CN202307832U - Wafer drying device - Google Patents
Wafer drying device Download PDFInfo
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- CN202307832U CN202307832U CN2011204206912U CN201120420691U CN202307832U CN 202307832 U CN202307832 U CN 202307832U CN 2011204206912 U CN2011204206912 U CN 2011204206912U CN 201120420691 U CN201120420691 U CN 201120420691U CN 202307832 U CN202307832 U CN 202307832U
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- wafer
- drying
- wafer device
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Abstract
The utility model discloses a wafer drying device. The wafer drying device is used for drying a wafer and comprises a rotary air knife dryer, wherein the rotary air knife dryer is used for rotatably jetting drying air to the surface of the wafer and is arranged relative to the surface of the wafer. The wafer drying device can be used for drying the wafer under the condition that the wafer does not rotate or rotates at a lower speed; the sheet throwing or sheet damaging phenomenon caused by over-high rotating speed of the wafer in the existing centrifugal dehydrating and drying manner is avoided, so that the efficiency and the safety for drying the wafer are efficiently increased; the wafer drying device is especially suitable for the drying technology for a large-size wafer; and the safety for drying the large-size wafer is efficiently increased.
Description
Technical field
The utility model relates to semiconductor applications, relates in particular to a kind of drying wafer device.
Background technology
At present, in the semiconductor production workshop, for the dried of wafer, what usually adopt is that the centrifugal dehydration mode is handled, and promptly in being full of the hothouse of mixed vapour, realizes the drying operation of wafer through the mode of high speed rotating wafer.Fast more when the rotary speed of wafer, the drying efficient of the water droplet on the crystal column surface is high more.
Yet from mechanical movement, high speed rotating itself just has certain risk, occurs getting rid of sheet and fragmentation phenomenon easily.For large scale wafer more,, certain challenge is just arranged for the reliability of clamping wafer like the 450mm wafer.And, then be difficult to arrive good drying efficiency again if reduce rotating speed.
In addition, say that existing centrifugal dehydration mode also forms water stain defective at crystal column surface easily from technological angle.
Therefore, how to provide that a kind of can not rotate or reduce the drying wafer device that improves drying efficiency and production security under the prerequisite of wafer rotary speed at wafer be the technical problem that those skilled in the art need to be resolved hurrily.
The utility model content
The purpose of the utility model is to provide a kind of drying wafer device, can not rotate or reduces and realize higher drying efficiency under the prerequisite of wafer rotary speed at wafer, especially can improve drying efficiency and fail safe for the large scale wafer.
In order to reach above-mentioned purpose, the utility model adopts following technical scheme:
A kind of drying wafer device is used for dry wafer, comprises the rotation air knife drier that is used for to the surperficial rotary-jet dry gas of wafer, and the surface of the said relatively wafer of said rotation air knife drier is provided with.
Preferably; In above-mentioned drying wafer device; Said rotation air knife drier comprises steam generator and at least one group of rotary spray mechanism, and said rotary spray mechanism is arranged at the front and/or the back side of said wafer, and said rotary spray mechanism comprises rotation motor and spray assembly; Said rotation motor drives said spray assembly and rotates, and said steam generator is communicated with through air supply pipe and said spray assembly.
Preferably; In above-mentioned drying wafer device; Said spray assembly comprises center bearing bracket and some showers, and an end of said shower is fixedly connected with said center bearing bracket respectively, and the other end of said shower stretches out respectively; The efferent of said rotation motor is connected with said center bearing bracket, and said steam generator is communicated with said shower respectively through air supply pipe.
Preferably, in above-mentioned drying wafer device, said shower is vertically arranged along pipe shaft and is provided with some spouts, and the scope of the injection direction of said spout and the angle of said wafer is the 50-80 degree.
Preferably, in above-mentioned drying wafer device, the injection direction of said spout and the angle of said wafer are 70 degree.
Preferably, in above-mentioned drying wafer device, said spray assembly comprises three showers, and said shower is by 120 degree separation.
