CN202265932U - Compound die card building block - Google Patents

Compound die card building block Download PDF

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Publication number
CN202265932U
CN202265932U CN201120316377XU CN201120316377U CN202265932U CN 202265932 U CN202265932 U CN 202265932U CN 201120316377X U CN201120316377X U CN 201120316377XU CN 201120316377 U CN201120316377 U CN 201120316377U CN 202265932 U CN202265932 U CN 202265932U
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CN
China
Prior art keywords
building block
panels
wainscot
compound die
die card
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CN201120316377XU
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Chinese (zh)
Inventor
傅礼铭
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傅礼铭
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Priority to CN201120316377XU priority Critical patent/CN202265932U/en
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Publication of CN202265932U publication Critical patent/CN202265932U/en

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Abstract

The utility model relates to a compound die card building block which is characterized by comprising an outer panel (1) and an inner panel (2), an insulation layer (3) is filled between the outer panel (1) and the inner panel (2), and the outer panel (1), the insulation layer (3) and the inner panel (2) are connected into a whole through a connector (4). The compound die card building block is designed by using an inner sandwich insulation layer, is lighter than the traditional clay brick and is adapted to the demands of modern high-rise buildings. The traditional site grouting wall building process is changed, the building block can be directly installed and fixed and is quick to construct, the technological flow and the construction material are reduced, and the engineering cost is lowered. The facade of the installed wall body is flat and smooth and has balanced strength and rigidity. With the compound die card building block, the heat bridge effect can be effectively blocked, the insulation property and waterproof property are obviously enhanced, and the compound die card building block has good sound insulation effect and good comprehensive properties.

Description

The building block of a kind of compound die card

Technical field

The present invention relates to technical field of buildings, be specially the building block of a kind of compound die card.

Background technology

Along with making rapid progress of urban construction, urban architecture has been trend of the times to many, the high-rise expansion.Yet the loam brick that uses in the traditional architecture because unit weight is big, causes whole building from great, and the body of wall heat-insulation and heat-preservation sound insulation value of formation is poor.And the production of this type brick usually can destroy a large amount of farmlands, damage water and soil conservation, and the sintering procedure of this type brick also can consume mass energy, at present by national limit production., Development of High-rise Buildings many for adapting to, exploitation light weight, anti-seismic performance is strong, heat insulation, the composite wall body material of insulation, sound insulation has been required.

For example, Application No. 200610136791.6, titled "double steel mesh perlite mineral wool sandwich wall panels," top layer of the invention is the use of double-layer steel mesh and the lower layer by layer steel mesh lath perlite, mineral sliver plate clamping an intermediate core layer, and then the top layer of double-layer steel mesh side and below double steel mesh sides with galvanized steel wire welded into qe type fixed connection, via spray concrete and mortar to form a wall components.This wallboard advantage is light weight, insulation, and shortcoming then is embodied in: and since unfixing between the double-deck steel mesh of intermediate core layer and surface layer, be prone to move, thus be difficult to keep surface layer concordant, thus it is inhomogeneous to cause spray to be smeared, and mortar is prone to come off; Owing between intermediate core layer and the surface layer steel mesh space is arranged, do not have gluing each other simultaneously, after body of wall is shaped, after being shaken, be prone to transposition or distortion between intermediate core layer and the surface layer steel mesh, thereby influence the intensity and the rigidity of whole body of wall; In addition, because interior outer coversheet adopts the zinc-coated wire welding fixing, during as outer body of wall, still there is heat bridge effect in the body of wall after condensing; Moreover the strength ratio of this type sandwich wall board a little less than, be not suitable for floor height than higher house, more be not suitable for building as load bearing wall.

