CN202244733U - Placement device of silicon wafers - Google Patents
Placement device of silicon wafers Download PDFInfo
- Publication number
- CN202244733U CN202244733U CN2011202536890U CN201120253689U CN202244733U CN 202244733 U CN202244733 U CN 202244733U CN 2011202536890 U CN2011202536890 U CN 2011202536890U CN 201120253689 U CN201120253689 U CN 201120253689U CN 202244733 U CN202244733 U CN 202244733U
- Authority
- CN
- China
- Prior art keywords
- silicon wafers
- silicon chip
- plate
- placement device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to a placement device of silicon wafers. The device comprises two separate base frames, wherein each base frame is connected to a fixed plate which is vertical to the base frame; a baffle vertical to the fixed plate is arranged on each fixed plate; the baffles and the base frames are mutually parallel or located in the same plane; and a groove is arranged on each baffle; and an inserting plate with a plurality of slots can be inserted into each groove. By using the placement device provided by the utility model, the silicon wafers can be taken off from a multi-line cutting machine and carried to a washing pool conveniently; the device can be used for carrying and turning over the silicon wafers during a washing procedure and preventing the silicon wafers from falling in adhesive failure, and can ensure the silicon wafers free from damage during carrying, overturn and degumming procedures; and the placement device is good in working effect.
Description
Technical field
The utility model relates to a kind of apparatus for placing of silicon chip, is used in particular for the cleaning of silicon chip and comes unstuck.
Background technology
Usually, after silicon rod cut into silicon chip, the polylith silicon chip that needs to put in order cutter was taken off from multi-line cutting machine, transfers to the pond afterwards and cleans, and transfers to the pond of coming unstuck then once more and comes unstuck.In this process, be removed to from multi-line cutting machine and be carried to the service sink process, damage silicon chip easily collides with; In the process of coming unstuck, the silicon chip lodging takes place easily together, cause the silicon chip damage.
Summary of the invention
The purpose of the utility model provides and prevent that silicon chip from the apparatus for placing of a kind of silicon chip of damage taking place in the carrying and the process of coming unstuck.
The technical scheme that the utility model is taked is: a kind of apparatus for placing of silicon chip; It is characterized in that it comprises two pedestal frames that separate; Be connected with the adapter plate perpendicular with it on each pedestal frame, adapter plate is provided with the baffle plate perpendicular with it, and on baffle plate, is provided with groove.
The described plate that has several slots that also comprises, plate can insert groove.
Be parallel to each other between described baffle plate and the pedestal frame or be positioned at same plane;
Adopt the utility model; Both can be convenient to silicon chip is removed to from multi-line cutting machine and is carried to the service sink; Can be used for carrying and upset in the silicon chip cleaning process; Can be used for preventing in the silicon wafer stripping silicon chip lodging again, and guarantee in carrying, cleaning upset and the process of coming unstuck, can not damage silicon chip, and the apparatus for placing of a kind of silicon chip of good working effect.
Description of drawings
Fig. 1 is that the master of the single pedestal frame of the utility model looks scheme drawing.
Fig. 2 is the schematic side view of the single pedestal frame of the utility model.
Fig. 3 is the scheme drawing that the utility model is used to clean.
Fig. 4 is the scheme drawing that the utility model is used to come unstuck.
Sequence number is represented among the figure: pedestal frame 1, groove 2, baffle plate 3, adapter plate 4, fixed orifice 5, sticking excellent iron plate 6, silicon chip 7, plate 8, slot 9 and steel bar 10
The specific embodiment
Be described further in the face of the utility model down.
With reference to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, the apparatus for placing of this silicon chip comprises two pedestal frames 1 that separate, and is connected with the adapter plate perpendicular with it 4 on each pedestal frame 1, and adapter plate 4 is provided with the baffle plate perpendicular with it 3, and on baffle plate 3, is provided with groove 2; Be parallel to each other between baffle plate 3 and the pedestal frame 1 or be positioned at same plane; The apparatus for placing of this silicon chip also comprises the plate 8 that has slot 9, and plate 8 can insert in the groove 2, can in slot 9, put into steel bar 10.
When cutting machine takes off silicon chip, be about to that two pedestal frames that separate 1 are inverted and relative thirty years of age, fixing through the fixed orifice 5 that adapter plate 4 is provided with silicon chip 7 together with sticking excellent iron plate 6, can carry to put into and clean the pond reverse-flush, finish up to cleaning.
When needs come unstuck, with two pedestal frames 1 that separate turn over just put relative thirty years of age, as shown in Figure 4.Equally, and insert plate 8 in the grooves 2, slot 9 framves that steel bar 10 is put on the plate 8 are good, can silicon chip be carried to the pond of coming unstuck together with the utility model (apparatus for placing) and come unstuck.
Like this, both can be used for silicon chip carrying, cleaned, can be used for silicon wafer stripping again, and can guarantee carrying, clean and the process of coming unstuck in can not damage silicon chip, and because of placement in good order, clean and degumming effect better.
Claims (3)
1. the apparatus for placing of a silicon chip is characterized in that it comprises two pedestal frames that separate, and is connected with the adapter plate perpendicular with it on each pedestal frame, and adapter plate is provided with the baffle plate perpendicular with it, and on baffle plate, is provided with groove.
2. the apparatus for placing of a kind of silicon chip according to claim 1 is characterized in that also comprising the plate that has several slots, and plate can insert groove.
3. the apparatus for placing of a kind of silicon chip according to claim 1 is characterized in that being parallel to each other between baffle plate and the pedestal frame or being positioned at same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202536890U CN202244733U (en) | 2011-07-15 | 2011-07-15 | Placement device of silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202536890U CN202244733U (en) | 2011-07-15 | 2011-07-15 | Placement device of silicon wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202244733U true CN202244733U (en) | 2012-05-30 |
Family
ID=46106013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202536890U Expired - Fee Related CN202244733U (en) | 2011-07-15 | 2011-07-15 | Placement device of silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202244733U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102990267A (en) * | 2012-11-30 | 2013-03-27 | 陈棋伟 | Device for welding and positioning polycrystalline silicon chips |
| CN105304538A (en) * | 2015-11-24 | 2016-02-03 | 山东华光光电子有限公司 | 2-inch chip photoresist peeling basket |
-
2011
- 2011-07-15 CN CN2011202536890U patent/CN202244733U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102990267A (en) * | 2012-11-30 | 2013-03-27 | 陈棋伟 | Device for welding and positioning polycrystalline silicon chips |
| CN105304538A (en) * | 2015-11-24 | 2016-02-03 | 山东华光光电子有限公司 | 2-inch chip photoresist peeling basket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20120715 |