CN202420687U - Measuring block - Google Patents
Measuring block Download PDFInfo
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- CN202420687U CN202420687U CN2011205455734U CN201120545573U CN202420687U CN 202420687 U CN202420687 U CN 202420687U CN 2011205455734 U CN2011205455734 U CN 2011205455734U CN 201120545573 U CN201120545573 U CN 201120545573U CN 202420687 U CN202420687 U CN 202420687U
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- wafer
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- thermometric
- measurement module
- temperature compensation
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Abstract
The utility model relates to a measuring block which comprises an infrared thermal sensor unit and a light filter unit. The infrared thermal sensor unit comprises a temperature measuring wafer and a temperature compensation wafer which is serially connected with the temperature measuring wafer reversely. The temperature measuring wafer and the temperature compensation wafer are respectively provided with a sensing film, and the sensing film of the temperature measuring wafer is used for receiving infrared signals and the sensing films of the temperature measuring wafer and the temperature compensation wafer are respectively used for receiving noise at the same time. The noise received by the temperature compensation wafer is used for offsetting the noise received by the temperature measuring wafer. The light filter unit is arranged on the path of the sensing film of the temperature measuring wafer which is used for receiving the infrared signals. Consequently, the utility model provides the measuring block capable of effectively reducing the interference of the noise and improving the measuring precision.
Description
Technical field
The utility model is relevant a kind of measurement module, and particularly relevant for a kind of with temperature compensation wafer differential concatenation in the measurement module of thermometric wafer.
Background technology
Be flooded with various infectious disease in the living environment now, and the infection symptoms of many infectious diseases is as preliminary judgement (as: SARS) with body temperature.Yet existing temperature measurement module is when measuring temperature, and regular meeting receives the interference of outside noise, and the temperature that temperature measurement module is recorded is accurate inadequately.
Therefore, how by the structural design of temperature measurement module, make temperature measurement module in the process that measures, reduce the interference of outside noise to temperature measurement module, this has become one of important topic now.
Edge is, the improving of the above-mentioned disappearance of inventor's thoughts is that the spy concentrates on studies and cooperates the utilization of scientific principle, proposes a kind of reasonable in design and effectively improve the utility model of above-mentioned disappearance finally.
The utility model content
The purpose of the utility model is to provide a kind of measurement module, and it can effectively reduce the interference of outside noise, and then improves the precision of measurement module measured numerical value when measuring.
The utility model embodiment provides a kind of measurement module, comprising: an infrared heat sensing unit, comprise a thermometric wafer and differential concatenation a temperature compensation wafer in this thermometric wafer, and this thermometric wafer and this temperature compensation wafer respectively are formed with: a sense film; An and ring-side wall; Form from this sense film periphery extension; This sense film and this ring-side wall surround and define an accommodation space, and the relative two sides of this ring-side wall are defined as one first end face and one second end face, and this first end face is formed with the opening of this accommodation space of connection; This second end face is formed with several bonding pads, and this second end face and this sense film roughly are copline; Wherein, The sense film of this thermometric wafer is in order to receive an infrared signal; And the sense film of the sense film of this thermometric wafer and this temperature compensation wafer receives respectively simultaneously has a noise, and the noise that this temperature compensation wafer is received is in order to offset the noise that this thermometric wafer is received; One filter unit, the sense film that is arranged at this thermometric wafer receives on the path of this infrared signal.
Preferably; This measurement module further includes a circuit board unit and a cover unit; This circuit board unit is fixed and be electrically connected to this infrared heat sensing unit; This cover unit is formed with a through hole, and this cover unit covers at this outside, infrared ray sensing unit and is fixed on this circuit board unit, and this thermometric wafer receives this external signal through this through hole.
Preferably; This thermometric wafer and this temperature compensation wafer are fixed in this circuit board unit with its first end face respectively; And this thermometric wafer and this temperature compensation wafer electrically connect its bonding pad and this circuit board unit with routing respectively, and this filter unit is installed in the through hole of this cover unit.
Preferably, this thermometric wafer and this temperature compensation wafer weld with its bonding pad respectively and are electrically connected at this circuit board unit, and this filter unit is installed in this thermometric wafer.
Preferably, this filter unit is fixed in ring-side wall first end face of this thermometric wafer and hides its opening, and the through hole of this cover unit is roughly corresponding to this filter unit.
