CN202405725U - Portable semiconductor laser de-icing device - Google Patents
Portable semiconductor laser de-icing device Download PDFInfo
- Publication number
- CN202405725U CN202405725U CN2011205653256U CN201120565325U CN202405725U CN 202405725 U CN202405725 U CN 202405725U CN 2011205653256 U CN2011205653256 U CN 2011205653256U CN 201120565325 U CN201120565325 U CN 201120565325U CN 202405725 U CN202405725 U CN 202405725U
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- China
- Prior art keywords
- semiconductor laser
- laser
- camera lens
- icing
- collimation camera
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Abstract
The utility model discloses a portable semiconductor laser de-icing device, which comprises a semiconductor laser, a driving power supply, an optical cable and an alignment lens, wherein the semiconductor laser is used for converting electric energy into laser; the driving power supply is connected with the semiconductor laser and used for supplying power to the semiconductor laser; one end of the optical cable is connected to the semiconductor laser and used as a laser transmission channel; and the alignment lens is connected to the other end of the optical cable and used for aligning the laser with a de-icing point. The portable semiconductor laser de-icing device has the advantages of high energy efficiency, safety, non-contact de-icing, low labor intensity, wide application range and the like, and power operation is not influenced.
Description
Technical field
The utility model relates to a kind of electrical power trans mission/distribution system deicer, relates in particular to a kind of portable semiconductor laser deicing device.
Background technology
The icing phenomenon of power transformation system has generation more, has caused heavy damage for operation power and communications and transportation, industrial and agricultural production.Given this; Industry has been developed multiple de-icing method; For example hot de-icing method, mechanical deicing's method, passive de-icing method etc.; Wherein hot de-icing method exists shortcomings such as the ice-melt effect is limited, energy consumption is high, the ice-melt cost high, infringement power circuit, and mechanical deicing's method exists shortcomings such as the scope of application is little, working strength is big, operation easier height, passive de-icing method to have shortcomings such as weak effect, coating life weak point, cost height.It is thus clear that industry still lacks is applied widely, efficiency is high, safety and operate easy de-icing method and device.
The utility model content
The purpose of the utility model is to provide a kind of portable semiconductor laser deicing device, does not still have efficiently to solve prior art, the problem of safe, easy-operating deicer.
For solving the problems of the technologies described above, the portable semiconductor laser deicing device that the utility model provides comprises: semiconductor laser is used to convert electrical energy into laser; Driving power is connected with said semiconductor laser, is used to said semiconductor laser the power supply support is provided; Optical cable, an end is connected in said semiconductor laser, is used for the laser transmission channel; The collimation camera lens is connected in the other end of said optical cable, is used to make laser alignment to remove freezing point.
A kind of preferred implementation according to above-mentioned portable semiconductor laser deicing device; Wherein, Also comprise the tripod that is used to support said collimation camera lens, said collimation camera lens is located on the said tripod so that said collimation camera lens points to highly different icing things movably.
According to a kind of preferred implementation of above-mentioned portable semiconductor laser deicing device, wherein, said collimation camera lens is located on the said tripod through universal joint movably.
The utility model combines technology such as semiconductor laser, power electronics, optical fiber, optical alignment; Convert electric energy to laser energy expeditiously; Through optical cable, collimation camera lens laser beam irradiation that luminous power is controlled to the icing of power equipment; Can fully utilize laser thermal effect, action of gravity and stress effect etc., thereby realize remote, non-contacting band point deicing operation.Thus it is clear that, the utlity model has efficiency height, safety, contactless deicing, do not influence operation power, advantage such as labour intensity is low, applied widely.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiment of the utility model, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the utility model preferred embodiment.
Embodiment
The accompanying drawing that will combine the utility model below carries out clear, intactly description to the technical scheme of the utility model, and obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
Below in conjunction with accompanying drawing and embodiment the utility model is explained further details.
Fig. 1 schematically shows the structure of the utility model preferred embodiment, and is as shown in the figure, and this preferred embodiment comprises driving power 1, semiconductor laser 2, optical cable 3, collimation camera lens 4, universal joint 5, tripod 6.Driving power 1 is connected through power line (unmarked among the figure) with semiconductor laser 2, is used for the power supply support to semiconductor laser being provided.Semiconductor laser 2 is used to convert electrical energy into laser.Optical cable 3 is connected between semiconductor laser 2 and the collimation camera lens 4, and as the laser transmission channel, it can be according to deicing apart from apolegamy.Collimation camera lens 4 is used to make the freezing point of removing on the laser alignment icing thing.
For the ease of moving the position of collimation camera lens 4, reduce operation easier, this preferred embodiment also comprises tripod 6, and collimation camera lens 4 is located on the tripod 6 movably.In this preferred embodiment, collimation camera lens 4 is located on the tripod 6 through universal joint 5, and like this, universal joint 5 can arbitrarily move, and is convenient to collimation camera lens 4 and points to highly different icing things.During application, operating personnel can control collimation camera lens 4 easily, remove the icing of eminence.
Through setting up some functional modules, this preferred embodiment can also be realized following function, and for example power adjustments is suitably adjusted power according to the icing situation, but also single channel is regulated; Overtemperature alarm, electric current is cut off in the too high warning of device temperature automatically; Power shows, the display device operating power; Low power laser indicator lamp is set to confirm ice-melt point position on the collimation camera lens; The single module break-make, each light beam module can work independently, also break-make separately; Adopt two kinds of voltage input modes of AC/DC.
In sum; The utility model is the basis with the semiconductor laser technique; In conjunction with technology such as power electronics, optical fiber, optical alignments, convert electric energy to laser energy expeditiously, through optical cable, collimation camera lens laser beam irradiation that luminous power is controlled to the icing of power equipment; Can fully utilize laser thermal effect, action of gravity and stress effect etc., thereby realize remote, non-contacting charged deicing operation.Wherein, the scattering that laser thermal effect is meant ice influences with the bubble, impurity and the fault of construction of itself that absorb in being iced strongly, and the ice temperature absorption coefficient that will cause icing laser that raises increases, and ensures and removes speed of icing.Stress effect is meant that the each several part of ice can not free wxpansion when the local instantaneous absorption significant amount of energy of ice, and the inside of ice will produce stress wave, and to impact ice body inner, causes ice body cracked.Hence one can see that, the utlity model has multiple advantages, and for example volume is little, in light weight, good portability; Efficiency is high, good reliability; Contactless deicing, insulating properties is better, and the circuit uninterrupted power supply does not influence the normal electricity production work; Deicing is safe and simple, need not climb shaft tower, and the easy manipulation insulating support just can be removed icing easily, alleviates working strength greatly, and it is dangerous to reduce operation; Do not injure and removed ice object, guarantee that ice detachment is safe and reliable; Select powerful laser for use, improve single tube power, reliability, raising power conversion efficiency, Wavelength stabilized, expand aspect such as wave-length coverage and can obtain more outstanding effect, using for laser deicing provides more reliable technique assurance.
The above; Be merely the embodiment of the utility model; But the protection range of the utility model is not limited thereto; Any technical staff who is familiar with the present technique field can expect changing or replacement in the technical scope that the utility model discloses easily, all should be encompassed within the protection range of the utility model.Therefore, the protection range of the utility model should be as the criterion by said protection range with claim.
Claims (3)
1. a portable semiconductor laser deicing device is characterized in that, comprising:
Semiconductor laser is used to convert electrical energy into laser;
Driving power is connected with said semiconductor laser, is used to said semiconductor laser the power supply support is provided;
Optical cable, an end is connected in said semiconductor laser, is used for the laser transmission channel;
The collimation camera lens is connected in the other end of said optical cable, is used to make laser alignment to remove freezing point.
2. portable semiconductor laser deicing device according to claim 1; It is characterized in that; Also comprise the tripod that is used to support said collimation camera lens, said collimation camera lens is located on the said tripod so that said collimation camera lens points to highly different icing things movably.
3. portable semiconductor laser deicing device according to claim 2 is characterized in that said collimation camera lens is located on the said tripod through universal joint movably.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205653256U CN202405725U (en) | 2011-12-30 | 2011-12-30 | Portable semiconductor laser de-icing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205653256U CN202405725U (en) | 2011-12-30 | 2011-12-30 | Portable semiconductor laser de-icing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202405725U true CN202405725U (en) | 2012-08-29 |
Family
ID=46703342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205653256U Expired - Lifetime CN202405725U (en) | 2011-12-30 | 2011-12-30 | Portable semiconductor laser de-icing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202405725U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104348110A (en) * | 2014-11-18 | 2015-02-11 | 国家电网公司 | Overhead high voltage line laser obstacle removal instrument |
| CN109468909A (en) * | 2018-10-26 | 2019-03-15 | 河海大学 | A kind of connected section bridge anti-freezing system of the bridge tunnel based on semiconductor laser technique |
| CN109572946A (en) * | 2018-12-27 | 2019-04-05 | 北京华夏光谷光电科技有限公司 | Suresh Kumar high power laser Ice Breaking System |
| JP7476329B2 (en) | 2020-09-23 | 2024-04-30 | 上海西邦電気有限公司 | Equipment safety protection method applied to laser obstacle removal device |
-
2011
- 2011-12-30 CN CN2011205653256U patent/CN202405725U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104348110A (en) * | 2014-11-18 | 2015-02-11 | 国家电网公司 | Overhead high voltage line laser obstacle removal instrument |
| CN109468909A (en) * | 2018-10-26 | 2019-03-15 | 河海大学 | A kind of connected section bridge anti-freezing system of the bridge tunnel based on semiconductor laser technique |
| CN109572946A (en) * | 2018-12-27 | 2019-04-05 | 北京华夏光谷光电科技有限公司 | Suresh Kumar high power laser Ice Breaking System |
| JP7476329B2 (en) | 2020-09-23 | 2024-04-30 | 上海西邦電気有限公司 | Equipment safety protection method applied to laser obstacle removal device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120829 |