CN202428347U - Grinding disc slotting device - Google Patents
Grinding disc slotting device Download PDFInfo
- Publication number
- CN202428347U CN202428347U CN2011205585507U CN201120558550U CN202428347U CN 202428347 U CN202428347 U CN 202428347U CN 2011205585507 U CN2011205585507 U CN 2011205585507U CN 201120558550 U CN201120558550 U CN 201120558550U CN 202428347 U CN202428347 U CN 202428347U
- Authority
- CN
- China
- Prior art keywords
- generating laser
- galvanometer
- abrasive disk
- swing arm
- grooving apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a grinding disc slotting device, which comprises a laser emitter arranged on a support swing arm, and a galvanometer is arranged below the laser emitter. The grinding disc slotting device is suitable for slotting a grinding disk used in the sapphire substrate wafer processing process, can ensure that the slotting depth reaches 8-9mm and the edges of slots are uniform without damage, improves the quality of grinding wafers, and is concise and reasonable in design structure, convenient to use and easy to operate.
Description
Technical field
The utility model relates to a kind of abrasive disk grooving apparatus, specifically is meant the grooving apparatus of a kind of crystal processing with abrasive disk.
Background technology
Sapphire is a kind of alumina single crystal material, has very high hardness, is the backing material that generally adopts of present LED industry, and the matrix that is used as the growth of gallium nitride homepitaxy is with light emitting diodes such as production blue lights.Need use a kind of abrasive disk in the sapphire process, reach industry requirement through processing on abrasive disk.
The groove that abrasive disk need be left solid shape can be realized the timely discharging of discarded object in even input and output and the process of lapping liquid.Traditional grooving method is through the diamond icking tool is installed on mechanical arm; Icking tool contacts big panel surface and slots through physical action; The groove depth that this method is left is generally in 1 ㎜, and the opening quotation of diamond icking tool damages the edge of groove easily, causes the damage of deep bid; The shallow excessively processing that is unfavorable for wafer of rib groove.Only groove depth is 8-9 ㎜ in the wafer process process, and traditional fluting can't reach requirement, becomes the difficult problem that Sapphire Substrate wafer grinding technique exists.
The utility model content
Deficiency to the prior art existence; The utility model technical problem to be solved is, a kind of abrasive disk grooving apparatus is provided, and is applicable to the fluting of the abrasive disk that Sapphire Substrate wafer process process is used; Can reach groove depth 8-9 ㎜, and the even not damaged in fluting edge.
For solving the problems of the technologies described above, the technical scheme that the utility model is taked is, a kind of abrasive disk grooving apparatus, and it comprises and is installed in the generating laser that supports in the swing arm that galvanometer is installed in the generating laser below.
Above-mentioned abrasive disk grooving apparatus, its generating laser are installed in the front end that supports swing arm, and generating laser forwards protrudes.
Above-mentioned abrasive disk grooving apparatus, its galvanometer are installed in generating laser front end below, and galvanometer moves forward and backward along supporting swing arm.
Above-mentioned abrasive disk grooving apparatus, its generating laser is along supporting arm shaft to protruding forward, and said galvanometer moves along supporting arm shaft forwards, backwards.
The utlity model has following advantage and useful technique effect:
1, is applicable to the fluting of the abrasive disk that Sapphire Substrate wafer process process is used, can reaches groove depth 8-9 ㎜, meet specification requirement;
2, effectively guarantee fluting edge not damaged, improve the grinding wafers quality;
3, the card reparation after being convenient to grind improves the flatness of wafer, reduces wafer simultaneously and cracked probability etc. in process of lapping, occurs;
4, project organization is succinctly reasonable, easy to use, simple to operate.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Among the above-mentioned figure:
The 1-generating laser, the 2-galvanometer, 3-supports swing arm, 4-copper dish.
The specific embodiment
As shown in the figure, the abrasive disk grooving apparatus of the utility model, it comprises the generating laser 1 that is installed in the support swing arm 3, galvanometer 2 is installed in generating laser 1 below.Generating laser 1 is installed in the front end that supports swing arm 3, and generating laser 1 forwards protrudes.Galvanometer 2 is installed in generating laser 1 front end below, and galvanometer 2 moves forward and backward along supporting swing arm 3.Generating laser 1 axially protrudes forward along supporting swing arm 3, and galvanometer 2 axially moves forward and backward along supporting swing arms 3.
Operate according to following steps during use:
(1) rotation copper dish 4;
(2) keep supporting swing arm 3 and do relative uniform motion with copper dish 4;
(3) start generating laser 1 and cooperate galvanometer 2, fluting on copper dish 4.
The above; It only is preferred embodiment to the utility model; Be not to be that the utility model is done other forms of restriction, any professional and technical personnel of being familiar with possibly utilize the technology contents of above-mentioned announcement to change or be modified as the equivalent embodiment of equivalent variations.But every the utility model scheme content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment did, still belongs to the protection domain of the utility model according to the technical spirit of the utility model.
Claims (4)
1. abrasive disk grooving apparatus is characterized in that: it comprises and is installed in the generating laser that supports in the swing arm that galvanometer is installed in the generating laser below.
2. abrasive disk grooving apparatus according to claim 1 is characterized in that: said generating laser is installed in the front end that supports swing arm, and generating laser forwards protrudes.
3. abrasive disk grooving apparatus according to claim 1 is characterized in that: said galvanometer is installed in generating laser front end below, and galvanometer moves forward and backward along supporting swing arm.
4. according to claim 2 or 3 described abrasive disk grooving apparatus, it is characterized in that: said generating laser is along supporting arm shaft to protruding forward, and said galvanometer moves along supporting arm shaft forwards, backwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205585507U CN202428347U (en) | 2011-12-28 | 2011-12-28 | Grinding disc slotting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205585507U CN202428347U (en) | 2011-12-28 | 2011-12-28 | Grinding disc slotting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202428347U true CN202428347U (en) | 2012-09-12 |
Family
ID=46777819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205585507U Expired - Fee Related CN202428347U (en) | 2011-12-28 | 2011-12-28 | Grinding disc slotting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202428347U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015192784A1 (en) * | 2014-06-18 | 2015-12-23 | 蓝思科技股份有限公司 | Copper disc for sapphire polishing, and method of repairing double-face copper disc |
-
2011
- 2011-12-28 CN CN2011205585507U patent/CN202428347U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015192784A1 (en) * | 2014-06-18 | 2015-12-23 | 蓝思科技股份有限公司 | Copper disc for sapphire polishing, and method of repairing double-face copper disc |
| US10220486B2 (en) | 2014-06-18 | 2019-03-05 | Lens Technology Co., Ltd. | Disc containing copper for sapphire polishing, and method for preparing discs containing copper facing each other |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170620 Address after: 266114 Hedong Road, hi tech Zone, Shandong, Qingdao Patentee after: Qingdao Jiaxing Electronic Technology Co., Ltd. Address before: Hongdao hi tech Industrial Development Zone, Qingdao city 266114 Shandong city of Qingdao province (AO Road No. 1 horse) Patentee before: Qingdao iStarWafer Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120912 Termination date: 20171228 |