CN202172531U - Device for removing glues of oversized blind hole plate - Google Patents
Device for removing glues of oversized blind hole plate Download PDFInfo
- Publication number
- CN202172531U CN202172531U CN 201120309397 CN201120309397U CN202172531U CN 202172531 U CN202172531 U CN 202172531U CN 201120309397 CN201120309397 CN 201120309397 CN 201120309397 U CN201120309397 U CN 201120309397U CN 202172531 U CN202172531 U CN 202172531U
- Authority
- CN
- China
- Prior art keywords
- water pipe
- blind hole
- support
- glue
- hole plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a device for removing glues of an oversized blind hole plate, comprising a support and a glue basin arranged at a bottom of the support, wherein an upper part of the support is provided with a water pipe, the water pipe is provided with a funnel, a pipe wall of the water pipe is provided with a plurality of through holes, the glue basin is provided with a baffle plate therein, and the baffle plate is provided with a plurality of semicircular holes. Compared with the prior art, when the device of the utility model is used for removing the glues of the oversized blind hole plate, a worker needs not to stretch his hands into a concentrated sulfuric acid solution, thereby reducing danger of the working; and at the same time, a distance between movable rods and the baffle plate can be adjusted according to a size of a circuit board, thereby realizing glue removing of the large-size circuit board.
Description
Technical field
The utility model belongs to the pcb board manufacture field, and what be specifically related to is that a kind of overlength size blind hole plate removes adhesive dispenser, is mainly used in the glue that removes of overlength size blind hole plate is handled.
Background technology
When blind hole layer central layer made in operations such as the copper of holing, sink, need core layer be pressed into the through hole shape, during pressing; Prepreg is converted into flowable glassy state by solid-state under hot conditions, under the effect of pressure, the prepreg of glassy state overflows from blind hole; Cooling curing is in outer copper face and blind hole; When carrying out the skin making, must remove the semi-solid preparation gummosis in outer copper face and the blind hole fully, to guarantee the quality of finished of wiring board.
In the present stage PCB manufacturing process; Blind hole remove glue the most frequently used, the most effectively be exactly that plank is put into concentrated sulfuric acid immersion five minutes; The operator wears Rubber gloves plank is pulled out from the glue frame then, clean and oven dry on horizontal line then with sulfuric acid cleaned, and so far blind hole is removed glue and is accomplished.Yet; Because the concentrated sulfuric acid has very strong corrosivity, so this operation has very strong danger, all is to adopt little glue basin to carry out the production of this part generally speaking; Yet little glue basin has restriction to the size of wiring board, and stock size need be controlled in the 600mm*500mm scope.
But develop rapidly along with electronic product; As the PCB size of components and parts carrier and connector considerably beyond 600mm*500mm; The length of part wiring board even reached 2m, the wiring board of this size can't have been used little glue basin to carry out blind hole and remove glue and handled.
The utility model content
For this reason, the purpose of the utility model is to provide a kind of overlength size blind hole plate to remove adhesive dispenser, can't use little glue basin to carry out the problem that blind hole is removed the glue processing to solve present overlength size blind hole plate.
For realizing above-mentioned purpose, the utility model mainly adopts following technical scheme:
A kind of overlength size blind hole plate removes adhesive dispenser; Comprise support (1) and be installed in the glue basin (2) of support (1) bottom; Said support (1) top is equipped with a water pipe (3), and this water pipe (3) is provided with a funnel (6), and the tube wall of water pipe (3) is provided with a plurality of through holes (7); Be provided with a baffle plate (8) in the said glue basin (2), this baffle plate (8) is provided with a plurality of semicircle orifices (9).
Wherein said support (1) is a triangle column body, and the angle between the side of this triangle column body and glue basin (2) base is 150 °.
Wherein said water pipe (3) two ends are connected with motion bar (4), and this motion bar (4) is connected with support (1) through reference column (5).
Wherein said glue basin (2) bottom also is provided with a moving valve (10).
Funnel in the utility model, water pipe, support, glue basin, baffle plate are the PVC material and process, and have the characteristic of acid resistance corrosion.
The utility model is positioned over wiring board between water pipe and the glue basin Internal baffle, and the wiring board upper end is pushed down through water pipe, and the lower end then props up baffle plate; In the funnel of water pipe, pour concentrated sulfuric acid solution into then, make concentrated sulfuric acid solution along mobile in the water pipe, and from the through hole of water pipe bottom, flow on the wiring board; When concentrated sulfuric acid solution flows in the circuit board, the residual glue that circuit is burn-on is removed, concentrated sulfuric acid solution enters into Jiao Penzhong and reclaims afterwards; When reaching a certain amount of; Flow into the semicircle orifice from baffle plate, and, utilize once more by moving valve.Compared with prior art, the utility model removes glue to overlength size blind hole plate, need not hand be extend in the concentrated sulfuric acid solution staff, has reduced the danger of work; Distance between the utility model motion bar and the baffle plate can be adjusted according to the size of wiring board simultaneously, has realized the glue that removes of large scale wiring board.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Identifier declaration among the figure: support 1, glue basin 2, water pipe 3, motion bar 4, reference column 5, funnel 6, through hole 7, baffle plate 8, semicircle orifice 9, moving valve 10.
