CN202425203U - V-cut uncovering structure for rigid-flexible circuit board - Google Patents
V-cut uncovering structure for rigid-flexible circuit board Download PDFInfo
- Publication number
- CN202425203U CN202425203U CN2012200172470U CN201220017247U CN202425203U CN 202425203 U CN202425203 U CN 202425203U CN 2012200172470 U CN2012200172470 U CN 2012200172470U CN 201220017247 U CN201220017247 U CN 201220017247U CN 202425203 U CN202425203 U CN 202425203U
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- Prior art keywords
- copper
- flexible
- board
- circuit board
- cut
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a V-cut uncovering structure for a rigid-flexible circuit board. The V-cut uncovering structure for the rigid-flexible circuit board is characterized in that a flexible board is arranged between two layers of copper-clad boards with copper foils; one section of cavity area is respectively formed between the upper surface in the middle of the flexible board and one copper-clad board and between the lower surface in the middle of the flexible board and the other copper-clad board; the upper surface and the lower surface on two end parts of the flexible board are adhered to the copper-clad boards through pure adhesive layers; two V-cuts are respectively formed on the copper-clad boards which are arranged on the outer sides of the two cavity areas; and a cover body is respectively formed on the upper side and the lower side of the flexible board. By the V-cut uncovering structure for the rigid-flexible circuit board, the cover body can be convenient to remove, the product yield is high, and the V-cut uncovering structure for the rigid-flexible circuit board is suitable for mass production.
Description
Technical field
The utility model belongs to the wiring board technical field, relates to a kind of flexible and hard combined circuit board V secant cover-opening structure.
Background technology
Existing Rigid Flex; (greater than 0.3mm) adopts the die-cut hardboard of mould zone of uncapping to have a lot of burrs and have a strong impact on outward appearance when the thickness of hardboard is thicker; It is too high and outerly have liquid medicine to get into the zone of uncapping to adopt mechanical gong to form the regional cost of uncapping; Therefore, be necessary to design a kind of new cover-opening structure.
The utility model content
The utility model technical problem to be solved is the deficiency that overcomes prior art; A kind of flexible and hard combined circuit board V secant cover-opening structure is provided; This flexible and hard combined circuit board V secant cover-opening structure can get rid of lid easily, and rate of finished products is high, is applicable to production in enormous quantities.
The technical solution of utility model is following:
A kind of flexible and hard combined circuit board V secant cover-opening structure is characterized in that flexible board is arranged between the copper-clad plate of two-layer band Copper Foil; Respectively form one section cavity area between the upper surface of flexible board pars intermedia and lower surface and the copper-clad plate; The upper surface at the both ends of flexible board and lower surface are all bonding through pure glue-line and copper-clad plate; In the copper-clad plate in two cavity area outsides, respectively be provided with 2 half secants, respectively form a lid in both sides up and down at flexible board.
Explain: flexible board is the Essential Terms of this area, and like FPC FPC, copper-clad plate is meant that the surface covers the plate of copper, is not the fine copper plate.Half secant has another name called the V secant, and promptly V-cut is to adopt the V-cut blade cuts to form.
Beneficial effect:
The flexible and hard combined circuit board V secant cover-opening structure of the utility model cuts the formula lid owing to designed V, and therefore, after etching, only need vertically break the lid zone into two with one's hands will get rid of the residual hardboard in zone of uncapping, and rate of finished products is high, is applicable to production in enormous quantities.
Description of drawings
Fig. 1 is the structural representation (when not uncapping) of the flexible and hard combined circuit board V secant cover-opening structure of the utility model.
Fig. 2 is the structural representation (when uncapping) of the flexible and hard combined circuit board V secant cover-opening structure of the utility model.
Label declaration: 1-half secant, 2-Copper Foil, the pure glue-line of 3-, 4-flexible board, 5-copper-clad plate, 6-lid.
Embodiment
Below will combine accompanying drawing and specific embodiment that the utility model is explained further details:
As shown in Figure 1, a kind of flexible and hard combined circuit board V secant cover-opening structure is characterized in that flexible board is arranged between the copper-clad plate of two-layer band Copper Foil; Respectively form one section cavity area between the upper surface of flexible board pars intermedia and lower surface and the copper-clad plate; The upper surface at the both ends of flexible board and lower surface are all bonding through pure glue-line and copper-clad plate; In the copper-clad plate in two cavity area outsides, respectively be provided with 2 half secants, respectively form a lid in both sides up and down at flexible board.
Explain: flexible board is the Essential Terms of this area, and like FPC FPC, copper-clad plate is meant that the surface covers the plate of copper, is not the fine copper plate.
Hardboard zone single face height adopts this V-CUT to uncap more satisfactory greater than 0.5mm.This kind mode of uncapping is fit to high-level (more than 8 layers) soft or hard bonded products makes, and production cost is minimum, flow process is simple, is applicable to making in enormous quantities.
Claims (1)
1. a flexible and hard combined circuit board V secant cover-opening structure is characterized in that flexible board is arranged between the copper-clad plate of two-layer band Copper Foil; Respectively form one section cavity area between the upper surface of flexible board pars intermedia and lower surface and the copper-clad plate; The upper surface at the both ends of flexible board and lower surface are all bonding through pure glue-line and copper-clad plate; In the copper-clad plate in two cavity area outsides, respectively be provided with 2 half secants, respectively form a lid in both sides up and down at flexible board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012200172470U CN202425203U (en) | 2012-01-13 | 2012-01-13 | V-cut uncovering structure for rigid-flexible circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012200172470U CN202425203U (en) | 2012-01-13 | 2012-01-13 | V-cut uncovering structure for rigid-flexible circuit board |
Publications (1)
Publication Number | Publication Date |
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CN202425203U true CN202425203U (en) | 2012-09-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2012200172470U Expired - Lifetime CN202425203U (en) | 2012-01-13 | 2012-01-13 | V-cut uncovering structure for rigid-flexible circuit board |
Country Status (1)
Country | Link |
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CN (1) | CN202425203U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103731977A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Non-symmetric flex-rigid combination circuit board and manufacturing method thereof |
CN110324992A (en) * | 2019-07-10 | 2019-10-11 | 高德(无锡)电子有限公司 | A kind of processing technology that Rigid Flex is uncapped using V-Cut docking cutting |
-
2012
- 2012-01-13 CN CN2012200172470U patent/CN202425203U/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103731977A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Non-symmetric flex-rigid combination circuit board and manufacturing method thereof |
CN103731977B (en) * | 2013-12-24 | 2016-08-24 | 广州兴森快捷电路科技有限公司 | Non-symmetric flex-rigid combination circuit board and preparation method thereof |
CN110324992A (en) * | 2019-07-10 | 2019-10-11 | 高德(无锡)电子有限公司 | A kind of processing technology that Rigid Flex is uncapped using V-Cut docking cutting |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20120905 |
|
CX01 | Expiry of patent term |