Preferably, an end of this filter unit passes the opening of this thermometric wafer and is arranged in this accommodation space and contacts at this ring-side wall inner edge, and the through hole of this cover unit is roughly corresponding to this filter unit.
Preferably, this cover unit is two crown caps, and it is outside that this two crown cap covers at this thermometric wafer and this temperature compensation wafer respectively, and covers at this outside crown cap of this thermometric wafer and be formed with above-mentioned through hole.
Preferably, this measurement module further includes an image unit, and this image unit is installed on this circuit board unit.
Preferably, this circuit board unit has a thermometric block and a shooting block, and the surface of this thermometric block is equiped with this infrared heat sensing unit, this cover unit, reaches this filter unit, and the surface of this shooting block is provided with this image unit.
Preferably; This thermometric block generally perpendicularly is connected in this shooting block; And this measurement module further includes one in order to light is separated into two spectral separator of infrared signal and visible light signal; The position of this pair spectral separator is between this cover unit and this image unit; And the relative two sides of this pair spectral separator are respectively towards this cover unit and this image unit, in order to infrared signal and visible light signal are passed to sense film and this image unit of this thermometric wafer respectively.
In sum; The measurement module that the utility model embodiment is provided; It can offset the noise that the thermometric wafer is received through the noise that the temperature compensation wafer is received, so that the thermometric wafer is offset noise effectively, and then makes the measured numerical value of measurement module more accurate.
For enabling further to understand the characteristic and the technology contents of the utility model; See also following detailed description and accompanying drawing about the utility model; But these explanations and appended graphic the utility model that only is used for explaining, but not the interest field of the utility model is done any restriction.
Description of drawings
Fig. 1 is the floor map of the utility model first embodiment;
Figure 1A is the schematic top plan view of Fig. 1;
Figure 1B is the floor map of another form of Fig. 1;
The elevational schematic view of the infrared heat sensing unit of Fig. 2 the utility model first embodiment;
The schematic top plan view of the infrared heat sensing unit of Fig. 3 the utility model first embodiment;
Fig. 4 levels up the face synoptic diagram for the bonding pad of the utility model first embodiment is electrically connected at transmission;
Fig. 4 A is provided with the floor map of metallic film for the temperature compensation wafer of Fig. 4;
Fig. 4 B is the floor map that one links to each other and constructs for the thermometric wafer of Fig. 4 with the temperature compensation wafer;
Fig. 4 C is not provided with the floor map of thermistor for the temperature compensation wafer of Fig. 4;
Fig. 5 is the floor map of the utility model second embodiment;
Fig. 5 A is the floor map of another form of Fig. 5;
Fig. 6 is the floor map of the utility model the 3rd embodiment;
Fig. 6 A is the floor map of another form of Fig. 6; And
Fig. 7 is the mode of operation synoptic diagram of the utility model the 4th embodiment.
Wherein, description of reference numerals is following:
1 infrared heat sensing unit;
11 thermometric wafers;
111 sense films;
112 ring-side walls;
1,121 first end faces;
1,122 second end faces;
1123 openings;
113 accommodation spaces;
114 thermistors;
115,115 ' bonding pad;
12 temperature compensation wafers;
121 sense films;
122 ring-side walls;
1,221 first end faces;
1,222 second end faces;
1223 openings;
123 accommodation spaces;
124 thermistors;
125,125 ' bonding pad;
126 metallic films;
2 circuit board units;
21 joint sheets;
22 transmission pads;
23 thermometric blocks;
24 shooting blocks;
3 cover unit;
31 through holes;
32 coats of metal;
4 filter units;
41 stickers;
5 image units;
6 pairs of spectral separator;
7 bodies to be measured.
Embodiment
(first embodiment)
See also Fig. 1 to Fig. 4 C, it is first embodiment of the utility model, and present embodiment is a kind of measurement module, comprising: an infrared heat sensing unit 1, a circuit board unit 2, a cover unit 3, an and filter unit 4.
With reference to shown in Fig. 1 and Figure 1A, said infrared heat sensing unit 1 includes structure identical a thermometric wafer 11 and a temperature compensation wafer 12 once more.Wherein, because thermometric wafer 11 is an identical construction with this temperature compensation wafer 12, but be easy-to-read, the Fig. 2 in present embodiment and Fig. 3 only explain thermometric wafer 11 parts.
