CN202449845U - Double-carrier double MEMS (micro-electromechanical system) apparatus encapsulating component - Google Patents
Double-carrier double MEMS (micro-electromechanical system) apparatus encapsulating component Download PDFInfo
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- CN202449845U CN202449845U CN 201120568237 CN201120568237U CN202449845U CN 202449845 U CN202449845 U CN 202449845U CN 201120568237 CN201120568237 CN 201120568237 CN 201120568237 U CN201120568237 U CN 201120568237U CN 202449845 U CN202449845 U CN 202449845U
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Abstract
A double-carrier double MEMS (micro-electromechanical system) apparatus encapsulating component comprises a lead frame, an encapsulating body for encapsulating the lead frame, adhesive tapes, a bonding wire, an inner cavity wall and an outer cavity wall, wherein the lead frame is a double-carrier frame with a first carrier and a second carrier; a first MEMS apparatus is adhered to the first carrier through a first adhesive tape; a second MEMS apparatus is adhered to the second carrier through a second adhesive tape; the second MEMS apparatus is connected with an inner pin of the lead frame through the bonding wire; and gold (copper) balls on a bonding pad of the first MEMS apparatus and a bonding pad of the second MEMS apparatus are connected through the bonding wire. The double-carrier double MEMS apparatus encapsulating component can effectively improve the stability of the MEMS apparatuses, is small in error, high in precision and low in encapsulating cost and achieves functions of an encapsulating shell required by the MEMS apparatus.
Description
Technical field
The utility model belongs to the encapsulation manufacturing technology field of microelectromechanical systems (MEMS) device, specifically a kind of pair of two MEMS device packages of carrier.
Background technology
Based on microelectromechanical systems (MEMS) technology is the comprehensive branch of learning of a quite typical multidisciplinary intersection infiltration, the microcomputer Sensitive Apparatus of microelectromechanical systems (MEMS) is little with its volume, cost is low, simple in structure, can be used widely with advantages such as treatment circuit are integrated and develop rapidly.And the encapsulation of MEMS device is what on the basis of microelectronics Packaging, to be grown up; The MEMS technology has been continued to use many (IC) manufacturing process; But the encapsulation of it and integrated circuit (IC) exists certain difference; Although the MEMS technology is on the basis of integrated circuit (IC) technology, to grow up; Because there are many difference with the IC compared with techniques in MEMS technology at aspects such as material, structure, technology, function and signaling interfaces, be difficult to simple (IC) encapsulation technology is transplanted in the MEMS encapsulation technology, this just makes the MEMS device be faced with many new problems at everyways such as design, material, processing, the system integration, packaging and testing; Wherein encapsulation is that restriction MEMS moves towards one of major reason of industrialization, and encapsulation technology is one of key technology of a puzzlement MEMS device exploitation and practicability always.The purpose of encapsulation is that environment such as chip and external temperature, humidity, air are completely cut off; Play the effect of protection and electrical apparatus insulation; The encapsulation of MEMS device is that the MEMS device moves towards market by the final step of client's acceptance and extensive use, also is a step very crucial during the MEMS device is made.The major function of MEMS device encapsulation has: mechanical support, environmental protection, with the interface of extraneous medium and with being electrically connected of other system.Developed many MEMS devices at present, but the kind of the MEMS device of industrialization, the marketization and few also has many MEMS devices still to fail to walk out the laboratory in a large number, give full play to its potential application in military and civilian goods.Presser sensor chip mainly adopts the strong chip that closes of silicon-glass at present; Yet because the coefficient of expansion of silicon-glass does not match, its type variable is different when being stressed, the particular attribute that the MEMS device material is intrinsic; Make that in encapsulation process heating-up temperature can not surpass the MEMS device temperature.
