CN104415930A - Substrate washing method, fluid nozzle and fluid nozzle device - Google Patents
Substrate washing method, fluid nozzle and fluid nozzle device Download PDFInfo
- Publication number
- CN104415930A CN104415930A CN201310394829.XA CN201310394829A CN104415930A CN 104415930 A CN104415930 A CN 104415930A CN 201310394829 A CN201310394829 A CN 201310394829A CN 104415930 A CN104415930 A CN 104415930A
- Authority
- CN
- China
- Prior art keywords
- fluid
- fluid nozzle
- sidewall surface
- interior sidewall
- head body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
- B05B7/0441—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber
- B05B7/0458—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber the gas and liquid flows being perpendicular just upstream the mixing chamber
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Nozzles (AREA)
Abstract
Disclosed are a substrate washing method, a fluid nozzle and a fluid nozzle device. The substrate washing method includes the steps of A, dissolving carbon dioxide in treating fluid to obtain secondary treating fluid; B, introducing gas and the secondary treating fluid into a fluid nozzle, and allowing the gas to press the secondary treating fluid to flow down; C, allowing the secondary treating fluid to spout from the fluid nozzle to a substrate; and D, releasing the carbon dioxide from the secondary treating fluid so as to increase impact force of the treating fluid contacting the surface of the substrate. The fluid nozzle employing the substrate washing method comprises a nozzle body, a chamber, an air incoming pipe, a fluid incoming pipe and a plurality of jet passages. The fluid nozzle device employing the substrate washing method comprises two fluid nozzles arranged on left and right. Therefore, efficiency in washing the substrates is greatly improved, product yield is increased, and the process is greener.
Description
Technical field
The present invention relates to a kind of cleaning base plate method, fluid nozzle and fluid nozzle device, particularly relate to a kind of cleaning base plate method, fluid nozzle and the fluid nozzle device that can keep the board cleaning such as semiconductor crystal wafer or base plate for displaying.
Background technology
Semiconductor crystal wafer is through multiple fabrication steps.Because every one silicon wafer process step has the pollution sources of potentiality, crystal column surface has residue as chemical liquid composition or chemical polymerization thing, defect can be caused to generate and element characteristic inefficacy.In manufacturing process for cleaning, utilize cleaning fluid to process wafer, eliminating particle and pollutant, and keep the clean of crystal column surface.
Existing cleaning way be by chemical agent immersion or with nozzle removing substrate residue, cleaning performance is not good, and affects the qualification rate of successive process; Moreover, the process of the chemical agent after cleaning, quite complicated.
Summary of the invention
The object of the present invention is to provide and a kind ofly promote the good and after-treatment liquid of the cleaning effect more cleaning base plate method of environmental protection, fluid nozzle and fluid nozzle device.
Cleaning base plate method of the present invention, comprises following steps:
(A) treatment fluid is made to be dissolved with carbon dioxide, to form after-treatment liquid;
(B) gas and after-treatment liquid are passed into fluid shower nozzle, and gas extrusion after-treatment liquid flows downward;
(C) after-treatment liquid is ejected on a substrate from this fluid nozzle; And
(D) carbon dioxide disengages from after-treatment liquid, to increase the impulsive force on treatment fluid contact substrate surface.
Preferably, the treatment fluid of this step (A) is deionized water.
Apply the fluid nozzle of described cleaning base plate method, this fluid nozzle comprises:
One head body, comprise one first interior sidewall surface, and be connected diapire face in this first interior sidewall surface and this second interior sidewall surface along a first direction with this first interior sidewall surface the second interior sidewall surface, separately, and one in contrast to the outer bottom wall in this interior diapire face;
One room, is formed at this head body and extends along this first direction, and two opposition sides of this room are respectively this first interior sidewall surface and this second interior sidewall surface, and the bottom surface of this room is this interior diapire face;
One air inlet pipe, is arranged at the top of this head body and is communicated with this room;
One feed tube, to extend and one end connects this second interior sidewall surface along this first direction, and comprise the inlet of this first interior sidewall surface contiguous, and be at least onely communicated with this room and the ejiction opening extended along this first direction in contrast to this air inlet pipe side; And
Multiple injection runner, each other along this first direction separately and be formed at this head body, and is communicated with this interior diapire face and this outer bottom wall of this head body.