And for example application number is 200720073982.2; The utility model of " building block of concrete heat-insulating mould card " by name; Insulation layer is between building block of outer mould card and the building block of internal layer mould card; Positioning link is connected the inwall fixing of inwall, insulation layer and the building block of internal layer mould card of the building block of outer mould card, the building block of an insulation of whole formation mould card.The advantage of this utility model is that its heat-insulating property is superior to common insulating brick, and also clearly but in practical implementation, also there are many drawbacks in energy-saving benefit:

The one, body of wall is blocked up overweight.Card building block of internal layer mould and the building block of outer mould card as basic component are provided with vertical grouting channel in it, thereby the building block oneself requirement reaches certain thickness, add the insulation layer between the ectonexine, and whole composite block is blocked up; Owing to be provided with vertical grouting through hole and horizontal grout groove in the building block of inside and outside layer mould card, its technological requirement must be in the milk and could be guaranteed that body of wall is firm simultaneously, but after the grouting; The body of wall deadweight is bigger; Thereby be difficult to adapt to many, highrise building needs, and it is loaded down with trivial details to construct, difficult quality guarantee.

The 2nd, insulation layer thickness is limited.Owing to be provided with the grouting through hole in card building block of internal layer mould and the building block of outer mould card; Himself just has certain thickness requirement; When body of wall is asked to be limited to certain thickness in design, then can cause the insulation layer of this utility model to cross thin even can't be provided with, heat insulation effect also will be had a greatly reduced quality.

The 3rd, still can't thoroughly cut off heat bridge.In this utility model, still there is the heat bridge passage in the positioning link junction.

In sum, it is simpler and more direct to develop a kind of construction, and performance is more firm, and the lightweight walling unit that heat insulating effect is good, fireproof performance is more superior is for being badly in need of.

Summary of the invention

The present invention seeks to provide the building block of a kind of compound die card, satisfying the requirement of all kinds of building block lightweight, and convenient transportation and construction; Institute's body of building a wall must be smooth not yielding, and it is evenly firm that intensity and rigidity are wanted; Simultaneously can intercept heat bridge effect, better thermal and insulating performance and fireproof performance are provided, possess good sound insulation soundproof effect.

The objective of the invention is to realize: the building block of said compound die card through following technical scheme; It is characterized in that the building block of said compound die card comprises outer panels, wainscot; Be filled with insulation layer between outer panels and the wainscot, outer panels and wainscot link into an integrated entity outer panels, insulation layer and wainscot through connector.Component assembly is adopted in said compound die card building block, not only greatly facilitates production, transportation and installation, when improving wall insulation performance, can also alleviate the house deadweight.

In the building block of said compound die card, described outer panels is or/and be provided with isolation layer between wainscot and the insulation layer;

Described isolation layer is adiabatic mortar, glass wool, rock wool, mineral wool, foamed plastics, expanded perlite or foam cement.Said isolation layer is selected the material of different coefficient of thermal conductivity according to the architectural design requirement, gathers materials on the spot, and reduces building costs.

In the building block of said compound die card, described outer panels is or/and at least one outside of wainscot is provided with breach.It is tight that said breach can make building block dock with blockhouse, reaches the purpose of antiseep, isolated steam and heat preservation energy-saving.Said breach takes different shapes and the different combinations mode, is suitable for the different parts that body of wall is formed.

In the building block of said compound die card, said outer panels is or/and at least one surface of wainscot is the light face, or at least one surface is a matsurface.Whitewash or do veneer coating when the mould card building block of light face appearance is convenient to fit up, and manufacture simple; The mould card building block of rough external surface then is fit to be used for pasting the outer wall surface material, like ceramic tile etc.; And inner surface is coarse mould card building block be more conducive to outer panels or wainscot with insulation layer or/and being connected of isolation layer.

In the building block of said compound die card, said outer panels is or/and wainscot is at least a in fine-stone concrete, light aggregate concrete, ceramics, burned brick, aerating concrete, high-strength mortar, metal product or the modification plastic refractory.Outer panels, wainscot material select factors such as needing building complex purposes, requirement, cost for use, but also can be according to inside and outside wall function needs, outer panels, wainscot use different materials

In the building block of said compound die card, described outer panels is or/and be provided with stiffener in the wainscot; Or said stiffener is reinforcing bar, gauze wire cloth, glass fiber mesh, fiber bundle, cloth, durafiber, nylon wire, nylon bundle, paper muscle, straw or cotton stalk.Said stiffener can improve the intensity of body of wall and be not easy to crack.Choose which kind of material and decide, gather materials on the spot, suit measures to local conditions according to body of wall required intensity and cost.

