CN202455642U - Lamination multilayer circuit board with buried holes - Google Patents
Lamination multilayer circuit board with buried holes Download PDFInfo
- Publication number
- CN202455642U CN202455642U CN2012200383170U CN201220038317U CN202455642U CN 202455642 U CN202455642 U CN 202455642U CN 2012200383170 U CN2012200383170 U CN 2012200383170U CN 201220038317 U CN201220038317 U CN 201220038317U CN 202455642 U CN202455642 U CN 202455642U
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- CN
- China
- Prior art keywords
- circuit board
- multilayer circuit
- via hole
- buried via
- central layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to the technology of PCB (printed circuit board) printed circuit boards in electronic industry, in particular to a lamination multilayer circuit board with buried holes. The lamination multilayer circuit board comprises a plurality of core boards and outer boards, wherein the outer boards are positioned at the top and at the bottom. The lamination multilayer circuit board is characterized in that the buried holes are etched on the core boards by means of drilling according to a conductive graph requirement and are used for communicating one core board or a plurality of core boards. By the aid of the buried holes, communication between inner boards can be especially improved, the quality and the performance of a multilayer board can be improved, more electronic components can be loaded, and the intensive degree and the integration degree of a circuit are improved.
Description
Technical field
The utility model relates to technology on the PCB printed substrate of electron trade, particularly a kind of lamination multilayer circuit board with buried via hole that adapts to high density interconnection structure.
Background technology
Printed substrate (PCB) is the indispensable fundamental parts of all electronic products, is the carrier of all electronic devices and components, is the main support body of electronics spare part when installing with interconnection.
The kind of printed substrate includes single sided board, double sided board and multi-layer sheet.Wherein, single sided board is the most basic PCB, and this wiring board part concentrates on wherein one side, and lead then concentrates on the another side, can not intersect between harness wiring and must be around path alone.All there is wiring on the two sides of double sided board; Can realize that through the hole circuit connects between the two sides; Therefore but the area of double sided board load-carrying unit is bigger one times than single sided board, and wiring can intermesh (can around to another side), and it is more suitable for being used in than single sided board more on the complicated circuitry.Multi-layer sheet is to make internal layer, one or two single faces work skins with one or more double sided board; Through navigation system and adhesive material alternately together and conductive pattern interconnect by designing requirement; Therefore which floor independently wiring layer is the number of plies of its plank just represented, and can be used in than double sided board more on the complicated circuitry.In response to the difference with the field, the structure of all kinds of required by electronic product wiring boards is also different with the number of plies.
In general, the major product of PCB in China industry is just experiencing by single sided board, double sided board to multiple-plate transformation, and promotes gradually for 6～8 layers from 4～6 courses.From product structure, in, low number of plies plate still is the current main-stream product.And existing P CB wiring board only is provided with through hole 4, is communicated with multiple-plate all flaggies through through hole 4, and is as shown in Figure 1.
Along with electronic equipment becomes increasingly complex; The part that needs is more and more naturally; Circuit and part on the pcb board are also more and more intensive, and list is two-sided all not to reach requirement with its unit are carrying number of electronic components of multilayer circuit board, the circuit dense degree that can realize and integrated degree.Therefore just need accurate laminated circuit board for this class of electronic devices (like mobile phone, digital camera and other communication apparatus etc.).
The utility model content
The utility model has proposed a kind of lamination multilayer circuit board with buried via hole to above-mentioned deficiency, can improve multiple-plate quality and performance, can carry more number of electronic components, improves the dense degree and the integrated degree of circuit.
The technical scheme of the utility model is following:
Lamination multilayer circuit board with buried via hole comprises the several layers central layer, is positioned at the lamina rara externa of end face and bottom surface, it is characterized in that: through the boring etching buried via hole that is communicated with between the central layer is arranged on the said central layer, said buried via hole only is communicated with one deck or multilayer central layer.Said boring etching is made through laser or precision optical machinery.