Preferably, the ejiction opening quantity of this feed tube is two and spaced apart.
Preferably, this air inlet pipe is arranged at the top of these head body central authorities, and definition one is by the axis of this air inlet pipe, and described ejiction opening to tilt an inclination angle relative to this axis.
Preferably, described injection runner is long and narrow.
Apply the fluid nozzle device of described cleaning base plate method, this fluid nozzle device comprises:
Two fluid nozzles, are arranged about it, and respectively this fluid nozzle comprises
One head body, comprise one first interior sidewall surface, and be connected diapire face in this first interior sidewall surface and this second interior sidewall surface along a first direction with this first interior sidewall surface the second interior sidewall surface, separately, and one in contrast to the outer bottom wall in this interior diapire face;
One room, is formed at this head body and extends along this first direction, and two opposition sides of this room are respectively this first interior sidewall surface and this second interior sidewall surface, and the bottom surface of this room is this interior diapire face;
One air inlet pipe, is arranged at the top of this head body and is communicated with this room;
One feed tube, to extend and one end connects this second interior sidewall surface along this first direction, and comprise the inlet of this first interior sidewall surface contiguous, and be at least onely communicated with this room and the ejiction opening extended along this first direction in contrast to this air inlet pipe side; And
Multiple injection runner, each other along this first direction separately and be formed at this head body, and is communicated with this interior diapire face and this outer bottom wall of this head body.
Preferably, respectively the ejiction opening quantity of this feed tube is two and spaced apart.
Preferably, respectively this air inlet pipe is arranged at the top of these corresponding head body central authorities, and defines one by the axis of this corresponding air inlet pipe, and respectively this ejiction opening to tilt an inclination angle relative to this axis of correspondence.
Preferably, described injection runner is long and narrow, respectively this head body also comprises one first lateral surface, respectively this first lateral surface of described head body is positioned at two opposition sides of this fluid nozzle device, and described injection runner this interior diapire self-corresponding faces this corresponding first lateral surface and tilts to extend to this corresponding outer bottom wall.
Beneficial effect of the present invention is: by the design of fluid nozzle, and cleaning base plate method be supply after-treatment liquid and gas to fluid nozzle, when after-treatment liquid flows out and sprays runner, carbon dioxide exposure air, carbon dioxide can produce and expand and explosion, and can increase treatment fluid cleaning or remove the coating substance of substrate surface or the ability of polluter and efficiency, and the cleaning efficiency of substrate is significantly promoted, contribute to successive process process, and then improving product qualification rate; Moreover after-treatment liquid and gas there is no reluctant waste water after cleaning, more environmental protection on processing procedure.
Accompanying drawing explanation
Fig. 1 is a flow chart, and a preferred embodiment of cleaning base plate method of the present invention is described;
Fig. 2 is a stereogram, and the fluid nozzle device that this cleaning base plate method is applied is described;
Fig. 3 is the top view of corresponding diagram 2;
Fig. 4 is a sectional view intercepted along the line VI-VI in Fig. 3;
Fig. 5 is the phantom that a room is communicated with multiple injection runner;
Fig. 6 is the sectional view of a partial enlargement, and the inclination angle of this ejiction opening is described;
Fig. 7 is a cross-sectional schematic, illustrates that this gas on average advances each point after-treatment liquid flow through corresponding injection runner and accelerate to be ejected to a substrate;
Fig. 8 is the cross-sectional schematic at another visual angle, illustrates that this gas on average advances each point after-treatment liquid flow through corresponding injection runner and accelerate to be ejected to a substrate;
Fig. 9 is a cross-sectional schematic, and this fluid nozzle device also adjustable angle cleaning base plate is described; And
Figure 10 is the close-up schematic view of a corresponding Fig. 9.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in detail.
Before the present invention is described in detail, should be noted that in the following description content, similar element represents with identical numbering.