Said thermometric wafer 11 is formed with a ring-side wall 112 of a sense film 111 and the extension of self-sensing film 111 peripheries, and sense film 111 defines an accommodation space 113 with ring-side wall 112 encirclements.
The relative two sides of above-mentioned ring-side wall 112 are defined as one first end face 1121 and one second end face 1122.Wherein, first end face 1121 be formed with one be communicated in accommodation space 113 opening 1123, the second end faces 1122 be formed with thermistor 114 and several bonding pads 115,115 ', and second end face 1122 roughly is copline with sense film 111.Moreover above-mentioned bonding pad 115,115 ' quantity are example with four in present embodiment, but when practical application, not as limit.
Said thermistor 114 is formed between above-mentioned four bonding pads 115,115 ' wherein two bonding pads 115 ', and thermistor 114 is electrically connected at above-mentioned two bonding pads 115 '.And all the other two bonding pads 115 are electrically connected at above-mentioned sense film 111.
Say that in more detail thermometric wafer 11 carries out etching in centre, make thermometric wafer 11 form above-mentioned sense film 111 in the bottom of etching place, and be not above-mentioned ring-side wall 112 in the etching position in thermometric wafer 11 peripheries.Wherein, thermometric wafer 11 begins to receive etched position promptly to form the opening 1123 of ring-side wall 112 first end faces 1121.
Moreover two bonding pads 115 that are electrically connected at sense film 111 in the thermometric wafer 11 can be considered two signal contacts.And two bonding pads 115 ' that are electrically connected at thermistor 114 can be considered two thermistor signal contacts.
Wherein, the sense film 111 of above-mentioned thermometric wafer 11 is in order to receiving an infrared signal, and the sense film 121 of the sense film 111 of thermometric wafer 11 and temperature compensation wafer 12 receives respectively simultaneously a noise is arranged.Temperature compensation wafer 12 is through being series at thermometric wafer 11, so that the noise that temperature compensation wafer 12 is received can be in order to offset the noise that thermometric wafer 11 is received.
Say that in more detail thermometric wafer 11 is a differential concatenation with the form of connecting of temperature compensation wafer 12, use the noise of offsetting thermometric wafer 11 via temperature compensation wafer 12.The implication of relevant above-mentioned differential concatenation is described further in this for example, and in simple terms: the positive pole that forward series connection is equivalent to a battery is connected in the negative pole of another battery, to reach the effect of effect superposition.The positive pole that differential concatenation is equivalent to a battery is connected in the positive pole of another battery, or the negative pole of a battery is connected in the negative pole of another battery, to reach the effect that effect is offset.
In addition; The sense film 111 of said temperature compensate for wafer 12 can extra plating be provided with a metallic film 126 with reflection external radiation (shown in Fig. 4 A); Use being beneficial to 12 pairs of thermometric wafers of temperature compensation wafer 11 and carrying out ambient-temperature compensation, and then avoid room temperature (room temperature means near the temperature the infrared heat sensing unit 1) to disturb here.
Once more with reference to shown in Figure 1, said circuit board unit 2 is an example with a circuit board in present embodiment.Circuit board unit 2 is formed with a joint sheet 21 and is positioned at joint sheet 21 both sides in the surface several transmission pads 22.
The thermometric wafer 11 of said infrared heat sensing unit 1 is fixed on the joint sheet 21 of circuit board unit 2 with its first end face 1121,1221 respectively with temperature compensation wafer 12, and thermometric wafer 11 and temperature compensation wafer 12 electrically connect its bonding pad 115,115 ', 125 and the transmission pad 22 (as shown in Figure 4) of circuit board unit 2 with routing respectively.And thermometric wafer 11 is one another in series to reach through circuit board unit 2 with temperature compensation wafer 12.
In addition, above-mentioned thermometric wafer 11 and temperature compensation wafer 12 can link to each other both and cut into a continuous structure (shown in Fig. 4 B) when manufacturing with metal wire, use and save the required consumed time of manufacture process.
Said cover unit 3 is an example with a crown cap in present embodiment.The nearly central part of cover unit 3 is formed with a through hole 31, and cover unit 3 is fixed in circuit board unit 2 and covers at infrared heat sensing unit 1 outside.And the through hole 31 of above-mentioned cover unit 3 uses making above-mentioned thermometric wafer 11 receive this external signal through this through hole 31 corresponding to the sense film 111 of thermometric wafer 11.