In the building block of said compound die card, said outer panels is or/and the inboard of wainscot is reserved with the fixed bearing of connector; Or said fixed bearing is at least a in projection, raised line, pothole, pit or the built-in fitting.Said fixed bearing can play the effect of girt strip in the resemble construction thing, rib post, make when strengthening outer panels, wainscot rigidity be connected to each other more firm.Fixed bearing adopts which kind of shape, structure to decide according to building requirement of strength and easy construction, also is associated with the connected mode of connector.

In the building block of said compound die card, described connector is that metalwork, modification plastic refractory, arrangement of reinforcement concrete goods or high annotated at least a in the alloy.The material of said connector is decided according to the requirement of mould card block strength, heat-insulating bridge-cut-off requirement and building costs.

In the building block of said compound die card, be provided with heat insulation layer between said fixed bearing and the connector or between fixed bearing and outer panels or the wainscot.When using the big connector of metal or coefficient of thermal conductivity, the effect that said heat insulation layer can play heat-insulating bridge-cut-off is set.

In the building block of said compound die card, described insulation layer is the polyphenyl compound, gather third ethene, phenolic resins, foam cement or air; Or described insulation layer be the polyphenyl compound, to gather third ethene, phenolic resins or foam cement be prefabricated block or cast-in-place shaping.Said insulation layer requires to select the material of different coefficient of thermal conductivity according to the wall thermal insulating of building, and job practices can adopt prefabricated or cast-in-site flexibly, and what be worth specifying is that closed air also is a kind of good insulation layer.

In the building block of said compound die card, described outer panels is or/and the shape of wainscot is triangle, quadrangle, pentagon, hexagon, octagon or bent limit shape.Can select difform outer panels, wainscot according to structural requirement, the appearance requirement of body of wall, whole firm and attractive in appearance to reach body of wall.

In the building block of said compound die card, said outer panels is used for socket joint connecting rod or in flakes or/and at least one side of wainscot is provided with in hole or the groove at least aly.

In the building block of said compound die card, described outer panels or/and the hole that is provided with at least one side of wainscot or/and be provided with dismountable connecting rod in the groove or in flakes; Said connecting rod with in flakes be that branchs is arranged or be prefabricated into integral body.Described hole, groove, connecting rod, effect is the firm connection of further strengthening blockhouse in flakes, and each mould card building block is connected in one, and outward appearance is more smooth, and rigidity and intensity are stronger.Connecting rod and dividing in flakes is arranged, and conveniently makes and installs; Connecting rod and integral prefabricated in flakes connects better effects if.

In the building block of said compound die card, described outer panels is or/and at least one side of wainscot is provided with at least one injection orifice; Or said injection orifice is provided with movable port lid.Injection orifice is used for injecting the plasticity heat insulating material, like the polyphenyl compound, gather the foaming and the moulding by casting of materials such as third ethene, phenolic resins, foam cement; Behind the casting complete, can on injection orifice, build movable span lid in case of necessity, also can movable port lid, and direct shutoff injection orifice when wall plastering.

Compared with prior art, beneficial effect of the present invention is: folder insulation layer design in adopting, be lighter than conventional clay, and adapt to modern many, highrise building needs; Change conventional on-site and smear and grout wall technology, this building block can directly install and fix, and quick construction reduces technological process and construction material, reduces construction costs; Body of wall facade after the installation is smooth as one, and strength and stiffness are balanced; Insulation layer is set or/and isolation layer can effectively be blocked heat bridge effect inner the reaching of building block, obviously strengthens wall thermal insulating heat-proof quality and fireproof performance, possess good sound insulation soundproof effect with the beam column contact surface; Compare traditional building block and other composite block in the market, the present invention has comprehensive performance.

Description of drawings

Fig. 1 is the structural representation of the embodiment of the invention 1.

Fig. 2 is the structural representation of the embodiment of the invention 2.