The explanation of following preferred embodiment is graphic with reference to what add, can be used for the specific embodiment of enforcement for illustrating the present invention.The direction term that the present invention mentions, such as " on ", D score, "front", "rear", "left", "right" etc., be only the direction with reference to annexed drawings.Therefore, the direction term of use is used to illustrate, but not is used for limiting the present invention.
Consult Fig. 1, cleaning base plate method of the present invention, comprises following steps:
S1: make treatment fluid be dissolved with carbon dioxide, to form after-treatment liquid.
Specifically, treatment fluid is deionized water (Deionized Water, DIW), but not as limit, treatment fluid also can be pure water.
S2: gas and after-treatment liquid are passed into fluid shower nozzle, gas extrusion after-treatment liquid flows downward.
Specifically, gas is dried compressed air (Clean Dry Air, CDA), by gas-pressurized and after-treatment liquid, the after-treatment liquid speed that flows downward is promoted.
S3: after-treatment liquid is ejected on a substrate from fluid nozzle.
In the present embodiment, substrate explains with a semiconductor crystal wafer citing.
S4: carbon dioxide disengages from after-treatment liquid, to increase the impulsive force on treatment fluid contact substrate surface.
Consult Fig. 2, Fig. 3, Fig. 4 and Fig. 5, specifically, cleaning base plate method of the present invention utilizes fluid ejecting device, to reach cleaning, this fluid nozzle device comprises: about two fluid nozzles be set up in parallel 1, wherein, be arranged in Fig. 2 right side for fluid shower nozzle 1, being positioned at left side is also fluid shower nozzle 1.The structure of two fluid nozzles 1 is slightly different, below structure for convenience of description, is first to explain for right side fluid nozzle 1.Besides the difference of bright left side fluid nozzle.Each fluid nozzle 1 comprises head body 2, room 3, air inlet pipe 4, feed tube 5 and multiple injection runner 6.
Head body 2 outward appearance is roughly in cuboid, and comprise one first lateral surface 210, one in contrast to the second lateral surface 211 of the first lateral surface 210, two joint faces 212 connecting the first lateral surface 210 and the second lateral surface 211 respectively, first interior sidewall surface 213 of the one opposing joint face 212 in front side, one along a first direction D1 and the first interior sidewall surface 213 separately and second interior sidewall surface 214 opposing with the joint face 212 of rear side, diapire face 216 in the inner roof wall face 215 and connecting the first interior sidewall surface 213 and the second interior sidewall surface 214, and one in contrast to the outer bottom wall 217 in interior diapire face 216.
The space of room 3 roughly in cuboid, be formed at head body 2 and extend along first direction D1, two opposition sides of room 3 are respectively the first interior sidewall surface 213 and the second interior sidewall surface 214, and the end face of room 3 is inner roof wall face 215, and the bottom surface of room 3 is interior diapire face 216.
Air inlet pipe 4 is arranged at the top of head body 2, and connects inner roof wall face 215 and be communicated with room 3.
Consult Fig. 4, Fig. 5 and Fig. 6, the joint face 212 of feed tube 5 from the front side of contiguous head body 2 is along first direction D1 extension and one end connects the second interior sidewall surface 214.Feed tube 5 comprises the inlet 51 of contiguous first interior sidewall surface 213, and two is spaced apart and be communicated with room 3 and the ejiction opening 52 extended along first direction D1 in contrast to air inlet pipe 4 side.Air inlet pipe 4 is arranged at the top of head body 2 central authorities, and definition one is by the axis L of air inlet pipe 4, and two ejiction openings 52 all to tilt an inclination alpha relative to axis L.In the present embodiment, feed tube 5 comprises two ejiction openings 52, but not as limit, feed tube 5 also only can comprise one and be communicated with and the ejiction opening 52 extended along first direction D1 in contrast to air inlet pipe 4 side and with room 3; The inclination alpha of the present embodiment is 30 degree, but not as limit, can adjust inclination alpha according to actual demand.
Described injection runner 6 each other along first direction D1 separately and be formed at head body 2, and is communicated with interior diapire face 216 and the outer bottom wall 217 of head body 2.Preferably, described injection runner 6 tilts to extend to outer bottom wall 217 towards the first lateral surface 210 from interior diapire face 216.Caliber and the Design of length of described injection runner 6 are long and narrow, contribute to fluid and flow through injection runner 6, fluid velocity is promoted.