Embodiment
For setting forth the thought and the purpose of the utility model, will combine accompanying drawing and specific embodiment that the utility model is done further explanation below.
See also shown in Figure 1ly, Fig. 1 is the structural representation of the utility model.The utility model provides a kind of overlength size blind hole plate and removes adhesive dispenser, is used to solve the problem that can't remove glue at present to size above the wiring board of 600mm*500mm.
Wherein this device comprises support 1 and glue basin 2, and said support 1 is a triangle column body, and glue basin 2 is installed in the bottom of support 1; And a side angle of the base of glue basin 2 and support 1 is 150 °, and said support 1 top is equipped with a water pipe 3, and this water pipe 3 is processed for the PVC material; Characteristic with acid corrosion-resistant; The right ends of said water pipe 3 respectively is connected with a motion bar 4, and this motion bar 4 is connected with reference column 5 on being arranged on support 1, and water pipe 3 lifts under motion bar 4 drives.
Be provided with a baffle plate 8 in the glue basin 2, the bottom is provided with a moving valve 10, and said baffle plate 8 is provided with a plurality of semicircle orifices 9.
Funnel in the utility model, water pipe, support, glue basin, baffle plate are the PVC material and process, and have the characteristic of acid resistance corrosion.
The operation principle of the utility model is: pull-up motion bar at first, and water pipe is lifted, an end of wiring board is put between water pipe and the support, water pipe is pushed down it, the other end is then put into Jiao Penzhong, props up the baffle plate in the glue basin; The staff is slowly pouring in the water pipe the funnel of the concentrated sulfuric acid from water pipe, and the concentrated sulfuric acid evenly flows to the surface of wiring board through the semicircle orifice of water pipe lower curtate, and the concentrated sulfuric acid can be removed the gummosis on the plank in the wiring board Surface runoff; After pouring the sulfuric acid certain hour into, observe gummosis and remove situation,, then stop to pour into sulfuric acid if remove totally; After treating in the sulfuric acid inflow glue basin on the PCB surface, open motion bar, wiring board is taken out, put into the residual concentrated sulfuric acid on the horizontal cleaning machine clean plate face; After treating that sulfuric acid in the glue basin surpasses half of glue basin, open moving valve, the concentrated sulfuric acid in the glue basin is discharged, remove glue as wiring board blind hole next time and use.
More than be that a kind of overlength size blind hole plate that the utility model is provided has carried out detailed introduction except that adhesive dispenser; Used concrete example among this paper the structural principle and the execution mode of the utility model are set forth, above embodiment just is used to help to understand the method and the core concept thereof of the utility model; Simultaneously, for one of ordinary skill in the art, according to the thought of the utility model, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.
Claims (4)
1. an overlength size blind hole plate removes adhesive dispenser; It is characterized in that comprising support (1) and be installed in the glue basin (2) of support (1) bottom; Said support (1) top is equipped with a water pipe (3), and this water pipe (3) is provided with a funnel (6), and the tube wall of water pipe (3) is provided with a plurality of through holes (7); Be provided with a baffle plate (8) in the said glue basin (2), this baffle plate (8) is provided with a plurality of semicircle orifices (9).
2. overlength size blind hole plate according to claim 1 removes adhesive dispenser, it is characterized in that said support (1) is a triangle column body, and the angle between the side of this triangle column body and glue basin (2) base is 150 °.
3. overlength size blind hole plate according to claim 1 removes adhesive dispenser, it is characterized in that said water pipe (3) two ends are connected with motion bar (4), and this motion bar (4) is connected with support (1) through reference column (5).
4. overlength size blind hole plate according to claim 1 removes adhesive dispenser, it is characterized in that said glue basin (2) bottom also is provided with a moving valve (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120309397 CN202172531U (en) | 2011-08-22 | 2011-08-22 | Device for removing glues of oversized blind hole plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120309397 CN202172531U (en) | 2011-08-22 | 2011-08-22 | Device for removing glues of oversized blind hole plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202172531U true CN202172531U (en) | 2012-03-21 |
Family
ID=45830716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120309397 Expired - Fee Related CN202172531U (en) | 2011-08-22 | 2011-08-22 | Device for removing glues of oversized blind hole plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202172531U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996516A (en) * | 2019-11-22 | 2020-04-10 | 加宏科技（无锡）股份有限公司 | Long-size circuit board V-cut processing method |
| CN115066096A (en) * | 2022-05-23 | 2022-09-16 | 广德通灵电子有限公司 | Manufacturing process of multilayer circuit board |
-
2011
- 2011-08-22 CN CN 201120309397 patent/CN202172531U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996516A (en) * | 2019-11-22 | 2020-04-10 | 加宏科技（无锡）股份有限公司 | Long-size circuit board V-cut processing method |
| CN115066096A (en) * | 2022-05-23 | 2022-09-16 | 广德通灵电子有限公司 | Manufacturing process of multilayer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120321 Termination date: 20140822 |
|
| EXPY | Termination of patent right or utility model |