Grinding mat trimmer
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of grinding mat trimmer.
Background technology
Grind in the processing procedure in semi-conductor industry; Wafer be can pile up on the lapped face of grinding pad and the material that removes and the abrasive grains in the lapping liquid ground; These particulates will fill up, stop up the micropore hole on the lapped face, make grinding pad lose grainding capacity, and industry is introduced grinding mat trimmer in process of lapping, to repair grinding pad; Grinding mat trimmer is pressed on the lapped face of grinding pad and rotation; On the lapped face of grinding pad, produce cutting and remove the atomic ability of filling, remove and remain in the particulate on the lapped face, make the lapped face of grinding pad be returned to comparatively ideal state again.In addition, grinding mat trimmer also has the lapping liquid of making and is evenly distributed on the grinding pad, stable effect of grinding processing procedure.
Shown in Figure 1 is grinding mat trimmer of the prior art; Said grinding mat trimmer comprises substrate 11; On a surface of said substrate 11, be provided with a plurality of abrasive particles 12, said abrasive particle 12 can be rough diamond, artificial single crystal's diamond, artificial polycrystalline diamond, cubic oxide boron, polycrystal cubic boron oxide etc.In grinding processing procedure; Said substrate 11 is provided with the surface pressure of abrasive particle 12 on the lapped face of grinding pad; Lapping liquid gets on the lapped face of said substrate 11 glands through the gap between the said abrasive particle 12; Particulate by cutting of said grinding mat trimmer and the filling lapped face that removes is discharged the lapped face of said substrate 11 glands through the gap between the said abrasive particle 12, and finally is rinsed out lapped face, reaches dressing purpose.For strengthening the grinding mat trimmer cutting and removing atomic ability; Said grinding mat trimmer comprises the abrasive particle 12 of a greater number usually; This makes that the gap between the said abrasive particle 12 is less, is unfavorable for the entering and the atomic discharge of lapping liquid, and the particulate that can not be discharged from can still be deposited on the lapped face of grinding pad; And become the deleterious particle of scratch crystal column surface; In addition, the difficult entering of lapping liquid makes lapping liquid can not be evenly distributed on the grinding pad, and the stability of processing procedure is ground in influence.
The utility model content
The purpose of the utility model is to provide a kind of grinding mat trimmer, and the surface that its substrate is provided with abrasive particle is provided with curved channel, can improve lapping liquid entering and particulate and discharge efficient, thereby reduce wafer scratch risk, improves the stability of grinding processing procedure.
In order to reach above-mentioned purpose; The utility model provides a kind of grinding mat trimmer; Comprise substrate and abrasive particle, a surface of said substrate is provided with many curved channels, and said many curved channels are arranged between the center and edge of said substrate; Said surface is divided into a plurality of zones, and said abrasive particle is arranged on said a plurality of zone.
Above-mentioned grinding mat trimmer, wherein, said many curved channels are combined to form towards the impeller pattern of certain orientation rotation, and the direction of rotation of said impeller pattern is identical with the direction of rotation of said substrate.
Above-mentioned grinding mat trimmer, wherein, said many curved channels evenly distribute along same circumference.
Above-mentioned grinding mat trimmer; Wherein, said curved channel comprises a gear-like by-pass and a smooth by-pass, along the direction of rotation of said substrate; Said gear-like by-pass is positioned at the place ahead of said smooth by-pass, and the gear of said gear-like by-pass is all towards the edge of said substrate.
Above-mentioned grinding mat trimmer, wherein, in each zone, said abrasive particle is arranged in many rows along the tangential direction of said substrate rotation.
Above-mentioned grinding mat trimmer, wherein, among the same row, the gap between adjacent two abrasive particles equates arbitrarily; Gap between adjacent arbitrarily two rows equates.
Above-mentioned grinding mat trimmer, wherein, said zone comprises a gear-like edge and a smooth edge, and along the direction of rotation of said substrate, said smooth edge is positioned at the place ahead at said gear-like edge.
Above-mentioned grinding mat trimmer wherein, is provided with convexity on the smooth edge in said zone.
The grinding mat trimmer of the utility model is provided with at substrate on the surface of abrasive particle many curved channels is set; Lapping liquid can get into the lapped face of substrate gland through this curved channel; The lapped face of substrate gland can be discharged through this curved channel by abrasive grain cutting and the particulate that removes; Improve the efficient that lapping liquid gets into and particulate is discharged greatly, both helped preventing that particulate was deposited in scratch wafer on the lapped face, improved the finishing effect of grinding mat trimmer; Help lapping liquid again and evenly spread, improve the stability of grinding processing procedure.
Description of drawings
The grinding mat trimmer of the utility model is provided by following embodiment and accompanying drawing.
Fig. 1 is the upward view of grinding mat trimmer of the prior art.
Fig. 2 is the upward view of the grinding mat trimmer of the utility model one embodiment.
Fig. 3 is the sketch map of lapping device in the utility model.
Fig. 4 is the sketch map of curved channel in the utility model.
Fig. 5 is the A-A cutaway view of Fig. 4.
The specific embodiment
Below will combine Fig. 2~Fig. 5 that the grinding mat trimmer of the utility model is done further to describe in detail.