It should be noted that, as shown in Figure 4, be positioned at the described injection runner 6 of right side for fluid nozzle 1 to tilt to extend to outer bottom wall 217 towards the first lateral surface 210 from diapire face 216, namely described injection runner 6 is tilted to the right, the fluid nozzle 1 being positioned at left side is roughly the same with the fluid nozzle 1 on right side, difference is in the setting direction in described injection runner 6, first lateral surface 210 of the described injection runner 6 that left side is fluid nozzle 1 from interior diapire face 216 towards left side tilts to extend to outer bottom wall 217, and namely described injection runner 6 is tilted to the left.Specifically, the described injection runner 6 of two fluid nozzles 1 is symmetrically towards outer incline.
Consult Fig. 2, should be noted that, two fluid nozzles 1 are affixed with the second lateral surface 211 of its head body 2 to be set up in parallel, respective the first lateral surface 210 of two head body 2 is positioned at two opposition sides of this fluid nozzle device, use two fluid nozzles 1 mainly to increase cleaning or remove substrate 9(as shown in Figure 7) coating substance on surface or the efficiency of polluter, to promote production capacity.In the present embodiment, two fluid nozzles 1 are set up in parallel, but not as limit, two fluid nozzles 1 may also be setting spaced apart.
Consulting Fig. 1, Fig. 7 and Fig. 8, below illustrate and utilize the operating process of fluid nozzle device cleaning base plate method of the present invention, and for convenience of description, is coordinate a fluid nozzle 1 to explain for example.
When gas 8 enters room 3 by air inlet pipe 4, because of the set-up mode of feed tube 5, make gas 8 flow through feed tube 5 and receive obstruction and be divided into two strands, then make gas 8 toward dirty, avoid gas 8 directly to lower impact, and average thrust can be reached; Simultaneously, owing to being that a large amount of after-treatment liquid 7 passes into feed tube 5, can first flow toward first direction D1, then by two ejiction openings 52, and make the easier diffuse flow downwards of after-treatment liquid 7 to room 3, after-treatment liquid 7 can on average be accumulated in room 3, gas 8 on average advances each point after-treatment liquid 7 flow through corresponding injection runner 6 and accelerate ejection, the injection runner 6 of contiguous inlet 51 can be made identical with the ejection speed of the after-treatment liquid 7 of the injection runner 6 away from inlet 51 by previous designs, significantly promote and spray the uniformity.
Specifically, when after-treatment liquid 7 flows out and sprays runner 6, now after-treatment liquid 7 contacts air and pressure drop, carbon dioxide 71 solubility declines, carbon dioxide 71 disengages from after-treatment liquid 7, carbon dioxide 71 volume rapid expanding and loss are in air, and treatment fluid 72 can erupt with carbon dioxide 71 loss, improve treatment fluid 72 and clean or remove the coating substance on substrate 9 surface or the ability of polluter and efficiency, the cleaning efficiency of substrate 9 is significantly promoted, to increase the impulsive force on treatment fluid 72 contact substrate 9 surface, contribute to successive process process, and then improving product qualification rate.
The after-treatment liquid 7 utilized due to this cleaning base plate method is deionized water (DeionizedWater, DIW) carbon dioxide 71 is added, gas 8 is dried compressed air (Clean Dry Air, CDA), these two kinds of fluids there is no reluctant waste water after cleaning, compared to the process of the chemical agent after the cleaning of prior art, more environmental protection on processing procedure.
On the other hand, the treatment fluid 72 of after-treatment liquid 7 adds the mode of carbon dioxide 71 are carbon dioxide 71 is directly access treatment fluid pipe (not shown).When treatment fluid 72 flows, carbon dioxide 71 can be squeezed in treatment fluid 72 uniformly, again because fluid nozzle device belongs to intermittent to spray after-treatment liquid 7, namely process has cleaned a plate base 9 when waiting for next plate base 9, the pipeline that after-treatment liquid 7 flows into feed tube 5 is blocked, now carbon dioxide 71 also can be squeezed in treatment fluid 72 uniformly, and make after-treatment liquid 7 include a certain proportion of carbon dioxide 71, treat that next plate base 9 comes then, fluid nozzle device can open the pipeline that after-treatment liquid 7 flows into feed tube 5, this substrate 9 is cleaned according to aforementioned S1 to S4 step, quantitative carbon dioxide 71 can help after-treatment liquid 7 to clean this substrate 9, and manufacturing process for cleaning is stablized, avoid because there being carbon dioxide 71 to separate out from treatment fluid 72, cause carbon dioxide 71 content in after-treatment liquid 7 uneven, and affect cleaning efficiency.
Supplementary notes, the quantity of described injection runner 6 and distribution can counterpart substrate 9 diameter dimension and adjust, therefore the present embodiment fluid nozzle device can a long and narrow block of a translation clean substrate 9, contributes to the lifting of cleaning efficiency.
Consult Fig. 9 and Figure 10, further, fluid nozzle device of the present invention also adjustable angle cleaning base plate 9, namely utilize a support (not shown) suspension strut fluid nozzle device, the axis L opposing substrate 9 of head body 2 is made to create an angle, as shown in Figure 9, when it is 90 degree that the described injection runner 6 of right side fluid nozzle 1 adjusts opposing substrate 9 (referring to that the bearing of trend spraying runner 6 is perpendicular to substrate 9), now, described injection runner 6 and the described injection runner 6 of left side fluid nozzle 1 of right side fluid nozzle 1 are with two different angles hydro-peening substrate 9 surfaces, the cleaning performance of mutual compensation different angles, and as shown in Figure 10, because substrate 9 surface is not smooth, but have the block of fluctuating projection, the region more can cleaned and be difficult in shape stretch into is obliquely installed by fluid nozzle device.In the present embodiment, fluid nozzle device adjustment angle to be described injection runner 6 opposing substrate 9 of fluid nozzle 1 that adjusts right side be 90 degree illustrate for example, but not as limit, angle can be adjusted according to actual demand.
In sum, by the design of fluid nozzle 1, and supply is dissolved with the after-treatment liquid 7 of carbon dioxide 71 and the cleaning base plate method of gas 8 to fluid nozzle 1, when making after-treatment liquid 7 flow out injection runner 6, carbon dioxide 71 contacts air, carbon dioxide 71 can produce and expand and explosion, and treatment fluid 72 can be increased clean or remove the coating substance on substrate 9 surface or the ability of polluter and efficiency, the cleaning efficiency of substrate 9 is significantly promoted, contribute to successive process process, and then improving product qualification rate; Moreover after-treatment liquid 7 and gas 8 there is no reluctant waste water, more environmental protection on processing procedure after cleaning, therefore really can reach the object of the present invention.
Claims (10)
1. a cleaning base plate method; It is characterized in that: this cleaning base plate method, comprises following steps:
(A) treatment fluid is made to be dissolved with carbon dioxide, to form after-treatment liquid;
(B) gas and after-treatment liquid are passed into fluid shower nozzle, and gas extrusion after-treatment liquid flows downward;
(C) after-treatment liquid is ejected on a substrate from this fluid nozzle; And
(D) carbon dioxide disengages from after-treatment liquid, to increase the impulsive force on treatment fluid contact substrate surface.
2. cleaning base plate method according to claim 1, is characterized in that: the treatment fluid of this step (A) is deionized water.
3. application rights requires a fluid nozzle for cleaning base plate method described in 1, it is characterized in that: this fluid nozzle comprises
One head body, comprise one first interior sidewall surface, and be connected diapire face in this first interior sidewall surface and this second interior sidewall surface along a first direction with this first interior sidewall surface the second interior sidewall surface, separately, and one in contrast to the outer bottom wall in this interior diapire face;
One room, is formed at this head body and extends along this first direction, and two opposition sides of this room are respectively this first interior sidewall surface and this second interior sidewall surface, and the bottom surface of this room is this interior diapire face;
One air inlet pipe, is arranged at the top of this head body and is communicated with this room;
One feed tube, to extend and one end connects this second interior sidewall surface along this first direction, and comprise the inlet of this first interior sidewall surface contiguous, and be at least onely communicated with this room and the ejiction opening extended along this first direction in contrast to this air inlet pipe side; And
Multiple injection runner, each other along this first direction separately and be formed at this head body, and is communicated with this interior diapire face and this outer bottom wall of this head body.