Moreover cover unit 3 inner edges can plate the coat of metal 32 (as: gold-plated or nickel plating) of establishing an emissivity and being lower than cover unit 3.By this, cover unit 3 can block outside noise effectively and disturb infrared heat sensing unit 1.And when cover unit 3 was heated, the coat of metal 32 of cover unit 3 inner edges can give out the radiant quantity low than cover unit 3, to reduce the interference to infrared heat sensing unit 1.
Said filter unit 4 is an example with an optical filter in present embodiment.Filter unit 4 is arranged at the through hole 31 of cover unit 3 outer rims and covering lid body unit 3.Filter unit 4 in the present embodiment is fixed in cover unit 3 outer rims with a sticker 41; Because the emissivity of sticker 41 is higher; So present embodiment intercepts sticker 41 outside cover unit 3; Use the radiation that is produced when utilizing cover unit 3 isolated stickers 41 to be heated, and then avoid interference infrared heat sensing unit 1.
In addition, the filter unit 4 in the present embodiment is an example to be adhered to cover unit 3 tops, but when practical application not as limit.For example: consult shown in Figure 1B, said filter unit 4 also can be embedded in the through hole 31 (shown in Figure 1B) of cover unit 3.
In addition, the structure of the temperature compensation wafer 12 in the present embodiment is equal to thermometric wafer 11, that is thermometric wafer 11 and temperature compensation wafer 12 have thermistor 114 in all.But when practical application, also can only have and build thermistor 114 (shown in Fig. 4 C) in the above-mentioned thermometric wafer 11.
(second embodiment)
See also Fig. 5 and Fig. 5 A; It is second embodiment of the utility model; The present embodiment and first embodiment are similar, exist together mutually no longer to repeat, and both differences mainly are; Thermometric wafer 11 and temperature compensation wafer 12 are arranged at the direction of circuit board unit 2, and filter unit 4 the position is set.Concrete difference is described below.
Once more with reference to shown in Figure 5, circuit board unit 2 is connected in the bonding pad 115,115 ', 125 on ring-side wall 112,122 second end faces 1122,1222 of thermometric wafer 11 and temperature compensation wafer 12.And above-mentioned ways of connecting can use conducting block (like the tin ball) that the transmission pad 22 of circuit board unit 2 is welded together with above-mentioned bonding pad 115,115 ', 125; Detailed bonding pad 115,115 ', 125 and transmission pad 22 between electrical connection roughly said as first embodiment, use the routing mode that replaces among first embodiment.Yet present embodiment is an example with above-mentioned fixed form, but not as limit.
Wherein, Because the thermometric wafer 11 and the temperature compensation wafer 12 of present embodiment are to be arranged at circuit board unit 2 with its second end face 1122,1222; Event thermometric wafer 11 can part be ground divided by its height of reduction with the ring-side wall 112,122 of temperature compensation wafer 12, and then reaches the effect of dwindling measurement module.
Moreover; Filter unit 4 is fixed in ring-side wall 112 first end faces 1121 of thermometric wafer 11; And the mode of said fixing can use sticker 41 (as: silica gel) that filter unit 4 is adhered to ring-side wall 112 first end faces 1121 of thermometric wafer 11 and hides its opening 1123; Use the effect that reaches sealing, and the through hole 31 of cover unit 3 is roughly corresponding to filter unit 4.Yet present embodiment is an example with above-mentioned fixed form, but not as limit.
In addition, cover unit 3 also can be two crown caps (shown in Fig. 5 A), uses the outside that covers at thermometric wafer 11 and temperature compensation wafer 12 respectively.Wherein, cover at thermometric wafer 11 outside crown caps and be formed with above-mentioned through hole 31.
(the 3rd embodiment)
See also Fig. 6 and Fig. 6 A, it is the 3rd embodiment of the utility model, and the present embodiment and second embodiment are similar, exist together mutually no longer to repeat, and both differences mainly are, said filter unit 4 the position is set.Concrete difference is described below.