Fig. 3 is the structural representation of the embodiment of the invention 3.

Fig. 4 is the structural representation of the embodiment of the invention 4.

Fig. 5 is the sectional drawing of the embodiment of the invention 5.

Fig. 6 is the sectional drawing of the embodiment of the invention 6.

Fig. 7 is the sectional drawing of the embodiment of the invention 7.

Fig. 8 is the sectional drawing of the embodiment of the invention 8.

Fig. 9 is the sectional drawing of the embodiment of the invention 9.

Figure 10 is the sectional drawing of the embodiment of the invention 10.

Figure 11 is the structural representation of the embodiment of the invention 11.

Figure 12 is the structural representation of the embodiment of the invention 12.

Figure 13 is the structural representation of the embodiment of the invention 13.

Figure 14 is the structural representation of the embodiment of the invention 14.

Figure 15 is the structural representation of the embodiment of the invention 15.

Figure 16 is the structural representation of the embodiment of the invention 16.

Figure 17 is the structural representation of the embodiment of the invention 17.

Figure 18 is the structural representation of the embodiment of the invention 18.

Figure 19 is the structural representation of the embodiment of the invention 19.

Figure 20 is the structural representation of the embodiment of the invention 20.

Figure 21 is the body of wall elevation after the embodiment of the invention 21 is installed.

Figure 22 is the body of wall elevation after the embodiment of the invention 22 is installed.

Figure 23 is the body of wall elevation after the embodiment of the invention 23 is installed.

Figure 24 is the body of wall elevation after the embodiment of the invention 24 is installed.

Figure 25 is the body of wall elevation after the embodiment of the invention 25 is installed.

Figure 26 is the structural representation of the embodiment of the invention 26.

Figure 27 is the structural representation of the embodiment of the invention 27.

Figure 28 is the structural representation of connecting rod among the present invention.

Figure 29 connects the structural representation of embodiment one in flakes for connecting rod of the present invention.

Figure 30 connects the structural representation of embodiment two in flakes for connecting rod of the present invention.

Figure 31 is the structural representation of injection orifice among the present invention.

Among the figure: 1-outer panels, 2-wainscot, 3-insulation layer, 4-connector, 5-isolation layer; The 6-breach, 7-stiffener, 8-fixed bearing, 9-projection, 10-raised line; The 11-pothole, 12-pit, 13-built-in fitting, 14-hole, 15-groove; 16-connecting rod, 17-in flakes, 18-injection orifice, the movable port lid of 19-, 20-heat insulation layer.

The specific embodiment

Below in conjunction with accompanying drawing the present invention is further specified: in each accompanying drawing, number identically, its explanation is identical.1 is outer panels among the figure, and 2 is wainscot, and 3 is insulation layer, and 4 is connector, and 5 is isolation layer; 6 is breach, and 7 is stiffener, and 8 is fixed bearing, and 9 is projection, and 10 is raised line; 11 is pothole, and 12 is pit, and 13 is built-in fitting, and 14 is hole, and 15 is groove; 16 is connecting rod, and 17 in flakes, and 18 is injection orifice, and 19 is movable port lid, and 20 is heat insulation layer.

Compound die card as shown in Figure 1 building block; It is characterized in that the building block of said compound die card comprises outer panels 1, wainscot 2; Be filled with insulation layer 3 between outer panels 1 and the wainscot 2, outer panels 1 links into an integrated entity outer panels 1, insulation layer 3 through connector 4 with wainscot 2 with wainscot 2.Embodiment illustrated in fig. 11 is the essential structure system of said compound die card building block.

Compound die card as shown in Figure 2 building block is characterized in that described outer panels 1 or/and be provided with isolation layer 5 between wainscot 2 and the insulation layer 3; Or described isolation layer 5 is adiabatic mortar, glass wool, rock wool, mineral wool, foamed plastics, expanded perlite or foam cement.In embodiment illustrated in fig. 22, be provided with isolation layer 5 between outer panels 1 and the insulation layer 3, combine, can make body of wall have better heat insulating effect, more effectively intercept heat bridge effect with insulation layer 3.

Like Fig. 3,4,5,6,7,8, the building block of the card of compound die shown in 9, it is characterized in that described outer panels 1 or/and at least one outside of wainscot 2 is provided with breach 6.In embodiment illustrated in fig. 33, four outsides of outer panels 1 and wainscot 2 are provided with breach 6, and it analyses and observe effect can be referring to Fig. 7, are concavity behind a kind of lordosis, and its side-looking effect then is the protruding concavity of going up down.The benefit that breach 6 is set is: make the profile of compound die card building block present different nested structures, one of advantage is to be used for flexibly the different parts of mould card body of wall, makes more convenient and quicker is installed, connects more solid and reliable; Two of advantage is tight nested structure effectively antiseep, isolated steam and heat preservation energy-saving, causes insulation layer burning or fusing simultaneously in the time of also effectively stoping metope to catch fire.

Showed breach 6 different change sets during Fig. 4 is extremely embodiment illustrated in fig. 9 and closed, not limit by illustrative example.The purpose of illustrated embodiment and benefit are said with embodiment 3.

In embodiment illustrated in fig. 44, inner concavity structure around the building block of compound die card is, it analyses and observe effect can be referring to Fig. 5.

In embodiment illustrated in fig. 55, concave inward structure before and after the building block of compound die card is.

In embodiment illustrated in fig. 66, outer male structure before and after the building block of compound die card is, its structure can become a kind of nested combination with embodiment 5.

In embodiment illustrated in fig. 77, the building block of compound die card presents lordosis recurve structure, and a plurality of the use simultaneously can have nested combination of one's own.

In embodiment illustrated in fig. 88, the building block of compound die card presents a kind of front and back dentalation of card mutually, and a plurality of uses simultaneously can form nested structure each other.

In embodiment illustrated in fig. 99, the inside and outside panel plate of compound die card building block end presents a kind of structure of lordosis recurve, and a plurality of uses simultaneously can have nested combination of one's own each other.This structure makes the building block seam nested tighter.

Compound die card shown in figure 10 building block is characterized in that described outer panels 1 or/and be provided with stiffener 7 in the wainscot 2.

Said stiffener 7 is reinforcing bar, gauze wire cloth, glass fiber mesh, fiber bundle, cloth, durafiber, nylon wire, nylon bundle, paper muscle, straw or cotton stalk.In embodiment illustrated in fig. 10 10, be provided with stiffener 7 in outer panels 1 and the wainscot 2.

Like Figure 11,12,13,14,15,16,17,18, the building block of the card of compound die shown in 19, it is characterized in that said outer panels 1 or/and the inboard of wainscot 2 is reserved with the fixed bearing 8 of connector 4; Said fixed bearing 8 is at least a in projection 9, raised line 10, pothole 11, pit 12 or the built-in fitting 13.

Each figure decomposes as follows:

Embodiment illustrated in fig. 11 11 show as outer panels 1 is provided with a plurality of projections 9 as fixed bearing 8 with wainscot 2 inboards;

Embodiment illustrated in fig. 12 12 show as outer panels 1 is provided with parallel raised line 10 as fixed bearing 8 with wainscot 2 inboards; Embodiment illustrated in fig. 13 13 show as outer panels 1 is provided with the fixed bearing 8 that raised line 10 is combined into hollow with wainscot 2 inboards; Embodiment illustrated in fig. 14 14 show as outer panels 1 is provided with the fixed bearing 8 that raised line 10 is combined into day font with wainscot 2 inboards; Embodiment illustrated in fig. 15 15 show as outer panels 1 is provided with the fixed bearing 8 that raised line 10 is combined into matrix pattern with wainscot 2 inboards.Different fixed bearing 8 shapes are fit to different plate sizes.Among raised line 10 embodiment recited above, diagram is linear pattern, but in practical implementation, is not limited thereto.

Embodiment illustrated in fig. 16 16 show as outer panels 1 is provided with a plurality of potholes 11 as fixed bearing 8 with wainscot 2 inboards.Among the embodiment 16; Connector 4 is provided with the opposite external threaded of rotation direction for two; The internal thread of corresponding rotation direction is set, after pothole 11 is aimed at screw rod two, in the pothole 11 in fixed bearing 8 towards the stubborn screw rod that revolves of a direction; Along with the internal and external threads coupling is goed deep into, outer panels 1 can inwardly fold until fastened with wainscot 2.

Embodiment illustrated in fig. 17 17 show as outer panels 1 is provided with a plurality of pits 12 as fixed bearing 8 with wainscot 2 inboards.Among the embodiment 17, connector 4 is I shape parts, is the pit 12 of T font and fixed bearing 8 is profiles.In actual installation, two of connector 4 sticks into horizontal mouthful that is located at outer panels 1 and wainscot 2 inboard T font pits 12 respectively; After waiting to snap into the position, press down connector 4, its vertical mouth along T font pit 12 is snapped in; After treating that card is pressed onto the end, outer panels 1 is just firmly linked into an integrated entity with wainscot 2.In this example, also can hole, the inboard wall of pit 12 be made the sloping shape of inclination, connector 4 can constantly inwardly be strained outer panels 1 and wainscot 2 in the process of pressing down, and connecting like this can be more firm.

Embodiment illustrated in fig. 18 18 show as outer panels 1 is provided with a plurality of built-in fittings 13 as fixed bearing 8 with wainscot 2 inboards.

In embodiment illustrated in fig. 19 19, connector 4 is a bolt, during installation it is passed the through hole that is located on the wainscot 2, and is threaded with being located at outer panels 1 inboard pothole 11, until outer panels 1 and wainscot 2 are tightened to one.After building block is installed, expose direct shutoff when the eyelet of panel outer surface can be in wall plastering.

Described connector 4 is in practical implementation; Can use rigid element, also can use elastomeric element according to engine request; Such as the screw thread spring link; Its benefit is to have certain tautness, also has certain tension redundancy simultaneously, can tackle like this that some highrise buildings rock, sedimentation and cause the situation of deformation of wall.

In the enforcement, connector 4 and fixed bearing 8 supporting settings, its connected mode and component are selected for use according to specific requirement and are decided, and its objective is convenient construction and firm the connection.

Compound die card shown in figure 20 building block, it is characterized in that between said fixed bearing 8 and the connector 4 or fixed bearing 8 and outer panels 1 or wainscot 2 between be provided with heat insulation layer 20.Fixed bearing 8 is cassette type built-in fittings in embodiment illustrated in fig. 20 20, in the seat and a bayonet socket periphery be equipped with heat insulation layer 20, when connector 4 cutting ferrules wherein after, the isolated parts contact surfaces of heat insulation layer 20, thus play the effect of heat-insulating bridge-cut-off.When using the big connector 4 of metal or coefficient of thermal conductivity, its benefit is more obvious.

Like Figure 21,22,23,24, the building block of the card of compound die shown in 25, it is characterized in that described outer panels 1 or/and the shape of wainscot 2 is triangle, quadrangle, pentagon, hexagon, octagon or bent limit shape.In practical implementation, the shape of choosing can be confirmed according to engineering design.Enumerated partly combination in the following example, not limit by instance.

In embodiment illustrated in fig. 21 21, the opposite joint assembly unit is adopted in said compound die card building block, and its body of wall effect is shown in figure.This erection method is simplicity generosity the most, convenient construction.

In embodiment illustrated in fig. 22 22, staggered joint erection is adopted in said compound die card building block, and its body of wall effect is shown in figure.This erection method can prevent effectively that level or vertical through crack from appearring in body of wall, guarantees the construction quality and the application life of body of wall better.

In embodiment illustrated in fig. 23 23, shown in body of wall be that triangle, quadrangle, the building block of hexagonal compound die card are assembled, flexible by panel, moulding is abundant.

In embodiment illustrated in fig. 24 24, shown in body of wall be that triangle, quadrangle, the building block of octagonal compound die card are assembled by panel.

In embodiment illustrated in fig. 25 25, shown in body of wall be that triangle, quadrangle, the building block of pentagonal compound die card are assembled by panel.

Like Figure 26, the building block of the card of compound die shown in 27, it is characterized in that said outer panels 1 or/and wainscot 2 at least one sides are provided with in hole 14 or the groove 15 at least a.In embodiment illustrated in fig. 26 26, the upper side edge of outer panels 1 and wainscot 2 is provided with hole 14; In embodiment illustrated in fig. 27 27, the upper side edge of outer panels 1 and wainscot 2 is provided with hole 14 and groove 15 simultaneously.

Like Figure 28,29, the building block of the card of compound die shown in 30, it is characterized in that described outer panels 1 or/and the hole 14 that is provided with on wainscot 2 at least one side or/and be provided with dismountable connecting rod 16 in the groove 15 or in flakes 17; Or said connecting rod 16 with 17 be that branchs is arranged or be prefabricated into integral body in flakes.Figure 28 is single connecting rod 16; Connecting rod shown in Figure 29 connects among the embodiment one in flakes, and one 17 is fixedly connected two connecting rods 16 in flakes; Connecting rod shown in Figure 30 connects among the embodiment two in flakes, and four 17 are fixedly connected four connecting rods 16 and are encircled into one in flakes.

Described hole 14 and groove 15 and connecting rod 16 and 17 supporting uses in flakes its objective is adjacent compound die card building block is fixedly connected, thereby make metope form firm integral body; And the compound mode of hole 14 and groove 15 or connecting rod 16 and in flakes 17 compound mode decide according to engine request.Its basic method of attachment is: in the building block of a compound die card; Connecting rod 16 is partially submerged into hole 14; 17 be partially submerged into groove 15 in flakes; With exposed connecting rod 16 or 17 embed in the hole 14 or groove 15 of another adjacent piece compound die card building block in flakes, be linked to be integral body then thereby reach metope through being connected to each other.

Compound die card shown in figure 31 building block is characterized in that described outer panels 1 or/and wainscot 2 at least one side are provided with at least one injection orifice 18; Or said injection orifice 18 is provided with movable port lid 19.Wainscot 2 is provided with an injection orifice 18 and a supporting movable port lid 19 among the embodiment shown in Figure 31, can be to injection orifice 18 injection plasticity heat insulating materials.Behind the plasticity heat insulating material foaming casting complete, available active port lid 19 capping injection orifices 18; Also can not use movable port lid 19, and when wall plastering directly with injection orifice 18 shutoff.

Above listed examples is used for telling about, and is not enumerated example in the practical implementation and limits.

Claims (14)

1. compound die card building block; It is characterized in that the building block of said compound die card comprises outer panels (1), wainscot (2); Be filled with insulation layer (3) between outer panels (1) and the wainscot (2), outer panels (1) links into an integrated entity outer panels (1), insulation layer (3) through connector (4) with wainscot (2) with wainscot (2).
2. compound die card according to claim 1 building block is characterized in that described outer panels (1) or/and be provided with isolation layer (5) between wainscot (2) and the insulation layer (3); Or described isolation layer (5) is adiabatic mortar, glass wool, rock wool, mineral wool, foamed plastics, expanded perlite or foam cement.
3. compound die card according to claim 1 and 2 building block is characterized in that described outer panels (1) or/and at least one outside of wainscot (2) is provided with breach (6).
4. compound die card according to claim 1 and 2 building block it is characterized in that said outer panels (1) or/and at least one surface of wainscot (2) is the light face, or at least one surface is a matsurface.
5. compound die card according to claim 1 and 2 building block is characterized in that said outer panels (1) or/and wainscot (2) is fine-stone concrete, light aggregate concrete, ceramics, burned brick, aerating concrete, high-strength mortar, metal product or modification plastic refractory.
6. compound die card according to claim 5 building block is characterized in that described outer panels (1) or/and be provided with stiffener (7) in the wainscot (2); Or said stiffener (7) is reinforcing bar, gauze wire cloth, glass fiber mesh, fiber bundle, cloth, durafiber, nylon wire, nylon bundle, paper muscle, straw or cotton stalk.
7. compound die card according to claim 1 building block is characterized in that said outer panels (1) or/and the inboard of wainscot (2) is reserved with the fixed bearing (8) of connector (4); Or said fixed bearing (8) is at least a in projection (9), raised line (10), pothole (11), pit (12) or the built-in fitting (13).
8. compound die card according to claim 1 building block is characterized in that described connector (4) annotates at least a in the alloy for metalwork, modification plastic refractory, arrangement of reinforcement concrete goods or high.
9. according to claim 7 or 8 described compound die card building blocks, it is characterized in that between said fixed bearing (8) and the connector (4) or fixed bearing (8) and outer panels (1) or wainscot (2) between be provided with heat insulation layer (20).
10. compound die card according to claim 1 building block is characterized in that described insulation layer (3) is the polyphenyl compound, gathers third ethene, phenolic resins, foam cement or air; Or described insulation layer (3) be the polyphenyl compound, to gather third ethene, phenolic resins or foam cement be prefabricated block or cast-in-place shaping.
11. compound die card according to claim 1 building block is characterized in that described outer panels (1) or/and the shape of wainscot (2) is triangle, quadrangle, pentagon, hexagon, octagon or bent limit shape.
12. compound die card according to claim 1 building block is characterized in that said outer panels (1) or/and at least one side of wainscot (2) is provided with in hole (14) or the groove (15) at least a.
13. compound die card according to claim 12 building block, it is characterized in that described outer panels (1) or/and the hole (14) that is provided with at least one side of wainscot (2) or/and be provided with dismountable connecting rod (16) in the groove (15) or (17) in flakes; Or said connecting rod (16) is that branchs is arranged with (17) in flakes or is prefabricated into integral body.
14. compound die card according to claim 1 building block is characterized in that described outer panels (1) or/and at least one side of wainscot (2) is provided with at least one injection orifice (18); Or said injection orifice (18) is provided with movable port lid (19).
CN201120316377XU 2011-08-26 2011-08-26 Compound die card building block CN202265932U (en)

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CN201120316377XU CN202265932U (en) 2011-08-26 2011-08-26 Compound die card building block

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Application Number Priority Date Filing Date Title
CN201120316377XU CN202265932U (en) 2011-08-26 2011-08-26 Compound die card building block

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102383521A (en) * 2011-08-26 2012-03-21 傅礼铭 Composite mold clamp building block
CN103321342A (en) * 2013-06-28 2013-09-25 周琳 Easily-combined heat-preserving wall brick
CN105155858A (en) * 2015-09-29 2015-12-16 刘斌 Construction method for assembled composite wall building by concrete composite modules
CN105464253A (en) * 2016-01-05 2016-04-06 浙江宝业建设集团有限公司 Building plate light partition system
CN108518017A (en) * 2018-04-28 2018-09-11 合肥国瑞集成建筑科技有限公司 A kind of building wall board and preparation method thereof of high sound insulation function
CN108643383A (en) * 2018-05-24 2018-10-12 中建科技有限公司 The moisture-proof truss sandwich wallboard of assembled heat insulation suitable for severe cold and cold district

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102383521A (en) * 2011-08-26 2012-03-21 傅礼铭 Composite mold clamp building block
CN103321342A (en) * 2013-06-28 2013-09-25 周琳 Easily-combined heat-preserving wall brick
CN105155858A (en) * 2015-09-29 2015-12-16 刘斌 Construction method for assembled composite wall building by concrete composite modules
CN105464253A (en) * 2016-01-05 2016-04-06 浙江宝业建设集团有限公司 Building plate light partition system
CN108518017A (en) * 2018-04-28 2018-09-11 合肥国瑞集成建筑科技有限公司 A kind of building wall board and preparation method thereof of high sound insulation function
CN108643383A (en) * 2018-05-24 2018-10-12 中建科技有限公司 The moisture-proof truss sandwich wallboard of assembled heat insulation suitable for severe cold and cold district

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