The utility model content
The utility model technical problem to be solved provides a kind of stability that can effectively improve chip, the two MEMS device packages of two carriers that error is little, precision is high.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of pair of two MEMS device packages of carrier; Encapsulated member, bonded adhesives and the bonding wire, cavity inner wall and the chamber outer wall that comprise lead frame, coating lead frame; Said lead frame is the two carrier frames that are provided with first carrier and second carrier; On said first carrier through the gluing MEMS device that is connected to of first bonding die; Through gluing the 2nd MEMS device that is connected to of second bonding die, the 2nd MEMS device is connected with the interior pin of lead frame through bonding line on second carrier, is connected through bonding line between gold (copper) ball on the pad of a said MEMS device and the 2nd MEMS device pad.
The utility model can effectively improve the stability of chip, and error is little, precision is high, and little to the package dimension of MEMS device, simple in structure, cost is low, realizes that the MEMS device is to the desired function of package casing.
Description of drawings
Fig. 1 is the utility model floor map;
Fig. 2 is the utility model cross-sectional view.
The drawing reference numeral explanation
1, first carrier; 2, the first bonding die glue; 3, a MEMS device; 4, frame inner pin; 5, first bonding line; 6, encapsulated member; 7, second bonding line; 8, second carrier; 9, the 2nd MEMS device; 10, cavity inner wall; 11, chamber outer wall; 12, the second bonding die glue; 13, gold (copper) ball.
The specific embodiment
Like Fig. 1, shown in Figure 2, the two MEMS device packages of a kind of pair of carrier comprise lead frame, coat encapsulated member, bonding die glue and the bonding line of lead frame.Lead frame comprises carrier, towards cavity inner wall of encapsulated member 10 and the outer wall 11 relative with inwall.Described lead frame is the two carrier frames that are provided with first carrier 1 and second carrier 8; Adopt the first bonding die glue 2 to be bonded with a MEMS device 3 on first carrier 1; Adopting the second bonding die glue 12 to be bonded with the 2nd MEMS device 9, the two MEMS devices 9 on second carrier 8 is connected with the interior pin 4 of lead frame through some bonding lines 5; Earlier on the 2nd MEMS device 9 another side pads, plant gold (copper) ball 13 then, a said MEMS device 3 is connected with gold (copper) ball 13 on the 2nd MEMS device 9 through bonding line 14.Exit when interior pin 4 is finally used as MEMS device and system and extraneous main interface and encapsulating structure; Accomplish power supply, the signal of telecommunication or radiofrequency signal and extraneous being electrically connected; Said encapsulated member 6 covers lead frame first carrier 1, second carrier 8, the first bonding die glue 2, the second bonding die glue 12, a MEMS device 3, first bonding line 5, the 2nd MEMS device 9, second bonding line 7; Encapsulated member 6 is processed by insulating materials, and a MEMS device 3, the 2nd MEMS device 9, first bonding line 5, second bonding line 7 have been played support and protective effect.
The utility model adopts following explained hereafter to form:
1, reduction scribing
The wafer attenuate final thickness of this packaging part is according to client MEMS designs demand and packing forms decision; The equipment and materials that attenuate uses is with the product wafer attenuate of common MEMS device encapsulation; Adopt corase grind+fine grinding technology mode, the back side roughness behind the attenuate: Ra is 0.11 mm～0.16mm.Equipment 6 "～8 " DFD3350 slicer, 12 are used in scribing, and " wafer adopts DFD3350 to use the specification and the model of glued membrane to encapsulate with common MEMS device;
2, bonding die
Adopt the two carrier frames of MEMS device; The bonded adhesives of high-adhesive-strength and highly heat-conductive material; With suction nozzle and the Glue dripping head that MEMS device package dimension matches, chip feeders such as AD828, on first carrier 1, put the first bonding die glue 2 earlier; Equipment is drawn the wafer MEMS device 3 on the zona that stretches tight automatically then, and the rotation contraposition is placed on puts above the first bonding die glue 2; Then change wafer and bonding die glue, the point second bonding die glue 12 is placed on the 2nd MEMS device 9 and puts on the second bonding die glue 12 on second carrier 8, glue behind the 2nd MEMS device 9 curing together and has toasted, and baking condition is: 150 ℃, and 3 hours;
3, pressure welding
Use Eagle60 bonding equipment or W3100 Plus bonding equipment; Adopt gold thread or copper cash; Earlier on the 2nd MEMS device 9 left side pads on second carrier 8, plant gold (copper) ball 13, encircle bonding wire on gold (copper) ball 13 of arcings the 2nd MEMS device 9 from a MEMS device 3 then, form the second strong zygonema 7; From a MEMS device 3 inside pin 4 bonding wires, form the first strong zygonema 5.Exit when interior pin 4 is finally used with encapsulating structure with extraneous main interface as MEMS device and system is accomplished being electrically connected of power supply, the signal of telecommunication or radiofrequency signal and the external world.