Ring-side wall 112 inner edges of said thermometric wafer 11 can form inclined-plane (as shown in Figure 6) or scalariform face (shown in Fig. 6 A); Use the opening 1123 that an end that makes filter unit 4 can pass thermometric wafer 11, and then be arranged in accommodation space 113 and contact at ring-side wall 112 inner edges.By this, make the height of measurement module significantly to reduce further.
(the 4th embodiment)
See also Fig. 7, it is the 4th embodiment of the utility model, and present embodiment is the practical application of above-mentioned first to the 3rd embodiment, that is the measurement module of present embodiment further includes an image unit 5 and a pair of spectral separator 6.Said image unit 5 is an example with an image pick-up device in present embodiment, and the form of implementation of the infrared heat sensing unit among present embodiment Fig. 71 and filter unit 4 is example with first embodiment, but is not subject to this.
Wherein, two spectral separator 6 are example with a light splitting piece (beam splitter) in present embodiment, and it can be in order to separate red outside line signal and visible light signal.But when practical application, the device of any separable infrared signal and visible light signal all can be used as two spectral separator 6, as: germanium form (germanium window) or silicon form (silicon window).
Said circuit board unit 2 is the circuit board that the cross section roughly is the L shape in present embodiment, and a thermometric block 23 and a shooting block 24 that approximate vertical links to each other can be divided in foregoing circuit plate unit 2.Wherein, the inside surface of said thermometric block 23 is equiped with above-mentioned infrared heat sensing unit 1, cover unit 3, and filter unit 4.And above-mentioned shooting block 24 inside surfaces are provided with said image unit 5.
Moreover two spectral separator 6 residing positions are between cover unit 3 and image unit 5.Say that in more detail the relative two sides of two spectral separator 6 are respectively towards cover unit 3 and image unit 5.
When measurement module when measuring a body 7 to be measured; Be passed to the infrared signal and the visible light signal of measurement module via body 7 to be measured; To be separated into infrared signal and visible light signal through two spectral separator 6; Wherein, infrared signal passes the sense film 111 that two spectral separator 6 are passed to thermometric wafer 11, and visible light signal reflexes to image unit 5 through two spectral separator 6.Yet, when practical application, also can be infrared signal and reflex to the sense film 111 (figure is slightly) of thermometric wafer 11, and visible light signal passes two spectral separator 6 and is passed to image unit 5 through two spectral separator 6.
By this, when the user uses measurement module to measure body 7 to be measured, can obtain the temperature and the image of body 7 to be measured simultaneously, use measurement module more easily so that the user to be provided.
In addition, in present embodiment, visible light signal can be that body to be measured 7 reflections just are present in extraneous light originally, and perhaps, measurement module can install light-emitting component (figure slightly) additional, and using when measuring emits beam from measurement module shines in body 7 to be measured.
(effect of embodiment)
According to the utility model embodiment; Above-mentioned measurement module can be through temperature compensation wafer 12 differential concatenations in thermometric wafer 11; The noise that temperature compensation wafer 12 is received is offset the noise that thermometric wafer 11 is received; With of the interference of effective reduction noise to thermometric wafer 11, and then the precision of raising measurement module measured numerical value when measuring.
Moreover second end face 1122,1222 that sees through thermometric wafer 11 and temperature compensation wafer 12 is arranged on the circuit board unit 2, uses the height that is beneficial to measurement module and further reduces.
In addition, measurement module is via installing image unit 5 and two spectral separator 6, when making the user use measurement module to measure body 7 to be measured, can obtain the temperature and the image of body 7 to be measured simultaneously, and then provide the user to use measurement module more easily.
Though preferred embodiment of the utility model such as preceding the introduction and description, what can envision is that to those skilled in the art, it can be design the utility model various modifications embodiment in spirit that does not break away from additional claim and scope.
Claims (10)
1. a measurement module is characterized in that, comprising:
One infrared heat sensing unit comprises a thermometric wafer and the differential concatenation temperature compensation wafer in this thermometric wafer, and this thermometric wafer and this temperature compensation wafer respectively are formed with:
One sense film; And
One ring-side wall; Form from this sense film periphery extension; This sense film and this ring-side wall surround and define an accommodation space, and the relative two sides of this ring-side wall are defined as one first end face and one second end face, and this first end face is formed with the opening of this accommodation space of connection; This second end face is formed with several bonding pads, and this second end face and this sense film are copline;
Wherein, The sense film of this thermometric wafer is in order to receive an infrared signal; And the sense film of the sense film of this thermometric wafer and this temperature compensation wafer receives respectively simultaneously has a noise, and the noise that this temperature compensation wafer is received is in order to offset the noise that this thermometric wafer is received;
One filter unit, the sense film that is arranged at this thermometric wafer receives on the path of this infrared signal.