Preferably, in above-mentioned drying wafer device, comprise also being used to drive the wafer clamper that said wafer rotates that the direction that said wafer rotates is opposite with the direction of rotation of said spray assembly.
Preferably, in above-mentioned drying wafer device, also comprise slide block and guide rail that at least one pair of is complementary, said slide block slides along said guide rail, and said slide block is fixedly set in the side of corresponding rotation motor.
Preferably, in above-mentioned drying wafer device, said rotation air knife drier comprises two groups of rotary spray mechanisms, and said rotary spray mechanism is arranged at the front and the back side of said wafer respectively.
Preferably, in above-mentioned drying wafer device, also comprise two pairs of slide blocks that are complementary and guide rail, said slide block slides along said guide rail respectively, and said slide block is fixedly set in the side of corresponding rotation motor respectively.
The beneficial effect of the utility model is following:
The drying wafer device that the utility model provides; Can be through being provided with to the rotation air knife drier of the surperficial rotary-jet dry gas of wafer; Can under the non-rotary prerequisite of wafer, realize drying to wafer; Avoid occurring in the existing centrifugal drying mode owing to the too fast phenomenon that sheet or fragmentation occur getting rid of of wafer rotary speed; Thereby effectively improved the efficient and the fail safe of drying wafer, be particularly useful for large-sized drying wafer technology, effectively improved the fail safe of large scale drying wafer.
In addition; Through being provided for driving the wafer clamper that said wafer rotates; When the direction that said wafer rotates is opposite with the direction of rotation of said spray assembly; The relative velocity of dry gas and crystal column surface can be further improved, thereby the drying efficiency of wafer can be under the prerequisite of the low rotary speed of wafer, improved.
Moreover through slide block and the guide rail that setting is complementary, said slide block slides along said guide rail; Said slide block is fixedly set in the side of said rotation motor; Thereby, through moving slider can the driven rotary motor and the spray assembly move, can further improve the drying efficiency of wafer.
Description of drawings
The drying wafer device of the utility model is provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of the drying wafer device of the utility model one embodiment;
Fig. 2 is the shower injection direction sketch map of the drying wafer device of the utility model one embodiment;
Fig. 3 is the schematic top plan view of rotary spray mechanism of the drying wafer device of the utility model one embodiment;
Fig. 4 is rotary spray mechanism and the schematic top plan view of said wafer reverse rotation of the drying wafer device of the utility model one embodiment;
Fig. 5 is rotary spray mechanism and the schematic side view of said wafer reverse rotation of the drying wafer device of the utility model one embodiment;
Fig. 6 is the sketch map that the rotary spray mechanism of the drying wafer device of the utility model one embodiment departs from said wafer.
Among the figure, spray regime, the injection direction of α-spout and the angle of wafer of the water droplet of 1-wafer, 2-steam generator, 3-rotation motor, 4-air supply pipe, 5-center bearing bracket, 6-shower, 7-wafer clamper, 8-guide rail, 9-air knife, 10-crystal column surface, 11-spray assembly.
Embodiment
Below will do further to describe in detail to the drying wafer device of the utility model.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented the preferred embodiment of the utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize the advantageous effects of the utility model.Therefore, following description is appreciated that extensively knowing to those skilled in the art, and not as the restriction to the utility model.
For clear, whole characteristics of practical embodiments are not described.In following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development possibly be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose, the characteristic that make the utility model is more obviously understandable, be further described below in conjunction with the embodiment of accompanying drawing to the utility model.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 1, shown in Figure 1 is the structural representation of the drying wafer device of the utility model one embodiment.This drying wafer device is used for dry wafer 1, comprises the rotation air knife drier that is used for to the surperficial rotary-jet dry gas of wafer 1, and the surface of the said relatively wafer 1 of said rotation air knife drier is provided with.