Said central layer comprises insulating barrier and conductive layer, and said insulating barrier is an epoxy resin, and said conductive layer is electrolytic copper foil or the rolled copper foil that attaches resinae.
Said central layer is processed the lamination multi-layer sheet according to this repeatedly through the structure of buried via hole formation inter-level interconnects.
The aperture of said buried via hole is more than or equal to 0.1mm; Adopt the laser pit to make inter-level interconnects; Precision increases; The random degree of depth of keyhole, but boring all is to adopt machine drilling on the original single sided board, double sided board, technology for preparing plywood, the key point that can not effectively solve buried via hole technology fully are that the interlayer micropore makes.
The beneficial effect of the utility model is following:
The utility model can improve the connection between the central layer especially through the buried via hole that is provided with, and can improve multiple-plate quality and performance, can carry more number of electronic components, improves the dense degree and the integrated degree of circuit.
Description of drawings
Fig. 1 is traditional circuit board structure sketch map
Fig. 2 is the structural representation of the utility model
Wherein, Reference numeral is: 1 lamina rara externa, 2 central layers, 3 buried via holes, 4 through holes.
Embodiment
Lamination multilayer circuit board with buried via hole comprises several layers central layer 2, is positioned at the lamina rara externa 1 of end face and bottom surface, through light or precision optical machinery boring etching the buried via hole 3 that is communicated with between the central layer 2 is arranged on the said central layer 2.As shown in Figure 2, be communicated with the 2nd layer the-the 5th layer of this circuit board through the buried via hole between the two-layer central layer 3, circuit board also is provided with the through hole 4 that is communicated with lamina rara externa 1 and central layer 2 simultaneously, sees all layers of circuit board through through hole 4 conductings.
Said central layer 2 comprises insulating barrier and conductive layer, and said insulating barrier is an epoxy resin, and said conductive layer is electrolytic copper foil or the rolled copper foil that attaches resinae.
Said central layer 2 is processed the lamination multi-layer sheet according to this repeatedly through the structure of buried via hole 3 formation inter-level interconnects.
The aperture of said buried via hole 3 is more than or equal to 0.1mm; Adopt the laser pit to make inter-level interconnects; Precision increases; The random degree of depth of keyhole, but boring all is to adopt machine drilling on the original single sided board, double sided board, technology for preparing plywood, the key point that can not effectively solve buried via hole technology fully are that the interlayer micropore makes.
Claims (4)
1. the lamination multilayer circuit board that has buried via hole comprises the several layers central layer, is positioned at the lamina rara externa of end face and bottom surface, it is characterized in that: through the boring etching buried via hole that is communicated with between the central layer is arranged on the said central layer, said buried via hole only is communicated with one deck or multilayer central layer.
2. lamination multilayer circuit board according to claim 1 is characterized in that: said central layer comprises insulating barrier and conductive layer, and said insulating barrier is an epoxy resin, and said conductive layer is electrolytic copper foil or the rolled copper foil that attaches resinae.
3. lamination multilayer circuit board according to claim 1 and 2 is characterized in that: said central layer is processed the lamination multi-layer sheet according to this repeatedly through the structure of buried via hole formation inter-level interconnects.
4. lamination multilayer circuit board according to claim 3 is characterized in that: the aperture of said buried via hole is more than or equal to 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200383170U CN202455642U (en) | 2012-02-07 | 2012-02-07 | Lamination multilayer circuit board with buried holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200383170U CN202455642U (en) | 2012-02-07 | 2012-02-07 | Lamination multilayer circuit board with buried holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202455642U true CN202455642U (en) | 2012-09-26 |
Family
ID=46871460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200383170U Expired - Fee Related CN202455642U (en) | 2012-02-07 | 2012-02-07 | Lamination multilayer circuit board with buried holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202455642U (en) |
-
2012
- 2012-02-07 CN CN2012200383170U patent/CN202455642U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20180207 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |