CN202111068U - Mould for removing waste edge of patch diode - Google Patents
Mould for removing waste edge of patch diode Download PDFInfo
- Publication number
- CN202111068U CN202111068U CN2011202050312U CN201120205031U CN202111068U CN 202111068 U CN202111068 U CN 202111068U CN 2011202050312 U CN2011202050312 U CN 2011202050312U CN 201120205031 U CN201120205031 U CN 201120205031U CN 202111068 U CN202111068 U CN 202111068U
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- China
- Prior art keywords
- mould
- main body
- diode
- rectangular
- die main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a mould for removing a waste edge of a patch diode, comprising a mould main body. The mould is characterized in that a plurality of rectangular cavities are transversely arranged at the upper end surface of the mould main body, and two ends of each rectangular cavity are respectively provided with a through groove which is extended to the side wall of the mould main body. The mould has the advantages that a half-finished rectangular pipe body of the diode can be just embedded into each rectangular cavity of the mould main body, and lead wires at two ends of the rectangular pipe body are arranged in the through groove when the mould is used, so that the waste edge is extruded out of the upper surface of the mould main body and scrubbed by a bamboo chip and the like, therefore, the bending of the lead wires and the rotating of the pipe body can be avoided.
Description
Technical field
The utility model relates to a kind of mould, and particularly a kind of stamp-mounting-paper diode removes the slitter edge mould.
Background technology
Stamp-mounting-paper diode must be removed the half-finished body slitter edge of diode after carrying out the injection mo(u)lding operation.The diode semi-finished product are as shown in Figure 1, comprise the body 1 that the center is equally spaced, and lead-in wire 2 is stretched out at body 1 two ends, and each goes between 2 through brace rod 3 connections, and body 1 is when injection mo(u)lding, and periphery produces slitter edge 4.Traditional method is directly to adopt the directly rejecting of scraping realization waste material and burr on rectangular tube of bamboo chip, is prone to cause the bending of diode semi-finished product two ends lead-in wire, the rotation of body, influences the production of later process.
Summary of the invention
The technical problem that the utility model will solve provides a kind of stamp-mounting-paper diode that is difficult for causing the diode semi-finished product to be out of shape and removes the slitter edge mould.
For solving the problems of the technologies described above; The technical scheme of the utility model is: a kind of stamp-mounting-paper diode removes the slitter edge mould; Comprise die main body; Its innovative point is: said die main body upper surface transverse row is shown some rectangular enclosures, and the two ends of said rectangular enclosure are provided with the groove that always extends to the die main body sidewall.
The advantage of the utility model is: during use; The half-finished rectangular tube of diode just can embed in the rectangular enclosure of die main body; The lead-in wire at rectangular tube two ends is positioned at groove; Make slitter edge be extruded the die main body upper surface, re-use scrapings such as bamboo chip, can not cause the bending of lead-in wire and the rotation of body.
Description of drawings
Fig. 1 is a diode semi-finished product structural representation of treating slitter edge.
Fig. 2 removes slitter edge mould vertical view for the utility model stamp-mounting-paper diode.
Fig. 3 goes the slitter edge mode host visual pattern for the utility model stamp-mounting-paper diode.
Embodiment
Like Fig. 2, shown in 3, comprise die main body 5, transverse row is shown some rectangular enclosures 6 in the upper surface of die main body 5, is provided with the groove 7 that always extends to the die main body sidewall at the two ends of rectangular enclosure 6.During concrete the use; The half-finished rectangular tube 1 of diode is embedded in the rectangular enclosure 6 of die main body 5, and the lead-in wire 2 at rectangular tube two ends is positioned at groove 7, makes slitter edge be extruded die main body 1 upper surface; Re-use scrapings such as bamboo chip, can not cause the bending of lead-in wire 2 and the rotation of rectangular tube 1.
Claims (1)
1. a stamp-mounting-paper diode removes the slitter edge mould, comprises die main body, it is characterized in that: said die main body upper surface transverse row is shown some rectangular enclosures, and the two ends of said rectangular enclosure are provided with the groove that always extends to the die main body sidewall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202050312U CN202111068U (en) | 2011-06-17 | 2011-06-17 | Mould for removing waste edge of patch diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202050312U CN202111068U (en) | 2011-06-17 | 2011-06-17 | Mould for removing waste edge of patch diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202111068U true CN202111068U (en) | 2012-01-11 |
Family
ID=45436522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202050312U Expired - Fee Related CN202111068U (en) | 2011-06-17 | 2011-06-17 | Mould for removing waste edge of patch diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202111068U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681370A (en) * | 2013-12-13 | 2014-03-26 | 如皋市易达电子有限责任公司 | Material cutting tool for SMD diode |
| CN104377152A (en) * | 2014-11-17 | 2015-02-25 | 如皋市易达电子有限责任公司 | Plastic package scrap-edge removing die for patch-type diode |
| CN104511988A (en) * | 2014-11-17 | 2015-04-15 | 如皋市易达电子有限责任公司 | Special tooling for waste edge removal mold for plastic package of surface mount device diode |
-
2011
- 2011-06-17 CN CN2011202050312U patent/CN202111068U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681370A (en) * | 2013-12-13 | 2014-03-26 | 如皋市易达电子有限责任公司 | Material cutting tool for SMD diode |
| CN103681370B (en) * | 2013-12-13 | 2016-04-20 | 如皋市易达电子有限责任公司 | A kind of stamp-mounting-paper diode cuts out material frock |
| CN104377152A (en) * | 2014-11-17 | 2015-02-25 | 如皋市易达电子有限责任公司 | Plastic package scrap-edge removing die for patch-type diode |
| CN104511988A (en) * | 2014-11-17 | 2015-04-15 | 如皋市易达电子有限责任公司 | Special tooling for waste edge removal mold for plastic package of surface mount device diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20140617 |
|
| EXPY | Termination of patent right or utility model |