In the present embodiment; Said rotation air knife drier comprises steam generator 2, at least one group of rotary spray mechanism; Said rotary spray mechanism is arranged at the front and/or the back side of said wafer 1; Said rotary spray mechanism comprises rotation motor 3 and spray assembly, and said rotation motor 3 drives said spray assembly and rotates, and said steam generator 2 is communicated with through air supply pipe 4 and said spray assembly.In the present embodiment, said rotation air knife drier comprises one group of rotary spray mechanism, and said rotary spray mechanism is arranged at the front of said wafer 1.
Said steam generator 2 is responsible for the used dry gas of control rotary spray mechanism, is generally mixed vapour.That is to say that said steam generator is the place that steam generation mixes,, be responsible for the pressure size of the control steam of supplying simultaneously to spray assembly supply steam.The optional usefulness of said mixture steam has certain volatility, can change the chemicals of wafer 1 surface to the adhesive ability of water, like the mixed vapour of IPA (isopropyl alcohol) with nitrogen.
Preferably; In the present embodiment, said spray assembly comprises center bearing bracket 5 and some showers 6, and an end of said shower 6 is fixedly connected with said center bearing bracket 5 respectively; The other end of said shower 6 stretches out respectively; The efferent of said rotation motor 3 is connected with said center bearing bracket 5, and said steam generator 2 is communicated with said shower 6 respectively through air supply pipe 4, thereby is provided for the mixed vapour of dry wafer 1 to shower 6.
Preferably, please combine to consult Fig. 1 and Fig. 2, wherein, Fig. 2 is the shower injection direction sketch map of the drying wafer device of the utility model one embodiment.Said shower 6 is vertically arranged along pipe shaft and is provided with some spouts (meaning not shown in the figures); The mixed vapour that said spout ejects forms air knife 9; The injection direction of said spout should be the 50-80 degree with the scope of the angle of said wafer 1; So, can obtain to remove preferably the effect of wafer 1 lip-deep water droplet 10.In the present embodiment, the angle of the injection direction of said spout and said wafer 1 is 70 degree.
Preferably, please combine to consult Fig. 1 and Fig. 3, wherein, Fig. 3 is the schematic top plan view of rotary spray mechanism of the drying wafer device of the utility model one embodiment.In the present embodiment, said spray assembly comprises three showers 6, and said shower 6 is by 120 degree separation.So in the spray regime 11 of spray assembly, can spray mixed vapour to wafer 1 equably, thereby, the efficient and the uniformity of raising wafer 1 drying.
Preferably, please continue to consult Fig. 1, Fig. 4 and Fig. 5, wherein, Fig. 4 is rotary spray mechanism and the schematic top plan view of said wafer reverse rotation of the drying wafer device of the utility model one embodiment; Fig. 5 is rotary spray mechanism and the schematic side view of said wafer reverse rotation of the drying wafer device of the utility model one embodiment.The drying wafer device of present embodiment also comprises being used to drive the wafer clamper 7 that said wafer rotates, and the direction that said wafer 1 rotates is opposite with the direction of rotation of said spray assembly.Because the direction that said wafer 1 rotates is opposite with the direction of rotation of said spray assembly, therefore can significantly improve the relative velocity on mixed vapour and wafer 1 surface, thereby can effectively promote the drying efficiency of wafer 1.
Preferably, please continue to consult Fig. 1 and Fig. 6, Fig. 6 is the sketch map that the rotary spray mechanism of the drying wafer device of the utility model one embodiment departs from said wafer.The drying wafer device of present embodiment also comprises at least one pair of slide block that is complementary (meaning not shown in the figures) and guide rail 8, and said slide block slides along said guide rail 8, and said slide block is fixedly set in the side of said rotation motor 3.Through moving slider can driven rotary motor 3 and the spray assembly move, can further improve the drying efficiency of wafer 1.The quantity of the respectively said rotary spray of the quantity of said slide block and guide rail 8 mechanism is identical, in the present embodiment, comprises a pair of slide block that is complementary and guide rail 8.
Certainly, said rotation air knife drier can also comprise two groups of rotary spray mechanisms, and said rotary spray mechanism is arranged at the front and the back side of said wafer respectively.Correspondingly, said rotation air knife drier can also comprise two pairs of slide blocks that are complementary and guide rail, and said slide block slides along said guide rail respectively, and said slide block is fixedly set in the side of corresponding rotation motor respectively.Thereby can realize drying to the positive and negative surface of wafer.Because the structure of two groups of rotary spray mechanisms is identical, as stated, so structure repeats no more.
In sum; The drying wafer device that the utility model provides; Can be through being provided with to the rotation air knife drier of the surperficial rotary-jet dry gas of wafer; Can under the non-rotary prerequisite of wafer, realize drying, avoid occurring in the existing centrifugal drying mode owing to the too fast phenomenon that sheet or fragmentation occur getting rid of of wafer rotary speed to wafer, thus the efficient and the fail safe that have effectively improved drying wafer.Be particularly useful for large-sized drying wafer technology, effectively improved the fail safe of large scale drying wafer.
In addition; Through being provided for driving the wafer clamper that said wafer rotates; When the direction that said wafer rotates is opposite with the direction of rotation of said spray assembly; The relative velocity of dry gas and crystal column surface can be further improved, thereby the drying efficiency of wafer can be under the prerequisite of the low rotary speed of wafer, improved.
Moreover through slide block and the guide rail that setting is complementary, said slide block slides along said guide rail, and said slide block is fixedly set in the side of said rotation motor.Thereby, through moving slider can the driven rotary motor and the spray assembly move, can further improve the drying efficiency of wafer.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.
Claims (10)
1. a drying wafer device is used for dry wafer, it is characterized in that, comprises the rotation air knife drier that is used for to the surperficial rotary-jet dry gas of wafer, and the surface of the said relatively wafer of said rotation air knife drier is provided with.
2. drying wafer device according to claim 1; It is characterized in that; Said rotation air knife drier comprises steam generator and at least one group of rotary spray mechanism, and said rotary spray mechanism is arranged at the front and/or the back side of said wafer, and said rotary spray mechanism comprises rotation motor and spray assembly; Said rotation motor drives said spray assembly and rotates, and said steam generator is communicated with through air supply pipe and said spray assembly.
3. drying wafer device according to claim 2; It is characterized in that; Said spray assembly comprises center bearing bracket and some showers, and an end of said shower is fixedly connected with said center bearing bracket respectively, and the other end of said shower stretches out respectively; The efferent of said rotation motor is connected with said center bearing bracket, and said steam generator is communicated with said shower respectively through air supply pipe.
4. drying wafer device according to claim 3 is characterized in that, said shower is vertically arranged along pipe shaft and is provided with some spouts, and the scope of the injection direction of said spout and the angle of said wafer is the 50-80 degree.
5. drying wafer device according to claim 4 is characterized in that, the injection direction of said spout and the angle of said wafer are 70 degree.
6. drying wafer device according to claim 3 is characterized in that, said spray assembly comprises three showers, and said shower is by 120 degree separation.
7. drying wafer device according to claim 2 is characterized in that, said drying wafer device also comprises the wafer clamper that is used to drive said wafer rotation, and the direction that said wafer rotates is opposite with the direction of rotation of said spray assembly.
8. drying wafer device according to claim 2 is characterized in that, said drying wafer device also comprises slide block and the guide rail that at least one pair of is complementary, and said slide block slides along said guide rail, and said slide block is fixedly set in the side of corresponding rotation motor.
9. according to any described drying wafer device among the claim 2-8, it is characterized in that said rotation air knife drier comprises two groups of rotary spray mechanisms, said rotary spray mechanism is arranged at the front and the back side of said wafer respectively.
10. drying wafer device according to claim 9; It is characterized in that; Said drying wafer device comprises two pairs of slide blocks that are complementary and guide rail, and said slide block slides along said guide rail respectively, and said slide block is fixedly set in the side of corresponding rotation motor respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204206912U CN202307832U (en) | 2011-10-29 | 2011-10-29 | Wafer drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204206912U CN202307832U (en) | 2011-10-29 | 2011-10-29 | Wafer drying device |
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| Publication Number | Publication Date |
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| CN202307832U true CN202307832U (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011204206912U Expired - Fee Related CN202307832U (en) | 2011-10-29 | 2011-10-29 | Wafer drying device |
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| CN (1) | CN202307832U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104233224A (en) * | 2013-06-13 | 2014-12-24 | 浩升开发科技股份有限公司 | Spray ultrasonic coating system and coating method |
| CN104634087A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Blowing device for rapidly drying surfaces of wafers |
| CN106842836A (en) * | 2017-04-05 | 2017-06-13 | 武汉华星光电技术有限公司 | Drying device and the exposure imaging equipment with the drying device |
| CN108592585A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of energy-efficient apparatus capable of fluctuating that Bubble-floating Method is combined with swing method |
| CN108592590A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of method of copper foil surface adherency copper powder when eliminating copper foil cutting of PLC controls |
| CN108592586A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of efficient copper foil surface processor |
| CN108613523A (en) * | 2016-06-25 | 2018-10-02 | 宁波恒进自动化技术有限公司 | A kind of copper foil drying unit that the rotation that can save energy combines |
| CN110265345A (en) * | 2019-05-24 | 2019-09-20 | 信利光电股份有限公司 | A kind of drying method and equipment of underlay substrate |
| WO2021046867A1 (en) * | 2019-09-10 | 2021-03-18 | 苏州超硕凡塑料制品有限公司 | Drying device for plastic products |
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2011
- 2011-10-29 CN CN2011204206912U patent/CN202307832U/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104233224A (en) * | 2013-06-13 | 2014-12-24 | 浩升开发科技股份有限公司 | Spray ultrasonic coating system and coating method |
| CN104634087A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Blowing device for rapidly drying surfaces of wafers |
| CN108613527A (en) * | 2016-06-25 | 2018-10-02 | 宁波恒进自动化技术有限公司 | A kind of apparatus capable of fluctuating that Bubble-floating Method is combined with swing method |
| CN108759419A (en) * | 2016-06-25 | 2018-11-06 | 宁波恒进自动化技术有限公司 | A kind of copper foil surface processor of automation |
| CN108592590A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of method of copper foil surface adherency copper powder when eliminating copper foil cutting of PLC controls |
| CN108592586A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of efficient copper foil surface processor |
| CN108613523A (en) * | 2016-06-25 | 2018-10-02 | 宁波恒进自动化技术有限公司 | A kind of copper foil drying unit that the rotation that can save energy combines |
| CN108613526A (en) * | 2016-06-25 | 2018-10-02 | 宁波恒进自动化技术有限公司 | A kind of automation apparatus capable of fluctuating that Bubble-floating Method is combined with swing method |
| CN108592590B (en) * | 2016-06-25 | 2020-06-12 | 郑贝贝 | Method for eliminating copper powder adhered to surface of copper foil during slitting of copper foil under control of PLC (programmable logic controller) |
| CN108592585A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of energy-efficient apparatus capable of fluctuating that Bubble-floating Method is combined with swing method |
| CN108759418A (en) * | 2016-06-25 | 2018-11-06 | 宁波恒进自动化技术有限公司 | A method of copper foil surface adheres to copper powder when eliminating copper foil cutting |
| CN108800864A (en) * | 2016-06-25 | 2018-11-13 | 宁波恒进自动化技术有限公司 | A kind of copper foil surface processor controlled by PLC |
| CN108826918A (en) * | 2016-06-25 | 2018-11-16 | 宁波恒进自动化技术有限公司 | A kind of automation copper foil drying unit that rotation combines |
| CN106842836A (en) * | 2017-04-05 | 2017-06-13 | 武汉华星光电技术有限公司 | Drying device and the exposure imaging equipment with the drying device |
| CN110265345A (en) * | 2019-05-24 | 2019-09-20 | 信利光电股份有限公司 | A kind of drying method and equipment of underlay substrate |
| WO2021046867A1 (en) * | 2019-09-10 | 2021-03-18 | 苏州超硕凡塑料制品有限公司 | Drying device for plastic products |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130425 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20130425 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20181029 |