2. measurement module as claimed in claim 1; It is characterized in that; Further include a circuit board unit and a cover unit, this circuit board unit is fixed and be electrically connected to this infrared heat sensing unit, and this cover unit is formed with a through hole; This cover unit covers at this outside, infrared ray sensing unit and is fixed on this circuit board unit, and this thermometric wafer receives this external signal through this through hole.
3. measurement module as claimed in claim 2; It is characterized in that; This thermometric wafer and this temperature compensation wafer are fixed in this circuit board unit with its first end face respectively; And this thermometric wafer and this temperature compensation wafer electrically connect its bonding pad and this circuit board unit with routing respectively, and this filter unit is installed in the through hole of this cover unit.
4. measurement module as claimed in claim 2 is characterized in that, this thermometric wafer and this temperature compensation wafer weld with its bonding pad respectively and be electrically connected at this circuit board unit, and this filter unit is installed in this thermometric wafer.
5. measurement module as claimed in claim 4 is characterized in that, this filter unit is fixed in ring-side wall first end face of this thermometric wafer and hides its opening, and the through hole of this cover unit is corresponding to this filter unit.
6. measurement module as claimed in claim 4 is characterized in that, an end of this filter unit passes the opening of this thermometric wafer and is arranged in this accommodation space and contacts at this ring-side wall inner edge, and the through hole of this cover unit is corresponding to this filter unit.
7. measurement module as claimed in claim 2 is characterized in that, this cover unit is two crown caps, and it is outside that this two crown cap covers at this thermometric wafer and this temperature compensation wafer respectively, and covers at this outside crown cap of this thermometric wafer and be formed with above-mentioned through hole.
8. like each described measurement module in the claim 2 to 7, it is characterized in that further include an image unit, this image unit is installed on this circuit board unit.
9. measurement module as claimed in claim 8; It is characterized in that; This circuit board unit has a thermometric block and a shooting block, and the surface of this thermometric block is equiped with this infrared heat sensing unit, this cover unit, reaches this filter unit, and the surface of this shooting block is provided with this image unit.
10. measurement module as claimed in claim 9; It is characterized in that; This thermometric block vertically is connected in this shooting block; And this measurement module further includes one in order to light is separated into two spectral separator of infrared signal and visible light signal; The position of this pair spectral separator is between this cover unit and this image unit, and the relative two sides of this pair spectral separator are respectively towards this cover unit and this image unit, in order to infrared signal and visible light signal are passed to sense film and this image unit of this thermometric wafer respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205455734U CN202420687U (en) | 2011-12-20 | 2011-12-20 | Measuring block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205455734U CN202420687U (en) | 2011-12-20 | 2011-12-20 | Measuring block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202420687U true CN202420687U (en) | 2012-09-05 |
Family
ID=46745442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205455734U Expired - Fee Related CN202420687U (en) | 2011-12-20 | 2011-12-20 | Measuring block |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202420687U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107407602A (en) * | 2015-03-25 | 2017-11-28 | 世美特株式会社 | Infrared temperature sensor, circuit substrate and the device using infrared temperature sensor |
| CN107407603A (en) * | 2015-03-25 | 2017-11-28 | 世美特株式会社 | Infrared temperature sensor and the device using infrared temperature sensor |
-
2011
- 2011-12-20 CN CN2011205455734U patent/CN202420687U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107407602A (en) * | 2015-03-25 | 2017-11-28 | 世美特株式会社 | Infrared temperature sensor, circuit substrate and the device using infrared temperature sensor |
| CN107407603A (en) * | 2015-03-25 | 2017-11-28 | 世美特株式会社 | Infrared temperature sensor and the device using infrared temperature sensor |
| CN107407602B (en) * | 2015-03-25 | 2020-10-23 | 世美特株式会社 | Infrared temperature sensor, circuit board, and device using the sensor |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20151220 |
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| EXPY | Termination of patent right or utility model |