CN202277980U - Cleaning device for semiconductor substrate - Google Patents
Cleaning device for semiconductor substrate Download PDFInfo
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- CN202277980U CN202277980U CN 201120422069 CN201120422069U CN202277980U CN 202277980 U CN202277980 U CN 202277980U CN 201120422069 CN201120422069 CN 201120422069 CN 201120422069 U CN201120422069 U CN 201120422069U CN 202277980 U CN202277980 U CN 202277980U
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- semiconductor substrate
- cleaning device
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- unit
- substrate cleaning
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Abstract
The utility model provides a cleaning device for a semiconductor substrate, which belongs to the technical field of production of the semiconductor substrates. The cleaning device for the semiconductor substrate, disclosed by the utility model, comprises a carrying table, as well as a transmission unit, a cleaning unit and an air-drying unit, which are arranged above the carrying table, wherein the cleaning unit comprises a fluid pipeline and a plurality of spray heads communicated with the fluid pipeline; each spray head comprises a water inlet part, a water outlet part and a spray head body, each water outlet part comprises a water outlet cavity and a water outlet hole, each water outlet cavity comprises a cylindrical barrel body and a conical surface-shaped top wall, the vertex of each conical surface-shaped top wall faces towards the bottom of the barrel body, and each water outlet hole is arranged at the center of the bottom of the barrel body. According to the cleaning device disclosed by the utility model, the working efficiency of the cleaning device for the semiconductor substrate can be improved.
Description
Technical field
The utility model relates to the semiconductor substrate production technical field, is specifically related to a kind of semiconductor substrate cleaning device.
Background technology
General semiconductor substrate (like tft array substrate) must can carry out next step operation and handle respectively through cleaning and air-dry processing after completing then.At present; To the machine that semiconductor substrate cleans, have and clean and air-dry function, but in actual production process; The designer finds that these machines are when cleaning semiconductor substrate; The area that its each shower nozzle can clean is less and cleaning is even inadequately, thereby causes cleaning performance bad, has had a strong impact on the operating efficiency of cleaning machine.
The utility model content
The utility model technical problem to be solved provides a kind of semiconductor substrate cleaning device, in order to improve the operating efficiency of semiconductor substrate cleaning device.
For solving the problems of the technologies described above, the utility model provides scheme following:
A kind of semiconductor substrate cleaning device comprises:
One plummer;
Be arranged on delivery unit, cleaning unit and the air-dry unit of said plummer top;
Said cleaning unit comprises fluid line and a plurality of shower nozzles that are communicated with said fluid line;
Wherein, Said shower nozzle comprises water entering section, outlet part and head body; Said outlet part includes water chamber and apopore, and wherein, said water chamber is made up of a staving cylindraceous and a conical surface-shaped roof; The summit of said conical surface-shaped roof is towards the bottom of said staving and near said apopore place, and said apopore is arranged on the center of the bottom of said staving.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
Be formed with a spiral fluid passage in the said head body, said water entering section is communicated with said fluid line, and said outlet part is communicated with said water entering section through said fluid passage.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
Said fluid line comprises a plurality of sub-pipes that are parallel to each other, and it is terminal that said shower nozzle is arranged on said sub-pipes, is communicated with said sub-pipes.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
Said delivery unit comprises a plurality of drive and conveyer belts that driven by a power source, and said drive is arranged on the said plummer, and said conveyer belt is set around on the said drive.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
Said air-dry unit comprises:
Be arranged on the said plummer, be used for the ultrasonic vapourizing unit of the liquid on the ultrasonic vaporization semiconductor substrate.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
Said air-dry unit also comprises:
The air inlet pipe of said plummer top is set; And
Be communicated with, be used for said semiconductor substrate is carried out the air knife group of air-dry processing with said air inlet pipe.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
Said ultrasonic vapourizing unit and said air knife group are provided with along the direction of transfer of said delivery unit in proper order.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
The air outlet of said air knife group towards, become an angle greater than 90 degree with the direction of transfer of said delivery unit.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
Said air knife group comprises:
Be installed on the said plummer and be positioned at the more than one air knife of said semiconductor substrate below;
And/or, be installed on the said air inlet pipe and be positioned at the more than one air knife of said semiconductor substrate top.
Preferably, in the above-mentioned semiconductor substrate cleaning device,
The area of the cross section of the air inlet of said air knife is greater than the area of the cross section of the air outlet of said air knife.
Can find out from the above; The semiconductor substrate cleaning device that the utility model embodiment provides; Through special sprinkler design, make shower nozzle when atomizing of liquids, can spray evenly and jet velocity can be improved, liquid forms a umbrella shape jeting effect after ejection; Can increase the cleaning area of single shower nozzle and improve cleaning performance, thereby improve cleaning efficiency.And; The utility model increases ultrasonic vapourizing unit the moisture film on the semiconductor substrate is carried out ultrasonic vaporization in air-dry unit, and then is undertaken air-dryly by air knife, can overcome prior art and still have problems such as water droplet is residual after air-dry; Reach better air-dry effect, improve air-dry efficient.
Description of drawings
The side view of the semiconductor substrate cleaning device that Fig. 1 provides for the utility model embodiment;
Fig. 2 is the vertical view of cleaning unit among the utility model embodiment;
Fig. 3 is the structural representation of the shower nozzle of the utility model embodiment;
Fig. 4 is the decomposing schematic representation of outlet part of the shower nozzle of the utility model embodiment;
Fig. 5 is the another kind of sketch map of the fluid passage that shower nozzle can adopt among the utility model embodiment;
Fig. 6 is the structural representation of the air knife of the utility model embodiment;
Fig. 7 is the manufacturing sketch map of outlet part of the shower nozzle of the utility model embodiment.
The specific embodiment
The semiconductor substrate cleaning device that the utility model provides adopts novel sprinkler design, make cleaning more evenly, cleaning area is bigger, thereby improved the effect and the efficient of cleaning.And the utility model also through in air-dry unit, increasing ultrasonic vaporization design, has improved air-dry efficient, and it is residual to guarantee that semiconductor substrate does not have water droplet, thereby has improved the operating efficiency of semiconductor substrate cleaning device greatly.
Below will combine accompanying drawing, the utility model will be further described through specific embodiment.
Please with reference to Fig. 1～4; Wherein, Fig. 1 is the side view of the described semiconductor substrate cleaning device of present embodiment; Fig. 2 is the vertical view of cleaning unit in the said semiconductor substrate cleaning device, and Fig. 3 is the structural representation of the shower nozzle of present embodiment, and Fig. 4 is the decomposing schematic representation of outlet part of the shower nozzle of present embodiment.
The semiconductor substrate cleaning device of present embodiment comprises a plummer 40 and the delivery unit, cleaning unit and the air-dry unit that are arranged on said plummer 40 tops; Wherein,
Said cleaning unit comprises:
Be arranged on the fluid line 11 of said delivery unit top;
Be arranged on water inlet 12 and soup import 13 on the said fluid line 11; And
Be arranged on a plurality of shower nozzles 14 on the said fluid line 11, said shower nozzle 14 all is communicated with said fluid line 11;
Wherein, said shower nozzle 14 comprises water entering section 141, outlet part 142 and head body 143.The outlet part 142 of said shower nozzle 14 includes water chamber 1421 and apopore 1422, and said water chamber 1421 is made up of a staving 14211 cylindraceous and a conical surface-shaped roof 14213.The summit of said conical surface-shaped roof 14213 is towards the bottom of said staving 14211 and near said apopore 1422 places, and said apopore 1422 is arranged on the center of the bottom of said staving 14211.
Among Fig. 3, be formed with a spiral fluid passage 1431 in the said head body 143, said water entering section 141 is communicated with said fluid line 11, and said outlet part 142 is communicated with said water entering section 141 through said fluid passage 1431.The manufacture of head body 143 can be with reference to figure 7; At first on the taper seat of a cone 145, etch a spiral helicine groove 14310; And then cone 145 is sheathed in the structure that an inner surface is a taper seat; And the taper seat of this inner surface and cone 145 is fitted tightly, thereby make groove 14310 wherein form said fluid passage 1431.
Fig. 5 gives the another kind of sketch map of the fluid passage that can adopt in the said shower nozzle of present embodiment.Fluid passage 1431 ' among Fig. 5 is a solenoid shape formula passage under the periphery screw; Its manufacture can be: at first; Etch groove 1431 ' at a cylindrical outer surface; Then this cylinder is being sheathed in the structure that an inner surface is the face of cylinder, and this inner surface and cylindrical intimate are fitted, thereby making groove 1431 ' wherein form said fluid passage.