4. fluid nozzle according to claim 3, is characterized in that: the ejiction opening quantity of this feed tube is two and spaced apart.
5. fluid nozzle according to claim 4, is characterized in that: this air inlet pipe is arranged at the top of these head body central authorities, and definition one is by the axis of this air inlet pipe, and described ejiction opening to tilt an inclination angle relative to this axis.
6. fluid nozzle according to claim 3, is characterized in that: described injection runner is long and narrow.
7. application rights requires a fluid nozzle device for cleaning base plate method described in 1, it is characterized in that: this fluid nozzle device comprises:
Two fluid nozzles, are arranged about it, and respectively this fluid nozzle comprises
One head body, comprise one first interior sidewall surface, and be connected diapire face in this first interior sidewall surface and this second interior sidewall surface along a first direction with this first interior sidewall surface the second interior sidewall surface, separately, and one in contrast to the outer bottom wall in this interior diapire face;
One room, is formed at this head body and extends along this first direction, and two opposition sides of this room are respectively this first interior sidewall surface and this second interior sidewall surface, and the bottom surface of this room is this interior diapire face;
One air inlet pipe, is arranged at the top of this head body and is communicated with this room;
One feed tube, to extend and one end connects this second interior sidewall surface along this first direction, and comprise the inlet of this first interior sidewall surface contiguous, and be at least onely communicated with this room and the ejiction opening extended along this first direction in contrast to this air inlet pipe side; And
Multiple injection runner, each other along this first direction separately and be formed at this head body, and is communicated with this interior diapire face and this outer bottom wall of this head body.
8. fluid nozzle device according to claim 7, is characterized in that: respectively the ejiction opening quantity of this feed tube is two and spaced apart.
9. fluid nozzle device according to claim 8, it is characterized in that: respectively this air inlet pipe is arranged at the top of these corresponding head body central authorities, and define one by the axis of this corresponding air inlet pipe, respectively this ejiction opening to tilt an inclination angle relative to this axis of correspondence.
10. fluid nozzle device according to claim 7, it is characterized in that: described injection runner is long and narrow, respectively this head body also comprises one first lateral surface, respectively this first lateral surface of described head body is positioned at two opposition sides of this fluid nozzle device, and described injection runner this interior diapire self-corresponding faces this corresponding first lateral surface and tilts to extend to this corresponding outer bottom wall.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310394829.XA CN104415930B (en) | 2013-09-03 | 2013-09-03 | The fluid nozzle of application cleaning base plate method and fluid nozzle device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310394829.XA CN104415930B (en) | 2013-09-03 | 2013-09-03 | The fluid nozzle of application cleaning base plate method and fluid nozzle device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104415930A true CN104415930A (en) | 2015-03-18 |
CN104415930B CN104415930B (en) | 2016-06-29 |
Family
ID=52966697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310394829.XA Active CN104415930B (en) | 2013-09-03 | 2013-09-03 | The fluid nozzle of application cleaning base plate method and fluid nozzle device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104415930B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104785482A (en) * | 2015-04-20 | 2015-07-22 | 武汉华星光电技术有限公司 | Substrate cleaning method and device |
CN104874500A (en) * | 2015-06-04 | 2015-09-02 | 北京七星华创电子股份有限公司 | Two-phase flow atomizing cleaner |