4, seal
Adopt and IC product packing forms encapsulating mold of the same type and material, adopt full-automatic sealing machine and environment-friendly type plastic packaging material;
5, electroplate
Select the production of the unleaded anti-absciss layer electroplating technology of automatic plating line for use, strict control size of current 95A ± 5A/ groove, coating is even, non-oxidation, does not have remaining flash, meets test stone; Bath temperature: 35 ℃～45 ℃, 5 minutes～8 minutes pickling time.
6, print
Print and adopt general printing anchor clamps, technology is produced with the common plastics encapsulated integrated circuit;
7, Trim Molding
Adopt automatic Trim Molding system, pipe is gone in automatic feed automatically.
Though illustrated and described the present invention in conjunction with the preferred embodiments, those skilled in the art can the people understand, and under the prerequisite of the spirit and scope of the present invention that limit without prejudice to accompanying claims, can make amendment and conversion.
Claims (1)
1. two MEMS device packages of two carriers; Encapsulated member, bonded adhesives and the bonding wire, cavity inner wall and the chamber outer wall that comprise lead frame, coating lead frame; It is characterized in that said lead frame is for being provided with two carrier frames of first carrier (1) and second carrier (8); Said first carrier (1) is gone up and is bonded with a MEMS device (3) through the first bonding die glue (2); Second carrier (8) is gone up and is bonded with the 2nd MEMS device (9) through the second bonding die glue (12); The 2nd MEMS device (9) is connected with the interior pin (4) of lead frame through bonding line (5), is connected through bonding line (7) between the gold on the pad of a said MEMS device (3) and the 2nd MEMS device (9) pad, copper ball (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120568237 CN202449845U (en) | 2011-12-31 | 2011-12-31 | Double-carrier double MEMS (micro-electromechanical system) apparatus encapsulating component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120568237 CN202449845U (en) | 2011-12-31 | 2011-12-31 | Double-carrier double MEMS (micro-electromechanical system) apparatus encapsulating component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202449845U true CN202449845U (en) | 2012-09-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120568237 Expired - Fee Related CN202449845U (en) | 2011-12-31 | 2011-12-31 | Double-carrier double MEMS (micro-electromechanical system) apparatus encapsulating component |
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| Country | Link |
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| CN (1) | CN202449845U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102431951A (en) * | 2011-12-31 | 2012-05-02 | 天水华天科技股份有限公司 | Double-carrier and double-MEMS (micro-electro-mechanical systems) device package and production method thereof |
-
2011
- 2011-12-31 CN CN 201120568237 patent/CN202449845U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102431951A (en) * | 2011-12-31 | 2012-05-02 | 天水华天科技股份有限公司 | Double-carrier and double-MEMS (micro-electro-mechanical systems) device package and production method thereof |
| CN102431951B (en) * | 2011-12-31 | 2015-05-27 | 天水华天科技股份有限公司 | Double-carrier and double-MEMS (micro-electro-mechanical systems) device package and production method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20151231 |
|
| EXPY | Termination of patent right or utility model |