Here; Said delivery unit comprises a plurality of drive 31 and conveyer belts 32 that driven by a power source (not shown); Said drive 31 is arranged on the said plummer 40; Said conveyer belt 32 is set around on the said drive 31, and semiconductor substrate 50 is delivered to cleaning unit and air-dry unit successively through the said conveyer belt 32 of stating.
As can beappreciated from fig. 2, the said fluid line 11 of present embodiment comprises a plurality of sub-pipes that are parallel to each other 111; Said shower nozzle 14 is arranged on the said sub-pipes 111, is communicated with said sub-pipes 111.
After adopting above-mentioned shower nozzle 14 structures; Present embodiment is when carrying out the semiconductor substrate cleaning; The water or the soup that clean usefulness are getting into water chamber 1421 through said fluid passage 1431, at water chamber 1421 formation rotating vortex as shown in Figure 3, are injected into semiconductor substrate 50 through apopore 1422 at last; Its spray evenly and jet velocity also than the obvious increase of prior art; Liquid forms the umbrella shape jeting effect after ejection, can increase the cleaning area of single shower nozzle and improve cleaning performance, thereby improve cleaning efficiency.
Present embodiment also further improves existing air-dry unit, and please with reference to shown in Figure 1, the air-dry unit of present embodiment comprises:
Be arranged on the said plummer 40, be used for the ultrasonic vapourizing unit 15 of the liquid on the ultrasonic vaporization semiconductor substrate;
The air inlet pipe 21 of said plummer 40 tops is set, and said air inlet pipe 21 is provided with the inlet 22 of gases at high pressure; And
The air knife group that is communicated with, is used for said semiconductor substrate is carried out air-dry processing with said air inlet pipe 21.
Wherein, said air knife group comprises plural air knife, can be installed on the plummer 40 and/or is installed on the said air inlet pipe 21.Among Fig. 1, said air knife group comprises and is installed on the said plummer 40 and is positioned at the air knife 25 of said semiconductor substrate 50 belows and is installed on the said air inlet pipe 21 and is positioned at the air knife 23 and 24 of said semiconductor substrate 50 tops.
In the structure of above-mentioned air-dry unit; Said ultrasonic vapourizing unit 15 is provided with the direction of transfer of said air knife group along said delivery unit in proper order; Be semiconductor substrate when direction of transfer advances, earlier through the primary importance at ultrasonic vapourizing unit 15 places, again through the second place at air knife group place.Like this, can carry out ultrasonic vaporization by the moisture film on 15 pairs of semiconductor substrates of ultrasonic vapourizing unit earlier, and then undertaken air-dryly by air knife, can overcome prior art and still have problems such as water droplet is residual after air-dry, reach better air-dry effect, enhance productivity.
Here; In order to obtain preferable ultrasonic vaporization effect, require ultrasonic vapourizing unit 15 and semiconductor substrate close usually, for example; Within several cm range; Therefore can ultrasonic vapourizing unit 15 be arranged on the plummer 40, when work, be in semiconductor substrate below, with obtain and semiconductor substrate between nearer distance.Certainly, ultrasonic vapourizing unit 15 also can be arranged on the top of semiconductor substrate.
For realizing better air-dry effect, in the present embodiment, the air outlet of said air knife group towards, become an angle greater than 90 degree with the direction of transfer of said delivery unit.Like this, air knife just can improve relative wind velocity to head-on blowing over against the next of said semiconductor substrate, obtains better air-dry effect.
Please with reference to Fig. 6, Fig. 6 has further provided a kind of concrete structure of the air knife that present embodiment can adopt.Said air knife comprises air knife body 232, air inlet 231 and air outlet 233; Wherein, said air inlet 231 is communicated with air inlet pipe 21, and said air outlet 233 is towards the conveyer belt of below; And the area of the cross section of said air inlet 231 is greater than the area of the cross section of said air outlet 233; To increase the pressure of air outlet, improve wind speed, obtain better air-dry effect.
Below a kind of application of the semiconductor substrate cleaning device of explanation present embodiment:
To sum up, the semiconductor substrate cleaning device that the utility model embodiment provides can provide cleaning efficiency and air-dry efficient, thereby enhances productivity.
Claims (10)
1. semiconductor substrate cleaning device comprises:
One plummer;
Be arranged on delivery unit, cleaning unit and the air-dry unit of said plummer top;
It is characterized in that said cleaning unit comprises fluid line and a plurality of shower nozzles that are communicated with said fluid line;
Wherein, Said shower nozzle comprises water entering section, outlet part and head body; Said outlet part includes water chamber and apopore, and wherein, said water chamber is made up of a staving cylindraceous and a conical surface-shaped roof; The summit of said conical surface-shaped roof is towards the bottom of said staving and near said apopore place, and said apopore is arranged on the center of the bottom of said staving.
2. semiconductor substrate cleaning device as claimed in claim 1 is characterized in that,
Be formed with a spiral fluid passage in the said head body, said water entering section is communicated with said fluid line, and said outlet part is communicated with said water entering section through said fluid passage.
3. semiconductor substrate cleaning device as claimed in claim 1 is characterized in that,
Said fluid line comprises a plurality of sub-pipes that are parallel to each other, and it is terminal that said shower nozzle is arranged on said sub-pipes, is communicated with said sub-pipes.
4. semiconductor substrate cleaning device as claimed in claim 1 is characterized in that,
Said delivery unit comprises a plurality of drive and conveyer belts that driven by a power source, and said drive is arranged on the said plummer, and said conveyer belt is set around on the said drive.
5. semiconductor substrate cleaning device as claimed in claim 1 is characterized in that,
Said air-dry unit comprises:
Be arranged on the said plummer, be used for the ultrasonic vapourizing unit of the liquid on the ultrasonic vaporization semiconductor substrate.
6. semiconductor substrate cleaning device as claimed in claim 5 is characterized in that,
Said air-dry unit also comprises:
The air inlet pipe of said plummer top is set; And
Be communicated with, be used for said semiconductor substrate is carried out the air knife group of air-dry processing with said air inlet pipe.
7. semiconductor substrate cleaning device as claimed in claim 6 is characterized in that,
Said ultrasonic vapourizing unit and said air knife group are provided with along the direction of transfer of said delivery unit in proper order.
8. semiconductor substrate cleaning device as claimed in claim 6 is characterized in that,
The air outlet of said air knife group towards, become an angle greater than 90 degree with the direction of transfer of said delivery unit.
9. like each described semiconductor substrate cleaning device of claim 6 to 8, it is characterized in that,
Said air knife group comprises:
Be installed on the said plummer and be positioned at the more than one air knife of said semiconductor substrate below;
And/or, be installed on the said air inlet pipe and be positioned at the more than one air knife of said semiconductor substrate top.
10. semiconductor substrate cleaning device as claimed in claim 9 is characterized in that,
The area of the cross section of the air inlet of said air knife is greater than the area of the cross section of the air outlet of said air knife.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120422069 CN202277980U (en) | 2011-10-28 | 2011-10-28 | Cleaning device for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120422069 CN202277980U (en) | 2011-10-28 | 2011-10-28 | Cleaning device for semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202277980U true CN202277980U (en) | 2012-06-20 |
Family
ID=46224166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120422069 Expired - Lifetime CN202277980U (en) | 2011-10-28 | 2011-10-28 | Cleaning device for semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202277980U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752571A (en) * | 2013-12-27 | 2014-04-30 | 深圳市华星光电技术有限公司 | Substrate washing device |
| CN110216094A (en) * | 2018-03-02 | 2019-09-10 | 金铉泰 | The scaling powder cleaning systems of cleaning object can independently be cleaned |
| CN110860509A (en) * | 2019-11-28 | 2020-03-06 | 湖南凯通电子有限公司 | Substrate cleaning device and cleaning method thereof |
-
2011
- 2011-10-28 CN CN 201120422069 patent/CN202277980U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752571A (en) * | 2013-12-27 | 2014-04-30 | 深圳市华星光电技术有限公司 | Substrate washing device |
| WO2015096204A1 (en) * | 2013-12-27 | 2015-07-02 | 深圳市华星光电技术有限公司 | Substrate cleaning device |
| CN110216094A (en) * | 2018-03-02 | 2019-09-10 | 金铉泰 | The scaling powder cleaning systems of cleaning object can independently be cleaned |
| CN110216094B (en) * | 2018-03-02 | 2022-02-18 | 金铉泰 | Flux cleaning system capable of independently cleaning object |
| CN110860509A (en) * | 2019-11-28 | 2020-03-06 | 湖南凯通电子有限公司 | Substrate cleaning device and cleaning method thereof |
| CN110860509B (en) * | 2019-11-28 | 2021-05-04 | 湖南凯通电子有限公司 | Substrate cleaning device and cleaning method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120620 |
|
| CX01 | Expiry of patent term |