CN110142160A (en) * | 2019-05-15 | 2019-08-20 | 厦门理工学院 | A kind of array dry ice spray head and gas-solid mixture production method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002079192A (en) * | 2000-09-08 | 2002-03-19 | Dainippon Screen Mfg Co Ltd | Device for cleaning substrate |
WO2006137202A1 (en) * | 2005-06-23 | 2006-12-28 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
CN1949086A (en) * | 2005-10-14 | 2007-04-18 | 大日本网目版制造株式会社 | Substrate processing method and substrate processing apparatus |
CN101207015A (en) * | 2006-12-15 | 2008-06-25 | 大日本网目版制造株式会社 | Two-fluid nozzle, substrate processing apparatus, and substrate processing method |
TW201023986A (en) * | 2008-12-17 | 2010-07-01 | Aqua Science Corp | Object cleansing method and object cleansing system |
CN102013389A (en) * | 2009-09-03 | 2011-04-13 | 芝浦机械电子装置股份有限公司 | Substrate processing apparatus and substrate processing method |
-
2013
- 2013-09-03 CN CN201310394829.XA patent/CN104415930B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002079192A (en) * | 2000-09-08 | 2002-03-19 | Dainippon Screen Mfg Co Ltd | Device for cleaning substrate |
WO2006137202A1 (en) * | 2005-06-23 | 2006-12-28 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
CN1949086A (en) * | 2005-10-14 | 2007-04-18 | 大日本网目版制造株式会社 | Substrate processing method and substrate processing apparatus |
CN101207015A (en) * | 2006-12-15 | 2008-06-25 | 大日本网目版制造株式会社 | Two-fluid nozzle, substrate processing apparatus, and substrate processing method |
TW201023986A (en) * | 2008-12-17 | 2010-07-01 | Aqua Science Corp | Object cleansing method and object cleansing system |
CN102013389A (en) * | 2009-09-03 | 2011-04-13 | 芝浦机械电子装置股份有限公司 | Substrate processing apparatus and substrate processing method |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104785482A (en) * | 2015-04-20 | 2015-07-22 | 武汉华星光电技术有限公司 | Substrate cleaning method and device |
CN104874500A (en) * | 2015-06-04 | 2015-09-02 | 北京七星华创电子股份有限公司 | Two-phase flow atomizing cleaner |
CN104874500B (en) * | 2015-06-04 | 2017-02-01 | 北京七星华创电子股份有限公司 | Two-phase flow atomizing cleaner |
CN110142160A (en) * | 2019-05-15 | 2019-08-20 | 厦门理工学院 | A kind of array dry ice spray head and gas-solid mixture production method |
Also Published As
Publication number | Publication date |
---|---|
CN104415930B (en) | 2016-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103506339B (en) | Device and method for cleaning reverse side of wafer | |
JP5737720B2 (en) | Spray gun | |
US20180141077A1 (en) | Coating apparatus, method for recycling coating liquid by utilization of the same, and method for cleaning the same | |
JP2006278859A (en) | Substrate processing equipment | |
CN104415930A (en) | Substrate washing method, fluid nozzle and fluid nozzle device | |
CN101568414B (en) | Method for washing mouthpiece member and apparatus for washing mouthpiece member | |
CN104704170A (en) | Nozzle device | |
JP2004221244A5 (en) | ||
CN104624542B (en) | Clean device | |
KR101426267B1 (en) | Device for injecting multi phase fluid | |
TWI462148B (en) | Fluid nozzle and fluid nozzle device | |
CN107937902B (en) | A kind of metal surface atomizing spray pre-treating technology | |
CN116441218A (en) | Silicon wafer cleaning device | |
CN201017856Y (en) | Ejection apparatus | |
TWM482444U (en) | Fluid nozzle and fluid nozzle apparatus | |
JP5336718B2 (en) | Lubricating liquid application equipment for plastic working | |
TWM481772U (en) | Fluid nozzle | |
CN101315876B (en) | Two-fluid supply module for substrate cleaning and cleaning device using the same | |
KR20120026244A (en) | Apparatus for etching | |
JP3063142U (en) | Equalizing type substrate surface treatment structure | |
JP2009074180A (en) | Cvd processing apparatus and cvd processing method | |
CN212883150U (en) | Wax spraying nozzle for spraying wax to inner cavity of tubular part | |
JP2017074579A (en) | Sheet material surface treatment method and sheet material surface treatment structure | |
CN103286090A (en) | Device for cleaning rubber eraser in photoresist coating process, and photoresist coating machine | |
KR100850234B1 (en) | A Chemical Solution Supply Device for the Process of fabricating the Semiconductor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |