of the corresponding sliding groove, and the second spring (1004) is sleeved on the outer sides of the corresponding sliding columns (1003) in a movable mode.
5. The device for testing the soldering effect of the chip package soldering flux at different temperatures according to claim 1, wherein the locking mechanism (11) comprises a first fixed block (1101) fixed on one side wall of the test box (2), a second fixed block (1107) fixed on one side wall of the sealing door (4), a fixed cylinder (1102) fixed on one end, away from the second fixed block (1107), of the first fixed block (1101), a movable block (1103) connected in a sliding manner in the fixed cylinder (1102), and a pull rod (1104) fixed on one end of the movable block (1103) and connected in a sliding and penetrating manner on the first fixed block (1101) and the fixed cylinder (1102).
6. The device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 5, wherein a spring III (1105) is connected between one end of the movable block (1103) and one side inner wall of the fixed cylinder (1102), the spring III (1105) is movably sleeved on the outer side of the pull rod (1104), the rotating block (1106) is rotatably sleeved on the outer side of the pull rod (1104), the fixed block II (1107) is movably sleeved on the outer side of the pull rod (1104), a through groove (1108) matched with the rotating block (1106) is formed in the fixed block II (1107), and a pull ring (1109) is further fixed at one end of the pull rod (1104).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110535355.0A CN113418547B (en) | 2021-05-17 | 2021-05-17 | Soldering effect experimental device for testing chip packaging soldering flux at different temperatures |
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| CN202110535355.0A CN113418547B (en) | 2021-05-17 | 2021-05-17 | Soldering effect experimental device for testing chip packaging soldering flux at different temperatures |
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| CN113418547B true CN113418547B (en) | 2024-04-26 |
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| CN208889132U (en) * | 2018-08-09 | 2019-05-21 | 信阳职业技术学院 | Mathematics Application solid geometry experimental provision |
| CN209271484U (en) * | 2018-12-14 | 2019-08-20 | 重庆创测科技有限公司 | A kind of bilayer gate-type chamber |
| CN210294217U (en) * | 2019-07-04 | 2020-04-10 | 广州芯品电子制造有限公司 | Solder paste detection device for chip processing |
| CN110634788A (en) * | 2019-10-08 | 2019-12-31 | 重庆电子工程职业学院 | Chip mounting carrier and mounting method |
| CN211697811U (en) * | 2020-03-19 | 2020-10-16 | 牛桂兵 | Highway engineering tightness proof box that gathers materials |
| CN212044350U (en) * | 2020-04-20 | 2020-12-01 | 南京微客力科技有限公司 | Reversible anchor clamps of soft micro-fluidic chip |
| CN212483762U (en) * | 2020-04-28 | 2021-02-05 | 遂宁合芯半导体有限公司 | Packaged chip testing device |
| CN212641047U (en) * | 2020-05-09 | 2021-03-02 | 苏州华碧微科检测技术有限公司 | Silver chromate test paper making devices |
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