The grinding mat trimmer of the utility model comprises substrate; One surface of said substrate is provided with many curved channels; Said many curved channels are arranged between said substrate center and the edge, and said surface is divided into a plurality of zones, on each zone, are provided with a plurality of abrasive particles.Be provided with at substrate on the surface of abrasive particle many curved channels are set; Lapping liquid can get into the lapped face of substrate gland through this curved channel; The lapped face of substrate gland can be discharged through this curved channel by abrasive grain cutting and the particulate that removes; Improve the efficient that lapping liquid gets into and particulate is discharged greatly, both helped preventing that particulate was deposited in scratch wafer on the lapped face, improved the finishing effect of grinding mat trimmer; Help lapping liquid again and evenly spread, improve the stability of grinding processing procedure.
The existing grinding mat trimmer that specifies the utility model with specific embodiment:
Referring to Fig. 2; The grinding mat trimmer of present embodiment comprises a substrate 200, and said substrate 200 is rounded, is provided with installing hole 210 at the circle centre position of said substrate 200; On a surface 220 of said substrate 200, be provided with many curved channels 230; Said curved channel 230 is arranged between the edge of said installing hole 210 and said substrate 200, is divided into a plurality of regionally 240 with said surperficial 220, on each zone 240, is provided with a plurality of abrasive particles 250.
Because said many curved channels 230 take certain space, the quantity that this has reduced abrasive particle 250 to a certain extent can reduce the risk of abrasive particle 250 scratch grinding pads 300, thereby reduces the risk of grinding pad 300 scratch wafers.
Preferably, said many curved channels 230 evenly distribute along same circumference, and each said shape of regional 240 is all identical, can guarantee that so the grinding effect of zones of different is basic identical.
Referring to Fig. 3; In grinding processing procedure, the surface 220 of said substrate 200 is pressed on the lapped face of grinding pad 300, said substrate 200 and said grinding pad 300 equidirectional rotations; Shown in the arrow among Fig. 3, said substrate 200 all rotates along counter clockwise direction with said grinding pad 300.
Continuation is referring to Fig. 2; Said many curved channels 230 are combined to form towards the impeller pattern of certain orientation rotation; The direction of rotation of said impeller pattern is identical with the direction of rotation of said substrate 200; Help lapping liquid like this and get into said curved channel 230, also help particulate and discharge said curved channel 230.
Continuation is referring to Fig. 2, and preferably, in each zone 240, said a plurality of abrasive particles 250 are arranged in many rows along the tangential direction of said substrate 200 rotations; Among the same row, the gap between adjacent two abrasive particles 250 equates arbitrarily; Gap between adjacent arbitrarily two rows equates;
Because the orientation of said abrasive particle 250 is the tangential direction of said substrate 200 rotations; Said abrasive particle 250 can produce bigger cutting and remove ability, and can keep good flatness, can improve the finishing effect of grinding mat trimmer greatly; And can reduce the quantity of abrasive particle 250; Reduce the risk of scratch grinding pad 300, thereby reduce the risk of grinding pad 300 scratch wafers, in addition; The minimizing of abrasive particle 250 quantity can increase the gap between the abrasive particle 250, helps lapping liquid entering and particulate and discharges;
On each zone 240; Said abrasive particle 250 is distributing regularly; Compare the rambling distribution of abrasive particle in the prior art; It is said regional 240 more smooth and easy more easily that the regular distribution of said abrasive particle 250 makes that lapping liquid gets into, and helps making lapping liquid to be evenly distributed on the grinding pad 300, improves the stability of grinding processing procedure; In addition, it is said regional 240 that the regular distribution of said abrasive particle 250 can make particulate discharge quickly and effectively, can prevent that particulate is deposited in scratch wafer on the lapped face of grinding pad 300, and can improve the finishing effect of grinding mat trimmer.
Referring to Fig. 4; Preferably; Said curved channel 230 comprises a gear-like by-pass 232 and a smooth by-pass 233, and along the direction of rotation (counterclockwise promptly) of said substrate 200, said gear-like by-pass 232 is positioned at the place ahead of said smooth by-pass 233; The gear 234 of said gear-like by-pass 232 helps guiding particulate to discharge the lapped face of said substrate 200 glands all towards the edge of said substrate 200.
Shown in the thin arrow among Fig. 4; The edge of lapping liquid along said curved channel 230 from substrate 200 flows into the center of substrate 200; Lapping liquid passes said curved channel 230 when said curved channel 230 flows smooth by-pass 233 flows into said regional 240, evenly spreads apart through the gap between the said abrasive particle 250 again; Shown in the thick arrow among Fig. 4; Said abrasive particle 250 cuttings and the gap of particulate between said abrasive particle 250 that removes are delivered to the gear-like by-pass 232 of said curved channel 230; Under the guiding function of said gear 234, particulate is discharged the lapped face of said substrate 200 glands through said curved channel 230.
Referring to Fig. 5, preferably, on said regional 240 smooth edge, be provided with protruding 241; On the one hand; Said protruding 241 hinder lapping liquid to a certain extent flows into said regionally 240, can be used to control the flow of lapping liquid, prevents that lapping liquid from pouring in said regional 240; On the other hand, said protruding 241 can to stop that the particulates that are transported in the said curved channel 230 get into once more said regional 240, helps atomic discharge.
Obviously, those skilled in the art can carry out various changes and modification to utility model and not break away from the spirit and the scope of the utility model.Like this, if these of the utility model are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these change and modification.